Lead-Free, RoHS, and WEEE Information Wanted

John R. Barnes KS4GL, PE, NCE, NCT, ESDC Eng, ESDC Tech, PSE, SM IEEE
May 6, 2008
jrbarnes@iglou.com

Since December 2004 I have been searching the engineering and scientific literature for information on how to design and build electronics to be lead-free, RoHS-compliant, and WEEE-compliant. My idea was to boil this information down for dBi's clients to use, with it eventually becoming a "Chapter 20.5" for a second edition of my books, Robust Electronic Design Reference Book, Volumes 1 and 2. But at this point it looks this study may become Volume 3, a separate book, or a massive collection of web pages instead. So far I have dug out of my own libraries, and bought/ downloaded/ photocopied the pertinent sections of 210+ books and 9,300+ papers/ magazine articles/ reports on these subjects. I've also looked at many thousands of webpages, and printed out a few hundred of them. My bibliography at http://www.dbicorporation.com/rohsbib.htm has references to everything that I have acquired to date, with links to 4,250+ documents that may be downloaded for free from the Internet. But in my searches I've found references to numerous other pertinent documents that I have not yet been able to locate. Many of these were published by:

The American Electroplaters and Surface Finishers Society (AESF),
The International Microelectronics And Packaging Society (IMAPS),
The Institute of Metal Finishing (IMF),
The Association Connecting Electronics Industries (IPC),
The Society for Advancement of Material and Process Engineering (SAMPE),
The Surface Mount and Related Technologies Group (SMARTgroup).
The Surface Mount Technology Association (SMTA),
The International Society for Optical Engineering (SPIE),
The Minerals, Metals & Materials Society (TMS),

whose journals and proceedings are so specialized that they can rarely be found in public, engineering, or university libraries.

If you come across free or reasonably-priced sources for any of the following documents, please E-mail me the information at jrbarnes@iglou.com. I will acknowledge your contribution to this research in my web pages, and in any magazine articles, papers, or books that may come out of it.

When I run across a database that looks promising, I search for:

lead-free
lead free
Pb-free
Pb free
RoHS
WEEE
tin whiskers
Sn whiskers
zinc whiskers
Zn whiskers
lead whiskers
Pb whiskers
gold whiskers
Au whiskers
silver whiskers
Ag whiskers
aluminum whiskers
Al whiskers
cadmium whiskers
Cd whiskers
tin pest
tin plague
tin leprosy
tin disease
tin blight
hexavalent chromium
Galaxy IV satellite
conductive adhesive
anisotropic conductive film
EuP
Kirkendall voids
Conductive anodic filaments (CAF)
ELV
SnAg
Sn-Ag
copper dissolution
REACH Directive

Thanks!

John R. Barnes

So far I have checked libraries at the following institutions for information on lead-free electronics, the RoHS Directive, the WEEE Directive, and their ilk:
AU = Auburn University (Auburn, AL) checked card catalog 2/28/2007, visited 3/3/2007
BSU = Boise State University (Boise, ID)
BU = Bradley University (Peoria, IL)
BYU = Brigham Young University (Salt Lake City, UT) checked card catalog 8/9/2006
CPL = Chicago Public Library (Chicago, IL) visited 8/2005
CSM = Colorado School of Mines (Golden, CO) visited 8/10/2006
FIT = Florida Institute of Technology (Melbourne, FL) checked card catalog 2/21/2007
FSU = Florida State University (Tallahassee, FL) checked card catalog 2/21/2007, visited 3/2/2007
GIT = Georgia Institute of Technology (Atlanta, GA) checked card catalog 2/21/2007, visited 2/23/2007
IEEE XPLORE = IEEE XPLORE checked 4/21/2008
ISU = Iowa State University (Ames, IA) visited 8/26/2006
IU = Indiana University (Bloomington, IN) checked card catalog 12/3/2006
KSU = Kansas State University (Manhattan, KS) visited 8/8/2006
KU = Kansas University (Lawrence, KS) visited 8/8/2006
KYVL = Kentucky Virtual Library
Lexmark = Lexmark Library (Lexington, KY) visited 1/5/2008
LH = Linda Hall Library of Science, Engineering & Technology (Kansas City, MO) visited 10/26/2007
MoSU = Montana State University (Bozeman, MT) checked card catalog 8/20/2006
MSU = Michigan State University visited 7/9/2006
MTUM = Montana Tech of the University of Montana (Butte, MT) visited 8/23/2006
NWU = Northwestern University (Chicago, IL) checked card catalog 9/24/2006, visited 9/25/2006
OGI = Oregon Graduate Institute (Beaverton, OR) checked card catalog 8/14/2006
OrSU = Oregon State University (Corvallis, OR) checked card catalog 8/14/2006
OSU = Ohio State University (Columbus, OH) visited 2005, checked card catalog 12/3/2006
PSU = Portland State University (Portland, OR) visited 8/15/2006
PU = Purdue University (West Lafayette, IN) checked card catalog 12/3/2006, visited 9/29/2006
SLU = Saint Louis University (St. Louis, MO)
SPU = Seattle Pacific University (Seattle, WA) checked card catalog 8/18/2006
SU = Seattle University (Seattle, WA) checked card catalog 8/18/2006
UA = University of Alabama (Tuscaloosa, AL)
UAB = University of Alabama at Birmingham (Birmingham, AL) checked card catalog 2/28/2007
UAH = University of Alabama in Huntsville (Huntville, AL) checked card catalog 2/28/2007
UC = University of Cincinnati (Cincinnati, OH) visited 5/2006, checked card catalog 12/3/2006
UCB = University of Colorado at Boulder (Boulder, CO) visited 10/23/2007
UCF = University of Central Florida (Orlando, FL) checked card catalog 2/21/2007, visited 3/1/2007
UCI = University of California at Irvine (Irvine, CA) checked card catalog 10/20/2006 visited 10/24/2006
UD = University of Dayton (Dayton, OH) visited 5/2006, checked card catalog 3/29/2008
UDe = University of Denver (Denver, CO) checked card catalog 8/9/2006
UF = University of Florida (Gainesville, FL) checked card catalog 2/27/2007, visited 3/1/2007
UH = University of Hawaii at Manoa (Honolulu, HI) visited 7/12/2007
UI = University of Iowa (Iowa City, IA) visited 8/27/2006
UIC = University of Illinois at Chicago (Chicago, IL) checked card catalog 9/27/2006
UIUC = University of Illinois - Urbana-Champaign (Urbana-Champaign, IL) checked card catalog 9/24/2006
UK = University of Kentucky (Lexington, KY) visited 3/18/2008
also UK ONLINE
and UK ONLINE SD
UL = University of Louisville (Louisville, KY) visited 4/24/2008
UM = University of Michigan (Ann Arbor, MI) visited 3/31/2008
UMC = University of Missouri - Columbia (Columbia, MO) checked card catalog 10/25/2007
UNF = University of North Florida (Jacksonville, FL) checked card catalog 2/27/2007
UNL = University of Nebraska - Lincoln (Lincoln, NE) visited 8/25/2006
USA = University of South Alabama (Mobile, AL)
USF = University of South Florida (Tampa, FL) checked card catalog 2/27/2007
USU = Utah State University (Logan, UT) checked card catalog 8/9/2006
UT = University of Tennessee (Knoxville, TN) checked card catalog 2/18/2007, visited 2/22/2007
UTo = University of Toledo (Toledo, OH) checked card catalog 12/3/2006
UU = University of Utah (Salt Lake City, UT) visited 8/11/2006
UW = University of Washington (Seattle, WA) visited 8/21/2006
UWF = University of West Florida (Pensacola, FL)
UWy = University of Wyoming (Laramie, WY)
WrSU = Wright State University (Dayton, OH) checked card catalog 9/16/2006
WSU = Wayne State University (Detroit, MI) visited 7/11/2006
WUSL = Washington University in St. Louis (St. Louis, MO) visited 8/7/2006
--------------------------------------------------------
"The Allotropic Transformation White Tin - Grey Tin", London: International Tin Research and Development Council, 1938.

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Electrically Conductive and Insulative Adhesives

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Hexavalent chromium Technical Report - University of Texas at Austin, Center for Research in Water Resources no. 240, July 1993, pp. 61, 65

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Lead and the Electronics Industry: A Proactive Approach Performer: National Center for Manufacturing Sciences, 3025 Boardwalk, Ann Arbor, MI 48108. May 1995. 50p. Report: NCMS-0177BK95

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PWB Engineering

Hinton, P. E, "Tin-Plating, Tin-Nickel Electroplate and Tin-plating over Nickel as Final Finishes on Copper," PWB Engineering, pp. 806 - 810

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(new source 1/18/2007)
Third semi-annual lead-free solder implementation summit. British Library

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Aristotle, "De Mirabilibus Aucultationibus."

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Betz M., Fullana, P.: Cost Action 530 - Life Cycle Inventories for Environmentally Conscious Manufacturing Processes, SETAC Europe 11th annual Meeting, Madrid, Spain, Mai. 2001.

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Bornemann, A., and Gela, T., "Studies in the Behavior of Certain Non-Ferrous Metals at Low Temperatures," Vol. II Final Report, Contract No. DA-36-939-SC-15393? DA-36-039-SC-15393? Dec. 1953, Signal Corps Project 2005 - MO8 - Metals, U. S. Army.

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Bredee, Thesis (Utrecht, 1928).

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Britton, S. C, Tin Whiskers, Publication 487, International Tin Research Institute, London.

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FSU dirac 621.319 C748s

Busch, Lieland? Wieland?, and Zoller, Semiconducting Materials, London: Butterworths Scientific Publications, 1951, pp. 188.

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Coleman, R.V. "Whiskers," Work Function, pp. 1 1 12.

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Douwes Dekker, K., Thesis Utrecht (1927).

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F. J. Dunkerly and W. L. Mudge, Jr., "Kinetics of the Alpha Beta Transformation of Pure Tin," Technical Report L5, University of Pennsylvania, Contract NObs-2477. Navy Department, Bureau of Ships (Jan. 1950).

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(new source 1/18/2007)
Allen Nathan Goland, Thermoelectric properties of gray tin. NWU

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(new source 1/18/2007)
Tamara Greenlaw, Cross-functional environmental initiatives : addressing Restriction of Hazardous Substance (RoHS) technical challenges at Sun Microsystems MIT

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(new source 1/18/2007)
Steven Herr Groves, Transport properties and band structure of gray tin. Harvard Univ DEC 1963 AD0432897

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Harris, P, , "The Growth of Tin Whiskers", International Tin Research Institute, 734, pp. 1 - 19, 1994.

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E. S. Hedges and C. E. Homer, "The Properties of Tin," International Tin Research and Development Council, Tech. Pub. B.1 1937. (have 1954 edition)

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Kennedy, Gerald L, Morgan, James F. TOXICITY OF LEAD CHROMATES. Publication date: 1981, pp. 43-60

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Koppel, W. Benjamin, Hathaway, James A. ACUTE CHEMICAL EFFECT OF CHROMIUM COMPOUNDS IN MAN. Publication date: 1981, pp. 24-30

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C. M. Liu, A study on the reaction between the Sn-3.5Ag solder and BGA surface finish, M.S. thesis Chungli City, Taiwan: National Central University, 2000, available in Chinese only as of Nov. 2003.

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R. M. MacIntosh, "Tin in Cold Service" Leaflet No. 55 published by the Tin research Association

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M. Margolis and A. Bornemann, "A Study in Ferrous and Non-Ferrous Alloys at Low Temperature," Final Report Contract No. W-36-039-SC-38135, Nov. 1950.

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(new source 1/18/2007)
Paul Tucker McElroy, The construction of a ratio reflectometer and its application to energy band studies in germanium and gray tin. Harvard Univ

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Peng, W, Zeng, K, Kivilahti, J, Performer: Literature Review on Potential Lead-Free Solder Systems Helsinki Univ. of Technology, Espoo (Finland). Dept. of Electrical and Communications Engineering. 2000. 68p. Report: ISBN-951-22-4979-0, HUT/EPT-1

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R. R. Rogers and W. R. G. Stewart, Report on Investigation MD2609, Mineral Dressing and Metallurgical Labs, Bureau of Mines, Ottawa, Canada, Nov. 23, 1949.

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R. R. Rogers and J. F. Fydell, "Factors Affecting the Transformation of Gray Tin at Low Temperatures," Mines Branch, Dept. of Mines and Technical Surveys, Jan. 26, 1952. Ottawa, Canada.

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(new source 1/18/2007)
P S Peercy, Helicon propagation in indium antimonide and gray tin Univ of Wis- Madison

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Sattelmeier, Gerald A, application of chromium bearing paint in the automobile industry. Publication date: 1981, pp. 165-177

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Silman, Harold, chromium plating - past, present and future. Publication date: 1984, p 140-146

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R. W. Smith, Ph. D. Thesis, Birmingham University, 1956.

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C. J. Smithells, Chapman-Hall's Centenary Year (1930), p. 178.

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GIT main QD470.S6

Andreas Smits, The theory of allotropy. *** not applicable ***

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IU bloomington fine CC137.M5S78

T. Stambolov, The Corrosion and Conservation of Metallic Antiquities and Works of Art, Central research Laboratory for Objects of Art and Science, Amsterdam, pp 175-177, 1985.

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P. Stephens, Use of Synchrotron Radiation to Determine the State of Strain in Tin Coatings on Integrated Circuit Packages Herndon, VA: NEMI, Tin Whisker Modeling Project Rep., May 2002, Available upon request from NEMI.

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Vianco, P.T. ; Yost, F.G. A ban on use of lead-bearing solders: Implications for the electronics industry OSTI ID: 5413166 10141426; Legacy ID: DE92013291 SAND-92-0211

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Vianco, P.T. ; Hosking, F.M. ; Frear, D.R. Lead-free solders for electronics applications: Wetting analysis OSTI ID: 5494227; DE91014900 SAND-91-0031C;CONF-9108110--1

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(new source 3/29/2008)
Soldering Handbook
UD roesch TT267.V5 (4th floor)

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(new source 1/18/2007)
Robert John Wagner, Free carrier reflectivity of gray tin single crystals. NWU

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Wolfson, R. G., M. S. Thesis, Northwestern University, June 1960.

Robert George Wolfson, Transformation studies of gray-tin single crystals. NWU

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(new source 1/18/2007)
Poh-shien Young, Measurements of electrical conductivity of filaments of gray tin alloys Oklahoma State Univ

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Acta crystallographica
NWU ONLINE & sci 548.05A188 OSU sel QD901A2 PU phys 548Ac8 UC chem QD901.A2 & SW depos QD901.A2 UD Roesch UIC science UK chem/phys QD901.I523 UL kersey QD901.I523 UM ONLINE & QD901.A18 UT hodges QD901.A3

Tiedema, May and Burgers, Acta. Cryst., 1949, 2, 151. *** not applicable ***

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Acta Materialia
OSU ONLINE & TN1A23 UC ONLINE & depository TN1.A2 UK ONLINE SD & eng TS200.A3 UL kersey TS200.A3 UM ONLINE & TN1.A19 UT ONLINE & hodges TN1.A3
v44#1-v56#7 checked 3/31/2008

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Acta Metallurgica
NWU ONLINE & sci L669.05A188 OSU sel TN1A2 PU phys 669.05Ac8 UC ONLINE & eng TN1.A2 UD roesch UIC daley TS200.A3 UK eng TS200.A3 UL kersey TN1.S36 & TS200.A3 UM ONLINE SD & TN1.A19 UT hodges TN1.A3

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Acta Metallurgica Sinica (China)
Jinshu Xuebao
Jin shu xue bao
FIT ONLINE LH closed UM ONLINE & hatcher microforms AO72:1
v19#1-v21#1 checked 3/31/2008

Li, F, Liu, C, Xian, A, Shang, J, Xian, A interfacial reaction between eutectic sn-58bi lead-free solder and electroless ni-p plating Acta Metallurgica Sinica (China). Vol. 40, no. 8, pp. 815-821. Aug. 2004

Qiao, M, Xian, A, Shang, J, Xian, A electro-deposition of sn-ag lead-free solder by alkaline pyrophosphate bath Acta Metallurgica Sinica (China). Vol. 40, no. 8, pp. 822-826. Aug. 2004

Tang, Xingyong, Wang, Jun, Gu, Bo, Yu, Hongkun, Xiao, Fei Effects of aging on structures and shear strength of interface of Sn-Ag-Cu solder/Ni-P plating layer Jinshu Xuebao/Acta Metallurgica Sinica, v 42, n 2, February, 2006, p 205-210 Language: Chinese

Wang, Wei, Wang, Zhongguang, Xian, Aiping, Shang, Jianku Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling Jinshu Xuebao/Acta Metallurgica Sinica, v 42, n 6, June, 2006, p 647-652

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Additives for Polymers
OSU ONLINE UC ONLINE UD ONLINE UM ONLINE UT ONLINE

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Adhesives & Sealants Industry
http://www.adhesivesmag.com/ IU ONLINE NWU ONLINE OSU ONLINE UIC ONLINE UK ONLINE UM ONLINE SD UT ONLINE
checked 11/22/2007

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Advanced Engineering Materials
AU ONLINE GIT ONLINE IU ONLINE LH closed NWU ONLINE OSU ONLINE & sel TA401.A15 UAB ONLINE UC ONLINE UCB ONLINE UCF ONLINE & main TA401.A15 UD ONLINE UIC ONLINE UM ONLINE & TA401A22 UT ONLINE
v1#1-v10#3 checked 3/31/2008

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Advanced Manufacturing Technology (AMT)
FIT ONLINE Lexmark LH closed MSU ONLINE NWU ONLINE OSU ONLINE PU ONLINE & eng 670.4205In8 UCB ONLINE UIC ONLINE UK eng T59.4.I5410 UM ONLINE UT ONLINE
v8#1-v9#24,v16#6,v28#1-v29#3

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Advanced Materials
OSU ONLINE & TA401.A24 UC ONLINE & TA401.A16 UH ONLINE UM ONLINE & shapiro TA401.A291 UT ONLINE & hodges TA401.A29
v17#1-V17#23 checked 3/31/2008

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Advanced Materials & Processes
AU rbd TA401.3.I5855 FIT ONLINE LH closed OSU ONLINE & sel TS200A762 UAB sterne TA401.A42 UC engr TA418.9.C6A28 UCB ONLINE UCI ONLINE & sci TS200.M361 UK eng TS200.M380 UL kersey TS200.M36 UM TS 200 .M5891 UT ONLINE & hodges TS200.M36
v157#3-V165#12

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Advanced Metallization Conference
LH TK7871.85.A228 OSU sel TK7871.85.A3482 PU eng 621.38152Ad9451p UC eng TK7871.85.A3482 UCB TK7871.85.A3482 UM TK7871.75.A23
1994,1998-2006

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Advanced Packaging
http://ap.pennnet.com/home.cfm OSU ONLINE LH closed UK ONLINE UT ONLINE UT ONLINE
v7#6,v9#1-v16#8(Dec2007) checked 12/6/2007

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xxxx Advanced Packaging Technology Conference
http://www.smta.org/knowledge/proceedings.cfm
2001 checked 11/11/2007

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Advanced Semiconductor Engineering Technical Conference

Lee, Jeffrey, , Whisker Formation Study of Lead-Free Plated Packages, Advanced Semiconductor Engineering Technical Conference Taipei, Taiwan December 2002 pag 103.

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xxxx Advanced Technology Symposium Conference Proceedings
http://www.smta.org/knowledge/proceedings.cfm
2002 checked 11/11/2007

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Advances in Chemistry Series
OSU sel QD1.A26NO218 UC chem QD1.A36 no.218 UD roesch various UM shapiro TK7871.15.P6E385 1988

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Advances in Coatings Technologies for Corrosion and Wear Resistant Coatings
NWU sci 620.11223A244
1995

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Advances in Coatings Technologies for Surface Engineering (see TMS Annual Meeting)
NWU sci 667.6 A244 PU engr 667.9 Ad945 1997 UF science A418.76.A391 UT hodges TA418.76.A383 1997

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Advances in Electronic Packaging
American Society of Mechanical Engineers, EEP
Manufacturing Aspects in Electronic Packaging xxxx
Proceedings of the xxxx International Electronics Packaging Conference
Proceedings of InterPack
Proceedings of the technical conference: Nth annual International Electronics Packaging Conference
LH TK7870.15.A83 MSU eng TK7870.15 .A88 PU engr 621.381046J668p UC sw TK7801.H544 UCB TK7870.15.J65 UM TK7870.15.A38 SWU sci TK7870.15.J65
1992-1993,1995,1997,1999,2001,2003,2005

Matsuoka, H, Tsukagoshi, I. "New type of anisotropic conductive film with high connection reliability and finer pitch densities Proceedings of the 1993 International Electronics Packaging Conference, 1993, pp. 489

McCluskey, F. P., Govind, A., and Beaudet, D., "Reliability assessment of BGA interconnects with CADMP-II," American Society of Mechanical Engineers, EEP, vol. 17, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 1996, pp. 93-100

Evaluation of a conductive adhesive based approach to lead free flip chip assembly Venkateswaran, Muthiah; Borgesen, Peter; Srihari, K. American Society of Mechanical Engineers, EEP, vol. 2, 2002, pp. 111-115

The lead-free interconnection movement: A pro-active approach to understand the effects on cots usage in the aerospace and defense industries Rafanelli, Anthony J. American Society of Mechanical Engineers, EEP, vol. 2, 2002, pp. 203-213

Akiguchi, Takashi, Koguchi, Hideo, Yamaguchi, M, Takayasu, A, "Deformation of conductive particles and reliability of electronic devices using COG," American Society of Mechanical Engineers, EEP, vol. 2, pp. 425-430, 2002.

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Advancing Microelectronics
http://www.imaps.org/advancingmicro.html UCI ONLINE & sci TK7874.A382
v28#1-v29#5,v30#2-v35#1 checked 2/6/2008

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Aerospace/Airlines Plating Forum
http://www.nmfrc.org/subs/tech.cfm
1994-1995,1999,2001

," 24th Annual Aerospace/Airline Plating & Metal Finishing Forum , 1988, pp. xx-xx.

1989

1990

1991

James A. Bates The Replacement of Cadmium Plating, Acid or Alkaline Zinc-Nickel , 1992, ,

," 28th Annual Aerospace/Airline Plating & Metal Finishing Forum , Apr. 20-23, 1992, pp. xx-xx.

1993

James A. Bates Comparison of Alkaline Zinc Nickel and Acid Zinc Nickel as Replacement Coatings for Cadmium , 1994, ,

," 30th Aerospace/Airline Plating & Metal Finishing Forum, 1994, pp. xx-xx.

," 31st Aerospace/Airline Plating & Metal Finishing Forum, 1995, pp. xx-xx.

N. Yanaki, X-Ray Fluorescence: The New Key to Highly Accurate, Non-destructive Coating Thickness Measurements for Industry , 1996,

J. Quets & J.R. Alford Thermal Spray for Chromium Plating Replacement, 1996,

," 32nd Aerospace/Airline Plating & Metal Finishing Forum, Apr. 30-May 2, 1996, pp. xx-xx.

," 33rd Annual Aerospace/Airline Plating & Metal Finishing Forum, San Francisco, CA, Mar. 25-26, 1997, pp. xx-xx.

," 1998 Aerospace/Airline Plating & Metal Finishing Forum, San Antonio, TX, Mar. 1998, pp. xx-xx.

Bryan Fuhr A New Aluminum Replacement for Cadmium, 1999,

Bruce D. Sartwell Qualification of HVOF Thermal Spray Coatings as Replacement for Hard Chrome Plating on Aircraft Landing Gear, 1999,

," 1999 Aerospace/Airline Plating & Metal Finishing Forum, Jacksonville, FL, Apr. 20-22, 1999, pp. xx-xx.

," 2000 Aerospace/Airline Plating & Metal Finishing Forum, Cincinnati, OH, Mar. 27-29, 2000, pp. xx-xx.

T.Naguy, M.Klingenberg, M.Neidbalson, M.Pavlik & D.Schario Status Report on Non-line-of-sight (NLOS) Hard Chromium Alternatives, 2001,

Bruce D.Sartwell Status of DoD Program on Replacement of Hard Chrome Plating With Thermal Spray Coatings on Aircraft Components, 2001,

," 2001 Aerospace/Airline Plating & Metal Finishing Forum, Portland, OR, Mar. 27-29, 2001, pp. xx-xx.

," 2002 Aerospace/Airline Plating & Metal Finishing Forum, Orlando, FL, Aug. 27-29, 2002, pp. xx-xx.

," 2004 Aerospace/Airline Plating & Metal Finishing Forum, Tulsa, OK, Mar. 29-Apr. 1, 2004, pp. xx-xx.

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AESF Chromium Colloquium
http://www.nmfrc.org/subs/tech.cfm

," AESF Chromium Colloquium, Cleveland, OH, May 30-31, 1996, pp. xx-xx.

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AESF SUR/FIN
Nth AES Annual Technical Conference Proceedings
AESF Annual Technical Conference
American Electroplaters' Society Nth Annual Technical Conference
Proceedings of the AESF Nth Annual Technical Conference
Proceedings of the AESF Annual Technical Conference
http://www.nmfrc.org/subs/tech.cfm GIT main TS670.A332X LH closed UCB pascal TS670.A332 WSU sci TS670.A332
1955,1979-1988,1993-2000,2002-2004

S. M. Arnold, "The growth and properties of metal whiskers," in Proc. 43rd Annual Convention of the American Electroplaters" Soc., 1956, pp. 26-31.

Arnold, S. Growth and Properties of Metal Whiskers Proc. 43rd Am. Electroplaters Soc, 26 (1956)

ZAKRAYSEK, L. ; TIN WHISKER GROWTH FROM A BRIGHT ACID TIN ELECTROPLATED FINISH , 1976, , 3033. SUR/FIN 76, SESSION D. Kaja, S, Pickering, H. W, Bitler, William R. INTERDIFFUSION OF ELECTRODEPOSITS WITH COPPER SUBSTRATES. Annual Technical Conference - American Electroplaters' Society, vol. 1, 1982, C-4, 2p

," Proceedings of the 79th AESF Annual Technical Conference SUR/FIN '92, Atlanta, GA, June 22-25, 1992, pp. xx-xx.

Jeannier, Eliane, Zinc plating and corrosion protection top coat Proceedings of the AESF Annual Technical Conference, 1993, pp. 297-308

," Proceedings of The International Technical Conference of AESF SUR/FIN, Anaheim, CA, June 21-24, 1993, pp. xx-xx.

," SUR/FIN '94 Technical Conference Proceedings, Indianapolis, IN, June 20-23, 1994, pp. xx-xx.

," Proceedings of The International Technical Conference of SUR/FIN, Baltimore, MD, June 26-29, 1995, pp. xx-xx.

Szotek, Jeff M, Alloy alternatives to hexavalent chromium Proceedings of the AESF Annual Technical Conference, 1996, pp. 935-943

," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. xx-xx.

," Technical Conference Proceedings AESF SUR/FIN, Detroit, MI, June 23-26, 1997, pp. xx-xx.

," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. xx-xx.

," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. xx-xx.

Fan, Chonglun; Blair, A.; Mayer, L.; Abys, J.A. Electric gadgets "must get greener" New Technical and Economical Developments in Nickel/Palladium Leadframe Surface Finishing AESF SUR/FIN, 2000, pp. 187-193

Nickel/Palladium Leadframe Surface Finishing New Technical and Economical Developments in , 2000, Jun, C. Fan, A. Blair, L. Mayer and J. A. Abys

Brenda Fernandes & Dr. Kazimierz Wikiel, Technic, Inc., R&D, Cranston, RI; SUR/FIN 2000 High-speed Electroplating of Lead-free Solder, SUR/FIN 2000

Yun Zhang, Chen Xu, Chonglun Fan & J.A. Abys, Properties of Electroplated Tin & Tin Alloy Coatings, SUR/FIN 2000

Richard M. Edgar, Florida Cir Tech Inc., Greeley, CO ; SUR/FIN 2000 An Analysis of Lead-free Final Finishes: The First Step in Producing a Lead-free Printed Wiring Board , 2000, Jun,

T. Naguy, M. Klingenberg, M. Pavlik & D. Schario Non-line-of-sight Hard Chromium Alternatives Update SUR/FIN 2000

C. Fan, B. Stacy, C. Xu and J. A. Abys Solderability and Wirebonding Performance of Palladium-Cobalt Finish SUR/FIN 2000

," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

," AESF SUR/FIN, Nashville, TN, June 25-28, 2001, pp. xx-xx.

Lal, S, "An Evaluative Study of Lead-Free Deposits in High Speed Applications, AESF SUR/FIN Conference 2001

R. Schetty, N. Brown, A. Egli, J. Heber, and A. Vinckler, "Lead-free finishes-whisker studies and practical methods for minimizing the risk of whisker growth," in Proc. AESF SUR/FIN Conf., Jun. 2001, pp. 1-5.

C. Xu, C. Fan, A. Vysotskoya, J. Abys, Y. Zhang, L. Hopkins, and F. Stevie, "Understanding whisker phenomenon\\\_Part II, competitive mechanisms," in Proc. AESF SUR/FIN Conf., Jun. 2001.

Oberle, R, , "Metallurgical Aspects of Tin Whisker Growth", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FIN Conference, June 24-28, 2002, pp. N/A

Boguslavsky, I, , N. Brown and H. Gray, "The Effect of Operating Parameters and Test Conditions On the Whisker Performance of Pure Tin as a Lead-Free Solderable Finish", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FI Conf June 24-28, 2002

," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. xx-xx.

," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. xx-xx.

," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. xx-xx.

," AESF SUR/FIN 2005, St. Louis, Missouri, June 13-16, 2005, pp. xx-xx.

--------------------------------------------------------
Air Force Research Laboratory Technology Horizons
http://www.afrlhorizons.com/CAC/
Mar2000-Oct2006 checked 11/22/2007

--------------------------------------------------------
Aircraft Engineering
OSU ONLINE & sel TL501A285 UC engr TL501.A555 UK ONLINE & eng TL501.A5615 UL ONLINE & kersey TL501.A5615 UM TL501.A296 UT ONLINE & hodges TL501.A5615
v76#5

--------------------------------------------------------
American Institute of Mining & Metallurgy
UK eng TN1.A5

--------------------------------------------------------
American Society of Mechanical Engineers, Design Engineering Division (Publication) DE

Gomatam, Rajesh R, and Sancaktar, Erol, "A study of fatigue and failure behavior of conductive adhesive joints subjected to elevated temperature and humidity," American Society of Mechanical Engineers, Design Engineering Division (Publication) DE, vol. 117, Proceedings of the ASME Design Engineering

--------------------------------------------------------
American Society of Mechanical Engineers, Manufacturing Engineering Division, MED
UM TS176.I68
2000-2003

--------------------------------------------------------
American Society of Mechanical Engineers, PED
UM TK7870.15.M33 & TS176.M36811

--------------------------------------------------------
Analytical Chemistry
Lexmark NWU ONLINE & sci L543.05I42 OSU ONL NE & sel TP1J861 PU chem 660.5In2a UC chem TP1.I62 UD ONLINE & Roesch UIC ONLINE UK chem/phys TP1.I615 UL ONLINE & kersey TP1.I615 UM ONLINE & TP1.I62 & buhr TP1.I62 & shapiro TP1.I62 UT ONLINE & hodges TP1.I615

--------------------------------------------------------
Ann. Institute of Physical Chemistry (Leningrad)

Stepanoff, Ann. Inst. Phys. Chem. (Leningrad), 2, 500 (1924).

--------------------------------------------------------
Annalen der Physik
IU ONLINE NWU ONLINE & sci 530.5 A61 OSU ONLINE & sel QC1A61 PU ONLINE & phys 530.5An7 UC ONLINE & phys QC1.A6 UIC science QC1.A6 UK chem/phys QC1.A6 & king QC1.A6 UL ONLINE & kersey QC1.A6 & ekstrom QC1.A6 UM ONLINE & shapiro QC1.A6 & buhr QC1.A613 UT ONLINE

--------------------------------------------------------
xxxx Nth Annual International Systems Packaging Symposium

Hong, Bor Zen, Viscoplastic deformation and thermal fatigue behavior of lead-free solder joints in a surface mount package The 1997 1st Annual International Systems Packaging Symposium, San Diego, CA, USA, 02-05 Dec. 1997. pp. 197-200. 1997

--------------------------------------------------------
Annual National Relay Conference
UK eng TK2851.N27

--------------------------------------------------------
Annual Technical Conference and Exhibition - Institute of Metal Finishing
LH TS653.A1I52

Smart, D, Such, T. E.; Wake, S. J. NOVEL TRIVALENT CHROMIUM ELECTROPLATING BATH. Technical Papers, Annual Technical Conference and Exhibition - Institute of Metal Finishing, vol. 1, 1983, pp. 41-72

--------------------------------------------------------
Annual Technical Conference - ANTEC
Society of Plastics Engineers Annual Technical Conference xxxx
LH TA455.P5S635 OSU sel TP1105.S62 UC engr TP1105.S63 UCB eng TP986.A1S5725 UL kersey TP1105.S62 UM ONLINE & TP986.A1S677
1994

--------------------------------------------------------
Anti-Corrosion Methods and Materials
OSU ONLINE & sel TA462A1A56 UC ONLINE UH ONLINE UK ONLINE & eng TA462.A67 UL ONLINE UM ONLINE & TA462.A1A628 UT ONLINE UTo ONLINE
v44#1-v55#2 checked 3/31/2008

--------------------------------------------------------
Appliance
OSU ONLINE PU eng 671M562 UM ONLINE UT ONLINE

--------------------------------------------------------
Appliance Design
http://www.appliancedesign.com/ IU ONLINE NWU ONLINE OSU ONLINE PU hicks 338.47643605Ap58 UIC ONLINE UK ONLINE UT ONLINE
Jan2006-Nov2007 checked 11/22/2007

--------------------------------------------------------
Applications of Surface Science
NWU sci 660.29453A6524 PU hicks 660.29453Ap58 UC geo TA418.7.A66 UM ONLINE SD & shapiro QC1.A652 UT ONLINE

--------------------------------------------------------
Applied Physics A
OSU ONLINE & QC1A6232 PU ONLINE & phys 530.05Ap51a UC ONLINE & phys QC1.A662 UM ONLINE & shapiro QC1.A65742 UT ONLINE & hodges QC1.A73

--------------------------------------------------------
Applied Physics Letters
FSU ONLINE GIT ONLINE OSU ONLINE & sel QC1A626 UC ONLINE & phys QC1.A67 UCF ONLINE UM ONLINE & QC1.A658 UT ONLINE

--------------------------------------------------------
Applied Surface Science
OSU ONLINE UC ONLINE & TA418.7.A66 UK ONLINE SD UL ONLINE & kersey TA418.7.A66 UM ONLINE & shapiro QC1.A652 UT ONLINE UTo ONLINE & carlson WSU ONLINE & carlson

--------------------------------------------------------
Archaeologia
MSU main DA20.A64 NWU main film 16500 OSU depos DA20A66 PU human microform 072 Ea76 Reel 1258-1261 UC class DA20.A66 UIC daley DA20.A64 UK King DA20.A64 UL art DA20.A64 & microforms UM hatcher film X1287 reel 1258-1261 UT hodges DA20.A64 WSU purdy-kresge

--------------------------------------------------------
Archives of Metallurgy and Materials
LH closed

--------------------------------------------------------
ASM International Electronic Materials and Processes Conference
UM TK7874.A771

--------------------------------------------------------
Assembly
http://www.assemblymag.com/ MTUM ONLINE OSU ONLINE UC ONLINE & engr TJ1320.A75 UT ONLINE WSU ONLINE
Jan2003-Nov2007 checked 11/22/2007

--------------------------------------------------------
Assembly Automation
OSU ONLINE UC ONLINE & engr TS178.4.A84 UH ONLINE UT ONLINE UTo ONLINE WSU ONLINE & sci
v12#1-v27#4 checked 2/14/2008

--------------------------------------------------------
ASTM special technical publication
NWU sci 620.6A5127s OSU misc PU eng misc Lexmark various UC various UD roesch various UIC verious UK eng TA410.A43 & QD133.A63 UL kersey TA418.9.C6T43 UM misc UT hodges TA401.A69

--------------------------------------------------------
Aufbereitungs-Technik/Mineral Processing
LH closed OSU sel TA401.A85

-------------------------------------------------------
Australian Journal of Scientific Research
IL bloomington alf QC1.A93 NWU sci 530.5A938 OSU sel QC1A93 PU chem 540.5Au73 UC phys Q1.A7 & SW depos Q1.A7 UIC science various UK chem/phys Q1.A773 UL ekstrom QH1.A983 UM ONLINE & shapiro QD1.A93 UT hodges closed Q1.A8

--------------------------------------------------------
Australian Printer Magazine
GIT main Z119.A895

Tribute, Andrew "Living with the environment," AP Australian Printer Magazine, n FEB., February, 2006, p 29

--------------------------------------------------------
Automotive Engineer
OSU ONLINE & sel TL1J192 UC engr TL1.A88 UK ONLINE & eng TL1.S5 UL ONLINE & kersey TL1.A596 & kersey TL1.S5 UT hodges TL1.A596
v28#5-v28#5

--------------------------------------------------------
Automotive Finishing

--------------------------------------------------------
Aviation Week & Space Technology
MSU ONLINE OSU ONLINE & sel TL501A95 UC engr TL501.A7 UK eng TL501.A8 UL kersey TL501.A8 UT ONLINE UTo ONLINE & carlson WSU ONLINE & sci
v124#6-v158#22

--------------------------------------------------------
Avnet Advantage
http://www.em.avnet.com/aam/home/0,2039,RID%253D%2526CID%253D0%2526CCD%253DUSA%2526SID%253D32216%2526DID%253DDF2%2526LID%253D32241%2526PVW%253D%2526BID%253DDF2%2526CTP%253DAAM,00.html
Apr2004-Jun2006,Mar2007 checked 11/22/2007

--------------------------------------------------------
Berichte der Deutschen Chemischen Gesellschaft
IU bloomington alf QD1.D4 NWU sci 540.6D48 OSU sel compact QD1.D48 PU chem 540.5D48 & hicks 540.5D48 UC chem (Oesper Rm) QD1.D4 UD roesch rare QD1.D4 UIC science UK chem/phys QD1.D4 UL kersey QD1.D4 UM ONLINE & shapiro QD1.D486b & hatcher QD1.D486b & buhr QD1.D486b UT hodges closed QD1.D4

--------------------------------------------------------
Boltzmann-Festschrift

J. H. van't Hoff, Boltzmann-Festschrift 1904, S. 233.

--------------------------------------------------------
Bosch Telecom

"CECC-parts with Pure Sn for Pretinning for VJ-capacitors," September 1996.

--------------------------------------------------------
Brass World
The Brass world and Platers Guide
OSU depos TS200B82 UM buhr TS200.P72 WSU storage

--------------------------------------------------------
British Chemical Abstracts
OSU depos QD1C52 PU hicks 540.5B77 UC biol QP1.P4 UK chem/phys QD1.B8 UL ekstrom QD1.B68 UM QD1.B8621 & shapiro QD1.B8621 UT hodges QD1.B68

--------------------------------------------------------
British Corrosion Journal
OSU sel TA462A1B7 UC engr TA462.B73 UK ONLINE & eng TA462.B73 UT hodges TA462.B73

--------------------------------------------------------
Bulletin of the American Physical Society
IU bloomington swain QC1.A512 & alf QC1.A512 NWU ONLINE & sci L530.6A512b OSU sel QC1A56 PU chem 530.5P56b & phys 530.5P56b UC phys QC1.A55 UD roesch UIC science QC1.A56 UK chem/phys QC1.A56 UL kersey QC1.A56 UM hatcher QC1.A524 UT hodges closed QC1.A58

--------------------------------------------------------
Cadalyst
http://www.cadalyst.com/cadalyst/ IU ONLINE NWU ONLINE OSU ONLINE PU eng 006.605C113 UC CAS T385.C338 UM ONLINE UT ONLINE
Jan2005-Nov2007 checked 11/22/2007

--------------------------------------------------------
Canadian Aeronautics and Space Journal
OSU sel TL501C3 UM buhr TL501.C23 UT hodges TL501.C2713

--------------------------------------------------------
Canadian Journal of Physics
IU blomington swain QC1.C21 & alf QC1.C21 NWU online & sci 530.5C212 OSU ONLINE & sel QC1C16 PU phys 506N213j & hicks 506N213j UC phys QC1.C3 UD roesch UIC science QC1.N3323 UK chem/phys QC1.C360 UL kersey QC1.N332 UM ONLINE & shapiro QC1.C21 UT hodges QC1.C36

--------------------------------------------------------
Capacitor and Resistor Technology Symposium
LH TK7872.C85
85-86,88-99,02-04 checked 10/26/2007

Blum, W, , R. Kullman, et al "On the Scope of Whisker Risk of Pure Tin Terminated SMD-Resistors", Capacitor and Resistor Technology Symposium (CARTS) Europe, October 15-17, 2002, pp.234-238

--------------------------------------------------------
(new source 1/29/2007)
CENS.com
http://cens.com/cens/html/en/index.html
checked 1/29/2007

--------------------------------------------------------
Chemical and Engineering News
OSU sel TP1J862 UC ONLINE & chem TP1.I63 UK chem/phys TP1.C35 UL ONLINE & kersey TP 1.C35

--------------------------------------------------------
Chemical Engineer
OSU sel & compact TP1I592 PU hicks 540.5C383 UC engr TP1.I7 UD roesch 2nd UK eng TP1.C445 UL kersey TP1.C524 UT ONLINE & hodges TP1.C356

--------------------------------------------------------
Chemical Market Reporter
OSU ONLINE & sel HD9650.1C486 UC engr TP1.O4 UK ONLINE UL kersey TP1.O4 UT ONLINE & hodges TP1.O4

--------------------------------------------------------
Chemisch Weekblad
NWU sci L540.5C5175 OSU depos QD1C6 PU hicks 540.5C42 UC SW depos QD1.C68 UIC warehouse QD1.C6885 UK King QD1.C6885 UM buhr QD1.M188

--------------------------------------------------------
(new source 11/20/2007)
Chemistry of Materials
UD ONLINE & Roesch UK ONLINE & chem/phys QD1.C7448 UL robotic UM ONLINE & QD1.C74481

-------------------------------------------------------
The Chinese Journal of Nonferrous Metals
Zhongguo Youse Jinshu Xuebao
LH closed

Xie, Hai-Ping, Yu, Da-Quan, Ma, Hai-Tao, Wang, Lai Microstructure, wettability and mechanical properties of Sn-Zn-Cu lead free solder Chinese Journal of Nonferrous Metals. Vol. 14, no. 10, pp. 1694-1699. Oct. 2004

--------------------------------------------------------
Chinese Journal of Semiconductors
Pan Tao Ti Hsueh Pao
LH closed

--------------------------------------------------------
Chinese University of Hong Kong Technical Conference (new name)

Shih, Richard L. H, , Metallurgy and stability of the pure Sn/Ni and Sn/Cu interface for lead-free flip chip application, The Chinese University of Hong Kong Technical Conference Taipei, Taiwan December 2002 pag 77

--------------------------------------------------------
Chip Scale Review
http://www.chipscalereview.com/issues/0406/index.php
Mar1998-Sept2007 checked 11/17/2007

--------------------------------------------------------
ChipPAC

Prasad, Swaminath, & Flynn Carson, G.S. Kim, J.S. Lee, Y.C.Park, Y.S. Kim &K.S.Min Plating Chemical Evaluations and Reliability of Lead-Free Lead frame Packages, ChipPAC (Santa Clara) -ChipPAC(Korea).

--------------------------------------------------------
Circuit World
ISU parks TK7867.A8 LH closed MSU ONLINE NWU ONLINE OSU ONLINE UC ONLINE UCB ONLINE UCI ONLINE & sci TK 7867 C573 UH ONLINE UK ONLINE UL ONLINE UM ONLINE UT ONLINE UTo ONLINE WSU ONLINE
v1#1-V34#1 checked 3/31/2008

--------------------------------------------------------
(new source 1/3/2007)
Circuitnet
http://www.circuitnet.com/
checked 1/3/2007

--------------------------------------------------------
Circuitree
http://www.circuitree.com/ AU ONLINE GIT ONLINE KSU ONLINE KU ONLINE LH closed MSU ONLINE UCB ONLINE UCF ONLINE UF ONLINE UNF ONLINE UT ONLINE WSU ONLINE
v13#3-v20#11 checked 11/22/2007

Handwerker, C. A. (METALLURGY DIVISION - 855) Lead-Free Solders: A Change in the Electronics Infrastructure Circuitree - September 01, 1999

Zhang, Y, , Circuitree, vol. 12, no. 11, pp. 10 - 22, November 1999.

--------------------------------------------------------
Circuits Assembly
http://www.circuitsassembly.com/ Lexmark OSU ONLINE UCI ONLINE UK ONLINE UT ONLINE UTo ONLINE WSU ONLINE
v12#4-V19#2 checked 2/17/2008

--------------------------------------------------------
Circuits Manufacturing
AU rbd TK7868.P7C543 ISU parks TK7869.C57x Lexmark LH closed PU hicks 621.381505C496

--------------------------------------------------------
(new source 11/20/2007)
Collection of Technical Papers - 45th AIAA Aerospace Sciences Meeting

Corbitt, N., Ngo, C. C., and Lai, F. C., "Effects of thermal and vibrational cycles on stresses in lead-free solder joints," Collection of Technical Papers - 45th AIAA Aerospace Sciences Meeting, vol. 11, pp. 7526-7533, 2007.

--------------------------------------------------------
Compliance Engineering
http://www.ce-mag.com/ Lexmark TH7800.C65 PU eng 343.7309945C738

--------------------------------------------------------
(new source 12/30/2006)
Components in Electronics
http://www.cieonline.co.uk/cie2/
checked 12/30/2006

--------------------------------------------------------
Composites Part A: applied science and manufacturing
NWU ONLINE & sci L620.11805C737a OSU ONLINE & sel TA418.9C6C628 PU ONLINE & eng 620.1105C738 UC ONLINE & eng TA418.9.C6C62 UD ONLINE UIC ONLINE & daley TA418.9.C6C63 UM ONLINE SD UT ONLINE & hodges TA418.9.C6C65

--------------------------------------------------------
Comptes Rendus Hebdomadaires des S�ances de l'Acad�mie des Sciences
AU rbd closed Q46.A14 GIT storage Q46.A14 NWU sci 506P23 OSU depos Q46P23 PU math 506Ac1ab & hicks 506Ac1ab UC chem (Oesper Rm) Q46.A143 UCI sci microform S-000210 UIC various UK chem/phys Q46.A14 & king Q2.A25 UL kersey Q46.A142 & Q46.A14 UM hatcher Q46.A14C7 & buhr Q46.A14C7 UT hodges Q46.A14Ser.2 WSU storage & sci

Compt. rend. 47, 106, Nov. 1868. *** not applicable ***

--------------------------------------------------------
Computer Law and Security Report
NWU ONLINE OSU ONLINE UC ONLINE UD ONLINE UIC ONLINE UM ONLINE UT ONLINE UTo ONLINE WSU ONLINE

--------------------------------------------------------
Computers, Materials and Continua
UCI ONLINE
v1#1-v4#1

-------------------------------------------------------
Conference Proceedings nth European Microwave Conference
GIT main TK7876.E87 IEEE XPLORE UCF main TK7876.E87 UCI sci TK7876.E87 UM TK7876.E88 UT hodges TK7876.E87 UTo depos TK7876.E87
1969-2007 checked 2/12/2008

--------------------------------------------------------
Conference Record of the xxxx International Display Research Conference
IEEE XPLORE NWU ONLINE PU hicks 621.38In7 UC engr microfiche 6491CM3071-8 UH TK7882.I6I168 & TK5103.5D5 UM TK5.I12
1982,1985,1988,1991 checked 12/24/2007

--------------------------------------------------------
Conformity
http://www.conformity.com/
v10#1-v12#1,v12#3 checked 11/17/2007

--------------------------------------------------------
Connect
http://www.twi.co.uk/j32k/unprotected/band_1/connect_archive.html NWU ONLINE UIC ONLINE UT ONLINE
checked 11/22/2007

--------------------------------------------------------
Connector Specifier
http://www.connectorspecifier.com/ NWU ONLINE OSU ONLINE UK ONLINE UT ONLINE
v16#1-v23#5 checked 11/17/2007

--------------------------------------------------------
(new source 1/8/2007)
Control Engineering
http://www.controleng.com/ UD ONLINE UK eng TJ212.C6 UM ONLINE & TA165.A1C76

--------------------------------------------------------
Corporate Environmental Strategy
OSU ONLINE & HD30.255.C6 UC ONLINE UCB ONLINE UF ONLINE USF ONLINE UT ONLINE & hodges HD30.255.E67 UTo ONLINE WSU ONLINE

Veleva, Vesela, and Sethi, Suresh, "The Electronics Industry in a New Regulatory Climate: Protecting the Environment and Shareholder Value," Corporate Environmental Strategy , vol. 11 no. 9, pp. 2-207-2-224, Oct. 2004.

--------------------------------------------------------
Corrosion
OSU TA462C75 UC engr TA462.C65 UK eng TA462.C65 UL kersey TA462.C65 UT ONLINE
v7#10

--------------------------------------------------------
Corrosion Science
OSU ONLINE & sel TA462C83 UC ONLINE & engr TA462.C678 UK ONLINE SD & eng TA462 .C659 UL ONLINE & kersey TA 462.C659 UM ONLINE SD UT ONLINE UTo ONLINE & carlson WSU ONLINE
v47#1-v50#4 checked 3/31/2008

--------------------------------------------------------
Dataweek
http://dataweek.co.za/
-Oct2007 checked 11/22/2007

--------------------------------------------------------
De Ingenieur
IS parks TA4.In4 UT hodges closed TA4.I4

--------------------------------------------------------
Defense Electronics
http://rfdesign.com/

--------------------------------------------------------
Design News
http://www.designnews.com/archive/
v60#1-v62#17 checked 11/19/2007

--------------------------------------------------------
(new source 3/19/2008)
DesignCon
99-00 checked 3/19/2008

," Designcon 1997 ," DesignCon 1998 ," DesignCon 2001, Santa Clara, CA, Jan. 29-Feb. 1, 2001, pp. .

," DesignCon 2002, Santa Clara, CA, Jan. 28-31, 2002, pp. .

," DesignCon 2003, Santa Clara, CA, Jan. 27-30, 2003, pp. .

," DesignCon East 2003, Boston, MA, June 23, 2003, pp. .

," DesignCon 2004, Santa Clara, CA, Feb. 2-5, 2004, pp. .

," DesignCon East 2004, Boxborough, MA, Apr. 5-7, 2004, pp. .

," Euro DesignCon 2004, Munich, Germany, Oct. 11-14, 2004, pp. .

," DesignCon 2005, Santa Clara, CA, Jan. 31-Feb. 3, 2005, pp. .

," DesignCon East 2005, Worcester, MA, Sept. 19-21, 2005, pp. .

," Euro DesignCon 2005, Munich, Germany, Oct. 24-27, 2005, pp. .

," DesignCon 2006, Santa Clara, CA, Feb. 6-9, 2006, pp. .

," DesignCon 2007, Santa Clara, CA, Jan. 29-Feb. 1, 2007, pp. .

," DesignCon 2008, Santa Clara, CA, Feb. 4-7, 2008, pp. .

--------------------------------------------------------
Desktop Engineering
http://www.deskeng.com/
checked 11/22/2007

--------------------------------------------------------
Diffusion and Defect Data Pt.B: Solid State Phenomena
GIT main QD543.D53X OSU sel QC611.8.P64P67 UC engr various UCF main QD543.D55 UK chem/phys QD543.D573
v105

--------------------------------------------------------
Discussions of the Faraday Society
NWU sci 541.3706F219d & geo 541.372F219i OSU sel QD1F23 PU chem 541.3F22 & hicks 541.3F22 UC chem (Oesper Rm) TK1.F24 UD roesch UIC science UK chem/phys QD1.F32 UL kersey QD1.F32 UM ONLINE & shapiro QD1.F22d & buhr TK1.F221D6 UT hodges closed TK1.F23

--------------------------------------------------------
Display Manufacturing Technology Conference, Digest of Technical Papers

Nis, John R, "TAB driver interconnection process for automated assembly Display Manufacturing Technology Conference, Digest of Technical Papers, 1997, pp. 57-58

--------------------------------------------------------
Doktorsavhandlingar vid Chalmers Tekniska Hogskola
AU rbd T7.G68 GIT main T7.G64X OSU depository T4G65 UK king T7.D650 UM hatcher T4.G675

An electron microscopy study on materials in electronic packaging Ye, Li-Lei Doktorsavhandlingar vid Chalmers Tekniska Hogskola no. 1875, 2002, p 1-53

--------------------------------------------------------
Drud. Ann,

Drud. Ann. 10, 647 (1903).

--------------------------------------------------------
ECN
http://www.ecnmag.com/ IU ONLINE NWU ONLINE OSU ONLINE UK ONLINE UT ONLINE
-Nov2007 checked 11/22/2007

--------------------------------------------------------
EDN
http://www.edn.com/archive/ IU ONLINE KYVL NWU ONLINE OSU ONLINE PU eng 621.305EL223 UC eng TK1.E323 UD roesch UIC ONLINE & daley TK1.E267 UK ONLINE UL kersey TK1.E266 UM TK1.E117 UT ONLINE & hodges TK7870.E515
-Dec2007(v52#25) checked 12/5/2007

------------------------------------------------------
EE Times
Electronic Engineering Times
http://www.eetimes.com/ IU ONLINE OSU ONLINE PU eng 621.38105EL245 UC eng TK7815.E43 & cas TK7815.E43 UM ONLINE UT ONLINE UTo ONLINE
checked 11/23/2007

--------------------------------------------------------
EE Times - Asia
http://www.eetasia.com/
checked 11/23/2007

-------------------------------------------------------
EE Times Europe
http://www.eetimes.eu/uk/
checked 11/23/2007

--------------------------------------------------------
Electro International

--------------------------------------------------------
Electrochemical and Solid-State Letters
IU bloomington chem QD551.E48 NWU ONLINE & sci L541.3705E385 OSU sel TK7871E38 PU ONLINE & chem 541.3705EL255 UC eng TK7871.E38 & chem TK7871.E38 UD ONLINE UIC daley TK7871.E38 UK ONLINE & eng TK7871.E38 UL kersey TK7869.E35 UM ONLINE SD UT ONLINE & hodges TK7871.E38

--------------------------------------------------------
Electrochemical Society Proceedings
OSU sel various UC engr TS645.I57

Zhang, Y, and J. A. Abys, "A Unique Electrodeposition Process of a Lead-Free Solder - Pure Tin", Electrochemical Society Proceedings 96-21, pp. 159 - 176, 1997.

--------------------------------------------------------
Electrochimica Acta
IU ONLINE OSU ONLINE & sel TP1.E4 PU chem 541.37EL25 UC ONLINE & engr TP1.E5 UD ONLINE UK ONLINE SD & chem/phys QD1.E376 UL ONLINE & kersey QD551.E43 UM ONLINE & shapiro QD1.E42 UT ONLINE & hodges TP250.E64
v50#3

--------------------------------------------------------
Electronic Business
http://www.edn.com/
IU ONLINE KYVL Lexmark NWU ONLINE & main L338.4621E37 OSU ONLINE & bus HD9696A3U5E55 PU manage 338.4762130973EL24 UC langsam HD9696.A3U5376 UD roesch UIC warehouse HD9696.A3U5376 UK ONLINE UM ONLINE UT ONLINE
checked 11/11/2007

--------------------------------------------------------
Electronic Components & Materials
Proceedings of International Conference on Electronic Components & Materials LH TK7869.I57
1989

Yong, Yan (Sichuan Res. Inst. of Nonferrious, Chengdu, China); Jiang Xiao-hu; Zhang Ji-zhong; Xu Jian-yang High performances Sn-Cu electronic lead-free solder Electronic Components & Materials, v 24, n 4, April 2005, p 54-6

Fu-ping, Liao (Sch. of Mater. Sci. & Eng., Nanchang Univ., China); Zhou Lang; Huang Hui-zhen Creep behavior of lead-free electronic solder alloys Electronic Components & Materials, v 24, n 4, April 2005, p 65-7

--------------------------------------------------------
Electronic Design
http://www.elecdesign.com/ IU ONLINE Lexmark NWU ONLINE OSU sel TK7800E37 PU eng 621.305EL248 UC eng TK7800.E37 UIC ONLINE UK eng TK7800.E437 UL kersey TK7800.E37 UM TK7869.E38 UT ONLINE & hodges TK7800.E4
v54#28-v55#27 checked 12/1/2007

--------------------------------------------------------
Electronic Device Failure Analysis
LH closed

-------------------------------------------------------
Electronic Manufacturing
Lexmark UT hodges TK1.A3I46

--------------------------------------------------------
Electronic News
http://www.edn.com/ IU ONLINE lexmark NWU ONLINE OSU ONLINE & bus HD9696U5E4 PU eng 621.305EL2832 UC eng microfilm 49 UD roesch UIC ONLINE UK ONLINE UM ONLINE & HD9696.A3U5E45 UT ONLINE & hodges closed microfilm HD9696.U5E4
checked 11/24/2007

--------------------------------------------------------
Electronic Packaging and Production
Lexmark OSU ONLINE UK ONLINE UM ONLINE UT ONLINE
v35#6, v40#5

--------------------------------------------------------
Electronic Product Design
LH closed

Take legal action Electronic Product Design, vol. 25 no. 2, Feb. 2004, pp. 35-36

Preparation is the key to RoHS and WEEE Electronic Product Design, vol. 25 no. 4, April, 2004, pp. 12

Clements, Vic Impacts and issues for WEEE Electronic Product Design, vol. 25 no. 4, April, 2004, pp. 48

Thomas, Suzanne How trouble-free is lead-free? Electronic Product Design, vol. 25 no. 11, Nov. 2004, pp. 28-30

Lefevre, Patrick Taking the lead in removing lead Electronic Product Design, v 27, n 6, June, 2006, p 17-18

Scotcher, Phil ROHS - The cost of compliance Electronic Product Design, v 27, n 6, June, 2006, p 21-22

--------------------------------------------------------
Electronic Production
LH closed

Putting lead-free into practice EP Electronic Production (London), vol. 29 no. 8, Sep, 2000, pp. 23

--------------------------------------------------------
Electronic Products
http://electronicproducts.com/ PU engr 621.38105EL26 UC engr TK7870.E543
v47#10-v50#7 (Dec07) checked 1/8/2008

--------------------------------------------------------
Electronics
Lexmark OSU QC1E38 UC engr QC544.V3A3 UK off-campus QC544.V3A3 UL kersey TK7800.E4384 UT ONLINE

--------------------------------------------------------
Electronics Cooling

v13#1-v13#4 checked 11/21/2007

--------------------------------------------------------
Electronics Manufacture and Test
http://www.emtonthenet.net/
June1998-Sept2004, Jan2005-May2005, Jan2006-July2006 checked 11/23/2007

--------------------------------------------------------
Electronics Manufacturing China

Shangguan, D, , Understanding Compatibility and Clarifying Issues in Lead-Free Transition. Electronics Manufacturing China, April 2004, pp. 20-24.

--------------------------------------------------------
Electronics Supply & Manufacturing
http://www.my-esm.com/;jsessionid=QVDXS2CZLDJ4IQSNDBOCKHSCJUMEKJVN
http://www.eetimes.eu/
Apr2004-Jun2007 checked 11/28/2007

--------------------------------------------------------
(new source 1/29/2007)
Nth Electronics Systemintegration Technology Conference
IEEE XPLORE UF ONLINE
2006 checked 12/24/2007

--------------------------------------------------------
Electronics Weekly
http://www.electronicsweekly.com/Home/Default.aspx http://www.edn.com/ UT ONLINE
98-11/24/07 checked 12/3/2007

--------------------------------------------------------
Electronics World
AU rbd TK6540.R668 FSU dirac 620.5W798 GIT main TK5700.W55 UA sterne microfilm TK7800.R668 UCF main TK7800.R668 UF science TK5700.W55 UH TK7800.R668 UK eng TK5700.W55 UL kersey TK 7800 .R668 OSU sel TK6540.R118 UCB eng TK5700.W55 USF TK5700.W55 UTo carlson WSU sci
v106#1765-v113#1855 checked 10/23/2007

--------------------------------------------------------
Electroplating & Finishing
http://www.plating.org/english/Search.asp?action=search
checked 11/26/2007

Fang, J-L Lecture series on final surface finishing process for PCB - II Process of replacement Sn plating for super thin flexible PCB with super density. Electroplating & Finishing. Vol. 23, no. 1, pp. 36-39. Feb. 2004

Li, Ming Applications of electroplating technology in electronic packaging Electroplating & Finishing. Vol. 24, no. 1, pp. 44-49. 2005

--------------------------------------------------------
Electroplating & Metal Finishing
OSU sel TS670A1E4 UM buhr TS670.A1E38 WSU storage
v28#5

--------------------------------------------------------
Elektron
http://www.eepublishers.co.za/view.php?sid=5779 (under EngineerIT, before Aug. 2006) GIT main TK1.E88X LH closed UI eng
Jan2005-Jun2006 checked 11/20/2007

--------------------------------------------------------
Elektronik
http://www.elektroniknet.de/ GIT main TK7800.E443 LH closed UT hodges TK7800.E443

--------------------------------------------------------
Elektronik Industrie
http://www.all-electronics.de/ei
Jan06-Dec06 checked 12/25/2006

--------------------------------------------------------
Elektronik Praxis
http://www.elektronikpraxis.de/ LH closed MSU ONLINE NWU ONLINE UCB ONLINE WUSL ONLINE

Cost of electrical component production in Germany Elektronik Praxis, n 3, 16 Feb. 2005, p 98-102 Language: German

--------------------------------------------------------
Embedded Technology

--------------------------------------------------------
xxxx Emerging Technologies Conference Proceedings
http://www.smta.org/knowledge/proceedings.cfm
97-98,00 checked 11/11/2007

--------------------------------------------------------
empfasis
http://www.empf.org/empfasis/
Jan2001-Nov2007 checked 11/26/2007

--------------------------------------------------------
emsnow
http://www.emsnow.com/
checked 11/27/2007

--------------------------------------------------------
Engineer
NWU sci 620.69E57 UK ONLINE UT ONLINE

--------------------------------------------------------
Engineering (London)
NWU sci L620.5E57 OSU depos TA1.E54 PU eng 620.5En32 UC eng TA1.E55 UK eng TA1.E55 UL kersey TA1.E55 UM TA1.E45 UT ONLINE WSU ONLINE & storage

--------------------------------------------------------
Engineering and Technology
IEEE XPLORE OSU sel TK1E65 PU eng 621.305En33 UD roesch UF ONLINE & science TK1.I4125
v1#1-v2#8 checked 12/31/2007

--------------------------------------------------------
Engineering Fracture Mechanics
IU NWU ONLINE OSU ONLINE & sel TA409A1E5 PU ONLINE & eng 620.1126En34 UC ONLINE & eng TA409.E5 UD ONLINE UIC ONLINE & daley TA409.E5 UK ONLINE & eng TA401.E576 UL ONLINE & kersey TA409.E5 UM ONLINE & TA409.E57 UT ONLINE & hodges TA401.E63

--------------------------------------------------------
Engineering Management
NWU ONLINE UK ONLINE UT ONLINE

--------------------------------------------------------
Engineering Technology
UC cas TA1.J64 LH closed

--------------------------------------------------------
EngineerIT
http://www.eepublishers.co.za/view.php?sid=6923
Jul2006-Oct2007 checked 11/20/2007

--------------------------------------------------------
Environmental Health Perspectives
UT ONLINE

--------------------------------------------------------
Environmental Impact Assessment Review
NWU ONLINE & main 333.71E61 OSU ONLINE PU hum 333.710973En89 UC ONLINE & eng TD194.6.E593 UD ONLINE UIC ONLINE UK ONLINE SD & young TD194.6.E593 (to 1982) UL ekstrom TD194.6.E593 UM ONLINE & TD194.6.E595 UT ONLINE

--------------------------------------------------------
Espec Technology Report
http://www.espec.co.jp/english/tech-info/tech_info/
#1-#21 checked 11/28/2007

--------------------------------------------------------
Eureka
LH closed MSU ONLINE NWU sci L620.105E89 UCB eng TA401.E9 UD roesch remote UM TA401.E561

"Polymers offer improved EMI shielding and design freedom," Eureka, vol. 26 no. 5, May, 2006, pp. 51.

*** not applicable ***

--------------------------------------------------------
EuroAsia Semiconductor
European Semiconductor
http://www.euroasiasemiconductor.com/ GIT main TK7871.85.E878
Dec03-Nov07 checked 11/26/2007

--------------------------------------------------------
EUROCORR 2004: Long Term Prediction & Modelling of Corrosion
LH CDRM 1294 UM TA418.76.E976 & TA445.5.C6749

Hansal, S, Pavetits, H, Hansal, W E G, Besenhard, J, Kronberger, H, Nauer, G E Corrosion behaviour of pulse plated tin-silver alloys EUROCORR 2004: Long Term Prediction & Modelling of Corrosion, Nice, France, 12-16 Sept. 2004. 2004

--------------------------------------------------------
European Electronics Engineer
http://www.engineerlive.com/european-electronics-engineer/
checked 12/25/2006

--------------------------------------------------------
European Journal of Operational Research
IU bloomington alf T57.6.E92 Lexmark NWU ONLINE & sci 001.424E895 OSU ONLINE & bus T57.6E96 PU ONLINE & eng 658.4034Eu74 UC ONLINE & langsam T57.6.E92 UD ONLINE & roesch UIC ONLINE & daley T57.6.E92 UK ONLINE SD UL ONLINE & kersey T57.6.E92 UM ONLINE & T57.6.E92 UT ONLINE & hodges T57.6.A1E8

--------------------------------------------------------
European Medical Device Manufacturer
http://www.devicelink.com/emdm/
Jan1997-Dec2007 checked 11/26/2007

--------------------------------------------------------
European Microelectronics & Packaging Conference

Ishii, Masahito, , Tatsuo Kataoka, Hiroaki Kurihara, "Whisker Problem in the Ultra-fine Pitch Circuits," l2th European Microelectronics & Packaging Conference, June 7 - 9, 1999. pp. 379-385.

--------------------------------------------------------
European Semiconductor Design Production Assembly

"Gold bumps off the danger list Jasper, Jorg, Shiels, Dave European Semiconductor Design Production Assembly, vol. 22 no. 7, Jul, 2000, pp. S-86-S-88.

"The vision thing Anon European Semiconductor Design Production Assembly, vol. 23 no. 4, Mar. 2001, pp. 81+83.

--------------------------------------------------------
Evaluation Engineering
http://www.evaluationengineering.com/ IU bloomington alf TK7869.E3 NWU ONLINE OSU ONLINE PU eng 621.38105Ev13 & hicks 621.38105Ev13 UM ONLINE & buhr TA168.A1E92 UT hodges K7870.E87
v45#12-46#12 checked 12/4/2007

--------------------------------------------------------
evertiq
http://www.evertiq.com/newsx/default.aspx
June14,2004-Nov27,2007 checked 11/27/2007

--------------------------------------------------------
Fastener World

--------------------------------------------------------
Fatigue and Fracture of Engineering Materials and Structures
IU ONLINE NWU ONLINE & sci microfiche S15 OSU ONLINE & sel TA418.38F382 PU ONLINE & eng 620.1123F269 & hicks 620.1123F269 UC ONLINE & eng TA630.F3 UD ONLINE UIC ONLINE UK ONLINE & eng TA418.38.F374 UL kersey TA418.38.F374 UM ONLINE & TA418.38.F25 UT ONLINE & hodges TA418.38.F374
v20#1-v31#1 checked 3/31/2008

--------------------------------------------------------
Feinwerktechnik, Mikrotechnik, Messtechnik
LH closed OSU sel Q184.Z48 UK king Q184.F18 UL ekstrom Q184.Z42

--------------------------------------------------------
Finishing
GIT ONLINE & main TT300.F53X LH closed MSU ONLINE OSU sel TS670A1E422 PU engr 667.905F495 UCB ONLINE UT ONLINE WSU ONLINE
v7#10-v30#6

--------------------------------------------------------
Finishing Today
Industrial Paint and Powder
http://www.ippmagazine.com/ http://www.finishingtodaymag.com/ IU ONLINE NWU ONLINE OSU ONLINE PU eng 667.605In2 UK ONLINE UM ONLINE UT ONLINE UTo ONLINE WSU ONLINE
v79#1-v83#11,v84#1-v84#3 checked 3/31/2008

--------------------------------------------------------
Flexo
GIT main Z252.5.F6F638x

Caudill, Cheryl Are you keeping up? Flexo, v 31, n 8, August, 2006, p 36-37

-------------------------------------------------------
(new source 1/5/2007)
flipchips.com
http://www.flipchips.com/
checked 11/27/2007

-------------------------------------------------------
Focus on Tin

"Tin 'whiskers' and how to avoid them," Focus on Tin, no. 3, pp. 3, Summer 1994.

--------------------------------------------------------
Fujikura Technical Review
http://www.fujikura.co.jp/gihou/gihou34e/gihou34e.html
Jan2000-Jan2007 checked 11/27/2007

--------------------------------------------------------
Fujitsu Scientific and Technical Journal
http://www.fujitsu.com/global/news/publications/periodicals/fstj/ OSU TK7800F9
v26#1-v43#4 checked 11/27/2007

--------------------------------------------------------
Furukawa Review
http://www.furukawa.co.jp/review/backnum.htm
May1999-Aug2006 checked 11/27/2007

--------------------------------------------------------
Galvanotechnik
http://www.galvanotechnik.com/gt/heft/uk_heftlink.asp LH closed WSU storage
checked 11/27/2007

Jostan, J.L. "Whisker Formation in Tin, Tin-Lead Alloys, Silver, and Gold" , Galvanotechnik, vol. 71, no. 9, pp. 946 - 955, Sept. 1980 (Language in German).

Strube, G, DAS ELEKTROLYTISCHE ABSCHEIDEN VON ZINN UND BLEI-ZINN-UEBERZUEGEN. (Electrolytic Deposition of Tin and Tin-Lead Coatings.) Galvanotechnik, vol. 73 no. 12, Dec. 1982, p 1330-1337

v. Leersum, I. Chromfreie Vorbehandlung - Statusbericht (Chromium-free pretreatment - a status report) Galvanotechnik, vol. 89 no. 5, May, 1998, p 1590-1594 Language: German

Koebbert, H.-O. Elektrotauchlackierung von Aluminium (Electrocoat painting of aluminum) Galvanotechnik, vol. 90 no. 1, Jan. 1999, pp. 158-167 Language: German

Thiery, L. Chrom(VI)-freie Oberflaechenbehandlung von Zink (Hexavalent chromium-free surface treatment of zinc) Galvanotechnik, vol. 91 no. 12, Dec. 2000, pp. 3373-3377 Language: German

Jordan, M. L�tbare bleifreie Schichten Solderable leadfree coatings, Galvanotechnik, vol. 92 no. 5, May, 2001, pp. 1225-1236

Preikschat, P. Chrom(VI)ersatz fur Zink und Zinklegierungen - Dickschichtpassivierung im kreuzverhor (An alternative to hexavalent chromium for zinc and alloy coatings - Thick film passivation under scrutiny) Galvanotechnik, vol. 92 no. 9, Sept. 2001, p 2373-2377+V Language: German

Reinhold, B.; Brettmann, M. Behandlung von aluminiumbauteilen und konstruktionen in mischbauweise (Treatment of aluminium components and assemblies in multi-metal constructions) Galvanotechnik, vol. 92 no. 10, October, 2001, pp. 2655-2663+IV Language: German

Jansen, R.; Preikschat, P. Chrom(VI)ersatz auf zink - Nachbehandlungsverfahren in der praxis (Hexavalent chromium replacement for zinc passivation - Post treatment processes in practice) Galvanotechnik, vol. 92 no. 12, December, 2001, pp. 3231-3238+V Language: German

Nowak, A.; Seidel, R. Verbesserung der Lackhaftung und des Korrosionsschutzes von Magnesium durch moderne Konversionsverfahren (Improved paint adhesion and corrosion protection of magnesium using modern conversion coatings) Galvanotechnik, vol. 95 no. 7, July, 2004, p 1724-1730+vi Language: German

Rauscher, Gerhard Neuartige chromfreie Vorbehandlungsverfahren fur die Aluminium-Lackbeschichtung (A novel chromium-free pretreatment process for painting of aluminium) Galvanotechnik, vol. 95 no. 11, Nov. 2004, p 2744-2751+vi Language: German

Crosby, Jeff, Lau, Danny Glanzendes Zinn mit niederem Kohlenstoffgehalt fur Steckverbinder (Bright tin with low carbon content for plug connectors) Galvanotechnik, v 96, n 2, February, 2005, p 311-322+v Language: German, English

Klobes, Karl-Hermann Zink- und Zinklegierungen - Massengalvanisierung im Automobilbau (Zinc and zinc alloys - Mass plating in automotive construction) Galvanotechnik, v 96, n 7, July, 2005, p 1562-1568+iv Language: German

Unruh, J.N. Chromabscheidung aus wassrigen Losungen - Teil 1: Chromsaurelosungen (Chromium electrodeposition from aqueous solution - Part 1: Chromic acid solutions) Galvanotechnik, v 96, n 9, September, 2005, p 2063-2071+v Language: German

Unruh, J.N.M. Chromabscheidung aus wassrigen elektrolyten teil 6: Die entwicklung der theorien (Electrodeposition of chromium from aqueous media - Part 6: Development of theories) Galvanotechnik, v 97, n 3, March, 2006, p 585-597 Language: German

Snyder, Donald L., Hill, Rock, Paulig, Franziska Dreiwertige und sechswertige dekorative chromverfahren im vergleich (Trivalent and hexavalent decorative chromium plating processes compared) Galvanotechnik, v 97, n 5, May, 2006, p 1117-1121+vi Language: German

Volk, P. Chrom(III)haltige passivierung fur aluminium (Trivalent chromium passivates for aluminium) Galvanotechnik, v 97, n 5, May, 2006, p 1122-1129+vi Language: German

Nagao, Toshimitsu, Sato, Kazuya, Otsuka, Kuniak, Nakagishi, Yutaka Herausforderung der chromfreien kunststoffbeschichtung (Challenge to chromium-free plastic plating method) Galvanotechnik, v 97, n 9, September, 2006, p 2124-2130+v Language: German, English

Dyllus, Thomas Glanzchromelektrolyt auf chrom(III)basis chrom(VI)gleichwertig in optik und bestandigkeit (Bright chromium deposits from a trivalent bath - Aesthetically and in performance, a match for hexavalent chromium plate) Galvanotechnik, v 97, n 9, September, 2006, p 2141-2147+vi Language: German

--------------------------------------------------------
GIDEP Alert

"Relay, Electromagnetic," Alert Number C6-A-91-03-V, April 1, 1991.

Heutel, K. J, , "Problem Notification - Tin Whisker Growth in Electronic Assemblies," GIDEP Alert F3-A-87-04A, February 19, 1988.

"Relay, Electromagnetic," GIDEP Alert Number F3-P-97-01-V, December 2, 1996.

J. Khuri, "Agency action notice," Government-Industry Data Exchange Program (GIDEP), Doc. no. AAN-U-02-104, Jul. 2002.

--------------------------------------------------------
Global Plastics Environmental Conference

Dawson, Raymond B.; Landry, Susan D.; Ranken, Paul Updates on end-of-life, safety, and regulatory aspects for flame retarded plastics used in electrical and electronic equipment Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, 2004, pp. 63-74

Bachman, Bonnie J.; Desai, Nitin B.; Kierl, William G.; Olson, William L.; Zollo, James A. Design for reuse: Where environmental regulations and business strategies meet Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, 2004, pp. 239-250

--------------------------------------------------------
Global SMT and Packaging
http://www.trafalgar2.com/ http://www.globalsmt.net/
v4#4,v5#1-v7#11 checked 11/17/2007

Goodman, Paul The impact of the WEEE and RoHS directives on electrical equipment manufacturers Global SMT and Packaging, vol. 3 no. 4, May, 2003, pp. 12-14

Lasky, Ronald; Jensen, Timothy Best practices in implementing Pb-free assembly Global SMT and Packaging, vol. 3 no. 8, Nov. 2003, pp. 10-15

Willis, Bob Secondary reflow failure - Another lead contamination defect Global SMT and Packaging, vol. 4 no. 1, December 2003/January 2004, 2003-2004, pp. 4-5

--------------------------------------------------------
Global Sources
http://www.globalsources.com/
checked 11/27/2007

--------------------------------------------------------
Government Computer News
http://www.gcn.com/archives/
checked 11/28/2007

--------------------------------------------------------
Government Microcircuit Applications Conference
UK eng TK7874.G580

Richardson, J. H, , and B.R. Lasley, "Tin Whisker Initiated Vacuum Metal Arcing in Spacecraft Electronics," 1992 Government Microcircuit Applications Conference, Vol. XVIII, pp. 119 - 122, November 10 - 12, 1992.

--------------------------------------------------------
Green SupplyLine
http://www.greensupplyline.com/
http://www.eetimes.eu/
http://www.electronicsweekly.com/
http://www.industrialcontroldesignline.com/
checked 11/28/2007

--------------------------------------------------------
Ground Water
UK geol GB1001.G75 UT ONLINE

--------------------------------------------------------
Hardware Secrets
http://www.hardwaresecrets.com/
checked 11/27/2007

--------------------------------------------------------
(new source 11/19/2007)
Harsh Environments Workshop

Hundt, Michael, "QFN 9X9 Solder Joint Reliability" (Harsh Environments Workshop, Indianapolis, IN, July 19-20, 2006)

--------------------------------------------------------
xxxx HD International Conference on High-Density Interconnect and Systems Packaging
xxxx International Conference on High-Density Interconnect and Systems Packaging
GIT UCB eng TK7874.I569 UH TK7874.I569
1999-2001

--------------------------------------------------------
Helvetica Physica Acta
IU bloomington alf QC1.H4 MSU remote QC1.H4 NWU sci 530.5H485 OSU sel QC1H48 PU ONLINE & phys 530.5An725 & 530.5H36 & 530.5 H36a & 530.6P21aa UC phys QC1.H4 UD roesch UIC science QC1.H4 UK king QC1.H4 UL kersey QC1.H4 UM shapiro QC1.H4 & buhr QC1.H4 UT hodges & closed QC1.H4 UTo carlson & depos WSU sci

--------------------------------------------------------
high-density interconnect
GIT main TK7870.15.I41x UCF main TK7870.15.I573 WSU sci TS510.P76

Winkler, S, and B. Horn, A Look at the Past Reveals a Lead-free Drop-In Replacement ATOTECH high-density interconnect Mar. 2001

--------------------------------------------------------
High-Purity Substances
Vysokochistye Veshchestva
ISU parks TP156.P83H54x

--------------------------------------------------------
Human Systems Management
MSU ONLINE NWU ONLINE OSU ONLINE UC SW depos HD28.H8 UIC ONLINE UL ekstrom HD28.H85 UM ONLINE & hatcher HD28.H92 & buhr HD28.H92 UT ONLINE & hodges HD28.H85 UTo ONLINE WSU ONLINE

--------------------------------------------------------
IBM Journal of Research and Development
KYVL Lexmark UM ONLINE & Q1.I12 UT ONLINE

--------------------------------------------------------
IEE Colloquium on Assembly and Connections in Microsystems
IEEE XPLORE
1997 checked 12/24/2007

--------------------------------------------------------
IET Communications Engineer
IEE Communications Engineer
http://www.iee.org/oncomms/sector/communications/magazine.cfm IEEE XPLORE NWU ONLINE OSU ONLINE UD Roesch UL ONLINE & kersey TK6540.R262322 UM ONLINE & TK5101.A1C76 UT hodges TK5101.A1C64
v1#1(Feb2003)-v5#6(Dec07-Jan08) checked 3/31/2008

--------------------------------------------------------
IEEE Aerospace Conference Proceedings
IEEE XPLORE UM ONLINE & TK5.I12 UTo carlson TL3000.A1I18a WSU ONLINE
1997-2007 checked 2/5/2008

--------------------------------------------------------
IEEE Annual International Reliability Physics
IEEE XPLORE UK eng TK 7870.S98
1995-2007 checked 2.5.2008

--------------------------------------------------------
IEEE Applied Power Electronics Conference and Exposition (APEC)
IEEE XPLORE OSU ONLINE & sel TK7881.15I34 UC ONLINE & depository TK7881.15.I32 UK eng TK7881.15.I32a UM TK5.I12 UT hodges TK7881.15.I14
1998-2007 checked 2/5/2008

--------------------------------------------------------
IEEE International Conference on Polymers and Adhesives
IEEE XPLORE UM ONLINE
2001-2005 checked 12/24/2007

----------------------------------------------------
Nth International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
IEEE XPLORE
01-02,04-07 checked 2/5/2008

," 3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Montreux, Switzerland, Oct. 21-23, 2003, pp.

----------------------------------------------------
(new source 11/20/2007)
IEEE International Conference on Semiconductor Electronics

IEEE XPLORE UM TK5.I12
96,98,00,02,04,06 checked 2/5/2008

----------------------------------------------------
Nth International Conference on Electronic Materials and Packaging
IEEE International Symposium on Electronic Materials and Packaging
International Symposium on Electronic Materials and Packaging
IEEE XPLORE
00-02,05-06 checked 2/14/2008

--------------------------------------------------------
IEEE International Symposium on Electronics & the Environment
Proceedings of the xxxx IEEE International Symposium on Electronics & the Environment
IEEE XPLORE OSU sel TK7835.I34 UK ONLINE & eng TK7835.I340 UM ONLINE & TK5.I12 UT hodges TK7835.I34 WSU sci TK7835.I33
1993-2007 checked 2/5/2008

--------------------------------------------------------
IEEE International Symposium on Polymeric Electronics Packaging
IEEE XPLORE UM TK5.I12
1997 checked 2/5/2008

--------------------------------------------------------
IEEE Microwave and Wireless Components Letters
IEEE XPLORE NWU ONLINE & sci L621.3813I222 OSU ONLINE & sel TK7876I46 PU ONLINE & eng 621.381305In7 UC ONLINE UD ONLINE UIC ONLINE & daley TK7800.I19 UK ONLINE & eng TK7876.I480 UL ONLINE UM ONLINE & TK7876.I1831 UT ONLINE & hodges QC685.I44

--------------------------------------------------------
xxxx IEEE MTT-S International Microwave Symposium Digest
IEEE XPLORE IU indianapolis TK7876.I18 OSU ONLINE & sel TK7876.I463 PU hicks 621.3813In75 UC ONLINE UK eng TK7876.I18a UL kersey TK7876.I18a UM ONLINE & TK5.I12 UT hodges TK7876.I18

--------------------------------------------------------
IEEE Nuclear Science Symposium Conference Record
IEEE EXPLORE UM ONLINE & TK5.I12
2003

--------------------------------------------------------
IEEE Potentials
IEEE XPLORE
v19#1(2000)-v27#2 checked 3/31/2008

--------------------------------------------------------
IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, RFIC, Digest of Technical Papers
IEEE XPLORE UM ONLINE & TK5.I12
1997-2007 all checked 2/5/2008

--------------------------------------------------------
(new source 11/20/2007)
IEEE Region 10 Annual International Conference, Proceedings
xxxx IEEE Region 10 Conference
xxxx IEEE Region 10
IEEE XPLORE UK eng TK7801.T74 & TK7885.T15
05-07 checked 2/24/2008

--------------------------------------------------------
xxxx IEEE Symposium on Product Safety & Compliance Engineering
IEEE Symposium on Product Compliance Engineering
IEEE XPLORE
04-07 all checked 2/5/2008

--------------------------------------------------------
IEEE Topical Meeting on Electrical Performance of Electronic Packaging
xxxx IEEE Electrical Performance of Electronic Packaging
IEEE XPLORE OSU ONLINE UC depository TK7800.I26 UM ONLINE & TK5.I12
1992-2007 all checked 2/5/2008

--------------------------------------------------------
(new source 4/3/2008)
IEEE Transactions on Electrical Insulation
UM ONLINE

--------------------------------------------------------
IEEE Transactions on Advanced Packaging
IEEE XPLORE Lexmark OSU ONLINE & TK7870A1I2723 UC ONLINE & engr TK7869.I184 UD ONLINE & roesch 2nd UK ONLINE & eng TK1.I5340 UL ONLINE & kersey TK7869.I182 UM ONLINE & TK5700.I58cpnb UT ONLINE & hodges TK7800.I543
v22#1-v31#1 checked 2/12/2008

--------------------------------------------------------
IEEE Transactions on Components and Packaging Technologies
IEEE XPLORE OSU ONLINE & sel TK7870.A1I27225 UC ONLINE & engr TK7869.I1825 UD ONLINE & roesch 2nd UK ONLINE & engr TK7869.I183 UL ONLINE & kersey TK7869.I18 UM TK5700.I58cpna UT hodges ONLINE & TK7800.I54 UTo carlson WSU ONLINE & sci
v22#1-v31#1 checked 3/31/2008

--------------------------------------------------------
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
IEEE XPLORE Lexmark OSU ONLINE & sel TK7870.A1I2722 UC ONLINE & eng TK7869.I18 UD ONLINE & roesch UK ONLINE & eng TK1.I530 UL ONLINE & kersey TK7869.I18 UM ONLINE & TK5700.I58cpna UT hodges TK7800.I54 92-93
v1#1-v16#8 all issues checked 10/29/2007

--------------------------------------------------------
IEEE Transactions on Components, Packaging, and Manufacturing Technology
IEEE XPLORE Lexmark OSU ONLINE & sel TK7870.A1I2723 UC ONLINE & TK7869.I18 UD ONLINE & Roesch 2nd UK ONLINE & eng TK7869.I183 UL ONLINE & kersey TK7869.I18 UM ONLINE & TK5700.I58cpn UT ONLINE & hodges TK7800.I543 Part A 94-98 Part B 94-98 Part C 96-98
v17#1-v21#4 all issues checked 10/29/2007

--------------------------------------------------------
IEEE Transactions on Device and Materials Reliability
IEEE XPLORE NWU ONLINE & sci 621.38105I225 OSU ONLINE & sel TK7800I214 PU ONLINE & eng 621.38105Ie2 UC ONLINE UD ONLINE UIC ONLINE & daley TK7870.23.I34 UK ONLINE & eng TK7870.23.I34 UL ONLINE & kersey TK7870.23.I34 UM ONLINE & TK7870.23.I44 UT ONLINE & hodges TK7870.23.I34
v1#1-v8#1 checked 3/31/2008

--------------------------------------------------------
IEEE Transactions on Electronics Packaging Manufacturing
IEEE XPLORE UM ONLINE UT ONLINE UTo ONLINE & carlson WSU ONLINE & sci
v18#1-v21#2,v22#1-v31#1 checked 3/31/2008

--------------------------------------------------------
IEEE Transactions on Microwave Theory and Techniques
IEEE XPLORE Lexmark UM ONLINE & TK5700.I58m UT ONLINE
v50#12

--------------------------------------------------------
IEEE Transactions on Plasma Science
IEEE XPLORE OSU ONLINE & sel QC717.6I3 UC engr TA2001.I18 UD ONLINE & roesch 2nd UK eng TA2001.I18a UL ONLINE & TA2001.I18 UM ONLINE & TK5700.I58 UT ONLINE & hodges QC717.6.I44

--------------------------------------------------------
IEEE/ASME Journal of Microelectromechanical Systems
IEEE XPLORE UM ONLINE
v11#1(2002)-v17#1 checked 3/31/2008

--------------------------------------------------------
Nth IEEE/CPMT International Electronic Manufacturing Technology Symposium
Nth IEEE/CHMT European International Electronic Manufacturing Technology Symposium
Nth IEEE/CHMT International Electronic Manufacturing Technology Symposium
Nth IEEE/CPMT International Electronics Manufacturing Technology Symposium
IEEE/CPMT/SEMI Nth International Electronics Manufacturing Technology Symposium
Nth IEMT/IMC Symposium
xxxx IEMT/IMC Symposium
Nth International Conference on Electronics Manufacturing and Technology
Nth International Electronic Manufacturing Technology
Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference
Proceedings of xxxx Japan International Nth IEEE/CPMT International Electronic Manufacturing Technology Symposium
Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology Symposium
Proceedings of the Nth IEEE/CPMT International Electronic Manufacturing Technology Symposium
Proceedings of xxxx Japan International Electronic Manufacturing Technology Symposium
AU ONLINE & rbd TK7836.I334 FSU dirac TK7881.I34 GIT ONLINE IEEE XPLORE Lexmark MSU eng TK7881.I5 NWU ONLINE OSU ONLINE & sel TS176.I463 PU hicks 621.381In8p UC ONLINE & microfiche 64 97CM 3606-8 UCB eng TK7881.I51 & pascal TK7881.I51 UCF main TK7836.I55 UF ONLINE UH TK7881.I23 UK ONLINE & eng TK7801.I18 & TK7881.I420 UM ONLINE & TK5.I12 UT hodges TK7836.I55
1-9,11-29,31-32 checked 3/21/2008

," (10th IEMT), Tokyo, Japan, 1991.

(9th in Washington D.C. was Oct. 1-2, 1990) (11th was Sept. 16-18, 1991) ," 30th International Electronics Manufacturing Technology Symposium , San Francisco, CA, July 11-13, 2005, pp. . (presentations only)

--------------------------------------------------------
IEEE/CPMT International Symposium on Advanced Packaging Materials
Nth International Symposium on Advanced Packaging Materials
IEEE XPLORE WSU ONLINE & sci TK7881.I2
1997-2007 checked 3/31/2008

--------------------------------------------------------
xxxx IEEE/CPMT Photonic Devices and Systems Packaging Symposium

John H. Lau / Agilent Technologies, Inc., CA S. W. Ricky Lee "Thermal Analysis of Vertical-Cavity Surface-Emitting LED/VCSEL Assembly with Lead-Free Flip Chip Interconnects ," 2002 IEEE/CPMT Photonic Devices and Systems Packaging Symposium , Palo Alto, CA, July 14-16, 2002, pp. .

J. Lau, Z. Mei, S. Pang, C. Amsden, J. Rayner and S. Pan "Nonlinear Time and Temperature Dependent Analysis of the Lead-Free Solder Sealing Ring of Photonic Switch ," 2002 IEEE/CPMT Photonic Devices and Systems Packaging Symposium , Palo Alto, CA, July 14-16, 2002, pp. .

--------------------------------------------------------
(new source 2/24/2008)
IET Circuits, Devices & Systems
UD ONLINE UM ONLINE
v1#1-v2#1 checked 3/31/2008

--------------------------------------------------------
III-Vs Review
OSU ONLINE PU ONLINE & chem 621.3815205T4133 UC ONLINE UCI ONLINE UD ONLINE UM ONLINE UT ONLINE UTo ONLINE

-------------------------------------------------------
Indian Journal of Pure & Applied Physics
UK king QC1.I53 OSU depository QC1I3915

--------------------------------------------------------
Industrial and Engineering Chemistry
NWU ONLINE & sci 660.5A613 OSU sel TP1J861 & depos TP1J861 PU eng 624.1Am28a & 660.05An78 & hicks 660.5In2 & 660.5In2n UD roesch UIC daley TP1.C35 & warehouse TP1.I6 UL kersey TP1.I6 & TP1.C35 & TP1.I615 UM ONLINE & shapiro TP1.I62 & buhr RA421.I38 & TP1.I62 UT ONLINE & hodges closed TP1.I6

--------------------------------------------------------
Industrial Control Design Line
http://www.industrialcontroldesignline.com/
checked 11/27/2007

--------------------------------------------------------
Industrial Finishing
AU rbd TT325.A1I6 FIT ONLINE GIT ONLINE & main TT300.I45X PU engr 667.605In2 UK ONLINE UL kersey TT325.A1I6 UM ONLINE UT ONLINE WSU ONLINE & storage

--------------------------------------------------------
Industry Week
http://www.industryweek.com/
Jan2004-Dec2007 checked 11/28/2007

--------------------------------------------------------
Information Display
Lexmark PU hicks 001.55505In3

--------------------------------------------------------
Innovation
http://www1.shimadzu.com/about/inno/index.html
#26=#37 checked 1/15/2007

--------------------------------------------------------
Inorganic Materials
KYVL NWU sci 620.11I58 OSU ONLINE & depos TN4A51 PU ONLINE & chem 620.11In7 UC ONLINE UD roesch UIC ONLINE & warehouse TN4.A334643 UK ONLINE UL kersey TN4.A334643 UM ONLINE UT ONLINE

--------------------------------------------------------
Institute

--------------------------------------------------------
Insulation/Circuits
OSU depository TK1.I55 PU hicks 621.305In7 UIC warehouse TK1.I46 UM buhr TK1.I597 UT hodges TK3331.I68

--------------------------------------------------------
Interface Science
OSU ONLINE & sel QD506.A1I55 PU ONLINE UC ONLINE UD ONLINE UIC ONLINE UM ONLINE UT ONLINE
v12#1

--------------------------------------------------------
Internal Conference on Lead Free Electronics

Use of Lead Free Solder Alloys in Electrical & Electronic Devices for the Automotive Industry Internal Conference on Lead Free Electronics, Soldertec. IPC. Junio 2003 pag 409.

--------------------------------------------------------
3rd International Brazing and Soldering Conference, April 23-27, 2006, San Antonio, TX.

Martin, J. J. ; Vianco, Paul Thomas ; Hlava, Paul Frank ; Rejent, Jerome Andrew ; Susan, Donald Francis Evaluation of the effects of Au content on intermetallic compound layer growth in Pb-Sn and Sn-Ag-Cu solder joints.

--------------------------------------------------------
xxxx International Conference on Advanced Packaging and Systems
GIT
2002

--------------------------------------------------------
International Conference on Crystal Growth
UTo carlson microform NAS1.26:190919

Kawanara, R. S. Nango, T. Hascgawa, and M. Ohtani, "Role of Lead in Growth Suppression and Growth Mechanism of Tin Proper Whisker", International Conference on Crystal Growth ...(ICCGCPS), vol. 10, n. 2, 148-156 1983,

--------------------------------------------------------
(new source 12/31/2007)
Nth International Conference on Electronic Measurement and Instruments
IEEE XPLORE UM ONLINE
07 checked 3/31/2008

--------------------------------------------------------
(new source 1/6/2007)
xxxx Nth International Conference on Electronic Packaging Technology
Nth International Conference on Electronic Packaging Technology
(various cities in China) IEEE XPLORE UK ONLINE UM ONLINE
03,05-06 checked 3/31/2008

--------------------------------------------------------
Nth International Conference on Information Technology Based Higher Education and Training
IEEE XPLORE UM ONLINE
2004-2006 checked 3/31/2008

--------------------------------------------------------
International Conference on Lead Free: Electronic Components and Assemblies
IPC/Jedec International Conference on Lead Free Electronic Components and Assemblies
3,5,7-8,12

Schetty, R, , "Tin Whisker Growth & The Metallurgical Properties of Electrodeposited Tin", IPC/JEDEC International Conference on Lead-Free Electronic Assemblies, Mar. 2002, pp. 137-145

Bergman, David W, "Why Industry Needs a Life Cycle Environmental Impact Evaluation of Tin-lead and lead-free solder", International Conference on Lead Free: Electronic Components and Assemblies, San Jose, CA, May 1-2, 2002, pp. 24.

Lal, S, , "Tin Whiskers: Their Appearance and Reduction in Electronic Connectors", 2nd IPC-JEDEC International Conference on Pb-Free Electronic Components and Assemblies, Taipei, Taiwan, Dec. 10, 2002, pp. 107-126

Freedman, M, and Lycoudes, N. JEDEC's Lead-Free Position Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 356 (2002)

Goudarzi, V. Lead-Free Solder Paste Evaluation and Implementation in Personal Communication Products Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 182 (2002)

Nimmo, K. Review of European Legislation and Lead-Free Technology Roadmap Internat. Conf. On Lead-Free Electronic Comp. And Assem, p.18 (2002)

Prasad, S. NEMI Pb-Free Task Group Report Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 68 (2002)

Romm, D. and Abbott, D. Component Issues for Lead-Free Processing Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 200 (2002)

Schetty, R. Tin Whisker Growth and the Metallurgical Properties of Electrodeposited Tin Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 139 (2002)

R. Schetty, "Tin whisker growth \\\& the metallurgical properties of electrodeposited tin," in Proc. IPC/JEDEC Pb-Free Conf., May 2002, pp. 1-25.

R. Schetty, Y. Zhang, and K. Hwang, "Whisker growth: The substrate effect and beyond," presented at the IPC-JEDEC Pb-Free Conf. Taipei, Taiwan, pp. 1-5, Dec. 2002.

S. Madra, "Thermo-mechanical characterization of lead-free tin plating: X-ray diffraction measurements and correlation with analytical and numerical models," in Proc. IPC-JEDEC Conf. Frankfurt, Germany, Jun. 2003.

K. Whitlaw, A. Egli, and M. Toben, "Preventing whiskers in electrodeposited tin for semiconductor lead frame applications," in IPC Int. Conf. Lead-Free Electronics Brussels, Belgium, Jun. 2003.

Geiger, D, , Arra, M, , and Shangguan, D, , Evaluation of Sn-Zn Solder Paste. Proceedings of IPC/JEDEC 2004 International Conference on Lead-Free Electronic Assemblies and Components, Singapore, Aug. 18-20, 2004.

Bixenman, Mike, Miller, Erik, and Rueda, Fernando, mike_bix@kyzen.com "Lessons Learned and Best Practices Developed for Cleaning Lead-Free Flux Residues from Printed Circuit Assemblies and Advanced Packages" (IPC/Jedec International Conference on Lead Free Electronic Components and Assemblies, Boston, MA, December 5-7, 2006)

Kato, Takahiko, Akahoshi, Haruo, Nakamura, Masato, Hashimoto, Tomoaki, and Nishimura, Asao, "Effect of Cu Leadframe Substance on Whisker Initiation from Electrodeposited Sn/Cu Coating" (IPC/Jedec International Conference on Lead Free Electronic Components and Assemblies, Boston, MA, December 5-7, 2006)

--------------------------------------------------------
International Conference on Lead-free Soldering
2005-2006 checked 4/28/2007

--------------------------------------------------------
(new source 11/29/2007)
Nth International Conference on Recent Advances in Space Technologies
Nth International Conference on Advances in Space Technologies
IEEE XPLORE UM ONLINE
03,05,07 checked 3/31/2008

--------------------------------------------------------
International Conference on Soldering and Reliability
2007 checked 10/11/2007

--------------------------------------------------------
International Journal of Adhesion and Adhesives
OSU ONLINE UC ONLINE UCI ONLINE UD ONLINE UK ONLINE SD UM ONLINE & TP967.I565 UT ONLINE UTo ONLINE WSU ONLINE
v1#1-v28#5 all checked 3/31/2008

--------------------------------------------------------
International Journal of Advanced Manufacturing Technology
IU ONLINE OSU ONLINE PU ONLINE & eng 670.4205In8 UC ONLINE UCI ONLINE UD ONLINE UK ONLINE UT ONLINE UTo ONLINE & carlson

-------------------------------------------------------
International Journal of Cast Metals Research
LH closed UM TS228.99.C37

--------------------------------------------------------
International Journal of Damage Mechanics
MSU ONLINE NWU ONLINE OSU ONLINE UIC ONLINE UD ONLINE UIC ONLINE UM ONLINE & TA409.I481 UTo ONLINE WSU ONLINE

--------------------------------------------------------
International Journal of Electronics
NWU ONLINE OSU ONLINE & sel TK7800.J6 PU ONLINE UC engr TK7800.J6 UD roesch UIC ONLINE UM ONLINE & TK7815.A1J86 UT ONLINE
v73#5

--------------------------------------------------------
International Journal of Environment and Pollution
GIT main TD1.I573
2002

--------------------------------------------------------
International Journal of Materials Research
GIT main TN3.Z45 LH closed OSU sel TN3Z48 PU eng 669.05Z3 & hicks 669.05Z3 UC ONLINE & eng TN3.Z45 UF science TN3.Z45 UM TN3.Z48 UT hodges TN3.Z45

-------------------------------------------------------
International Journal of Microcircuits and Electronic Packaging
http://www.imaps.org/journal/index1.asp PU engr 621.3817In7 & 621.38104605J826 UC ONLINE & engr TK7870.15.I58 UM TK7870.15.I581 WSU sci
v15#1-v25#3 checked 11/28/2007

--------------------------------------------------------
International Journal of Microelectronic Packaging Materials and Technologies

Li, Li, Morris, J.E. "Introduction to electrically conductive adhesives International Journal of Microelectronic Packaging Materials and Technologies, vol. 1 no. 3, 1998, pp. 159-175.

--------------------------------------------------------
International Journal of Physical Distribution & Logistics Management
IU ONLINE NWU ONLINE OSU ONLINE & bus HF5415.7.I572 PU hicks 658.7805In8 UC ONLINE & langsam HF5415.7.I55 UD ONLINE UIC ONLINE & daley HF5415.7.I552 UK ONLINE UL ekstrom HF5415.7.I61 UM ONLINE UT ONLINE & hodges HF5415.6.I68

--------------------------------------------------------
International Journal of Production Research
NWU ONLINE & sci L658.505I61 OSU ONLINE & sel T175A1I54 PU ONLINE & eng 658.5705In8 & hicks 658.5705In8 UC ONLINE & eng TS155.A1I64 UD roesch UIC ONLINE & daley TS155.A1I64 UK ONLINE & eng TS155.A1I64 UL kersey TS155.A1I64 UM ONLINE & TS155.A1I62 UT ONLINE & hodges HD28.I59

--------------------------------------------------------
International Journal of Services and Standards
LH closed

--------------------------------------------------------
International Journal of Solids & Structures
OSU ONLINE & TA349I5 UK ONLINE SD & eng TA349.I5 UL ONLINE & kersey TA349.I5 UT ONLINE
v36#1

--------------------------------------------------------
International Journal of Thermophysics
OSU ONLINE PU ONLINE & eng 620.11296In7 UC ONLINE & phys QC192.I57 UCI ONLINE UD ONLINE UK ONLINE & eng QC192.I57 UM ONLINE & shapiro QC192.I615 UT ONLINE & hodges QC192.I57 UTo ONLINE
v25#1-v29#1 checked 3/31/2008

-------------------------------------------------------
International SAMPE Electronics Conference
AU rbd TK7871.I577 PSU millar TK7871.I577a UD roesch TK7871.I577 USU lee TK7871.I577 UT hodges TK7871.I577
1987-1993,1998-2000,2002

Barbieri, R.; Coppari, G.; Rudland, D. Use of adhesive technology in the replacement of solder for the manufacture of the new fiat 500 ignition system International SAMPE Electronics Conference, vol. 7, 1994, pp. 51-56

McCormack, M.; Jin, S. Design and properties of new, Pb-free solder alloys International SAMPE Electronics Conference, vol. 7, 1994, pp. 394-404

Li, Lin, Chung, D.D.L. "Z-axis anisotropic electrically conducting polymer-matrix composite film International SAMPE Electronics Conference, vol. 7, 1994, pp. 482-486

Jackson, A.M. ; Artakl, I. ; Vianco, P.T. Manufacturing feasibility of several lead-free solders for electronic assembly Conference: 7. International Society for the Advancement of Material and Process Engineering materials processes electronics conference,Parssipany, NJ (United States),21-23 Jun 1994; Other Information: PBD: [1994]

--------------------------------------------------------
International SAMPE Symposium and Exhibition
OSU sel TA401.3N36 UM TL 950.S63

--------------------------------------------------------
International SAMPE Technical Conference
OSU sel TL950A1N32 UC depository TA401.3.I584 & engr TA401.3.N37 UCB eng TL698 .N294 UCI sci TA418.9.C6I5935 UM TA401.3.S675 UTo depos TL698.N28 WSU sci TA401.3.I584
1991,1995,2001-2002

--------------------------------------------------------
Nth International Spring Seminar on Electronics Technology
IEEE XPLORE
2001,2003-2007 checked 4/21/2008

--------------------------------------------------------
International Symposium on High Density Packaging and Microsystem Integration
Proceedings of the Nth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
IEEE XPLORE OSU ONLINE
04-07 checked 12/31/2007

--------------------------------------------------------
International Symposium on Microelectronics
International Microelectronics Symposium
Proceedings xxxx International Symposium on Microelectronics
AU rbd TK7874.I59 FSU dirac TK7874.I5925 GIT main TK7874.I5925 Lexmark TK7874.I5918 UCB eng TK7874.I5918 UCF main TK7874.I592 UF science TK7874.I5918a WSU sci TS510.P76
71-80,82-83,86-88,90-03

--------------------------------------------------------
(new source 12/17/2006)
Nth International Symposium on the Physical and Failure Analysis of Integrated Circuits
Proceedings of the Nth International Symposium on the Physical and Failure Analysis of Integrated Circuits
IEEE XPLORE
95-07 checked 12/24/2007

--------------------------------------------------------
International Symposium for Testing & Failure Analysis
Advanced Techniques in Failure Analysis Symposium (ATFA)
Conference Proceedings from the International Symposium for Testing and Failure Analysis
ISTFA Proceedings
Proceedings of the Nth International Symposium on Testing and Failure Analysis
LH CDRM OrSU valley TK7871.I591 OSU sel TK7870.A38 & sel TK7870.A3822 UC engr TK7871.I48 UCB eng TK7871.I595 UM TK5.I12& TK401.I581 UNL eng TK7871.85.A244 UT hodges TK7871.85.A39 & hodges TK7871.I4735
1976-1978,1981,1991,1993-2006

Evans, K. L, Anderson, T. A.; Kirkman, D. C. COMPARATIVE ANALYTICAL TECHNIQUES FOR THE DETERMINATION OF Pb IN SOLDER PLATED LEADS. AFTA Inc, 1984, pp. 247-253

Williams, Esther H. tin whiskers on flat pack lead plating between solder dip and sealing glass. AFTA, 1985, pp. 16-21

Williams, E. H, , "Tin Whiskers on Flat Pack Lead Plating Between Solder Dip and Sealing Glass," ISTFA Proceedings, pp. 16-21, 1985.

Westerhuyzen, D. H. Van, , Backes, P. G, , J.F. Linder, S.C. Merrell and R.L. Poeschel, "Tin Whisker Induced Failure in Vacuum," l8th International Symposium for Testing & Failure Analysis, v. 18, pp.407 - 412, October 17, 1992.

Armendariz, Norman J, Paulraj, Prawin Materials Characterization of Lead Free Compositions for Minimum Temperature SMT Processes at the SLI-Second Level Interconnect Solder Joint ISTFA 2004: 30th International Symposium for Testing and Failure Analysis, Boston, MA, USA, 14-18 Nov. 2004. pp. 261-266. 2004

--------------------------------------------------------
Nth International Wafer-Level Packaging Congress
Nth International Wafer Level Packaging Congress
http://www.smta.org/knowledge/knowledge.cfm
2004-2006 checked 11/11/2007

," 4th International Wafer Level Packaging Congress, San Jose, CA, Sept. 17-19, 2007, pp. xx-xx.

--------------------------------------------------------
InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
FSU dirac TK7870.25.I6 IEEE XPLORE OSU sel TK7870.25.I44 UK eng TK7870.25.I56 UM ONLINE & TK5.I12 UT hodges TK7870.25.I68
88,90,92,94,96,98,00,02,04,06 checked 12/24/2007

--------------------------------------------------------
IPC Conference
GIT main TK7868.P7I56X
1981

Schetty, R, "Whisker Growth Studies". Proceedings of IPC Annual Meeting, Session Y, paper B, October 2001, Orlando, PL, USA.

Egli, A, , W Zhang, J Heber, F. Schwager, M. Toben, "Where Crystal Planes Meet: Contribution to the Understanding of the Tin Whisker Growth Process", IPC Conference (New Orleans), November 2002
A. Egli, W. Zhang, J. Heber, F. Schwater, and M. Toben, "Where crystal planes meet: Contribution to the understanding of the whisker growth process," in IPC Annu. Meeting, Nov. 2002, pp. S08-3-1-S-8-3-5.

Kumar, G. Achut, , "Lead-Free Matte-Sn Termination for Lead Frame Packages" , IPC-JEDEC Conference, Taipei, Taiwan December 2002 pag 38.

Shangguan, D, , Managing Compatibility Issues For Transitioning To vol. Manufacturing For Lead-Free Pcb Assembly. Keynote session presentation. Proceedings of 2003 International Printed Circuit & Electronics Assembly Fair Technical Conference and

--------------------------------------------------------
(new source 11/19/2007)
IPC/JEDEC Global Conference on Lead-Free Reliability and Reliability Testing for RoHS Lead-Free Electronics

Cavanaugh, David, "Impact of Surface Finish Choice on Reliability Test Results: Data Analysis of HALT Testing on the Reliant TV-3" (IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, April 10-12, 2007)

de Sousa, Isabel, Henderson, Donald W., Patry, Luc, and Martel, Robert, donwhend@us.ibm.com. "Characterization and Reliability of Increased Cu Levels in SAC Alloys" IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, April 10-12, 2007)

Faure, Christiane, Elkins, Mark, Bath, Jasbir, Unterborn, Aaron, Mainwaring, Stephen, Willie, Dennis, Zhou, Xiang, and Watson, Doug, christianefaure@fr.slr.com. "Shrinkage Hole Effect on Lead-Free Pin Through-Hole Solder Joint Reliability" (IPC/JEDEC Global Conference on Lead-Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, April 10-12, 2007)

Ma, L., Donaldson, A., Walwadkar, S., Hsu, I., alan.w.donaldson@intel.com. "Reliability Challenges of Lead-Free (LF) Plated Through-Hole (PTH) Mini-pot Rework" (IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, April 10-12, 2007)

Nishikawa, Hiroshi, Miki, Kousuke, and Takemoto, Tadashi, "Evaluation of Sn-3.5Ag Based Solder Joint by Ball Impact Test" (IPC/JEDEC Global Conference on Lead-Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, April 10-12, 2007)

--------------------------------------------------------
IPC Printed Circuits Expo
http://www.pwbrc.org/ GIT main TK7868.P7I63X Lexmark TK7868.P7I63
1994,1998 checked 11/28/2007

," IPC Expo, San Diego, CA, May 2-4, 1995, pp. .

," IPC Printed Circuits Expo, San Jose, CA, Mar. 3-7, 1996, pp. .

," IPC/SMTA Electronics Assembly Expo 1998, Providence, RI, Oct. 24-29, 1998, pp. .

," IPC Printed Circuits Expo 1999, Long Beach, CA, Mar. 14-18, 1999, pp. .

," Printed Circuits Expo 2000, San Diego, CA, Apr. 2-6, 2000, pp. .

--------------------------------------------------------
IPC Review
Dec2005-May2006 checked 5/12/2006

--------------------------------------------------------
IPC Works '99
http://www.pwbrc.org/
checked 11/28/2007

," IPC Works '99, Minneapolis, MN, Oct. 23-28, 1999, pp. xx-xx.

R. Schetty, "Minimization of tin whisker formation for lead-free electronics finishing," in Proc. IPC Works Conf. Miami, FL, 2000, pp. S-02-R-S-02-3-6.

--------------------------------------------------------
Jahrbuch der Kaiserlich-Koniglichen Geologischen Reichsanstalt
UM shapiro QE266.A3 & buhr QE266.A3

--------------------------------------------------------
Jane's Defence Weekly
CPL washington IU wells UF530.J35 OSU ONLINE & main UF530J36 UK young UF530.J35 UM ONLINE

--------------------------------------------------------
Japanese Journal of Applied Physics
UK chem/phys QC1.J39 OSU ONLINE & sel TA4J34 UM ONLINE & QC1.J344 UTo ONLINE & carlson WSU sci

--------------------------------------------------------
JEDEX

Vo, N, , "Whisker Growth Evaluations of Tin-Based Plating Finishes", JEDEX 2002 Conference, Santa Clara, CA, Mar. 25, 2002

--------------------------------------------------------
JOM
http://doc.tms.org/ NWU ONLINE & sci 669.05.86 OSU ONLINE & TN1J62 PU hicks 669.05J82 UC engr TN1.J68 & depository TN1.J68 UIC ONLINE & warehouse TN1.A513 UK eng TN1.A513 UL kersey TN1.A513 UM ONLINE & TN1.J87 UT ONLINE & hodges TN1.A513
v43#6-v59#11 checked 11/19/2007

--------------------------------------------------------
Journal of Adhesion Science and Technology
OSU ONLINE PU ONLINE & engr 547.7P7695 UC ONLINE & engr QC183.J65 UIC ONLINE UK ONLINE & eng QC183.J650 UM QD381.9.S97P659 UT ONLINE UTo ONLINE WSU sci
v13#7-v21#10 checked 11/6/2007

--------------------------------------------------------
Journal of Alloys and Compounds
Journal of the Less-Common Metals
IU bloomington alf TN1.J88 NWU ONLINE & sci 669.05J861 OSU ONLINE & sel TN1J7 & sel TN1J72 PU hicks 669.9J82 UC ONLINE & phys N1.J7 UD ONLINE UIC ONLINE & science UK ONLINE SD & chem/phys TN1.J7 & king TN1.J7 UL ONLINE & kersey TN1.J7 UM ONLINE & shapiro TN1.J89 & buhr TN1.J89 UT ONLINE & hodges TN1.J7 & closed TN1.J7
v330#1-v455#2 checked 3/31/2008

--------------------------------------------------------
Journal of the American Chemical Society
IU ONLINE & bloomington chem QD1.A5 NWU ONLINE & sci 540.5A51 OSU ONLINE & sel QD1A54 PU ONLINE & chem 540.6Am3j & hicks 540.5Am32 & 540.5J816 UC ONLINE & chem QD1.A5 UD ONLINE & roesch UIC ONLINE & science UK chem/phys QD1.A5 UL ONLINE & kersey QD1.A5 UM ONLINE & QD1.A512j UT ONLINE & hodges QD1.A5

--------------------------------------------------------
Journal of Applied Electrochemistry
IU ONLINE NWU ONLINE OSU ONLINE & sel TP250J68 PU ONLINE & eng 660.29705J826 UC ONLINE & eng TP250.J68 UD ONLINE UI CONLINE UK ONLINE & chem/phys TP250.J68 UL kersey TP250.J68 UM ONLINE & buhr QD551.J86 UT ONLINE & hodges TP250.J68

--------------------------------------------------------
Journal of Applied Physics
KYVL Lexmark MSU eng QC1.J83 NWU ONLINE & sci 530.5J86 OSU ONLINE & sel QC1P5742 PU ONLINE & phys 530.5P564 & engr 538.06C76p UC ONLINE & geo QC1.P6 UIC ONLINE & periodical UK chem/phys QC1.J83 UL kersey QC1.J83 UM QC1.J863 UT ONLINE & hodges QC1.J83 UTo ONLINE & carlson & depos WSU ONLINE & sci

--------------------------------------------------------
Journal of Applied Surface Finishing

Brooman, Eric W., "Nickel- and Cobalt-based Nanocomposite Chromium Coating Alternatives," Journal of Applied Surface Finishing, vol. 1 no. 1, pp. xx-xx, Jan.-Mar. 2006.

Lal, S., and Moyer, T. D., "Tin-Bismuth Finishes and the Phenomenon of Whiskers," Journal of Applied Surface Finishing, vol. 1 no. 1, pp. xx-xx, Jan.-Mar. 2006.

Olsen, K. P., and Ivey, D. G., "Pulsed Electrodeposited Sn-Cu Alloys for Use as Pb-Free Component Finishes in Microelectronic Applications," Journal of Applied Surface Finishing , vol. 1 no. 1, pp. xx-xx, Jan.-Mar. 2006.

--------------------------------------------------------
Journal of Applied Polymer Science
UCI ONLINE UH ONLINe UM TP156.P6J86 & QD471.J85 UT ONLINE UTo ONLINE & carlson & depos WSU ONLINE & sci
v56#7-v93#6

--------------------------------------------------------
Journal of Central South University
Zhongnan Daxue Xuebao
LH closed OSU sel TN600.J68

Han, Zong-Jie, Ju, Jin-Long, Xue, Song-Bai, Fang, Dian-Song, Wang, Jian-Xin, Yao, Li-Hua Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering Zhongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Central South University (Science and Technology), vol. 37 no. 2, April, 2006, p 229-234 Language: Chinese

-------------------------------------------------------
Journal of Chemical Education
Lexmark NWU sci 540.28J86 & 540.78T343 OSU ONLINE & sel QD1J865 PU chem 540.5J82 UC chem QD1.J9 UD roesch UIC ONLINE & science UK ONLINE & chem/phys QD1.J93 UL kersey QD1.J93 UM ONLINE & QD3.J86 UT ONLINE & hodges QD1.J93

--------------------------------------------------------
Journal of the Chemical Industry (USSR)

Ivanova and Fedorchenko, J. Chem Ind. (USSR) 18, No. 15-16, 40 (1941).

--------------------------------------------------------
Journal of Chemical Industry and Engineering (China)
LH closed

--------------------------------------------------------
Journal of Chemical Physics
IU ONLINE & bloomington chem QD1.J836 NWU ONLINE & sci L541.05J863 OSU ONLINE & sel QC1J87 PU ONLINE & chem 530.5J821 & phys 530.5J821 UC ONLINE & chem QD1.J94 & phys QD1.J94 UD ONLINE & roesch UIC ONLINE & science UK chem/phys DQ1.J94 UL kersey QD1.J94 UM ONLINE & QD1.J867 UT ONLINE & hodges QD1.J94

--------------------------------------------------------
Journal of Crystal Growth
OSU ONLINE & sel QD921J6 UK ONLINE SD & eng QD921.J6 UL ONLINE & ekstrom QD921.J67 UM ONLINE SD UT ONLINE & hodges QD901.J68

--------------------------------------------------------
Journal of Dalian University of Technology
LH closed

--------------------------------------------------------
Journal of Electroanalytical Chemistry
OSU ONLINE & QD115A1J6 UK ONLINE SD & chem/phys QD551.J6 UL kersey QD551.J6 UT ONLINE

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Journal of the Electrochemical Society
OSU ONLINE & TP250E5 UC eng TP250.E5 UK ONLINE SD & chem/phys TP250.E595 UL kersey TP250.E542 UM ONLINE & TP250.E37 UT ONLINE

--------------------------------------------------------
Journal of Electronic Materials
http://www.tms.org/pubs/journals/JEM/jem.html IEEE XPLORE OSU TK7871J66 PU engr 621.38105 J826 UIC daley periodicals UK eng TK7871.J66 UL kersey TK7871.J66 UM ONLINE & TK7871.J86
v15#6-v37#4 checked 3/31/2008

--------------------------------------------------------
Journal of Electronic Packaging
American Society of Mechanical Engineers, EEP
GIT ONLINE & main TK7870.J68X NWU ONLINE OSU ONLINE & TK7870J58 PU ONLINE & engr 621.381046J826 UAB ONLINE & sterne TK7870.J656 UCF ONLINE & main TK7870.J656 UCI ONLINE & sci TK7870.J656 UF ONLINE & science TK7870.J656 UH ONLINE UIC ONLINE & daley TK7870.J656 UK eng TK7870.J656 UL kersey TK7870.J656 UM ONLINE UT ONLINE
v116#1-v130#1 checked 3/31/2008

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Journal of Electronics Manufacturing
OSU ONLINE UK ONLINE UT ONLINE UTo ONLINE
v9#1-V11#2

Watanabe, Itsuo, Takemura, Kenzo, Shiozawa, Naoyuki, Watanabe, Osamu, Kojima, Kazuyoshi, Ohta, Tomohisa, "Flip-chip interconnection to various substrates using anisotropic conductive adhesive films," Journal of Electronics Manufacturing, vol. 5 no. 4, Dec. 1995, pp. 273-276.

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Journal of Environmental Quality
OSU faes S1J863 UK Young S1 .J780 UL ekstrom S1.J78 UT ONLINE
v5#4

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Journal of Environmental Science and Health - Part C
GIT ONLINE & main RC268.5.J68 OSU ONLINE PU life 301.3105En95c UC sw depos TD172.E564 UCF ONLINE UCI ONLINE UK ONLINE UM ONLINE & RA565.A1J861 UT ONLINE UTo ONLINE

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Journal of Failure Analysis and Prevention
UCI ONLINE

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Journal of the Franklin Institute
NWU ONLINE OSU ONLINE & depository T1.F83 PU ONLINE & hicks 605J82 UC engr T1.F8 UIC ONLINE & daley T1.F8 UK ONLINE SD & young T1.F8 & S2 Reel 282-287 UL kersey T1.F8 UM ONLINE & T1.F834j UT ONLINE & hodges T1.F8

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Journal of Functional Materials
Gongneng Cailiao

Effect of cooling rates on the microstructure and mechanical behavior of Sn-Ag solder Shen, Jun; Gao, Hou-Xiu; Liu, Yong-Chang; Wei, Chen; Yang, Yu-Qin Gongneng Cailiao/Journal of Functional Materials, vol. 36 no. 1, January, 2005, pp. 47-49 Language: Chinese

Liu, Peng, Gao, Yuan, Guo, Fu, Lei, Yong-Ping, Xia, Zhi-Dong, and Shi, Yao-Wu, "Progress and research in lead-free composite solder," Journal of Functional Materials, vol. 37 no. supplement, pp. 823-826, Sept. 2006.

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Journal of Functional Materials and Devices
Gongneng Cailiao yu Qijian Xuebao

Zhang, Dong-Mei, Ding, Gui-Fu, Wang, Hong, Jiang, Zheng, Yao, Jin-Yuan Low temperature hermetic bonding process based on electrodeposited Sn/Bi alloy Gongneng Cailiao yu Qijian Xuebao/Journal of Functional Materials and Devices, v 12, n 3, June, 2006, p 211-214 Language: Chinese

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Journal of Hazardous Materials
FSU ONLINE & dirac 660.5J8633 GIT ONLINE & main T55.3.H3J68 IU ONLINE OSU ONLINE PU ONLINE & eng 628.532D433 & eng 363.1705J826 UC ONLINE & eng T55.3.H3J68 & sw depos T55.3.H3J68 UCF ONLINE UCI ONLINE & sci T55.3H3J6 UD ONLINE UK eng T55.3.H3J68 UM ONLINE & T55.3.H3J86 UT ONLINE & hodges T55.3.H3J68 UTo ONLINE & carlson
v136#3

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Journal of Hebei University of Science and Technology
LH closed

Hua, Man (Material Sci. & Eng. Coll., Henan Sci. & Technol. Univ., Luoyang, China); Zhang Ke-Ke; Yang Jie; Cheng Guang-Hui; Huang Jin-Liang Present situation of microjoining lead-free solder and application of rare earth Journal of Hebei University of Science and Technology, v 26, n 1, Feb. 2005, p 10-13

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Journal of Henan University of Science and Technology (Natural Science)
Henan Keji Daxue Xuebao (Ziran Kexue Ban)

Influence of Ag on Microstructure and Mechanical Properties of Sn-57Bi Lead-Free Solder Henan Keji Daxue Xuebao (Ziran Kexue Ban) / (Journal of Henan University of Science and Technology) (Natural Science) (China), vol. 25, pp. 10-13, June 2004

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Journal of High Temperature Society of Japan
LH closed

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Journal of the Illuminating Engineering Society
AU rbd TH7700.I35 GIT ONLINE & main TH7700.I35 & storage TH7700.I35 PU hicks 621.326IL6 UCF ONLINE UCI ONLINE & sci TP700.I34 UH TH7700.I35 UIC warehouse TP700.I33 UM ONLINE & TH7700.I28 UT hodges TH7700.I35 UTo carlson & storage WSU ONLINE

Anon FOUR ROUTES TO BETTER FINISHES. Journal of the Illuminating Engineering Society, vol. 102, n 4, Oct. 1972, 5p

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Journal of Industrial Ecology
CPL washington IU ONLINE KYVL OSU ONLINE & sel TS161.J68 PU ONLINE & eng 658.408J826 UC ONLINE & daap TS1.J68 UIC ONLINE UK ONLINE UM ONLINE & shapiro TS161.J681 UT ONLINE

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Journal of the Institute of Metals
NWU sci 660.6I591j OSU sel TN1I5 PU hicks 669.06In7 & 669.005M57 UC eng TS200.I5 & SW depos TS200.I5 UD roesch UIC warehouse TS200.I5 UK eng TS200.I5 UM buhr TN1.I59j UT hodges closed TS200.I5 UTo carlson WSU

Lead-Free, RoHS, and WEEE Information Wanted

John R. Barnes KS4GL, PE, NCE, NCT, ESDC Eng, ESDC Tech, PSE, SM IEEE May 6, 2008 jrbarnes@iglou.com

John R. Barnes KS4GL, PE, NCE, NCT, ESDC Eng, ESDC Tech, PSE, SM IEEE
May 6, 2008
jrbarnes@iglou.com