Lead-Free, RoHS, and WEEE Information Wanted

John R. Barnes KS4GL, PE, NCE, NCT, ESDC Eng, ESDC Tech, PSE, SM IEEE
March 5, 2010
jrbarnes@iglou.com

Since December 2004 I have been searching the engineering and scientific literature for information on how to design and build electronics to be lead-free, RoHS-compliant, and WEEE-compliant. My idea was to boil this information down for dBi's clients to use, with it eventually becoming a "Chapter 20.5" for a second edition of my books, Robust Electronic Design Reference Book, Volumes 1 and 2. But at this point it looks this study may become Volume 3, a separate book, or a massive collection of web pages instead. So far I have dug out of my own libraries, and bought/ downloaded/ photocopied the pertinent sections of 254 books, 222 Ph. D. and Masters theses, and 15,225+ papers/ magazine articles/ reports on these subjects. I've also looked at many thousands of webpages, and printed out a few hundred of them. My bibliography at http://www.dbicorporation.com/rohsbib.htm has references to everything that I have acquired to date, with links to 5,650+ documents that may be downloaded for free from the Internet. But in my searches I've found references to numerous other pertinent documents that I have not yet been able to locate. Many of these were published by: whose journals and proceedings are so specialized that they can rarely be found in public, engineering, or university libraries.

If you come across free or reasonably-priced sources for any of the following documents, please E-mail me the information at jrbarnes@iglou.com. I will acknowledge your contribution to this research in my web pages, and in any magazine articles, papers, or books that may come out of it.

When I run across a database that looks promising, I search for:

I'm also finding additional sources to mine, by doing Dogpile and Google searches for everything written by certain authors:

Thanks!

John R. Barnes

So far I have checked libraries at the following institutions for information on lead-free electronics, the RoHS Directive, the WEEE Directive, and their ilk:
AU = Auburn University (Auburn, AL) checked card catalog 9/16/2009, last visited 3/3/2007
BSU = Boise State University (Boise, ID)
BU = Bradley University (Peoria, IL)
BYU = Brigham Young University (Salt Lake City, UT) checked card catalog 9/16/2009
CBU = Christian Brothers University (Memphis, TN) checked card catalog 9/16/2009
CPL = Chicago Public Library (Chicago, IL) last visited 8/2005
CSM = Colorado School of Mines (Golden, CO) last visited 8/10/2006
CSU = Cleveland State University (Cleveland, OH) checked card catalog
CWRU = Case Western Reserve University (Cleveland, OH) checked card catalog
FIT = Florida Institute of Technology (Melbourne, FL) checked card catalog 9/16/2009
FSU = Florida State University (Tallahassee, FL) checked card catalog 9/16/2009, last visited 3/2/2007
GIT = Georgia Institute of Technology (Atlanta, GA) checked card catalog 9/16/2009, last visited 3/8/2009
IEEE XPLORE = IEEE XPLORE checked catalog 9/16/2009 last visited 3/4/2010
ISU = Iowa State University (Ames, IA) last visited 8/26/2006
IU = Indiana University (Bloomington, IN) checked card catalog 9/16/2009
KSU = Kansas State University (Manhattan, KS) last visited 8/8/2006
KU = Kansas University (Lawrence, KS) last visited 8/8/2006
KYVL = Kentucky Virtual Library
Lexmark = Lexmark Library (Lexington, KY) checked card catalog 9/16/2009, last visited 4/29/2009
LH = Linda Hall Library of Science, Engineering & Technology (Kansas City, MO) checked card catalog 9/17/2009, last visited 10/26/2007
LU = lamar university (Beaumont, TX) checked card catalog 9/16/2009, last visited 10/23/2008
McMU = McMaster University (Hamilton, Ontario) checked card catalog
MoSU = Montana State University (Bozeman, MT) checked card catalog 9/16/2009
MST = Missouri University of Science and Technology (Rolla, MO) checked card catalog 9/16/2009, last checked 8/14/2009
MSU = Michigan State University last visited 7/9/2006
MTUM = Montana Tech of the University of Montana (Butte, MT) last visited 8/23/2006
NWU = Northwestern University (Chicago, IL) checked card catalog 9/16/2009, last visited 9/25/2006
OCU = Oklahoma Christian University (Oklahoma City, OK) checked card catalog 9/16/2009
OGI = Oregon Graduate Institute (Beaverton, OR) checked card catalog 9/16/2009
OkSU = Oklahoma State University (Stillwater, OK) checked card catalog 9/16/2009
OrSU = Oregon State University (Corvallis, OR) checked card catalog 9/16/2009
OSU = Ohio State University (Columbus, OH) checked card catalog 9/16/2009, last visited 5/11/2009
PQ = ProQuest Dissertations & Theses Database, checked 7/9/2009.
PSU = Portland State University (Portland, OR) last visited 8/15/2006
PU = Purdue University (West Lafayette, IN) checked card catalog 9/16/2009, last visited 9/29/2006
RIT = Rochester Institute of Technology (Rochester, NY) checked card catalog
RU = Rice University (Houston, TX) checked card catalog 9/16/2009, last visited 10/22/2008
RyU = Ryerson University (Toronto, Ontario) checked card catalog 10/24/2009, last checked 10/25/2009
SDSU = San Diego State University (San Diego, CA) checked card catalog 9/25/2009, last visited 10/5/2009
SIUC = Southern Illinois University Carbondale (Carbondale, IL) checked card catalog 9/16/2009, last visited 8/13/2009
SIUE = Southern Illinois University Edwardsville (Edwardsville, IL) checked card catalog 9/16/2009, last visited 8/25/2009
SLU = Saint Louis University (St. Louis, MO)
SPU = Seattle Pacific University (Seattle, WA) checked card catalog 9/16/2009
SU = Seattle University (Seattle, WA) checked card catalog 9/16/2009
SUNB = State University of New York - Buffalo checked card catalog
TTU = Tennessee Technological University (Cookeville, TN) checked card catalog 9/16/2009
UA = University of Alabama (Tuscaloosa, AL)
UAB = University of Alabama at Birmingham (Birmingham, AL) checked card catalog 9/16/2009
UAH = University of Alabama in Huntsville (Huntville, AL) checked card catalog 9/16/2009
UAk = University of Akron (Akron, OH) checked card catalog
UAr = University of Arkansas (Fayetteville, AR) checked card catalog 9/16/2009, last visited 8/24/2009
UC = University of Cincinnati (Cincinnati, OH) checked card catalog 9/16/2009, last visited 5/8/2009
UCB = University of Colorado at Boulder (Boulder, CO) last visited 10/23/2007
UCF = University of Central Florida (Orlando, FL) checked card catalog 9/16/2009, last visited 3/1/2007
UCI = University of California at Irvine (Irvine, CA) checked card catalog 9/16/2009, last visited 10/24/2006
UCSD = University of California - San Diego (San Diego, CA) checked card catalog 9/25/2009, last visited 10/4/2009
UD = University of Dayton (Dayton, OH), checked card catalog 9/16/2009, last visited 5/14/2009
UDe = University of Denver (Denver, CO) checked card catalog 9/16/2009
UE = University of Evansville (Evansville, IN) checked card catalog 9/16/2009, last visited 8/12/2009
UF = University of Florida (Gainesville, FL) checked card catalog 9/16/2009, last visited 3/1/2007
UH = University of Hawaii at Manoa (Honolulu, HI) last visited 7/12/2007
UI = University of Iowa (Iowa City, IA) last visited 8/27/2006
UIC = University of Illinois at Chicago (Chicago, IL) checked card catalog 9/16/2009
UIUC = University of Illinois - Urbana-Champaign (Urbana-Champaign, IL) checked card catalog 9/17/2009
UK = University of Kentucky (Lexington, KY) checked card catalog 9/17/2009, last visited 3/4/2010
UL = University of Louisville (Louisville, KY) last visited 4/24/2008
UM = University of Michigan (Ann Arbor, MI) checked card catalog 9/17/2009, last visited 10/22/2009
UMC = University of Missouri - Columbia (Columbia, MO) checked card catalog 9/17/2009
UMe = University of Memphis (Memphis, TN) checked card catalog 9/17/2009
UNF = University of North Florida (Jacksonville, FL) checked card catalog 9/17/2009
UNL = University of Nebraska - Lincoln (Lincoln, NE) last visited 8/25/2006
UOk = University of Oklahoma (Norman, OK) checked card catalog 9/16/2009, last visited 8/23/2009
UR = University of Rochester (Rochester, NY) checked card catalog
USA = University of South Alabama (Mobile, AL)
USD = University of San Diego (San Diego, CA) checked card catalog 9/25/2009, last visited 10/6/2009
USF = University of South Florida (Tampa, FL) checked card catalog 9/17/2009
USU = Utah State University (Logan, UT) checked card catalog 5/3/2009
UT = University of Tennessee (Knoxville, TN) checked card catalog 9/17/2009, last visited 3/10/2009
UTA = University of Texas at Austin (Austin, TX) checked card catalog 9/17/2009, last visited 8/18/2009
UTo = University of Toledo (Toledo, OH) checked card catalog 9/17/2009, last visited 3/20/2009
UTor = University of Toronto (Toronto, Ontario) checked card catalog 10/24/2009, last visited 10/25/2009
UU = University of Utah (Salt Lake City, UT) last visited 8/11/2006
UW = University of Washington (Seattle, WA) last visited 8/21/2006
UWa = University of Waterloo (Waterloo, Ontario) checked card catalog 10/24/2009, last visited 10/23/2009
UWF = University of West Florida (Pensacola, FL)
UWi = University of Windsor checked card catalog
UWO = University of Western Ontario (London, Ontario) checked card catalog
UWy = University of Wyoming (Laramie, WY)
VU = Vanderbilt University (Nashville, TN) last visited 10/16/2008
WrSU = Wright State University (Dayton, OH) checked card catalog 9/17/2009
WSU = Wayne State University (Detroit, MI) last visited 8/17/2008
WUSL = Washington University in St. Louis (St. Louis, MO) last visited 8/7/2006
def f10 = [cursor command] [begin line] [erase end line] 'l /---
/' [execute] [down 22] [up 22] def f10 = [cursor command] [begin line] [erase end line] 'l /(new s/' [execute] [down 22] [up 22] def f10 = [cursor command] [begin line] [erase end line] 'l /priority/' [execute] [execute] def f10 = [cursor command] [begin line] [erase end line] 'l /XPLORE/' [execute] [center line] s margins 1 80 --------------------------------------------------------
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Koppel, W. Benjamin, Hathaway, James A. ACUTE CHEMICAL EFFECT OF CHROMIUM COMPOUNDS IN MAN. Publication date: 1981, pp. 24-30

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"The Allotropic Transformation White Tin - Grey Tin", London: International Tin Research and Development Council, 1938.

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Sattelmeier, Gerald A, application of chromium bearing paint in the automobile industry. Publication date: 1981, pp. 165-177

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C. J. Smithells, Chapman-Hall's Centenary Year (1930), p. 178.

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E. Ignatowitz, Chemie fu"r Schule und Beruf (Chemistry for School and Profession), Europa Lehrmittel Verlag, Haan-Gruiten, 1999, p. 180.

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Silman, Harold, chromium plating - past, present and future. Publication date: 1984, p 140-146

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IU bloomington fine CC137.M5S78

T. Stambolov, The Corrosion and Conservation of Metallic Antiquities and Works of Art, Central research Laboratory for Objects of Art and Science, Amsterdam, pp 175-177, 1985.

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Electrically Conductive and Insulative Adhesives (book)

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R. R. Rogers and J. F. Fydell, "Factors Affecting the Transformation of Gray Tin at Low Temperatures," Mines Branch, Dept. of Mines and Technical Surveys, Jan. 26, 1952. Ottawa, Canada.

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Harris, P, , "The Growth of Tin Whiskers", International Tin Research Institute, 734, pp. 1 - 19, 1994.

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Hexavalent chromium Technical Report - University of Texas at Austin, Center for Research in Water Resources no. 240, July 1993, pp. 61, 65

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F. J. Dunkerly and W. L. Mudge, Jr., "Kinetics of the Alpha Beta Transformation of Pure Tin," Technical Report L5, University of Pennsylvania, Contract NObs-2477. Navy Department, Bureau of Ships (Jan. 1950).

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Lead and the Electronics Industry: A Proactive Approach Performer: National Center for Manufacturing Sciences, 3025 Boardwalk, Ann Arbor, MI 48108. May 1995. 50p. Report: NCMS-0177BK95

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To"pfer, J. G., Lehrbuch der Orgelbaukunst (Textbook on Organbuilding), Ill. 571a, Vol. 4, 4th & 5th editions by Paul Smets, Rheingold-Verlag Mainz, 1960.

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E. S. Hedges and C. E. Homer, "The Properties of Tin," International Tin Research and Development Council, Tech. Pub. B.1 1937. (have 1954 edition)

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Hinton, P. E, "Tin-Plating, Tin-Nickel Electroplate and Tin-plating over Nickel as Final Finishes on Copper," PWB Engineering, pp. 806 - 810

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R. R. Rogers and W. R. G. Stewart, Report on Investigation MD2609, Mineral Dressing and Metallurgical Labs, Bureau of Mines, Ottawa, Canada, Nov. 23, 1949.

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FSU dirac 621.319 C748s

Busch, Lieland? Wieland?, and Zoller, Semiconducting Materials, London: Butterworths Scientific Publications, 1951, pp. 188.

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Bornemann, A., and Gela, T., "Studies in the Behavior of Certain Non-Ferrous Metals at Low Temperatures," Vol. II Final Report, Contract No. DA-36-939-SC-15393? DA-36-039-SC-15393? Dec. 1953, Signal Corps Project 2005 - MO8 - Metals, U. S. Army.

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M. Margolis and A. Bornemann, "A Study in Ferrous and Non-Ferrous Alloys at Low Temperature," Final Report Contract No. W-36-039-SC-38135, Nov. 1950.

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GIT main QD470.S6

Andreas Smits, The theory of allotropy. *** not applicable ***

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Third semi-annual lead-free solder implementation summit. British Library

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R. M. MacIntosh, "Tin in Cold Service" Leaflet No. 55 published by the Tin research Association

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Britton, S. C, Tin Whiskers, Publication 487, International Tin Research Institute, London.

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Kennedy, Gerald L, Morgan, James F. TOXICITY OF LEAD CHROMATES. Publication date: 1981, pp. 43-60

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P. Stephens, Use of Synchrotron Radiation to Determine the State of Strain in Tin Coatings on Integrated Circuit Packages Herndon, VA: NEMI, Tin Whisker Modeling Project Rep., May 2002, Available upon request from NEMI.

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Coleman, R.V. "Whiskers," Work Function, pp. 1112.

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Andrae, Anders S. G., Environmental life-cycle assessment in microelectronics packaging Ph.D., Chalmers Tekniska Hogskola (Sweden), 2005, 204 pages; AAT C820926

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Bredee, Thesis (Utrecht, 1928).

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DAVIS, JACK HAYNE, THE EFFECT OF HIGH ELASTIC UNIAXIAL STRAIN ON THE RESISTIVITY AND THE SUPERCONDUCTING TRANSITION TEMPERATURE OF TIN WHISKERS Ph.D., Clemson University, 1966, 73 pages; AAT 6706953

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Douwes Dekker, K., Thesis Utrecht (1927).

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Tomas Ekvall; Anders Andrae Attributional and Consequential Environmental Assessment of the Shift to Lead-Free Solders (10 pp) Corresponding author:: Tomas Ekvall, Division of Energy Technology, Chalmers University of Technology, SE-412 96 G”teborg, Sweden (tomas.ekvall@me.chalmers.se)

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Steven Herr Groves, Transport properties and band structure of gray tin. Harvard Univ DEC 1963 AD0432897

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KITTERMAN, JOHN HOWARD, GROWTH OF CADMIUM WHISKERS IN INERT ATMOSPHERES Ph.D., Colorado State University, 1970, 231 pages; AAT 7105342

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C. M. Liu, A study on the reaction between the Sn-3.5Ag solder and BGA surface finish, M.S. thesis Chungli City, Taiwan: National Central University, 2000, available in Chinese only as of Nov. 2003.

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MCCANLESS, WILLIAM VOSS, THE SIZE AND TEMPERATURE DEPENDENCE OF THE ELECTRICAL RESISTIVITY OF INDIUM AND ZINC WHISKERS Ph.D., Clemson University, 1971, 77 pages; AAT 7125609

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Paul Tucker McElroy, The construction of a ratio reflectometer and its application to energy band studies in germanium and gray tin. Harvard Univ

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MILLER, JOHN RICHARD, MEASUREMENTS OF THE COMPLEX-IMPEDANCE OF ONE-DIMENSIONAL TIN WHISKER CRYSTALS NEAR THE SUPERCONDUCTING TRANSITION-TEMPERATURE Ph.D., University of Virginia, 1973, 84 pages; AAT 7324973

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NEWBOWER, RONALD STANLEY, FEMTOVOLT MEASUREMENTS OF THE SUPERCONDUCTING TRANSITION OF TIN WHISKER CRYSTALS Ph.D., Harvard University, 1971; AAT 0237976

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Peng, W, Zeng, K, Kivilahti, J, Performer: Literature Review on Potential Lead-Free Solder Systems Helsinki Univ. of Technology, Espoo (Finland). Dept. of Electrical and Communications Engineering. 2000. 68p. Report: ISBN-951-22-4979-0, HUT-EPT-1

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Presche, P., Dissertation, TU Berlin, Berlin 1966.

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Savolainen, Petri, Solder-filled anisotropic conductive adhesives in electronic interconnections Dr.Tech., Teknillinen Korkeakoulu (Helsinki) (Finland), 1996, 76 pages; AAT C566354

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Seppala, Anne Kristiina, Flip chip attachment on rigid substrates using anisotropic conductive adhesive films D.Sc.(Tech.), Tampereen Teknillinen Korkeakoulu (Finland), 2003, 105 pages; AAT C815115

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SKOVE, MALCOLM JOHN, THE ELASTIC AND PLASTIC PROPERTIES OF ZINC AND CADMIUM WHISKERS Ph.D., University of Virginia, 1960, 62 pages; AAT 6004619

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R. W. Smith, Ph. D. Thesis, Birmingham University, 1956.

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zhan, sheng Surface Insulation Resistance Degradation and Electrochemical Migration on Printed Circuit Boards University of Maryland (College Park, Md.) (restricted until May 04, 2013) http://www.lib.umd.edu/drum/handle/1903/6736

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AAAA

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Acta crystallographica
MST wilson QD901.I523 NWU online & sci 548.05A188 OkSU online OSU sel QD901A2 PU phys 548Ac8 SDSU online SIUC storage 50865-5481 SIUE storage UAr online UC chem QD901.A2 & sw depos QD901.A2 UCSD s&e QD1.A190 UD roesch UIC sci UK chem/phys QD901.I523 UL kersey QD901.I523 UM online & aael QD901.A18 UOk online UT hodges QD901.A3
(1 items found as of 4/19/2009)

Tiedema, May and Burgers, Acta. Cryst., 1949, 2, 151. *** not applicable ***

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Acta Electronica Sinica
Tien Tzu Hsueh Pao
priority

(new references 12/30/2008)
Liu, Fang, Meng, Guang, Zhao, Mei, Zhao, Jun-Feng .Researches of lead-free solder joint reliability under board-level drop impact Tien Tzu Hsueh Pao/Acta Electronica Sinica, v 35, n 11, November, 2007, p 2083-2086 Language: Chinese

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Acta Materialia
MST wilson TS200.A3 OkSU online OSU online & TN1A23 SDSU online SIUC morris 50872-6693 UAr online UC online & depository TN1.A2 UCSD online UK online sd & eng TS200.A3 UL kersey TS200.A3 UM online & aael TN1.A19 UOk bizzell TN1.A3 UT online & hodges TN1.A3
(>=20 items found as of 3/2/2010)
v44#1-v58#7 Articles in Press to Mar. 3, 2010 checked 3/2/2010

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Acta Metallurgica
MST wilson TS200.A3 NWU online & sci L669.05A188 OkSU online OSU sel TN1A2 PU phys 669.05Ac8 SDSU main TN1.A2 SIUC morris 50872-6691 UAr main TS200.A3 UC online & eng TN1.A2 UCSD s&e TN1.A191 UD roesch UE UIC daley TS200.A3 UK eng TS200.A3 UL kersey TN1.S36 & TS200.A3 UM online sd & aael TN1.A19 UOk online UT hodges TN1.A3
(12 items found as of 4/19/2009)

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Acta Metallurgica Sinica (China)
Jinshu Xuebao
Jin shu xue bao
FIT online LH closed OkSU online RyU online UCSD s&e TN1.C55 UM online & hatcher microforms AO72:1 UTor online VU online (not fulltext)
(0 items found as of 9/21/2009)

v1#1-v3#6,v4#3-v4#6,v19#1-v22#5 checked 10/22/2009 low priority

(new references 12/29/2008)
Li, F, Liu, C, Xian, A, Shang, J, Xian, A interfacial reaction between eutectic sn-58bi lead-free solder and electroless ni-p plating Acta Metallurgica Sinica (China). Vol. 40, no. 8, pp. 815-821. Aug. 2004

Qiao, M, Xian, A, Shang, J, Xian, A electro-deposition of sn-ag lead-free solder by alkaline pyrophosphate bath Acta Metallurgica Sinica (China). Vol. 40, no. 8, pp. 822-826. Aug. 2004

Tang, Xingyong, Wang, Jun, Gu, Bo, Yu, Hongkun, Xiao, Fei Effects of aging on structures and shear strength of interface of Sn-Ag-Cu solder/Ni-P plating layer Jinshu Xuebao/Acta Metallurgica Sinica, v 42, n 2, Feb. 2006, p 205-210 Language: Chinese

Wang, Wei, Wang, Zhongguang, Xian, Aiping, Shang, Jianku Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling Jinshu Xuebao/Acta Metallurgica Sinica, v 42, n 6, June 2006, p 647-652

Zhu, Qingsheng, Zhang, Li, Wang, Zhongguang, Wu, Shiding, Shang, Jianku .Effect of intermetallics Ag3Sn on the tensile property of Sn.8Ag.7Cu solder alloy Jinshu Xuebao/Acta Metallurgica Sinica, v 43, n 1, January, 2007, p 41-46 Language: Chinese

Zhao, Ning, Pan, Xuemin, Ma, Haitao, Wang, Lai .Study of the liquid structure of Sn-Cu solders Jinshu Xuebao/Acta Metallurgica Sinica, v 44, n 4, April, 2008, p 467-472 Language: Chinese

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Acta Organologica
BYU music ML5.A253 FSU music ML5.A253 IU bmusic ML552.A188 OSU music ML550.A1A2 SIUC mclafferty 786.608 A188 UC ccm ML550.A25 UF music ML5.A253 UK finearts ML5.A253 UM music ML5.A19 & buhr ML5.A19 UMc music ML5.A253 UOk finearts ML5.A253
(1 items found as of 4/19/2009)

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Additives for Polymers
OkSU online OSU online SDSU online UC online UCSD online UD online UM online UOk online UT online
(1 items found as of 4/19/2009)

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Adhesives & Sealants Industry
http://www.adhesivesmag.com/ IU online NWU online OkSU online OSU online SDSU online SIUC online UAr online UCSD online UIC online UK online UM online sd UOk online USD online UT online
(13 items found as of 3/2/2010)
v8#1-v16#10 checked 3/2/2010

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Advanced Engineering Materials
AU online GIT online IU online LH closed NWU online OkSU online OSU online & sel TA401.A15 RyU online SDSU online SIUC online UAB online UAr online UC online UCB online UCF online & main TA401.A15 UCSD online UD online UIC online UM online & aael TA401A22 UOk online UT online UTor online UWa online VU online
(9 items found as of 10/23/2009)
v1#1-v11#9 Early view to Oct.1, 2009 all checked 10/23/2009 low priority

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Advanced Manufacturing Technology (AMT)
FIT online Lexmark LH closed MSU online NWU online OkSU online OSU online PU online & eng 670.4205In8 UCB online UIC online UK eng T59.4.I5410 UM online UOk online USD online UT online UTor online VU online
(5 items found as of 10/22/2009)
v8#1-v9#24,v16#6,v21#12-v30#9 checked 10/22/2009 low priority

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Advanced Materials
MST wilson TA401.A29 OkSU online OSU online & TA401.A24 RyU online SDSU online SIUC online TTU UAr online UC online & TA401.A16 UCSD s&e TA1.A243 UH online UM online & shapiro TA401.A291 UOk online USD online UT online & hodges TA401.A29 UTor online VU online
(8 items found as of 10/25/2009)
v1#1-v21#40 Early View to Oct. 24, 2009 all checked 10/25/2009 low priority

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Advanced Materials & Processes
AU rbd TA401.3.I5855 FIT online LH closed MST wilson TS200.M36 OkSU online OSU online & sel TS200A762 SDSU online SIUC online UAB sterne TA401.A42 UAr online UC eng TA418.9.C6A28 UCB online UCI online & sci TS200.M361 UCSD s&e TS1.M587 UE UK online & eng TS200.M380 UL kersey TS200.M36 UM online & aael TS200.M5891 UOk online USD online UT online & hodges TS200.M36 VU online & sel TS200.M36
(15 items found as of 3/2/2010)
v157#1(2000)-v168#2 checked 3/2/2010

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Advanced Materials Research
NWU online UAH sci TN688.3.B33I58 UAr online UC online UCSD online UD roesch TA660.S63F54 UK online UMC online
(11 items found as of 3/2/2010)
v22-v101 checked 3/2/2010

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Advanced Metallization Conference
LH TK7871.85.A228 MST wilson TK7871.85.A228 OSU sel TK7871.85.A3482 PU eng 621.38152Ad9451p UC eng K7871.85.A3482 UCB TK7871.85.A3482 UM aael TK7871.75.A23 UOk eng TK 7871.85.A3482
(3 items found as of 4/19/2009)
94,98-07 checked 4/16/2009 priority

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Advanced Packaging
Advanced Packaging online Article
http://ap.pennnet.com/home.cfm LH closed OkSU online OSU online SDSU online SIUC online UAr online UCSD online UK online UOk online USD online UT online
(>=20 items found as of 3/2/2010)
v7#6,v9#1-v52#12 checked 3/2/2010

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Advanced Packaging Materials Conference
priority

(new references 6/8/2009)
P. Markondeya Raj, Isaac Robin Abothu, Reza Abdolvand, Farrokh Ayazi and Rao Tummala, "Solution-Derived 3D /Vertical Piezoelectric and High Capacitance Density Structures for MEMS and Biomedical Applications", Advanced Packaging Materials Conference, March 15-17, 2006, p. 122, Atlanta.

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2001 Advanced Packaging Technology Conference
http://www.smta.org/knowledge/proceedings.cfm
(14 items found as of 11/6/2009)
01 checked 11/6/2009 priority

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Advanced Semiconductor Engineering Technical Conference
priority

Lee, Jeffrey, , Whisker Formation Study of Lead-Free Plated Packages, Advanced Semiconductor Engineering Technical Conference Taipei, Taiwan Dec. 2002 pag 103.

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2002 Advanced Technology Symposium Conference Proceedings
http://www.smta.org/knowledge/proceedings.cfm
(8 items found as of 11/6/2009)
02 checked 11/6/2009 priority

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Advances in Chemistry Series
MST wilson various OSU sel QD1.A26NO218 SDSU QD1.A355 SIUC mclafferty 540.8A244 SIUE lovejoy QD1.A355 UAr main QD1.A355 UC chem QD1.A36 UCSD s&e QD1.A24453 UD roesch various UM shapiro TK7871.15.P6E385 UOk bizzell QD1.A355 & chem-math QD1.A355 USD cl QD1.A355
(0 items found as of 4/19/2009)

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Advances in Coatings Technologies for Corrosion and Wear Resistant Coatings
NWU sci 620.11223A244
(1 items found as of 4/19/2009)
95

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Advances in Coatings Technologies for Surface Engineering (see TMS Annual Meeting)
MST wilson TA418.76.A38 NWU sci 667.6 A244 PU eng 667.9 Ad945 1997 UF sci A418.76.A391 UT hodges TA418.76.A383 1997
(0 items found as of 4/19/2009)

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Advances in Electronic Packaging
Proceedings of the ASME InterPack Conference
Proceedings of InterPack
LH TK7870.15.A83 MST wilson TK7870.15.A83 MSU eng TK7870.15.A88 PU eng 621.381046J668p SIUE lovejoy TK7870.15.A85 UC sw TK7801.H544 UCB TK7870.15.J65 UM aael TK7870.15.A38 SWU sci TK7870.15.J65
(>=20 items found as of 4/19/2009)
92-93,95,97,99,01,03,05,07 checked 3/22/2009 priority

(new references 12/30/2008)
Subbarayan, Guhan, Tsai, Pei Fang Jennifer, Kinyanjui, Robert, Srihari, Krishnaswami .Mechanical reliability evaluation of stripped and replated component termination finishes 2007 Proceedings of the ASME InterPack Conference, IPACK 2007, v 1, 2007 Proceedings of the ASME InterPack Conference, IPACK 2007, 2007, p 43-49

Gopakumar, Sunil, Billaut, Francois, Fremd, Eric, Economou, Manthos .Pb-free process development for a high end storage area network application 2007 Proceedings of the ASME InterPack Conference, IPACK 2007, v 1, 2007 Proceedings of the ASME InterPack Conference, IPACK 2007, 2007, p 937-943

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Advancing Microelectronics
http://www.imaps.org/advancingmicro.html UAr main TK7874.A38 UCI online & sci TK7874.A382
(>=20 items found as of 7/19/2009)
v28#1-v29#5,v30#2-v36#3 checked 7/19/2009 priority

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Aerospace/Airlines Plating Forum
http://www.nmfrc.org/subs/tech.cfm
(0 items found as of 4/19/2009)
94-95,99,01 checked 4/6/2009 priority

," 24th Annual Aerospace/Airline Plating & Metal Finishing Forum , 1988, pp. xx-xx.

1989

1990

1991

James A. Bates The Replacement of Cadmium Plating, Acid or Alkaline Zinc-Nickel , 1992, ,

," 28th Annual Aerospace/Airline Plating & Metal Finishing Forum , Apr. 20-23, 1992, pp. xx-xx.

1993

James A. Bates Comparison of Alkaline Zinc Nickel and Acid Zinc Nickel as Replacement Coatings for Cadmium , 1994, ,

," 30th Aerospace/Airline Plating & Metal Finishing Forum, 1994, pp. xx-xx.

," 31st Aerospace/Airline Plating & Metal Finishing Forum, 1995, pp. xx-xx.

N. Yanaki, X-Ray Fluorescence: The New Key to Highly Accurate, Non-destructive Coating Thickness Measurements for Industry , 1996,

J. Quets & J.R. Alford Thermal Spray for Chromium Plating Replacement, 1996,

," 32nd Aerospace/Airline Plating & Metal Finishing Forum, Apr. 30-May 2, 1996, pp. xx-xx.

," 33rd Annual Aerospace/Airline Plating & Metal Finishing Forum, San Francisco, CA, Mar. 25-26, 1997, pp. xx-xx.

," 1998 Aerospace/Airline Plating & Metal Finishing Forum, San Antonio, TX, Mar. 1998, pp. xx-xx.

Bryan Fuhr A New Aluminum Replacement for Cadmium, 1999,

Bruce D. Sartwell Qualification of HVOF Thermal Spray Coatings as Replacement for Hard Chrome Plating on Aircraft Landing Gear, 1999,

," 1999 Aerospace/Airline Plating & Metal Finishing Forum, Jacksonville, FL, Apr. 20-22, 1999, pp. xx-xx.

," 2000 Aerospace/Airline Plating & Metal Finishing Forum, Cincinnati, OH, Mar. 27-29, 2000, pp. xx-xx.

T.Naguy, M.Klingenberg, M.Neidbalson, M.Pavlik & D.Schario Status Report on Non-line-of-sight (NLOS) Hard Chromium Alternatives, 2001,

Bruce D.Sartwell Status of DoD Program on Replacement of Hard Chrome Plating With Thermal Spray Coatings on Aircraft Components, 2001,

," 2001 Aerospace/Airline Plating & Metal Finishing Forum, Portland, OR, Mar. 27-29, 2001, pp. xx-xx.

," 2002 Aerospace/Airline Plating & Metal Finishing Forum, Orlando, FL, Aug. 27-29, 2002, pp. xx-xx.

," 2004 Aerospace/Airline Plating & Metal Finishing Forum, Tulsa, OK, Mar. 29-Apr. 1, 2004, pp. xx-xx.

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AESF Chromium Colloquium
http://www.nmfrc.org/subs/tech.cfm
(1 items found as of 4/19/2009)
checked 4/6/2009 priority

," AESF Chromium Colloquium, Cleveland, OH, May 30-31, 1996, pp. xx-xx.

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AESF SUR/FIN
Nth AES Annual Technical Conference Proceedings
AESF Annual Technical Conference
American Electroplaters' Society Nth Annual Technical Conference
Proceedings of the AESF Nth Annual Technical Conference
Proceedings of the AESF Annual Technical Conference
http://www.nmfrc.org/subs/tech.cfm GIT main-6e TS670.A332X LH closed UCB pascal TS670.A332 UTor eng TS670.A642 WSU sci TS670.A332
(>=20 items found as of 4/19/2009)
55,79-88,93-00,02-04 checked 4/6/2009 priority

ZAKRAYSEK, L. ; TIN WHISKER GROWTH FROM A BRIGHT ACID TIN ELECTROPLATED FINISH , 1976, , 3033. SUR/FIN 76, SESSION D. Kaja, S, Pickering, H. W, Bitler, William R. INTERDIFFUSION OF ELECTRODEPOSITS WITH COPPER SUBSTRATES. Annual Technical Conference - American Electroplaters' Society, vol. 1, 1982, C-4, 2p

," Proceedings of the 79th AESF Annual Technical Conference SUR/FIN '92, Atlanta, GA, June 22-25, 1992, pp. xx-xx.

Jeannier, Eliane, Zinc plating and corrosion protection top coat Proceedings of the AESF Annual Technical Conference, 1993, pp. 297-308

," Proceedings of The International Technical Conference of AESF SUR/FIN, Anaheim, CA, June 21-24, 1993, pp. xx-xx.

," SUR/FIN '94 Technical Conference Proceedings, Indianapolis, IN, June 20-23, 1994, pp. xx-xx.

," Proceedings of The International Technical Conference of SUR/FIN, Baltimore, MD, June 26-29, 1995, pp. xx-xx.

Szotek, Jeff M, Alloy alternatives to hexavalent chromium Proceedings of the AESF Annual Technical Conference, 1996, pp. 935-943

," Proceedings AESF SUR/FIN '96, Cleveland, OH, June 10-13, 1996, pp. xx-xx.

," Technical Conference Proceedings AESF SUR/FIN, Detroit, MI, June 23-26, 1997, pp. xx-xx.

," Proceedings of AESF SUR/FIN, Minneapolis, MN, June 22-25, 1998, pp. xx-xx.

," Proceedings of AESF SUR/FIN '99, Cincinnati, OH, June 21-24, 1999, pp. xx-xx.

Fan, Chonglun; Blair, A.; Mayer, L.; Abys, J.A. Electric gadgets "must get greener" New Technical and Economical Developments in Nickel/Palladium Leadframe Surface Finishing AESF SUR/FIN, 2000, pp. 187-193

Nickel/Palladium Leadframe Surface Finishing New Technical and Economical Developments in , 2000, Jun, C. Fan, A. Blair, L. Mayer and J. A. Abys

Brenda Fernandes & Dr. Kazimierz Wikiel, Technic, Inc., R&D, Cranston, RI; SUR/FIN 2000 High-speed Electroplating of Lead-free Solder, SUR/FIN 2000

Yun Zhang, Chen Xu, Chonglun Fan & J.A. Abys, Properties of Electroplated Tin & Tin Alloy Coatings, SUR/FIN 2000

Richard M. Edgar, Florida Cir Tech Inc., Greeley, CO ; SUR/FIN 2000 An Analysis of Lead-free Final Finishes: The First Step in Producing a Lead-free Printed Wiring Board , 2000, Jun,

T. Naguy, M. Klingenberg, M. Pavlik & D. Schario Non-line-of-sight Hard Chromium Alternatives Update SUR/FIN 2000

C. Fan, B. Stacy, C. Xu and J. A. Abys Solderability and Wirebonding Performance of Palladium-Cobalt Finish SUR/FIN 2000

," Proceedings of the AESF SUR/FIN 2000, Chicago, IL, June 26-29, 2000, pp. xx-xx.

," AESF SUR/FIN, Nashville, TN, June 25-28, 2001, pp. xx-xx.

Lal, S, "An Evaluative Study of Lead-Free Deposits in High Speed Applications, AESF SUR/FIN Conference 2001

R. Schetty, N. Brown, A. Egli, J. Heber, and A. Vinckler, "Lead-free finishes-whisker studies and practical methods for minimizing the risk of whisker growth," in Proc. AESF SUR/FIN Conf., Jun. 2001, pp. 1-5.

C. Xu, C. Fan, A. Vysotskoya, J. Abys, Y. Zhang, L. Hopkins, and F. Stevie, "Understanding whisker phenomenon\\\_Part II, competitive mechanisms," in Proc. AESF SUR/FIN Conf., Jun. 2001.

Oberle, R, , "Metallurgical Aspects of Tin Whisker Growth", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FIN Conference, June 24-28, 2002, pp. N/A

Boguslavsky, I, , N. Brown and H. Gray, "The Effect of Operating Parameters and Test Conditions On the Whisker Performance of Pure Tin as a Lead-Free Solderable Finish", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FI Conf June 24-28, 2002

," Proceedings of AESF SUR/FIN 2002, Chicago, IL, June 24-27, 2002, pp. xx-xx.

," AESF SUR/FIN Proceedings, Milwaukee, WI, June 23-26, 2003, pp. xx-xx.

," AESF SUR/FIN 2004, Chicago, IL, June 28-July 1, 2004, pp. xx-xx.

," AESF SUR/FIN 2005, St. Louis, Missouri, June 13-16, 2005, pp. xx-xx.

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xxxx AIMS Harsh Environments Electronics Symposium
(5 items found as of 10/17/2009)
09 checked 10/17/2009

," 2009 AIMS Harsh Environments Electronics Symposium, San Diego, CA, Oct. 5-6, 2009, pp. .

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Air and Waste Management Association - Nth Annual International Conference on Thermal Treatment Technologies
priority

(new references 12/30/2008)
Kubik, Katarzyna, Donaj, Pawel, Swiderski, Artur, Yang, Weihong, Blasiak, Wlodzimierz, Christer, Forsgren .Assessment of ASR treatment using pyrolysis and reforming of its residences for small scale electricity generation systems Air and Waste Management Association - 27th Annual International Conference on Thermal Treatment Technologies 2008, v 2, Air and Waste Management Association - 27th Annual International Conference on Thermal Treatment Technologies 2008, 2008, p 717-726

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Air Force Research Laboratory Technology Horizons
http://www.afrlhorizons.com/CAC/
(3 items found as of 4/19/2009)
Mar00-Aug09 checked 9/26/2009

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Aircraft Engineering
OkSU stillwater 629.1305A2985 OSU online & sel TL501A285 SDSU TL501.A5615 UC eng TL501.A555 UK online & eng TL501.A5615 UL online & kersey TL501.A5615 UM TL501.A296 UOk bizzell TL501.A5615 UT online & hodges TL501.A5615
(3 items found as of 4/19/2009)
v76#5

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AIST Steel Properties and Applications Conference Proceedings
priority

(new references 12/31/2008)
Fess, S., .XRF as a method for measuring coat weight thickness of various conversion coatings on steel or aluminum AIST Steel Properties and Applications Conference Proceedings, Combined with Ms and T'07, Materials Science and Technology 2007, AIST Steel Properties and Applications Conference Proceedings, Combined with Ms and T'07, Materials Science and Technology 2007, 2007, p 347-360

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American Institute of Mining & Metallurgy
UK eng TN1.A5
(2 items found as of 4/19/2009)

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American Laboratory
AU rbd Q184.A54 GIT main-3e Q184.A54 LH closed MST Q184.A54 OrSU online OSU health Q184.A54 PU chem 502.8Am35 & hicks 502.8Am35 RyU QD53.L322 SIUC morris 51089-5071 TTU UAB sterne Q184.A54 UCI sci drum Q184.A54 UF ifas centers UIUC chem 600.7805AM UK sci Q184.A54 UM taubman Q184.A52 & buhr Q184.A52 UOk bizzell Q184.A54 UTA geol Q184A54 UTor Q184.A54 UWa davis Q184.A54
(0 items found as of 8/19/2009 priority

Sieber, John R., . Certified reference materials for testing of declarable substances American Laboratory, v 39, n 9, April, 2007, p 20-22

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American Society of Mechanical Engineers, Design Engineering Division (Publication) DE
priority

Gomatam, Rajesh R, and Sancaktar, Erol, "A study of fatigue and failure behavior of conductive adhesive joints subjected to elevated temperature and humidity," American Society of Mechanical Engineers, Design Engineering Division (Publication) DE, vol. 117, Proceedings of the ASME Design Engineering

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American Society of Mechanical Engineers, EEP
Manufacturing Aspects in Electronic Packaging xxxx
92-93 priority

McCluskey, F. P., Govind, A., and Beaudet, D., "Reliability assessment of BGA interconnects with CADMP-II," American Society of Mechanical Engineers, EEP, vol. 17, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 1996, pp. 93-100

Evaluation of a conductive adhesive based approach to lead free flip chip assembly Venkateswaran, Muthiah; Borgesen, Peter; Srihari, K. American Society of Mechanical Engineers, EEP, vol. 2, 2002, pp. 111-115

The lead-free interconnection movement: A pro-active approach to understand the effects on cots usage in the aerospace and defense industries Rafanelli, Anthony J. American Society of Mechanical Engineers, EEP, vol. 2, 2002, pp. 203-213

Akiguchi, Takashi, Koguchi, Hideo, Yamaguchi, M, Takayasu, A, "Deformation of conductive particles and reliability of electronic devices using COG," American Society of Mechanical Engineers, EEP, vol. 2, pp. 425-430, 2002.

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American Society of Mechanical Engineers, Manufacturing Engineering Division, MED
UM aael TS176.I68 RU TS176.P72854
(2 items found as of 4/19/2009)
00-03 checked 3/22/3009 priority

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American Society of Mechanical Engineers, Production Engineering Division
PED
UM aael TK7870.15.M33
(0 items found as of 4/19/2009)
92-93 checked 3/22/2009 priority

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Analytical Chemistry
Lexmark MST depos 660.5In21am & wilson TP1.I615 NWU online & sci L543.05I42 OkSU main 660.5A532 OSU ONL NE & sel TP1J861 PU chem 660.5In2a SDSU online SIUE online Uar online UC chem TP1.I62 UCSD s&e QD450.2.P58 UD online & roesch UIC online UK chem/phys TP1.I615 UL online & kersey TP1.I615 UM online & aael TP1.I62 & buhr TP1.I62 & shapiro TP1.I62 UOk chem-math TP1.I615 USD online UT online & hodges TP1.I615
(0 items found as of 4/19/2009)

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Ann. Institute of Physical Chemistry (Leningrad)
priority

Stepanoff, Ann. Inst. Phys. Chem. (Leningrad), 2, 500 (1924).

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Annalen der Physik
Drude's Annalen
IU online MST depos 530.5An7a & wilson QC1.A6 NWU online & sci 530.5 A61 OkSU main 530.5A6127 OSU online & sel QC1A61 PU online & phys 530.5An7 SDSU online SIUC online SIUE lovejoy UAr online UC online & phys QC1.A6 UCSD s&e QC1.A6134 UIC sci QC1.A6 UK chem/phys QC1.A6 & king QC1.A6 UL online & kersey QC1.A6 & ekstrom QC1.A6 UM online & shapiro QC1.A6 & buhr QC1.A613 UOk bizzell QC1.A6 USD online UT online
(2 items found as of 4/19/2009)

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Nth Annual IEEE Semiconductor Thermal Measurement and Management Symposium
SEMI-THERM
Proceedings of xxxx IEEE/CPMT Nth Semiconductor Thermal Measurement and Management Symposium
IEEE XPLORE (88-) GIT online & main TK7871.85.I27 UK online UM online? (many other universities also subscribe to IEEE XPLORE)
(2 items found as of 2/28/2010)
88-09 checked 2/28/2010

-------------------------------------------------------
1997 1st Annual International Systems Packaging Symposium
priority

Hong, Bor Zen, Viscoplastic deformation and thermal fatigue behavior of lead-free solder joints in a surface mount package The 1997 1st Annual International Systems Packaging Symposium, San Diego, CA, USA, 02-05 Dec. 1997. pp. 197-200. 1997

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106th Annual Meeting and Exposition of The American Ceramic Society
UCF main TP807.I65 UF sci various
priority

(new references 6/8/2009)
Devarajan Balaraman, P. Markondeya Raj, Sid Dalmia, Isaac Robin Abothu, Swapan Bhattacharya, Lixi Wan, Michael. D. Sacks, Madhavan Swaminathan and Rao R. Tummala, "Integration of Hydrothermal and Sol-Gel Derived Ceramic Film Capacitors for Next-Generation Convergent Microsystems", Presented at 106th Annual Meeting and Exposition of The American Ceramic Society held during April 18-21, 2004.

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Annual National Relay Conference
UK eng TK2851.N27
(1 items found as of 4/19/2009) priority

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Annual Technical Conference and Exhibition - Institute of Metal Finishing
LH TS653.A1I52
(1 items found as of 4/19/2009) priority

Smart, D, Such, T. E.; Wake, S. J. NOVEL TRIVALENT CHROMIUM ELECTROPLATING BATH. Technical Papers, Annual Technical Conference and Exhibition - Institute of Metal Finishing, vol. 1, 1983, pp. 41-72

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Annual Technical Conference - ANTEC
Society of Plastics Engineers Annual Technical Conference xxxx
LH TA455.P5S635 MST wilson TP1105.S55 OkSU main 668.408S678t OSU sel TP1105.S62 SDSU TP986.A1.S5725 UC eng TP1105.S63 UCB eng TP986.A1S5725 UL kersey TP1105.S62 UM online & aael TP986.A1S677 UOk online
(2 items found as of 4/19/2009)
94

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Anti-Corrosion Methods and Materials
MST wilson TA462.A57 OkSU online OSU online & sel TA462A1A56 SDSU online SIUC morris 51391-6202 UAr online UC online UH online UK online & eng TA462.A67 UL online UM online & aael TA462.A1A628 UOk online UT online UTo online
(9 items found as of 3/2/2010)
v39#1-v57#1 checked 3/2/2010

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Appliance
OSU online PU eng 671M562 SDSU online UM online UT online
(1 items found as of 4/19/2009)

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Appliance Design
http://www.appliancedesign.com/ IU online NWU online OSU online PU hicks 338.47643605Ap58 SDSU online SIUC online UAr online UCSD online UIC online UK online UOk online USD online UT online
(>=20 items found as of 3/2/2010)
v52#1(Jan04)-v58#1(Jan10) checked 3/2/2010

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Application Reference Materials
http://arm.eem.com/
(1 items found as of 4/19/2009)
checked 4/6/2009

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Applications of Surface Science
MST wilson TA418.7.A66 NWU sci 660.29453A6524 OkSU online PU hicks 660.29453Ap58 SIUC morris 57118-6611 UAr chem TA418.7.A66 UC geo TA418.7.A66 UCSD online UM online sd & shapiro QC1.A652 UT online
(1 items found as of 4/19/2009)

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Applied Physics A
MST online OCU online OkSU online OSU online & QC1A6232 PU online & phys 530.05Ap51a SDSU online SIUC online UAr online UC online & phys QC1.A662 UCSD online UM online & shapiro QC1.A65742 USD online UT online & hodges QC1.A73
(2 items found as of 4/19/2009)

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Applied Physics Letters
FSU online GIT online MST online OkSU online OSU online & sel QC1A626 SDSU online SIUC online SIUE online UAr online UC online & phys QC1.A67 UCF online UCSD online UE UM online & aael QC1.A658 UOk online USD online UT online
(>=20 items found as of 7/22/2009)
v90#11,v92#9,v92#21,v93#1,v93#4,v93#12 checked 7/10/2009

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Applied Surface Science
MST wilson TA418.7.A66 OkSU online OSU online SDSU online SIUC online UAr chem TA418.7.A66 UC online & TA418.7.A66 UCSD s&e UK online sd UL online & kersey TA418.7.A66 UM online & shapiro QC1.A652 UOk online UT online UTo online & carlson WSU online & carlson
(6 items found as of 4/19/2009)

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Archaeologia
MSU main DA20.A64 NWU main film 16500 OSU depos DA20A66 PU human microform 072 Ea76 Reel 1258-1261 SIUC morris 32675-9131 UC class DA20.A66 UCSD ssh oversize UIC daley DA20.A64 UK King DA20.A64 UL art DA20.A64 & microforms UM hatcher film X1287 reel 1258-1261 UT hodges DA20.A64 WSU purdy-kresge
(1 items found as of 4/19/2009)

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(new source 1/6/2010)
Archives of Environmental Contamination and Toxicology
UK online
(1 items found as of 4/19/2009)
v53#2 checked 1/8/2020

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Archives of Metallurgy and Materials
LH closed
(1 items found as of 4/19/2009)

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Arrow Asian Times
(7 items found as of 6/10/2009)

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Ars Organi
FSU music MT182.P4 IU bmusic NWU music MT182.P4 RU fondren ML5.A68 UC ccm MT182.P4 UK finearts MT182.P4 UM music ML5.A78 UMc music MT182.P43A7 UTor music ML5.A647
priority

(new references 2/11/2009)
[7] K. Bormann, Ars Organi 1969, 35, 1326.

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ASHRAE Journal
AU online CBU FIT online FSU online GIT online IU online LH closed LU gray TH7201.A22 MoSU TH7005.A87 MST wilson TH7201.A512 NWU online OCU microform OGI online OkSU online OrSU valley TH7201.A53 OSU online PU online RU fondren SDSU online SIUC online SIUE lovejoy microfiche SU online TTU UAB sterne TH7201.A22 UAH online UAr online UC online UCF online UCI online UCSD online UD online UDe online UE UF online UIC online UIUC online UK online & eng TH7005.A74 UM online & aael TH7201.A516 UMC online UMe mcwherter UNF online UOk online USD online USF online USU online UT online UTA online UTo online WrSU online
(1 items found as of 4/19/2009)

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Nth Asia and South Pacific Design Automation Conference

ASP-DAC
IEEE XPLORE (95,97-)
(1 items found as of 2/28/2010)

95,97-09 checked 2/28/2010

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xxxx Asia-Pacific Symposium on Electromagnetic Compatibility
APEMC
Asia-Pacific Symposium on Electromagnetic Compatibility and Nth International Zurich Symposium on Electromagnetic Compatibility
IEEE XPLORE(08) UM online? (many other universities also subscribe to IEEE XPLORE)
(2 items found as of 3/4/2010)
08 checked 3/4/2010

-------------------------------------------------------
Nth Asian-Pacific Congress on Computational Mechanics
GIT main-4e QA801.A75 OSU sel QA801.A75 UIUC eng 531As42c UM aael QA801.A751 UOk chem-math QA801.A75
(1 items found as of 4/19/2009)

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ASM International Electronic Materials and Processes Conference
UM aael TK7874.A771
(1 items found as of 4/19/2009)

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ASME International Mechanical Engineering Congress and Exposition
IMECE
ASME International Mechanical Engineers Conference
BYU TJ5.I58 GIT main-5e TJ5.I58x LH TA349.R41 MST wilson TA190.E66 OrSU valley TJ212.2.I56 OSU sel TA349.P763 PU eng 620.0068En335 RU fondren TJ260.I564 & TJ212.2.P76 RyU TJ5.M36 UC eng TA164.A85 & eng TJ212.2.P76 & eng TJ260.A75 UM aael various UTA eng TJ260I5755
(>=20 items found as of 8/19/2009)
07-08 checked 8/19/2009 priority

(new references 6/8/2009)
S. Bhattacharya and R. Tummala, "Epoxy nanocomposite capacitors for integral passives technology, " ASME International Mechanical Engineers Conference, Technical Paper 99-IMECE/EEP-25, pp. 1-8, Nashville, Tennessee, November 1999

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Assembly
http://www.assemblymag.com/ MST online MTUM online OkSU online OSU online SDSU online UAr main TS178.4.A75 UC online & eng TJ1320.A75 UCSD ssh PR3291.A1A77 UOk online UT online VU online WSU online
(>=20 items found as of 10/22/2009)
Jan03-Jul09(v52#7) checked 10/22/2009

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Assembly Automation
MST online OkSU online OSU online SDSU online UAr online UC online & eng TS178.4.A84 UCSD online UH online UOk online UT online UTo online WSU online & sci
(5 items found as of 8/23/2009)
v12#1-v29#4 checked 8/23/2009

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ASTM special technical publication
MST wilson various NWU sci 620.6A5127s OkSU main 620.112A512s OSU misc PU eng misc Lexmark various SDSU TA401.A69 SIUC mclafferty 620.112A512s SIUE lovejoy various UAr various UC various UCSD s&e various UD roesch various UIC verious UK eng TA410.A43 & QD133.A63 UL kersey TA418.9.C6T43 UM misc USD various UT hodges TA401.A69

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Aufbereitungs-Technik Mineral Processing
LH closed OSU sel TA401.A85

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Australian Journal of Scientific Research
IL bloomington alf QC1.A93 MST depos 505Au78 NWU sci 530.5A938 OkSU online OSU sel QC1A93 PU chem 540.5Au73 SDSU Q1.A773 SIUC storage 51368-5301 & storage 51010-5741 UC phys Q1.A7 & sw depos Q1.A7 UCSD s&e Q1.A938 UIC sci various UK chem/phys Q1.A773 UL ekstrom QH1.A983 UM online & shapiro QD1.A93 UOk bizzell Q1.A773 & bizzell QH1.A983 UT hodges closed Q1.A8
(0 items found as of 4/19/2009)

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Australian Printer Magazine
GIT main-6e Z119.A895

Tribute, Andrew "Living with the environment," AP Australian Printer Magazine, n FEB., Feb. 2006, p 29

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Automotive Engineer
OkSU online OSU online & sel TL1J192 SDSU online SIUC online SIUE lovejoy microfiche UAr online UC eng TL1.A88 UCSD online UK online & eng TL1.S5 UL online & kersey TL1.A596 & kersey TL1.S5 UOk online USD online UT hodges TL1.A596
(4 items found as of 4/19/2009)
v28#5

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Automotive Finishing
SDSU online UOk online
(2 items found as of 4/19/2009)

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Aviation Week & Space Technology
MST wilson TL501.A8 MSU online OCU beam OkSU stillwater 629.1305A9588 OSU online & sel TL501A95 SDSU online SIUC online SIUC lovejoy UAr online UC eng TL501.A7 UCSD online UE UK eng TL501.A8 UL kersey TL501.A8 UOk online USD online UT online UTo online & carlson WSU online & sci
(4 items found as of 4/19/2009)
v124#6-v158#22(2003)

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Avnet Advantage
http://www.em.avnet.com/aam/home/0,2039,RID%253D%2526CID%253D0%2526CCD%253DUSA%2526SID%253D32216%2526DID%253DDF2%2526LID%253D32241%2526PVW%253D%2526BID%253DDF2%2526CTP%253DAAM,00.html
(>=20 items found as of 4/19/2009)
Apr04-Jun06,Mar07 checked 4/6/2009

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BBBB

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Berichte der Deutschen Chemischen Gesellschaft
IU bloomington alf QD1.D4 MST depos 540.6D48 NWU sci 540.6D48 OkSU stillwater 540.5C5168 OSU sel compact QD1.D48 PU chem 540.5D48 & hicks 540.5D48 SDSU online SIUC morris 51816-5401 SIUE storage UAr online UC chem (Oesper Rm) QD1.D4 UCSD online UD roesch rare QD1.D4 UE UIC sci UK chem/phys QD1.D4 UL kersey QD1.D4 UM online & shapiro QD1.D486b & hatcher QD1.D486b & buhr QD1.D486b UOk online UT hodges closed QD1.D4
(2 items found as of 4/19/2009)

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Board Authority
UM online
(3 items found as of 4/19/2009)

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Boltzmann-Festschrift

J. H. van't Hoff, Boltzmann-Festschrift 1904, S. 233.

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Bosch Telecom

"CECC-parts with Pure Sn for Pretinning for VJ-capacitors," Sept. 1996.

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Brass World
The Brass world and Platers Guide
OSU depos TS200B82 UAr storage ML1.B72 UM buhr TS200.P72 WSU storage
(1 items found as of 4/19/2009)

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British Chemical Abstracts
OSU depos QD1C52 PU hicks 540.5B77 SIUC storage 51903-5401 UC biol QP1.P4 UK chem/phys QD1.B8 UL ekstrom QD1.B68 UM aael QD1.B8621 & shapiro QD1.B8621 UOk bizzell 660.5B899b UT hodges QD1.B68
(1 items found as of 4/19/2009)

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British Corrosion Journal
OSU sel TA462A1B7 SIUC storage 51630-6201 UC eng TA462.B73 UCSD s&e QD1.B864 UK online & eng TA462.B73 UOk bizzell TA462.B73 UT hodges TA462.B73
(1 items found as of 4/19/2009)

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British Plastics & Rubber
AU online BYU hbll TP1101.B75x FIT online FSU online GIT main-4w HD9661.G7B73 LH NWU sci L678.05B849 PU eng 678.05P695 & hicks 678.05P695 SIUC storage 51156-6732 UDe online UF online UIUC eng 668.405BR UM online & aael TP1101.P72B UNF online USF online
(1 items found as of 4/19/2009)

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Bulletin of the American Physical Society
IU bloomington swain QC1.A512 & alf QC1.A512 MST depos 530.5Am35b NWU online & sci L530.6A512b OkSU online OSU sel QC1A56 PU chem 530.5P56b & phys 530.5P56b SDSU online SIUC morris 51134-5301 UAr online UC phys QC1.A55 UCSD online UD roesch UIC sci QC1.A56 UK chem/phys QC1.A56 UL kersey QC1.A56 UM hatcher QC1.A524 UOk bizzell QC1.A473 UT hodges closed QC1.A58
(3 items found as of 4/19/2009)

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CCCC

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Cadalyst
http://www.cadalyst.com/cadalyst/ IU online NWU online OkSU stillwater 620.5C1221 OSU online PU eng 006.605C113 SDSU online UC CAS T385.C338 UCSD online UM online UOk online UT online
(1 items found as of 10/22/2009)
Apr00-Feb09 checked 10/22/2009

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Calphad: Computer Coupling of Phase Diagrams and Thermochemistry
AU online BYU online FSU online GIT online LH closed MoSU QD510.C17 MST wilson QD503.C2 NWU sci microfiche S13 OkSU online OSU online PU online SDSU online UC online UCI online UCSD online UD online UDe online UF online UIC online UIUC online UM online sd UMC online UNF online USD online USU online UT online UTA online UTo online WrSU online
(1 items found as of 4/19/2009)
v31#4 checked 3/5/2009

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Canadian Aeronautics and Space Journal
MST wilson TL501.C2713 OkSU stillwater north_boomer 629.1305C212 OSU sel TL501C3 SIUC storage 51729-6291 UCSD s&e TL1.C212 UM buhr TL501.C23 UOk online UT hodges TL501.C2713
(1 items found as of 4/19/2009)

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Canadian Journal of Physics
IU blomington swain QC1.C21 & alf QC1.C21 MST wilson QC1.C3 NWU online & sci 530.5C212 OkSU online OSU online & sel QC1C16 PU phys 506N213j & hicks 506N213j SDSU online SIUC online SIUE storage UAr online UC phys QC1.C3 UCSD online UD roesch UIC sci QC1.N3323 UK chem/phys QC1.C360 UL kersey QC1.N332 UM online & shapiro QC1.C21 UOk online USC online UT hodges QC1.C36
(2 items found as of 4/19/2009)

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Capacitor and Resistor Technology Symposium
CARTS
Nth Annual Capacitor and Resistor Technology Symposium
CARTS xxxx Proceedings
CARTS USA xxxx Proceedings
Nth Passive Components Symposium
Proceedings of the Nth Symposium for Passive Components
http://ecadigitallibrary.com/conference.php?cid=17 LH open TK7872.C65C36 & TK7872.C65C37 & TK7872.C85 & 628.1X29
(>=20 items found as of 6/17/2009)
85-86,88-99,02-09 checked 6/17/2009 priority

Proceedings of the 15th Capacitor and Resistor Technical Symposium, San Diego, CA, Mar. 13-16, 1995, pp.

1996 CARTS Conference, 1996, pp. xx-xx.

17th Annual Capacitor and Resistor Technology Symposium

18th Annual Capacitor and Resistor Technology Symposium, CA, Mar. 1998, pp.

19th Annual Capacitor and Resistor Technology Symposium, New Orleans, LA, Mar. 1999, pp. xx-xx.

CARTS USA 2000 Proceedings, Huntington Beach, CA, Mar. 6-10, 2000, pp. xx-xx.

CARTS 2001 Proceedings, St. Petersburg, FL, Mar. 26-30, 2001, pp. xx-xx.

CARTS 2002 Proceedings, New Orleans, LA, Mar. 25-29, 2002, pp. xx-xx.

CARTS USA 2003 Proceedings, Mar. 31-Apr. 3, 2003, pp. xx-xx.

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CARTS Asia 2008 Proceedings
http://ecadigitallibrary.com/conference.php?cid=17
(>=20 items found as of 6/16/2009)
05-07 all checked 6/16/2009 priority

CARTS Asia 2008, Taipei, Taiwan, Oct. 7-11, 2008, pp.

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CARTS Europe xxxx Proceedings
Nth European Passive Components Conference
Proceedings Carts-Europe xxxx
Proceedings Nth European Passive Components Symposium
http://ecadigitallibrary.com/conference.php?cid=17 UWa davis TK7872.C85E85x
(>=20 items found as of 6/16/2009)
04-07 checked 6/16/2009 priority

CARTS Europe '93, Geneva, Switzerland, Oct. 4-7, 1993, pp.

Proceedings Nth European Passive Components Symposium, Crowborough, UK, Oct. 17-20, 1994, pp.

CARTS Europe '95, Amsterdam, Netherlands, 1995, pp.

CARTS Europe 96, Nice, France, 1996, pp.

Proceedings of 9th European Passive Components Symposium, Prague, Czech Republic, 1997, pp.

Proceedings CARTS-Europe '98, Nice, France, Oct. 13-16, 1998, pp.

CARTS-Europe '99, Lisbon, Portugal, Oct. 18-22, 1999, pp. xx-xx.

CARTS Europe 2000, Brussels, Belgium, Oct. 16-20, 2000, pp.

CARTS Europe 2001, Copenhagen, Denmark, Oct. 15-19, 2001, pp.

CARTS Europe 2002, Nice, France, Oct. 15-17, 2002, pp.

Blum, W, , R. Kullman, et al "On the Scope of Whisker Risk of Pure Tin Terminated SMD-Resistors", Capacitor and Resistor Technology Symposium (CARTS) Europe, Oct. 15-17, 2002, pp. 234-238

CARTS Europe 2003, Stuttgart, Germany, Oct. 26-29, 2003, pp.

CARTS Europe 2008 Proceedings, Helsinki, Finland, Oct. 20-23, 2008, pp.

CARTS Europe 2009, England, Sept. 2009, pp.

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CENS.com
http://cens.com/cens/html/en/index.html
(19 items found as of 4/19/2009)
checked 4/6/2009

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Chemical and Engineering News
MST wilson TP1.C35 OkSU stillwater 660.5C5172 OSU sel TP1J862 SDSU online SIUC online SIUE online UAr online UC online & chem TP1.I63 UCSD s&e QD1.C517 UE UK chem/phys TP1.C35 UL online & kersey TP1.C35 UOk online USD online
(12 items found as of 4/19/2009)

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Chemical Engineer
MST online OCU beam OkSU stillwater 660.5C51728 OSU sel & compact TP1I592 PU hicks 540.5C383 SDSU online SIUC morris 51393-6611 UAr online UC eng TP1.I7 UCSD online UD roesch UK eng TP1.C445 UL kersey TP1.C524 UOk eng TP1.C322 USD online UT online & hodges TP1.C356
(1 items found as of 4/19/2009)

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Chemical Market Reporter
MST online OkSU stillwater 660.5O391 OSU online & sel HD9650.1C486 SDSU online SIUC online SIUE microfiche UAr online UC eng TP1.O4 UCSD online UK online UL kersey TP1.O4 UOk online USD online UT online & hodges TP1.O4
(3 items found as of 4/19/2009)

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Chemical Processing
http://www.chemicalprocessing.com/ AU online FSU online LH closed NWU sci L660.5C5178 OkSU online OrSU valley TD1.C5006 OSU sel TP1.C48 & compact TP1.P739 PU eng 660.5C4193 & hicks 660.5C4193 SDSU online SIUC online SU online UC sw depos TP1.C35 UCF main TP1.B693 UCSD s&e QD1.C5248 UD online UDe online UF sci TP1.P684 UK online UMC online USF online UTA chem TP1C367 UTo online
(8 items found as of 4/29/2009)
May02-Apr09 checked 4/29/2009

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Chemisch Weekblad
NWU sci L540.5C5175 OSU depos QD1C6 PU hicks 540.5C42 UC sw depos QD1.C68 UIC warehouse QD1.C6885 UK King QD1.C6885 UM buhr QD1.M188 UOk hist_of_sci
(6 items found as of 4/19/2009)

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Chemistry of Materials
AU online FSU online GIT online LH closed NWU sci L660.205C5172 OGI sci OkSU online OrSU valley QD1.C73931 OSU online PU online RU online SDSU online SPU online SU online TTU online UAB online UAr online UC online UCF online UCI online UCSD online UD online UDe online UF online UIC online UIUC online UK online & chem/phys QD1.C7448 UL robotic UM online & aael QD1.C74481 UMC online USD online USF online USU online UTA online UTo online WrSU online
(15 items found as of 3/2/2010)
v12#1-v22#5 Articles ASAP to Oct. 21, 2009 checked 3/2/2010

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Chemosphere
AU online BYU hbll QH540.C48 FSU online GIT online IU online LH closed MST wilson QH540.C48 NWU online OGI online OkSU stillwater 628.505C5175 OrSU valley QH540.C48 OSU online PU online RU online SDSU online SIUC online UAB sterne QH540.C48 UAr online UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UK online UM online sd & shapiro QH540.C51 UMC online UNF online UOk online USd online USF online USU online UT online UTA online UTo online WrSU online
(1 items found as of 4/19/2009)

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China Welding (English Edition)
LH closed UTo online
(1 items found as of 4/19/2009) priority

(new references 12/30/2008)
Zhang, Liang, Xue, Songbai, Lu, Fangyan, Han, Zongjie, Wang, Jianxin .Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape leads China Welding (English Edition), v 17, n 2, June, 2008, p 37-41

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Chinese Journal of Materials Research
Cailiao Yanjiu Xuebao
LH closed UTo online
priority

(new references 12/30/2008)
Zhang, Xinping, Yin, Limeng, Yu, Chuanbao .Advances in research and application of lead-free solders for electronic and photonic packaging Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research, v 22, n 1, February, 2008, p 1-9 Language: Chinese

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The Chinese Journal of Nonferrous Metals
Zhongguo Youse Jinshu Xuebao
LH closed
(4 items found as of 4/19/2009) priority

(new references 12/29/2008)
Xie, Hai-Ping, Yu, Da-Quan, Ma, Hai-Tao, Wang, Lai Microstructure, wettability and mechanical properties of Sn-Zn-Cu lead free solder Chinese Journal of Nonferrous Metals. Vol. 14, no. 10, pp. 1694-1699. Oct. 2004

Lu, Bin, Wang, Juan-Hui, Li, Hui, Zhu, Hua-Wei, Jiao, Xian-He .Effect of .10% Ce on intermetallic compounds at Sn-.7Cu-.5Ni/Cu interface Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, v 17, n 3, March, 2007, p 390-395 Language: Chinese

Lu, Bin, Li, Hui, Wang, Juan-Hui, Zhu, Hua-Wei, Jiao, Xian-He .Effect of Er on microstructure and properties of Sn-.0Ag-.5Cu lead-free solder alloy Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, v 17, n 4, April, 2007, p 518-524 Language: Chinese

Wei, Guo-Qiang, Kuang, Min, Yang, Yong-Qiang, Zhao, Li .Interfacial growth behavior of Sn-9Zn/additive Cu-particles and Sn-9Zn/Cu-substrate Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, v 17, n 7, July, 2007, p 1083-1089 Language: Chinese

Fan, Zhi-Gang, Ma, Hai-Tao, Wang, Lai .Effect of Cu on electrochemical corrosion behavior of lead-free Sn-9Zn-xCu solder Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, v 17, n 8, August, 2007, p 1302-1306 Language: Chinese

Li, Yuan-Shan, Chen, Zhen-Hua, Lei, Xiao-Juan .Influence of rapid cooling and diffusion annealing on Sn-Bi-X solder Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, v 17, n 8, August, 2007, p 1319-1323 Language: Chinese

Ju, Guo-Kui, Wei, Xi-Cheng, Sun, Peng, Liu, Johan .Effects of interfacial IMC on tensile fracture behavior of Sn-.0Ag-.5Cu solder joints on copper substrates Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, v 17, n 12, December, 2007, p 1936-1942 Language: Chinese

Zeng, Ming, Chen, Zheng-Zhou, Shen, Bao-Luo, Xu, Dao-Fen .Indentation creep behavior of Sn-.5Ag-2Bi lead-free solder Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, v 18, n 4, April, 2008, p 620-625 Language: Chinese

Zhou, Ying-Chun, Pan, Qing-Lin, Li, Wen-Bin, Liang, Wen-Jie, He, Yun-Bin, Li, Yun-Chun, Lu, Cong-Ge .Effect of La on intermetallic compounds of Sn-Ag-Cu lead-free alloy soldered with copper Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, v 18, n 9, September, 2008, p 1651-1657 Language: Chinese

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Chinese Journal of Semiconductors
Pan Tao Ti Hsueh Pao
LH closed
(2 items found as of 4/19/2009)

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Chinese University of Hong Kong Technical Conference

Shih, Richard L. H, , Metallurgy and stability of the pure Sn/Ni and Sn/Cu interface for lead-free flip chip application, The Chinese University of Hong Kong Technical Conference Taipei, Taiwan Dec. 2002 pag 77

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Chip Scale Review
http://www.chipscalereview.com/issues/0406/index.php MST online
(>=20 items found as of 12/25/2009)
Mar98-Sept07,Apr08-May08,Jul08-(v13#3)May09,Aug09-Nov09 checked 12/25/2009

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Circuit Cellar
http://www.circuitcellar.com/ MST wilson QA76.76.A65C55
(1 items found as of 4/19/2009)
#215,#217-#226 checked 5/3/2009

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Circuit World
ISU parks TK7867.A8 LH closed MST online MSU online NWU online OkSU online OSU online SDSU online UAr online UC online UCB online UCI online & sci TK7867C573 UH online UK online UL online UM online UOk online USD online UT online UTo online WSU online
(>=20 items found as of 3/2/2010)
v1#1-v36#1 all checked 3/2/2010

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Circuitnet
http://www.circuitnet.com/
(>=20 items found as of 4/19/2009)
checked 4/6/2009

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Circuitree
http://www.circuitree.com/ AU online GIT online KSU online KU online LH closed MST online MSU online SDSU online UCB online UCF online UF online UNF online UOk ONLNE UT online UTor online WSU online
(>=20 items found as of 10/30/2009)
v13#3-v22#10 checked 10/30/2009 priority

Handwerker, C. A. (METALLURGY DIVISION - 855) Lead-Free Solders: A Change in the Electronics Infrastructure Circuitree - Sept. 1, 1999

Zhang, Y, , Circuitree, vol. 12, no. 11, pp. 10 - 22, Nov. 1999.

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Circuits Assembly
http://www.circuitsassembly.com/ Lexmark OkSU online OSU online SDSU online SIUC online UAr online UCI online UCSD online UK online UOk online USD online UT online UTo online WSU online
(>=20 items found as of 12/25/2009)
v12#4-v20#11 checked 12/25/2009

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Circuits Manufacturing
AU rbd TK7868.P7C543 ISU parks TK7869.C57x Lexmark LH closed PU hicks 621.381505C496
(1 items found as of 4/19/2009)

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Clean Technologies and Environmental Policy
Clean Products and Processes
AU online GIT online MST online NWU online OGI online OrSU online OSU online PU online SDSU online SIUC online SU online UAr online UC online UCI online UCSD online UDe online UF online UK online UMC online UNF online USD online USF online UOk online UT online UTA online UTo online WrSU online
(0 items found as of 3/2/2010)
v1#2-v12#1 online First to Mar. 3, 2010 checked 3/2/2010

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Collection of Papers Presented at The Nth International Workshop on THERMal INvestigation of ICs and Systems
THERMINIC
Proceedings of the 12th International Workshop on THERMal INvestigations of ICs and Systems
IEEE XPLORE (07-) UM online? (many other universities also subscribe to IEEE XPLORE)
(3 items found as of 2/28/2010)
07-09 checked 2/28/2010

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Collection of Technical Papers - Nth AIAA Aerospace Sciences Meeting
UTA online UTor aero TA630.S76 UWa davis TL671.2.A369

Corbitt, N., Ngo, C. C., and Lai, F. C., "Effects of thermal and vibrational cycles on stresses in lead-free solder joints," Collection of Technical Papers - 45th AIAA Aerospace Sciences Meeting, vol. 11, pp. 7526-7533, 2007.

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Collection of Technical Papers - AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference
AU rbd TA645.A3 GIT TA645.A3 & TL875.A111 LH open MoSU documents MST various OSU sel TA645.A19 PU eng 620.106St89 SIUC morris 629.1A288c UAr online UC eng TA645.A2 UF sci TL671.2.A369 UIUC eng 629.1Ai12c UM aael TL950.A28 UOk eng TA645.A512
priority

(new references 12/30/2008)
Qian, H., Sun, C.T. .Effect of bondline thickness on mode I fracture in adhesive joints Collection of Technical Papers - AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, 49th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference, 2008, p 2008-1845

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Compliance Engineering
http://www.ce-mag.com/ Lexmark TH7800.C65 OkSU online PU eng 343.7309945C738 SDSU online
(16 items found as of 4/19/2009)

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Components in Electronics
http://www.cieonline.co.uk/cie2/
(>=20 items found as of 4/19/2009)
-Apr09 checked 4/6/2009

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Composites Part A: applied science and manufacturing
MST online NWU online & sci L620.11805C737a OSU online & sel TA418.9C6C628 PU online & eng 620.1105C738 SDSU online SIUC online UAr mullins per-microfiche UC online & eng TA418.9.C6C62 UCSD online UD online UIC online & daley TA418.9.C6C63 UM online sd UOk online UT online & hodges TA418.9.C6C65
(1 items found as of 4/19/2009)

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Comptes Rendus Hebdomadaires des S‚ances de l'Acad‚mie des Sciences
AU rbd closed Q46.A14 GIT storage Q46.A14 MST depos 505C73 NWU sci 506P23 OkSU stillwater 506A167c OSU depos Q46P23 PU math 506Ac1ab & hicks 506Ac1ab SDSU online SIUC online SIUE storage UAr storage Q2.A24 UC chem (Oesper Rm) Q46.A143 UCI sci microform S-000210 UCSD s&e Q1.A1683 UIC various UK chem/phys Q46.A14 & king Q2.A25 UL kersey Q46.A142 & Q46.A14 UM hatcher Q46.A14C7 & buhr Q46.A14C7 UOk bizell Q2.A26 UT hodges Q46.A14Ser.2 WSU storage & sci

Compt. rend. 47, 106, Nov. 1868. *** not applicable ***

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Computational Materials Science
AU online FSU online GIT online LH closed MST online NWU online OkSU online OrSU valley TA403.6.C67 OSU online PU online RU online SDSU online UAB sterne TA401.C656 UAr online UC online UCSD s&e TA1.C64245 UM online UMC online UNF online UOk online USF online USU online UT online UTA online UTo online UTor online UWa online WrSU online
(5 items found as of 10/22/2009)
v43#1-v46#4 In Press to Oct. 2, 2009 checked 10/22/2009 low priority

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Computer Law and Security Report
NWU online OkSU online OSU online SDSU online UC online UCSD online UD online UIC online UM online UOk online UT online UTo online WSU online
(2 items found as of 10/5/2009)
v18#1-v25#5 checked 10/5/2009

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Computers, Materials and Continua
UCI online
(1 items found as of 4/19/2009)
v1#1-v4#1 priority

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Conference Proceedings nth European Microwave Conference
EuMC European Microwave Conference
Proceedings of the Nth European Microwave Conference
IEEE XPLORE (69-) GIT main TK7876.E87 UCF main TK7876.E87 UCI sci TK7876.E87 UK online UM online & aael TK7876.E88 UT hodges TK7876.E87 UTo depos TK7876.E87 (many other universities also subscribe to IEEE XPLORE)
(3 items found as of 2/28/2010)
69-09 all checked 2/28/2010

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Conference Record - IEEE Instrumentation and Measurement Technology Conference
IMTC
Instrumentation and Measurement Technology Conference Proceedings
Proceedings of the IEEE Instrumentation and Measurement Technology Conference
Proceedings of the Nth IEEE Instrumentation and Measurement Technology Conference
IEEE XPLORE (88-) UK online UM online? (many other universities also subscribe to IEEE XPLORE)
(12 items found as of 2/28/2010)
88-09 checked 2/28/2010

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Conference Record of the xxxx IEEE Nth World Conference on Photovoltaic Energy Conversion
IEEE XPLORE (94,03,06) UK online UM online? (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
94,03,06 checked 2/28/2010

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Conference Record of the xxxx International Display Research Conference
IEEE XPLORE (88,91) NWU online PU hicks 621.38In7 UC eng microfiche 6491CM3071-8 UH TK7882.I6I168 & TK5103.5D5 UK online UM online & aael TK5.I12 (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
82,85,88,91 checked 2/28/2010

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Conformity
http://www.conformity.com/
(>=20 items found as of 4/19/2009)
v10#1-v12#1,v12#3,v14#1,v14#4(last) checked 5/3/2009

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Connect
http://www.twi.co.uk/j32k/unprotected/band_1/connect_archive.html NWU online SDSU online SIUC online UIC online UT online
(10 items found as of 4/19/2009)
-#157(Feb09) checked 4/6/2009

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Connector Specifier
http://www.connectorspecifier.com/ NWU online OkSU online OSU online SDSU online SIUC online UAr online UCSD online UK online USD online UT online
(>=20 items found as of 3/2/2010)
v16#1-v25#5 checked 3/2/2010

*** here for UK *** --------------------------------------------------------
Control
http://www.controlglobal.com/issues/index.html AU rbd TJ212.C59 LH closed NWU sci L629.8305C764 OkSU stillwater 670.4205C764 OrSU valley TK7880.C6 OSU depos TJ212.C595 PU hicks 629.805C768 RU fondren TK7882.C6C65 SIUC online UIC warehouse TJ212.C59 UIUC eng 629.805CO UK online UM online & buhr TJ212.C76 USF online WrSU swdepos TJ212.C59
(1 items found as of 4/29/2009)
Jan07-Apr09 checked 4/29/2009

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Control Engineering
http://www.controleng.com/ AU online CBU FSU online GIT online LH closed MST wilson TJ212.C6 NWU sci L629.8905C764 OGI online OkSU stillwater 621.805C764 OrSU valley TJ212.C6 OSU online PU eng 621.805C76 & hicks 621.805C76 RU fondren TJ212.C6 SDSU online SIUC online SU online TTU TJ212.C6 UAB sterne TJ212.C6 UAr online UC online UCF online UCI sci drum TJ212.C6 UCSD online UD online UDE online UF online UIC online UIUC online UK eng TJ212.C6 UM online & aael TA165.A1C76 UNF online USD online USF online USU online UTA online UTo online WrSU online
(4 items found as of 4/19/2009)

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Corporate Environmental Strategy
OSU online & faes HD30.255.C67 SDSU online UC online UCB online UCSD online UF online USF online UT online & hodges HD30.255.E67 UTA online UTo online WSU online
v5#1-v9#4 checked 4/15/2009

Veleva, Vesela, and Sethi, Suresh, "The Electronics Industry in a New Regulatory Climate: Protecting the Environment and Shareholder Value," Corporate Environmental Strategy , vol. 11 no. 9, pp. 2-207-2-224, Oct. 2004.

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Corrosion
MST online OSU TA462C75 SIUC online UC eng TA462.C65 UCSD online UK eng TA462.C65 UL kersey TA462.C65 UT online
(1 items found as of 4/19/2009)
v7#10

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Corrosion Reviews
Reviews of Coatings & Corrosion
GIT main-5e TA418.76.R48 LH closed MST wilson TA418.76.R48 TTU UIUC eng 620.112205RE1 USF tampa TA418.76.R48 UT hodges TA418.76.R48
(4 items found as of 8/14/2009)
v3#1-v26#6 checked 8/14/2009 priority

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Corrosion Science
MST wilson TA462.C67 OkSU online OSU online & sel TA462C83 SDSU online SIUC online UAr mullins TA462.C659 UC online & eng TA462.C678 UCSD online UK online sd & eng TA462.C659 UL online & kersey TA462.C659 UM online sd UT online UTo online & carlson WSU online
(13 items found as of 12/28/2009)
v42#1(2000)-v52#2 Articles in Press to Dec. 28, 2009 checked 12/28/2009

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DDDD

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Dataweek
http://dataweek.co.za/
(>=20 items found as of 4/19/2009)
-Apr1,09 checked 4/6/2009

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De Ingenieur
IS parks TA4.In4 UT hodges closed TA4.I4
(1 items found as of 4/19/2009)

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Defense Electronics
http://rfdesign.com/ UOk online
(1 items found as of 4/19/2009)

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Defense Tech Briefs
http://www.defensetechbriefs.com/
(1 items found as of 4/19/2009)
v2#3-v2#6 checked 4/6/2009

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xxx Nth Design Automation Conference
DAC
Nth Design Automation Conference
Proceedings xxxx Nth Design Automation Conference
Proceedings of the Nth Design Automation Conference
IEEE XPLORE (78-)
(9 items found as of 2/28/2010)
78-09 checked 2/28/2010

----------------------------------------------------
Design News
http://www.designnews.com/archive/ OkSU stillwater 620.004205D457 SDSU online SIUC morris 52092-6201 UAr online UCSD online UOk online USD online
(>=20 items found as of 12/25/2009)
v60#1-v64#12 checked 12/25/2009

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Design World
http://www.designworldonline.com/ AU ladc NK1490.D47 FSU strozier 740.5D4577 OkSU main 745.405D457 UM aael NK1490.D46
(3 items found as of 1/2/2010)
v3#7-v3#12,v4#4-v4#12 checked 1/2/2010 priority

--------------------------------------------------------
DesignCon
http://www.designcon.com/infovault/
(>=20 items found as of 6/6/2009)

99-00 checked 3/19/2008 priority

," Designcon 1997 ," DesignCon 1998 ," DesignCon 2001, Santa Clara, CA, Jan. 29-Feb. 1, 2001, pp. .

," DesignCon 2002, Santa Clara, CA, Jan. 28-31, 2002, pp. .

," DesignCon 2003, Santa Clara, CA, Jan. 27-30, 2003, pp. .

," DesignCon East 2003, Boston, MA, June 23, 2003, pp. .

," DesignCon 2004, Santa Clara, CA, Feb. 2-5, 2004, pp. .

," DesignCon East 2004, Boxborough, MA, Apr. 5-7, 2004, pp. .

," Euro DesignCon 2004, Munich, Germany, Oct. 11-14, 2004, pp. .

," DesignCon 2005, Santa Clara, CA, Jan. 31-Feb. 3, 2005, pp. .

," DesignCon East 2005, Worcester, MA, Sept. 19-21, 2005, pp. .

," Euro DesignCon 2005, Munich, Germany, Oct. 24-27, 2005, pp. .

," DesignCon 2006, Santa Clara, CA, Feb. 6-9, 2006, pp. .

," DesignCon 2007, Santa Clara, CA, Jan. 29-Feb. 1, 2007, pp. .

," DesignCon 2008, Santa Clara, CA, Feb. 4-7, 2008, pp. .

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Desktop Engineering
http://www.deskeng.com/
(2 items found as of 12/25/2009)
checked 12/25/2009

--------------------------------------------------------
Diffusion and Defect Data. Pt A Defect and Diffusion Forum
AU online BYU hbll QD543.D49pt.A FSU remote 530.5D569 GIT main-4e QD543.D52X IU online LH closed MST depos QD543.D492 NWU online OkSU main 541.341D56851 OrSU valley QC185.D51 OSU online RU fondren QC176.8.D5D53 SU online UC chem TP810.D44 UCI sci drum TP810.D44 UCSD s&e QD1.D569 UF sci QD543.D49 UK sci QC611.6.D4D43 UM online & aael TP815.D444 USU auto QD543.D49pt.A UTA eng TP156D47D4777 UTor online
(4 items found as of 10/25/2009)
v169-v170,v177-v178,v186-v187,v263-v264 checked 10/25/2009 priority

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Diffusion and Defect Data Pt.B: Solid State Phenomena
GIT main QD543.D53X MST wilson various OkSU stillwater 541.341 D56853 OSU sel QC611.8.P64P67 UC eng various UCF main QD543.D55 UCSD s&e QD1.S685 UK chem/phys QD543.D573
(1 items found as of 4/19/2009)
v105

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Digest of Technical Papers - SID International Symposium
xxxx SID International Symposium Digest of Technical Papers
GIT main-6e TK7882.I6S18A Lexmark TK7882.I6S18 & TK7882.I6I57 LH closed
(3 items found as of 4/19/2009)
05,07-08 checked 3/8/2009 priority

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Discussions of the Faraday Society
MST wilson QD1.F32 NWU sci 541.3706F219d & geo 541.372F219i OkSU stillwater 541.06F219d OSU sel QD1F23 PU chem 541.3F22 & hicks 541.3F22 SDSU QD1.F32 SIUC online SIUE UAr online UC chem (Oesper Rm) TK1.F24 UCSD online UD roesch UIC sci UK chem/phys QD1.F32 UL kersey QD1.F32 UM online & shapiro QD1.F22d & buhr TK1.F221D6 UT hodges closed TK1.F23
(2 items found as of 4/19/2009)

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Display Manufacturing Technology Conference, Digest of Technical Papers

Nis, John R, "TAB driver interconnection process for automated assembly Display Manufacturing Technology Conference, Digest of Technical Papers, 1997, pp. 57-58

--------------------------------------------------------
DoD Diminishing Manufacturing Sources and Material Shortages Conference
DOD DMSMS Conference
http://www.dtic.mil/ndia/2006dmsms/ http://www.dmsms.org/
(1 items found as of 4/19/2009)

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Doktorsavhandlingar vid Chalmers Tekniska Hogskola
AU rbd T7.G68 GIT main T7.G64X OSU depository T4G65 UK king T7.D650 UM hatcher T4.G675

An electron microscopy study on materials in electronic packaging Ye, Li-Lei Doktorsavhandlingar vid Chalmers Tekniska Hogskola no. 1875, 2002, p 1-53

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EEEE

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ECN
http://www.ecnmag.com/Archive-Magazine.aspx?menuid=588 IU online NWU online OkSU online OSU online SDSU online SIUC online UAr online UCSD online UK online UOk online USD online UT online
(>=20 items found as of 12/27/2009)
-v53#15(Dec15,09) checked 12/27/2009

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ECS Transactions (Electrochemical Society)
MST online UC chem TP156.C46C48 UCI online UCSD online UMC online UTA online UTo online UTor online UWa online
(4 items found as of 8/19/2009)
v3#10,v3#31,v3#43,v6#8-v6#9,v18#1 checked 8/19/2009 priority

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EDA Tech Forum
http://www.edatechforum.com/journal/
v6#2 checked 5/3/2009

--------------------------------------------------------
EDN
http://www.edn.com/archive/ IU online KYVL NWU online OCU beam OkSU stillwater 621.3805 E105 OSU online PU eng 621.305EL223 SDSU online SIUC online UAr online UC eng TK1.E323 UCSD online UD roesch UIC online & daley TK1.E267 UK online UL kersey TK1.E266 UM aael TK1.E117 USD online UT online & hodges TK7870.E515
(>=20 items found as of 12/27/2009)
-v54#24(Dec15,09) checked 12/27/2009

------------------------------------------------------
EE Times
Electronic Engineering Times
http://www.eetimes.com/ IU online OkSU online OSU online PU eng 621.38105EL245 SDSU online SIUC online UC eng TK7815.E43 & cas TK7815.E43 UCSD online UM online UOk online USD online UT online UTo online
(>=20 items found as of 1/2/2010)
#1536-#1566,#1568-#1573 checked 1/2/2010

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EE Times - Asia
http://www.eetasia.com/
(>=20 items found as of 4/19/2009)
-12/16/08 checked 1/27/2009

-------------------------------------------------------
EE Times Europe
http://www.eetimes.eu/uk/
USD online
(>=20 items found as of 4/19/2009)
-1/27/09 checked 1/27/2009

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Electrical Design of Advanced Packaging and Systems Symposium
IEEE Electrical Design of Advanced Packaging & Systems Symposium
EDAPS
IEEE XPLORE (08) UM online? (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
08,09 checked 2/28/2010

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(new source 3/5/2010)
Electrical Manufacturing
(1 items found as of 3/5/2010)

--------------------------------------------------------
Electrical World
AU online FIT online FSU online GIT online UL closed LU online NWU online OGI online OkSU stillwater 621.305E3838 OrSU storage TK1.E56 OSU online PU online RU fondren TK1.E46 SDSU online SIUC online SIUE online SU online TTU UAH online UAr online UC eng TK1.E5 & swdepos microfilm UCF online UCI online UCSD online UD online & roesch UDe penrose microform UE microform UF online UIC warehouse TK1.E6 UIUC online UMe mcwherter UK online & storage TK1.E5 UM online UMc online UNF online UOk online USD online USF online USU online UT hodges TK1.E5 UTA eng 621.305EL25 UTo online WrSU online
(1 items found as of 4/19/2009)
v121#26 checked 2/17/2009

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Electro International
ELECTRO 'xx
Electro/xx International
Proceedings of the Electro/xx Technical program
IEEE XPLORE (91,94-96,98-99) SDSU online USD online (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
91,94-96,98-99 checked 2/28/2010

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Electrochemical and Solid-State Letters
IU bloomington chem QD551.E48 MST ONLINE NWU online & sci L541.3705E385 OkSU stillwater 621.38105E38 OSU sel TK7871E38 PU online & chem 541.3705EL255 SDSU TK7871.E38 SIUC online UAr online UC eng TK7871.E38 & chem TK7871.E38 UCSD online UD online UIC daley TK7871.E38 UK online & eng TK7871.E38 UL kersey TK7869.E35 UM online sd UOk online UT online & hodges TK7871.E38
(2 items found as of 4/19/2009)

--------------------------------------------------------
Electrochemical Society Interface
http://www.electrochem.org/dl/interface/ AU online BYU online FIT online FSU online GIT online IU online LH closed MST online NWU online OGI online OkSU online OrSU online OSU online PU online RU online SDSU online SIUC online SU online TTU UAH N-1 UAr online UC online UCI online UCSD online UD roesch UDe online UIC online UIUC online UK sci TP250.E595 UM online UMc online UMe chem UOk online USU storage UT online UTA chem TP250E543 UTO online WrSU dunbar TP250.E595
(10 items found as of 10/22/2009)
v1#1-v18#3 all checked 10/22/2009

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Electrochemical Society Proceedings
MST online OSU sel various UC eng TS645.I57 UCSD s& e various UTA online & chem TP256.S95
(0 items found as of 4/19/2009) priority

Zhang, Y, and J. A. Abys, "A Unique Electrodeposition Process of a Lead-Free Solder - Pure Tin", Electrochemical Society Proceedings 96-21, pp. 159 - 176, 1997. Proceedings of the Symposium on Environmental Aspects of Electrochemical Technology : Applications in Electronics

--------------------------------------------------------
Electrochimica Acta
IU online MST wilson TP250.E63 OkSU stillwater 541.3705E38 OSU online & sel TP1.E4 PU chem 541.37EL25 SDSU online SIUC online UAr mullins chem per QD551.E55 UC online & eng TP1.E5 UCSD online UD online UK online sd & chem/phys QD1.E376 UL online & kersey QD551.E43 UM online & shapiro QD1.E42 UOk online UT online & hodges TP250.E64
(>=20 items found as of 12/28/2009)
v38#1-v55#3 Articles in Press to Dec. 28, 2009 checked 12/28/2009

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Electronic Business
http://www.edn.com/ IU online KYVL Lexmark MST online NWU online & main L338.4621E37 OkSU online OSU online & bus HD9696A3U5E55 PU manage 338.4762130973EL24 SDSU online SIUC online SIUE online UAr online UC langsam HD9696.A3U5376 UCSD online UD roesch UIC warehouse HD9696.A3U5376 UK online UM online USD online UT online
(>=20 items found as of 4/19/2009)
checked 4/7/2009

--------------------------------------------------------
Electronic Components & Materials
Proceedings of International Conference on Electronic Components & Materials LH TK7869.I57
89

Yong, Yan (Sichuan Res. Inst. of Nonferrious, Chengdu, China); Jiang Xiao-hu; Zhang Ji-zhong; Xu Jian-yang High performances Sn-Cu electronic lead-free solder Electronic Components & Materials, v 24, n 4, Apr. 2005, p 54-6

Fu-ping, Liao (Sch. of Mater. Sci. & Eng., Nanchang Univ., China); Zhou Lang; Huang Hui-zhen Creep behavior of lead-free electronic solder alloys Electronic Components & Materials, v 24, n 4, Apr. 2005, p 65-7

--------------------------------------------------------
Electronic Design
http://www.elecdesign.com/ IU online Lexmark MST wilson TK7800.E437 NWU online OkSU online OSU sel TK7800E37 PU eng 621.305EL248 SDSU online SIUC online UAr online UC eng TK7800.E37 UCSD online UIC online UK eng TK7800.E437 UE online UL kersey TK7800.E37 UM aael TK7869.E38 UOk online USD online UT online & hodges TK7800.E4
(>=20 items found as of 12/27/2009)
v54#28-v57#26 checked 12/27/2009

--------------------------------------------------------
Electronic Device Failure Analysis
LH closed RyU online UOk online
(1 items found as of 4/19/2009)
v11#1-v11#3 checked 10/25/2009 priority

-------------------------------------------------------
Electronic Manufacturing
Lexmark UT hodges TK1.A3I46
(1 items found as of 4/19/2009) priority

--------------------------------------------------------
Electronic News
http://www.edn.com/ IU online lexmark NWU online OkSU online OSU online & bus HD9696U5E4 PU eng 621.305EL2832 SDSU online SIUC online SIUE microfilm UAr online UC eng microfilm 49 UCSD online UD roesch UIC online UK online UM online & aael HD9696.A3U5E45 USD online UT online & hodges closed microfilm HD9696.U5E4
(>=20 items found as of 4/19/2009)
checked 4/7/2009

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Electronic Packaging and Production
Lexmark OkSU online OSU online SDSU online SIUC online UAr online UCSD online UK online UM online UOk online USD online UT online
(1 items found as of 4/19/2009)
v35#6, v40#5

--------------------------------------------------------
Electronic Product Design
http://www.epdonthenet.net/ LH closed
(11 items found as of 4/19/2009)
checked 4/5/2009 priority

(new references 12/30/2008)
Take legal action Electronic Product Design, vol. 25 no. 2, Feb. 2004, pp. 35-36

Preparation is the key to RoHS and WEEE Electronic Product Design, vol. 25 no. 4, Apr. 2004, pp. 12

Clements, Vic Impacts and issues for WEEE Electronic Product Design, vol. 25 no. 4, Apr. 2004, pp. 48

Thomas, Suzanne How trouble-free is lead-free? Electronic Product Design, vol. 25 no. 11, Nov. 2004, pp. 28-30

Anon .Envirowise issues a call to compliance Electronic Product Design, v 26, n 8, August, 2005, p 4

--------------------------------------------------------
Electronic Production
LH closed
(5 items found as of 4/19/2009) priority

Putting lead-free into practice EP Electronic Production (London), vol. 29 no. 8, Sep, 2000, pp. 23

--------------------------------------------------------
Electronic Products
http://electronicproducts.com/ MST online OkSU online OSU online PU eng 621.38105EL26 SDSU online UC eng TK7870.E543 UCSD online UTor online
(>=20 items found as of 12/27/2009)
v47#10-v50#7(Dec07),v50#9(Feb08),v51#1(Jun08)-v52#7(Dec09) checked 12/27/2009 priority

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Electronics
Lexmark MST wilson TK7800.E45 OkSU online OSU QC1E38 SDSU TK7800.E439 SIUC morris 52217-6213 SIUE microfiche UAr mullins TK7800.E4384 UC eng QC544.V3A3 UCSD s&e TK1.E384 UE microform UK off-campus QC544.V3A3 UL kersey TK7800.E4384 USD online UT online
(0 items found as of 4/19/2009)

--------------------------------------------------------
Electronics Cooling
http://www.electronics-cooling.com/html/articles.php SIUC online
(2 items found as of 5/9/2009)

v13#1-v15#1 checked 5/9/2009

--------------------------------------------------------
Electronics Engineer
UF sci microfilm TK7800.E438
(1 items found as of 4/19/2009)

--------------------------------------------------------
Electronics Manufacture and Test
http://www.emtonthenet.net/
(>=20 items found as of 4/19/2009)
June98-Sept04,Jan05-May05,Jan06-July06,Apr07-Mar09 checked 4/5/2009 priority

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Electronics Manufacturing China

Shangguan, D, , Understanding Compatibility and Clarifying Issues in Lead-Free Transition. Electronics Manufacturing China, Apr. 2004, pp. 20-24.

--------------------------------------------------------
Electronics Production World
http://www.electronicsproductionworld.com/articleList~idcategory~10.html

--------------------------------------------------------
Electronics Supply & Manufacturing
OkSU online UOk online USD online
(>=20 items found as of 5/31/2009)
Apr04-Jun07(finished) checked 5/31/2009

--------------------------------------------------------
Nth Electronics System-Integration Technology Conference
IEEE XPLORE (06,08) UF online UM online? (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
06,08 checked 2/28/2010

--------------------------------------------------------
Electronics Weekly
http://www.electronicsweekly.com/Sitemap/Default.aspx?SlotPageID=3 http://www.edn.com/ OkSU online SDSU online SIUC online UAr online UCSD online UOk online USD online UT online
(>=20 items found as of 4/19/2009)
98-1/27/09 checked 1/27/2009

--------------------------------------------------------
Electronics World
Electronics World + Wireless World
AU rbd TK6540.R668 FSU dirac 620.5W798 GIT main-6e TK5700.W55 LU gray TK5700.W55 MST microfilm 621.38405 R118n OkSU stillwater 621.38405W798111 OSU sel TK6540.R118 RU fondren TK5700.W55 SDSU TK7800.E5 SIUC morris 54335-6214 UA sterne microfilm TK7800.R668 UAr mullins TK5700.W55 UC swdepos TK6540.R34 UCB eng TK5700.W55 UCF main TK7800.R668 UCSD s&e TK1.E3865 UF sci TK5700.W55 UH TK7800.R668 UK eng TK5700.W55 UL kersey TK7800.R668 UOk bizzell TK7800.R668 USF TK5700.W55 UTo carlson WSU sci UTor eng TK5700.W5522 UWa davis TK5700.W55
(>=20 items found as of 4/19/2009)
v96#xxxx-v115#1874 checked 3/20/2009 priority

--------------------------------------------------------
Electroplating & Finishing
http://www.plating.org/english/Search.asp?action=search
(0 items found as of 4/19/2009)
checked 4/4/2009 priority

Fang, J-L Lecture series on final surface finishing process for PCB - II Process of replacement Sn plating for super thin flexible PCB with super density. Electroplating & Finishing. Vol. 23, no. 1, pp. 36-39. Feb. 2004

Li, Ming Applications of electroplating technology in electronic packaging Electroplating & Finishing. Vol. 24, no. 1, pp. 44-49. 2005

--------------------------------------------------------
Electroplating & Metal Finishing
MST depos 671.705El25m OSU sel TS670A1E4 SIUC morris 52174-6711 UM buhr TS670.A1E38 WSU storage
(0 items found as of 4/19/2009)
v28#5 priority

--------------------------------------------------------
Elektronik
GIT main TK7800.E443 LH closed OkSU online SDSU online SIUC online UAr online UOk online USD online UT hodges TK7800.E443
(2 items found as of 4/19/2009) priority

--------------------------------------------------------
Elektronik Industrie
(1 items found as of 4/19/2009)
Jan06-Dec06 checked 1/27/2009 priority

--------------------------------------------------------
Elektronik Praxis
http://www.elektronikpraxis.de/ LH closed MST online MSU online NWU online OkSU online SDSU online UAr online UCB online UOk online USD online VU online WUSL online

Cost of electrical component production in Germany Elektronik Praxis, n 3, 16 Feb. 2005, p 98-102 Language: German

--------------------------------------------------------
EMasia
http://www.emasiamag.com/
(1 items found as of 4/19/2009)

--------------------------------------------------------
Embedded Technology
(1 items found as of 4/19/2009)

--------------------------------------------------------
EMC

(1 items found as of 11/9/2009)
#221-#222 checked 11/9/2009

--------------------------------------------------------
xxxx Emerging Technologies Conference Proceedings
http://www.smta.org/knowledge/proceedings.cfm OkSU online
(2 items found as of 11/6/2009)
97-98,00 checked 11/6/2009

--------------------------------------------------------
empfasis
http://www.empf.org/empfasis/
(>=20 items found as of 1/6/2010)
Jan01-Dec09 checked 1/6/2010

--------------------------------------------------------
emsnow
http://www.emsnow.com/
(>=20 items found as of 4/19/2009)
checked 4/4/2009

--------------------------------------------------------
Energy & Fuels
AU online FSU online GIT online LH closed MST online NWU online OCU online OGI online OkSU online OrSu valley TP315.E518 OSU online PU online RU online SDSU online SIUC online SPU online SU online TTU online & TP315.E518 UAB online UAr online UC online UCF online UCI online UCSD online UD online UDe online UE online UF online UIC online UIUC online UK online UM online & aael TP315.E5181 UMC online USD online USF online UTA online UTo online WrSU online
(5 items found as of 4/19/2009)
checked 6/23/2008

--------------------------------------------------------
Energy Conversion and Resources
GIT main-5e TJ163.2.E466x LH open MST wilson TJ163.2.E466 OrSU valley TJ163.2.E466 OSU sel TJ163.7.E53 PU eng 621.042En262 RU fondren TJ163.7.E53 UC eng TJ163.7.E54623 UIUC eng 621.31E5673 UM aael TJ163.2.I68 UTA eng TJ163.7E54634
(1 items found as of 8/19/2009)
03-06 checked 8/19/2009

--------------------------------------------------------
Energy Policy
AU online FSU strozier 330.5E56 GIT online & main-4w HD9502.A1E54 LH closed MST wilson HD9502.A1E54 NWU online OGI online OkSU stillwater 621.05E56 OSU depos HD9502.A1E54 PU eng 333.8205En27 & hicks 333.8205En27 RU online SDSU online SIUC online UAR mullins HD9502.A1E54 UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UM online UMC eng HD9502.A1E54 UNF online ESD online USF online UTA online UTo online WrSU online
(1 items found as of 4/19/2009)

--------------------------------------------------------
Engineer
MST depos 620.5En2 NWU sci 620.69E57 OkSU stillwater 620.5E56 SIUC morris 52212-6201 SIUE online UAr online UCSD online UK online USD online UT online
(2 items found as of 4/19/2009)
v293#7716 checked 1/22/2009

-------------------------------------------------------
Engineering (London)
MST depos 620.5En3 NWU sci L620.5E57 OSU depos TA1.E54 PU eng 620.5En32 SDSU TA1.E55 SIUC morris 52316-6201 UAr morris per microfiche TA1.E55 UC eng TA1.E55 UCSD online UE UK eng TA1.E55 UL kersey TA1.E55 UM aael TA1.E45 UT hodges TA1.E35 WSU online & storage
(2 items found as of 4/19/2009)
v247#8 checked 3/9/2009

--------------------------------------------------------
Engineering and Technology
IET Engineering and Technology
IEEE XPLORE (V1#1-) OSU sel TK1E65 PU eng 621.305En33 SDSU TK1.I412 SIUC online UCSD online UD roesch UF online & sci TK1.I4125 VU online (many other universities also subscribe to IEEE XPLORE)
(4 items found as of 2/28/2010)
v1#1-v4#21 all checked 2/28/2010

--------------------------------------------------------
Engineering Fracture Mechanics
IU MSt wilson TA409.E5 NWU online OkSU online OSU online & sel TA409A1E5 PU online & eng 620.1126En34 SDSU online UAr mullins per microfiche TA401.E53 UC online & eng TA409.E5 UCSD online UD online UIC online & daley TA409.E5 UK online & eng TA401.E576 UL online & kersey TA409.E5 UM online & aael TA409.E57 UT online & hodges TA401.E63
(1 items found as of 4/19/2009)

--------------------------------------------------------
Engineering Management
NWU online SDSU HD31.R57 UAr online UCSD online UK online UT online
(4 items found as of 4/19/2009)

--------------------------------------------------------
Engineering Technology
UC cas TA1.J64 LH closed
(5 items found as of 4/19/2009) priority

(new references 12/30/2008)
Langfield-Holland, Mark, .WEEE and RoHS: Just what are my responsibilities? Engineering Technology, v 8, n 10, December 2005/January 2006, 2005-2006, p 41-43

--------------------------------------------------------
EngineerIT
Elektron
http://www.eepublishers.co.za/view.php?sid=6923 GIT main-6e TK1.E88X LH closed UI eng
(5 items found as of 4/19/2009)
Jan05-Mar09 checked 4/4/2009

--------------------------------------------------------
Environmental Health Perspectives
MST online OkSU online SDSU online SIUC online SIUE online UAr online UCSD online UE online USD online UT online
(3 items found as of 4/19/2009)

--------------------------------------------------------
Environmental Impact Assessment Review
NWU online & main 333.71E61 OkSU online OSU online PU hum 333.710973En89 SDSU online SIUC online UC online & eng TD194.6.E593 UCSD online UD online UIC online UK online sd & young TD194.6.E593 (to 1982) UL ekstrom TD194.6.E593 UM online & aael TD194.6.E595 UT online
(4 items found as of 4/19/2009)

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Environmental Science
Huanjing Kexue
LH closed
priority

(new references 12/29/2008)
Zhao, Jie, Meng, Xian-Ming, Chen, Chen, Zang, Hua-Xun, Ma, Hai-Tao .Leaching behavior of heavy metal elements in lead-free solders Huanjing Kexue/Environmental Science, v 29, n 8, August, 2008, p 2341-2344 Language: Chinese

--------------------------------------------------------
Environmental Science & Technology
AU online FSU online GIT online LH closed MST online NWU online OGI online OkSU online OrSU valley TD180.E5 OSU online PU online RU online SIUC online SIUE online SPU online SU online UAB online UAr online UC online UCI online UCSD online UD online UDe online UE online UF online UIC online UIUC online UK online UM online & aael TD172.E62 UMC online UNF TD180.E5 USD online USF online UTA online
(>=20 items found as of 1/8/2010)
v34#20,v37#20,v40#8,v42#18 checked 1/8/2010

--------------------------------------------------------
ESPEC Technology Report
Espec Technology Report
http://www.espec.co.jp/english/tech-info/tech_info/
(12 items found as of 4/19/2009)
#1-#26 all checked 4/4/2009

--------------------------------------------------------
Eureka
LH closed MST depos 620.11Eu72 MSU online NWU sci L620.105E89 SIUC storage 58708-6201 UCB eng TA401.E9 UD roesch remote UM aael TA401.E561 USD online
(0 items found as of 4/19/2009)

--------------------------------------------------------
EuroAsia Semiconductor
European Semiconductor
http://www.euroasiasemiconductor.com/ GIT main-6e TK7871.85.E878
(12 items found as of 4/19/2009)
Dec03-Mar09 checked 4/4/2009

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EUROCORR 2004: Long Term Prediction & Modelling of Corrosion
LH CDRM 1294 UM aael TA418.76.E976 & aael TA445.5.C6749 UOk online

Hansal, S, Pavetits, H, Hansal, W E G, Besenhard, J, Kronberger, H, Nauer, G E Corrosion behaviour of pulse plated tin-silver alloys EUROCORR 2004: Long Term Prediction & Modelling of Corrosion, Nice, France, 12-16 Sept. 2004. 2004

--------------------------------------------------------
European Electronics Engineer
http://www.engineerlive.com/european-electronics-engineer/
(5 items found as of 4/19/2009)
checked 4/4/2009

--------------------------------------------------------
European Journal of Operational Research
IU bloomington alf T57.6.E92 Lexmark NWU online & sci 001.424E895 OkSU online OSU online & bus T57.6E96 PU online & eng 658.4034Eu74 SDSU online SIUC morris 52320-5181 UAr online UC online & langsam T57.6.E92 UCSD online UD online & roesch UIC online & daley T57.6.E92 UK online sd UL online & kersey T57.6.E92 UM online & aael T57.6.E92 UOk online USD online UT online & hodges T57.6.A1E8
(3 items found as of 4/19/2009)
v183#2,V191#3 checked 1/22/2009

--------------------------------------------------------
European Medical Device Manufacturer
http://www.devicelink.com/emdm/
(12 items found as of 4/19/2009)
Jan97-Apr09 checked 4/4/2009

--------------------------------------------------------
European Microelectronics and Packaging Conference
IEEE XPLORE (09) UOk eng TK7874.E978 (many other universities also subscribe to IEEE XPLORE)
(20 items found as of 2/28/2010)
09 checked 2/28/2010 priority

Ishii, Masahito, , Tatsuo Kataoka, Hiroaki Kurihara, "Whisker Problem in the Ultra-fine Pitch Circuits," l2th European Microelectronics & Packaging Conference, June 7 - 9, 1999. pp. 379-385.

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European Polymer Journal
AU online FSU online GIT online LH closed LU gray MST wilson microfilm 547.84Eu74 NWU online OkSU online OSU online PU online RU online SDSU online SIUC storage 55374-5471 TTU UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UM online & aael QD281.P6E892 UMC online UNF online UOk online USF online USU online UT online UTA online UTo online WrSU online
(1 items found as of 10/22/2009)
v45#1-v45#11 checked 10/22/2009

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European Semiconductor Design Production Assembly

"Gold bumps off the danger list Jasper, Jorg, Shiels, Dave European Semiconductor Design Production Assembly, vol. 22 no. 7, Jul, 2000, pp. S-86-S-88.

"The vision thing Anon European Semiconductor Design Production Assembly, vol. 23 no. 4, Mar. 2001, pp. 81+83.

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Evaluation Engineering
http://www.evaluationengineering.com/ IU bloomington alf TK7869.E3 NWU online OkSU online OSU online PU eng 621.38105Ev13 & hicks 621.38105Ev13 SIUC online UCSD online UM online & buhr TA168.A1E92 USD online UT hodges K7870.E87
(2 items found as of 1/6/2010)
v45#12-v49#1 checked 1/6/2010

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evertiq
http://www.evertiq.com/
(>=20 items found as of 4/19/2009)
June14,04-Apr4,09 checked 4/4/2009

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FFFF

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Fastener World
(1 items found as of 4/19/2009)

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Fatigue and Fracture of Engineering Materials and Structures
IU online MST wilson TA418.38.F37 NWU online & sci microfiche S15 OkSU online OSU online & sel TA418.38F382 PU online & eng 620.1123F269 & hicks 620.1123F269 SDSU online SIUC online UAr mullins TA418.38.F374 UC online & eng TA630.F3 UCSD online UD online UIC online UK online & eng TA418.38.F374 UL kersey TA418.38.F374 UM online & aael TA418.38.F25 UOk online USD online UT online & hodges TA418.38.F374
(9 items found as of 12/28/2009)
v19#1-v33#1 checked 12/28/2009

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Feinwerktechnik, Mikrotechnik, Messtechnik
LH closed OSU sel Q184.Z48 UK king Q184.F18 UL ekstrom Q184.Z42
(1 items found as of 4/19/2009)

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Finishing
Finishing Industries
GIT online & main TT300.F53X LH closed LU gray TT300.F5 MST online MSU online OkSU online OSU sel TS670A1E422 PU eng 667.905F495 SDSU online SIUC online UCB online UOk online USD online UT online VU online WSU online
(19 items found as of 4/19/2009)
v1#1-v5#11,v6#1-v6#2,v6#4-v6#11,v7#1-v32#4 checked 10/23/2008 low priority

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Finishing Today
Industrial Paint and Powder
http://www.ippmagazine.com/ http://www.finishingtodaymag.com/ IU online NWU online OkSU stillwater 698.305I421 OSU online PU eng 667.605In2 SDSU online SIUC online UAr online UK UCSD online, online UM online UOk online USD online UT online UTo online WSU online
(7 items found as of 10/22/2009)
v78#1-v84#7 checked 10/22/2009 low priority

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Flexo
GIT main Z252.5.F6F638x

Caudill, Cheryl Are you keeping up? Flexo, v 31, n 8, Aug. 2006, p 36-37

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flipchips.com
http://www.flipchips.com/
(>=20 items found as of 4/19/2009)
tutorial1-tutorial93 checked 4/4/2009

-------------------------------------------------------
Focus on Tin
(1 items found as of 4/19/2009) priority

"Tin 'whiskers' and how to avoid them," Focus on Tin, no. 3, pp. 3, Summer 1994.

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Forbes
http://www.forbes.com/ MST wilson HF5001.F6 OkSU online SDSU online SIUE lovejoy UAr online UCSD online UE USD online
(3 items found as of 4/19/2009)

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Fujikura Technical Review
http://www.fujikura.co.jp/00/gihou/e_gihou.html
(9 items found as of 4/19/2009)
29(Jan00)-37(Jan08) checked 4/4/2009 priority

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Fujitsu Scientific and Technical Journal
http://www.fujitsu.com/global/news/publications/periodicals/fstj/ OkSU online OSU sel TK7800F9 SDSU online SIUC online UAr storage TK1.F85 UCSD online UTor online VU online
(9 items found as of 10/25/2009)
v26#1-v45#4 checked 10/25/2009 priority

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Furukawa Review
http://www.furukawa.co.jp/review/backnum.htm OkSU online SDSU online UTor online
(5 items found as of 4/19/2009)
#18(May99)-#36(09) checked 10/25/2009 priority

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GGGG

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Galvanotechnik
http://www.galvanotechnik.com/gt/heft/uk_heftlink.asp LH closed OkSU main 671.732P523g WSU storage
(>=20 items found as of 4/19/2009)
-Mar09 checked 4/3/2009 priority

(new references 12/30/2008)
Jostan, J.L. "Whisker Formation in Tin, Tin-Lead Alloys, Silver, and Gold" , Galvanotechnik, vol. 71, no. 9, pp. 946 - 955, Sept. 1980 (Language in German).

Strube, G, DAS ELEKTROLYTISCHE ABSCHEIDEN VON ZINN UND BLEI-ZINN-UEBERZUEGEN. (Electrolytic Deposition of Tin and Tin-Lead Coatings.) Galvanotechnik, vol. 73 no. 12, Dec. 1982, p 1330-1337

v. Leersum, I. Chromfreie Vorbehandlung - Statusbericht (Chromium-free pretreatment - a status report) Galvanotechnik, vol. 89 no. 5, May 1998, p 1590-1594 Language: German

Koebbert, H.-O. Elektrotauchlackierung von Aluminium (Electrocoat painting of aluminum) Galvanotechnik, vol. 90 no. 1, Jan. 1999, pp. 158-167 Language: German

Thiery, L. Chrom(VI)-freie Oberflaechenbehandlung von Zink (Hexavalent chromium-free surface treatment of zinc) Galvanotechnik, vol. 91 no. 12, Dec. 2000, pp. 3373-3377 Language: German

Jordan, M. L”tbare bleifreie Schichten Solderable leadfree coatings, Galvanotechnik, vol. 92 no. 5, May 2001, pp. 1225-1236

Preikschat, P. Chrom(VI)ersatz fur Zink und Zinklegierungen - Dickschichtpassivierung im kreuzverhor (An alternative to hexavalent chromium for zinc and alloy coatings - Thick film passivation under scrutiny) Galvanotechnik, vol. 92 no. 9, Sept. 2001, p 2373-2377+V Language: German

Reinhold, B.; Brettmann, M. Behandlung von aluminiumbauteilen und konstruktionen in mischbauweise (Treatment of aluminium components and assemblies in multi-metal constructions) Galvanotechnik, vol. 92 no. 10, Oct. 2001, pp. 2655-2663+IV Language: German

Jansen, R.; Preikschat, P. Chrom(VI)ersatz auf zink - Nachbehandlungsverfahren in der praxis (Hexavalent chromium replacement for zinc passivation - Post treatment processes in practice) Galvanotechnik, vol. 92 no. 12, Dec. 2001, pp. 3231-3238+V Language: German

Nowak, A.; Seidel, R. Verbesserung der Lackhaftung und des Korrosionsschutzes von Magnesium durch moderne Konversionsverfahren (Improved paint adhesion and corrosion protection of magnesium using modern conversion coatings) Galvanotechnik, vol. 95 no. 7, July 2004, p 1724-1730+vi Language: German

Rauscher, Gerhard Neuartige chromfreie Vorbehandlungsverfahren fur die Aluminium-Lackbeschichtung (A novel chromium-free pretreatment process for painting of aluminium) Galvanotechnik, vol. 95 no. 11, Nov. 2004, p 2744-2751+vi Language: German

Crosby, Jeff, Lau, Danny Glanzendes Zinn mit niederem Kohlenstoffgehalt fur Steckverbinder (Bright tin with low carbon content for plug connectors) Galvanotechnik, v 96, n 2, Feb. 2005, p 311-322+v Language: German, English

Klobes, Karl-Hermann Zink- und Zinklegierungen - Massengalvanisierung im Automobilbau (Zinc and zinc alloys - Mass plating in automotive construction) Galvanotechnik, v 96, n 7, July 2005, p 1562-1568+iv Language: German

Unruh, J.N. Chromabscheidung aus wassrigen Losungen - Teil 1: Chromsaurelosungen (Chromium electrodeposition from aqueous solution - Part 1: Chromic acid solutions) Galvanotechnik, v 96, n 9, Sept. 2005, p 2063-2071+v Language: German

Unruh, J.N.M. Chromabscheidung aus wassrigen elektrolyten teil 6: Die entwicklung der theorien (Electrodeposition of chromium from aqueous media - Part 6: Development of theories) Galvanotechnik, v 97, n 3, Mar. 2006, p 585-597 Language: German

Snyder, Donald L., Hill, Rock, Paulig, Franziska Dreiwertige und sechswertige dekorative chromverfahren im vergleich (Trivalent and hexavalent decorative chromium plating processes compared) Galvanotechnik, v 97, n 5, May 2006, p 1117-1121+vi Language: German

Volk, P. Chrom(III)haltige passivierung fur aluminium (Trivalent chromium passivates for aluminium) Galvanotechnik, v 97, n 5, May 2006, p 1122-1129+vi Language: German

Nagao, Toshimitsu, Sato, Kazuya, Otsuka, Kuniak, Nakagishi, Yutaka Herausforderung der chromfreien kunststoffbeschichtung (Challenge to chromium-free plastic plating method) Galvanotechnik, v 97, n 9, Sept. 2006, p 2124-2130+v Language: German, English

Dyllus, Thomas Glanzchromelektrolyt auf chrom(III)basis chrom(VI)gleichwertig in optik und bestandigkeit (Bright chromium deposits from a trivalent bath - Aesthetically and in performance, a match for hexavalent chromium plate) Galvanotechnik, v 97, n 9, Sept. 2006, p 2141-2147+vi Language: German

Unruh, Jurgen .Chromabscheidung aus wassrigen Elektrolyten Teil 14: Chrom(III) im Chromelektrolyten (Electrodeposition of chromium from aqueous electrolytes - Part 14: Trivalent chromium in hexavalent chromium electrolytes) Galvanotechnik, v 98, n 3, March, 2007, p 591-602+v Language: German

Thiery, Lionel, Raulin, Frederic .Fortschritte beim chrom(III)basierten passivieren (Advances in trivalent passivates on zinc and zinc alloys) Galvanotechnik, v 98, n 4, April, 2007, p 862-869+IV Language: German, English

Zhang, Wan, Schwager, Felix .Funktion von Blei bei der Verhinderung der Whiskerbildung in Zinnschichten (The role of lead in repressing whisker formation in tin deposits) Galvanotechnik, v 98, n 5, May, 2007, p 1121-1130+V Language: German

Wegricht, Jens, Spinaler, Jurgen, Mittweida, Fels, Carl Christian .Untersuchungen zur Chrom(VI)freien Vorbehandlung fur die Kunststoffgalvanisierung (Studies of chromium(VI)-free pretreatment for metallising of plastics) Galvanotechnik, v 98, n 6, June, 2007, p 1371-1379+vi Language: German

Van Der Pas, Frando, Zacearia, Bruno, Pinamonti, Marco .Eltos Bevorzugt Enthones AlphaSTAR [registered trademark] (Eltos Votes for Enthone's AlphaSTAR [registered trademark]) Galvanotechnik, v 98, n 7, July, 2007, p 1648-1652+vii Language: German

Kassing, Bernd, Schreiner, Harald .Sechs Jahre Praxiserfahrung mit Chromfreier Vorbehandlung von Aluminium (Six years practical experience with chromate-free pre-treatment of aluminium) Galvanotechnik, v 98, n 9, September, 2007, p 2248-2250+VI Language: German

Romankiewicz, K., Bohnet, J., Metzner, M., Kaszmann, H. .Chromdispersionsabscheidung - Veranderung der Schichteigenschaften durch Nanoskalige Feststoffe (Chromium matrix composite electrodeposits - Enhancement of deposit properties by use of nanoparticles) Galvanotechnik, v 98, n 12, December, 2007, p 2906-2919+IV Language: German

Kurtz, Olaf, Kuhlkamp, Peter, Barthelmes, Jurgen, Ruther, Robert .Antikorrosionslosung zur Reduktion und Vermeidung von Korrosionswhiskern (A new corrosion inhibitor for minimising or avoiding tin whisker formation) Galvanotechnik, v 99, n 6, June, 2008, p 1349-1357+IV Language: German

Funk, St. .Praxistauglichkeit von chrom (VI) freien alternativschichten fur aluminium in der architektur (Serviceability of hexavalent chromium-free conversion coating for architectural aluminium applications) Galvanotechnik, v 99, n 8, August, 2008, p 2006-2007+vi Language: German

--------------------------------------------------------
Gate to Environmental and Health Sciences (Internet-Journal Gate to EHS)

--------------------------------------------------------
GIDEP Alert

"Relay, Electromagnetic," Alert Number C6-A-91-03-V, Apr. 1, 1991.

Heutel, K. J, , "Problem Notification - Tin Whisker Growth in Electronic Assemblies," GIDEP Alert F3-A-87-04A, Feb. 19, 1988.

"Relay, Electromagnetic," GIDEP Alert Number F3-P-97-01-V, Dec. 2, 1996.

J. Khuri, "Agency action notice," Government-Industry Data Exchange Program (GIDEP), Doc. no. AAN-U-02-104, Jul. 2002.

--------------------------------------------------------
Global Plastics Environmental Conference
Society of Plastics Engineers - Global Plastics Environmental Conference
priority

(new references 12/30/2008)
Dawson, Raymond B.; Landry, Susan D.; Ranken, Paul Updates on end-of-life, safety, and regulatory aspects for flame retarded plastics used in electrical and electronic equipment Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, 2004, pp. 63-74

Bachman, Bonnie J.; Desai, Nitin B.; Kierl, William G.; Olson, William L.; Zollo, James A. Design for reuse: Where environmental regulations and business strategies meet Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, 2004, pp. 239-250

Arnold, Rocky R., .Innovative "Green" EMI shielding based on polymer film material Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, 2004, p 35-43

Schnecke, Doreen, Gunther, Jorg .Study on recyclibility of in-mold decorated plastics parts Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, 2004, p 55-61

Bachman, Bonnie J., Desai, Nitin B., Kierl, William G., Olson, William L., Zollo, James A. .Design for reuse: Where environmental regulations and business strategies meet Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, Global Plastics Environmental Conference 2004 - Plastics: Helping Grow a Greener Environment, GPEC 2004, 2004, p 239-250

Russell, Kimberley A., Sackett, Donald .Meeting the plastics challenges for toxic materials Global Plastics Environmental Conference 2005: GPEC 2005 - Creating Sustainability for the Environment, Global Plastics Environmental Conference 2005: GPEC 2005 - Creating Sustainability for the Environment, 2005, p 665-670

Thomas, Gabi, Bernd, Heinz .Celstran [registered trademark] recycling concept - Incorporation of LFT production scrap into Celstran [registered trademark] pultrudate Society of Plastics Engineers - Global Plastics Environmental Conference, GPEC 2007 - Environmental Innovation: Plastics Recycling and Sustainability, v 2, Society of Plastics Engineers - Global Plastics Environmental Conference, GPEC 2007 - Environmental Innovation: Plastics Recycling and Sustainability, 2007, p 878-892

Miller, Gordon C., .Alternatives to chrome plating and related chemical use in creating automobile, light truck, and heavy truck decorative components Society of Plastics Engineers - Global Plastics Environmental Conference, GPEC 2007 - Environmental Innovation: Plastics Recycling and Sustainability, v 2, Society of Plastics Engineers - Global Plastics Environmental Conference, GPEC 2007 - Environmental Innovation: Plastics Recycling and Sustainability, 2007, p 962-994

Linehan, Thomas, .RoHS and WEEE and how it has affected our designs for process controls for the plastics industry Society of Plastics Engineers - Global Plastics Environmental Conference, GPEC 2007 - Environmental Innovation: Plastics Recycling and Sustainability, v 3, Society of Plastics Engineers - Global Plastics Environmental Conference, GPEC 2007 - Environmental Innovation: Plastics Recycling and Sustainability, 2007, p 1309-1314

--------------------------------------------------------
Global SMT and Packaging
http://www.trafalgar2.com/ http://www.globalsmt.net/ MST online OkSU online SDSU online
(>=20 items found as of 11/9/2009)
v4#4,v5#1-v9#3,v9#9 checked 11/9/2009 priority Don

(new references 12/31/2008)
Goodman, Paul The impact of the WEEE and RoHS directives on electrical equipment manufacturers Global SMT and Packaging, vol. 3 no. 4, May 2003, pp. 12-14

Lasky, Ronald; Jensen, Timothy Best practices in implementing Pb-free assembly Global SMT and Packaging, vol. 3 no. 8, Nov. 2003, pp. 10-15

Willis, Bob Secondary reflow failure - Another lead contamination defect Global SMT and Packaging, vol. 4 no. 1, Dec. 2003/Jan. 2004, 2003-2004, pp. 4-5

Ashmore, Clive, .Mass imaging process performance with Pb-free solder pastes Global SMT and Packaging, v 4, n 2, February, 2004, p 26-28

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Global Sources
http://www.globalsources.com/
(10 items found as of 4/19/2009)
checked 4/4/2009

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Global Symposium on Recycling, Waste Treatment and Clean Technology
LH open MST TD794.5.G55 UF UM aael TD794.5.G46 UOk eng TD896.G56 UTor eng TD794.5.G56
99 checked 8/14/2009 priority

(new references 12/31/2008)
Bonoli, Alessandra, Goldoni, Silvia, Guerra, Galliano .Analysis of WEEE treatment methodologies within the meaning of directive 2002/96/EC of the European Parliament REWAS'04 - Global Symposium on Recycling, Waste Treatment and Clean Technology, REWAS'04 - Global Symposium on Recycling, Waste Treatment and Clean Technology - Proceedings, 2005, p 2873-2874

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Government Computer News
http://www.gcn.com/archives/ MST depos QA75.5.G68 OkSU stillwater 004.05G721 SDSU online SIUC online UAr online UCSD online UOk online USD online
(2 items found as of 4/19/2009)
-Mar23,09 checked 4/4/2009

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xxxx Government Microcircuit Applications Conference
UK eng TK7874.G580

Richardson, J. H, , and B.R. Lasley, "Tin Whisker Initiated Vacuum Metal Arcing in Spacecraft Electronics," 1992 Government Microcircuit Applications Conference, Vol. XVIII, pp. 119 - 122, Nov. 10 - 12, 1992.

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Green SupplyLine
http://www.greensupplyline.com/
http://www.eetimes.eu/
http://www.electronicsweekly.com/
http://www.industrialcontroldesignline.com/
(>=20 items found as of 4/19/2009)
checked 4/4/2009

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Ground Water
MST wilson GB1001.G7 OkSU stillwater 551.4905G882 SDSU online UAr online UCSD online UK geol GB1001.G75 USD online UT online
(2 items found as of 4/19/2009)

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HHHH

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Hardware Secrets
http://www.hardwaresecrets.com/
(1 items found as of 4/19/2009)
checked 4/4/2009

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Harsh Environments Workshop

Hundt, Michael, "QFN 9X9 Solder Joint Reliability" (Harsh Environments Workshop, Indianapolis, IN, July 19-20, 2006)

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2001 HD International Conference on High-Density Interconnect and Systems Packaging
xxxx International Conference on High-Density Interconnect and Systems Packaging
GIT SIUC mclafferty 621.381046I614 UCB eng TK7874.I569 UCSD s&e TK7874.I569 UH TK7874.I569 UTor eng TK7874.H3 UWa davis TR5.S6x
(13 items found as of 4/19/2009)
99-01 priority

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Heat Treatment of Metals
Jinshu Rechuli
LH closed PU eng 671.3605H353 & hicks 671.3605H353
priority

(new references 12/30/2008)
Xiao, Dai-Hong, Song, Min, Chen, Kang-Hua .Effect of heat treatment on the formation and growth of tin whisker Jinshu Rechuli/Heat Treatment of Metals, v 32, n 11, November, 2007, p 88-90 Language: Chinese

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Helvetica Physica Acta
IU bloomington alf QC1.H4 MST depos 530.5H369 MSU remote QC1.H4 NWU sci 530.5H485 OkSU stillwater north_boomer 530.5H485 OSU sel QC1H48 PU online & phys 530.5An725 & 530.5H36 & 530.5 H36a & 530.6P21aa SDSU QC1.H4 SIUC morris 52643-5301 SIUE storage UAr storage QC1.H4 UC phys QC1.H4 UCSD s&e QC1.H485 UD roesch UIC sci QC1.H4 UK king QC1.H4 UL kersey QC1.H4 UM shapiro QC1.H4 & buhr QC1.H4 UOk bizzell QC1.H4 USD online UT hodges & closed QC1.H4 UTo carlson & depos WSU sci
(4 items found as of 4/19/2009)

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high-density interconnect
HDI
UCF main TK7870.15.I573 WSU sci TS510.P76

Winkler, Sandra, and Horn, Bance, A Look at the Past Reveals a Lead-free Drop-In Replacement ATOTECH high-density interconnect Mar? Apr? 2001

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High-Purity Substances
Vysokochistye Veshchestva
ISU parks TP156.P83H54x
(3 items found as of 4/19/2009)

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High-Speed Digital Design
http://www.sigcon.com/
(>=20 items found as of 4/19/2009)
v10#1 checked 4/9/2009

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Human Systems Management
MST online MSU online NWU online OkSU online OSU online SDSU online SIUC online UAr mullins HD28.H85 UC sw depos HD28.H8 UCSD online UIC online UL ekstrom HD28.H85 UM online & hatcher HD28.H92 & buhr HD28.H92 USD online UT online & hodges HD28.H85 UTo online WSU online
(1 items found as of 4/19/2009)

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IIII

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IBM Journal of Research and Development
KYVL Lexmark MST online SDSU online SIUC online SIUE lovejoy UAr online UCSD online UE microform UM online & aael Q1.I12 UOk online USD online UT online
(7 items found as of 4/19/2009)

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IEE Colloquium on Assembly and Connections in Microsystems
IEEE XPLORE (97) UK online UM online (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
97 checked 2/28/2010

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IEE Seminar on Beyond WEEE. Unsustainable Product Design and How to Avoid It
IEEE XPLORE (05) UM online? (many other universities also subscribe to IEEE XPLORE)
(2 items found as of 2/28/2010)
05 checked 2/28/2010

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IEEE Aerospace Conference Proceedings
IEEE XPLORE (97-) UK online UM online & TK5.I12 UTo carlson TL3000.A1I18a WSU online (many other universities also subscribe to IEEE XPLORE)
(3 items found as of 2/28/2010)
97-09 checked 2/28/2010

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IEEE Annual International Reliability Physics
IRPS
Nth Annual IEEE International Reliability Physics Symposium Proceedings
Nth Annual Reliability Physics Symposium
IEEE XPLORE (67,70-) UK online & eng TK 7870.S98 UM online (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
67,70-09 checked 2/28/2010

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IEEE Applied Power Electronics Conference and Exposition (APEC)
APEC
Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition
Proceedings of xxxx IEEE Applied Power Electronics Conference
IEEE XPLORE (88-) OSU online & sel TK7881.15I34 UC online & depository TK7881.15.I32 UK online & eng TK7881.15.I32a UM online & aael TK5.I12 UT hodges TK7881.15.I14 (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
88-09 checked 2/28/2010

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IEEE Custom Integrated Circuits Conference
CICC
IEEE XPLORE (88-) UK online? UM online? (many other universities also subscribe to IEEE XPLORE)
(3 items found as of 2/28/2010)
88-09 checked 2/28/2010

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Nth International Conference on Electronic Materials and Packaging
EMAP
Nth International Symposium on Electronic Materials and Packaging
IEEE International Symposium on Electronic Materials and Packaging
International Symposium on Electronic Materials and Packaging
http://www.cpmt.org/proceedings/order.html
IEEE XPLORE (00-02,05-) UK online UM online (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
00-02,05-08 checked 2/28/2010

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xxxx IEEE International Conference on Mechatronics and Automation
ICMA
International Conference on Mechatronics and Automation
Proceedings of the xxxx IEEE International Conference on Mechatronics and Automation
xxx IEEE/ASME Advanced Intelligent Mechatronics
xxxx IEEE/ASME International Conference on Advanced Intelligent Mechatronics
IEEE XPLORE (01-) UM online? (many other universities also subscribe to IEEE XPLORE)
(2 items found as of 2/28/2010)
01-09 checked 2/28/2010

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IEEE International Conference on Polymers and Adhesives
UM online
(0 items found as of 2/28/2010)
01-05 checked 2/28/2010

----------------------------------------------------
Nth International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
POLYTRONIC
Nth IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics
IEEE XPLORE (01-02,04-05,07-) LH closed UK online UM online (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
01-02,04-08 checked 2/28/2010

----------------------------------------------------
The Nth IEEE International Conference on Secure System Integration and Reliability Improvement
SSIRI
IEEE XPLORE (08-) UM online? (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
08-09 checked 2/28/2010

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IEEE International Conference on Semiconductor Electronics
ICSE
IEEE XPLORE (96,98,00,02,04,06,08) UK online UM online & aael TK5.I12 (many other universities also subscribe to IEEE XPLORE)
(4 items found as of 2/28/2010)
96,98,00,02,04,06,08 checked 2/28/2010

----------------------------------------------------
Nth International Conference on Solid-State and Integrated Circuit Technology
ICSICT
IEEE XPLORE (95,98,01,04,06,08) UM online? (many other universities also subscribe to IEEE XPLORE)
(3 items found as of 2/28/2010)
95,98,01,04,06,08 checked 2/28/2010

----------------------------------------------------
xxxx IEEE International Engineering Management Conference, Europe
IEMC
IEEE XPLORE (88,90,92-95,01-) UK online UM online? (many other universities also subscribe to IEEE XPLORE)
(4 items found as of 2/28/2010)
88,90,92-95,01-08 checked 2/28/2010

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Proceedings of the Nth International Power Modulator Symposium
Conference Record of the xxxx Nth International Power Modulator Symposium
IEEE Conference Record of the xxxx Nth Power Modulator Symposium
Proceedings of the xxxx IEEE International Power Modulators and High Voltage Conference
IEEE XPLORE (88,90,92,94,96,98,00,02,04,06,08)
(13 items found as of 2/28/2010)
88,90,92,94,96,98,00,02,04,06,08 checked 2/28/2010

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IEEE International Symposium on Circuits and Systems
ISCAS
Proceedings of the 2004 International Symposium on Circuits and Systems
2001 IEEE International Symposium on Circuits and Systems
IEEE XPLORE (88-)
(3 items found as of 3/4/2010)

92-09 checked 3/4/2010

*** here for xplore *** --------------------------------------------------------
IEEE International Symposium on Electronics & the Environment
ISEE
xxxx IEEE International Symposium on Electronics and the Environment
IEEE International Symposium on Sustainable Systems and Technology
Proceedings of the xxxx IEEE International Symposium on Electronics & the Environment
IEEE XPLORE (93-) OSU sel TK7835.I34 UK online & eng TK7835.I340 UM online & aael TK5.I12 UT hodges TK7835.I34 WSU sci TK7835.I33 (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
93-09 checked 2/28/2010

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IEEE International Symposium on Polymeric Electronics Packaging
IEEE XPLORE (97) UK online UM online & aael TK5.I12 (many other universities also subscribe to IEEE XPLORE)
(13 items found as of 2/28/2010)
97 checked 2/28/2010

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IEEE Microwave and Wireless Components Letters
IEEE XPLORE (v11#1-) NWU online & sci L621.3813I222 OSU online & sel TK7876I46 PU online & eng 621.381305In7 UC online UD online UIC online & daley TK7800.I19 UK online & eng TK7876.I480 UL online UM online & aael TK7876.I1831 UT online & hodges QC685.I44 (many other universities also subscribe to IEEE XPLORE)
(3 items found as of 5/25/2009)

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xxxx IEEE MTT-S International Microwave Symposium Digest
MTT-S
IEEE XPLORE (74-) IU indianapolis TK7876.I18 OSU online & sel TK7876.I463 PU hicks 621.3813In75 UC online UK online & eng TK7876.I18a UL kersey TK7876.I18a UM online & aael TK5.I12 UT hodges TK7876.I18 (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 5/25/2009)

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IEEE Nuclear Science Symposium Conference Record
NSS
IEEE XPLORE (96-) UK online UM online & aael TK5.I12 (many other universities also subscribe to IEEE XPLORE)
(2 items found as of 6/23/2009)
03,06-08 checked 6/23/2009

*** here for XPLORE *** --------------------------------------------------------
IEEE Potentials
IEEE XPLORE (v7#1-) UK online UM online (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
v7#1-v29#1 checked 2/28/2010

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IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, RFIC, Digest of Technical Papers
RFIC
IEEE XPLORE (97-) UK online UM online & aael TK5.I12 (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
97-09 all checked 2/28/2010

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IEEE Region 10 Annual International Conference, Proceedings
TENCON
xxxx IEEE Region 10 Conference
xxxx IEEE Region 10
IEEE XPLORE (89-) UK online & eng TK7801.T74 & TK7885.T15 UM online (many other universities also subscribe to IEEE XPLORE)
(4 items found as of 2/28/2010)
89-09 checked 2/28/2010

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IEEE Nth International Symposium on Applications of Ferroelectrics
ISAF
IEEE XPLORE (86,90,92,94,96,98,00,02,04,06-09)
(>=20 items found as of 2/28/2010)
86,90,92,94,96,98,00,02,04,06-09 checked 2/28/2010

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xxxx IEEE Symposium on Product Safety & Compliance Engineering
2009 IEEE Symposium on Product Compliance Engineering Proceedings
IEEE Symposium on Product Compliance Engineering
xxxx IEEE Symposium on Product Compliance Engineering
IEEE XPLORE (05-08) UM online? (many other universities also subscribe to IEEE XPLORE)
(14 items found as of 2/28/2010)
04-09 all checked 2/28/2010

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IEEE Topical Meeting on Electrical Performance of Electronic Packaging
EPEP
Nth Topical Meeting on Electrical Performance of Electronic Packaging
xxxx IEEE Electrical Performance of Electronic Packaging
IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems
IEEE XPLORE (92-) OSU online UC depository TK7800.I26 UK online UM online & aael TK5.I12 (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
92-09 all checked 2/28/2010

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IEEE Transactions on Advanced Packaging
IEEE XPLORE (v22#1-) Lexmark OSU online & TK7870A1I2723 UC online & eng TK7869.I184 UD online & roesch 2nd UK online & eng TK1.I5340 UL online & kersey TK7869.I182 UM online & aael TK5700.I58cpnb UT online & hodges TK7800.I543 (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 3/4/2010)
v22#1-v33#1 checked 3/4/2010

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IEEE Transactions on Components and Packaging Technologies
IEEE XPLORE (v22#1-) OSU online & sel TK7870.A1I27225 UC online & eng TK7869.I1825 UD online & roesch 2nd UK online & eng TK7869.I183 UL online & kersey TK7869.I18 UM online & aael TK5700.I58cpna UT hodges online & TK7800.I54 UTo carlson WSU online & sci (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 3/4/2010)
v22#1-v32#4 checked 3/4/2010

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IEEE Transactions on Components, Hybrids, and Manufacturing Technology
IEEE XPLORE (v1#1-v16#8) Lexmark OSU online & sel TK7870.A1I2722 UC online & eng TK7869.I18 UD online & roesch UK online & eng TK1.I530 UL online & kersey TK7869.I18 UM online & aael TK5700.I58cpna UT hodges TK7800.I54 92-93 (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
v1#1-v16#8 all checked 2/28/2010

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IEEE Transactions on Components, Packaging, and Manufacturing Technology
IEEE XPLORE (v17#1-v21#4) Lexmark OSU online & sel TK7870.A1I2723 UC online & TK7869.I18 UD online & roesch 2nd UK online & eng TK7869.I183 UL online & kersey TK7869.I18 UM online & aael TK5700.I58cpn UT online & hodges TK7800.I543 Part A 94-98 Part B 94-98 Part C 96-98 (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
v17#1-v21#4 all checked 2/28/2010

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IEEE Transactions on Device and Materials Reliability
IEEE XPLORE (v1#1-) NWU online & sci 621.38105I225 OSU online & sel TK7800I214 PU online & eng 621.38105Ie2 UC online UD online UIC online & daley TK7870.23.I34 UK online & eng TK7870.23.I34 UL online & kersey TK7870.23.I34 UM online & aael TK7870.23.I44 UT online & hodges TK7870.23.I34 (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
v1#1-v9#4 all checked 2/28/2010

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IEEE Transactions on Dielectrics and Electrical Insulation
IEEE XPLORE (v1#1-v28#6) UD online & roesch UM online (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
v1#1-v17#1 all checked 2/28/2010

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IEEE Transactions on Electromagnetic Compatibility
IEEE XPLORE (v6#1-) TTU online UK online UM online? (many other universities also subscribe to IEEE XPLORE)
(0 items found as of 1/2/2010)
v48#4-v49#4,v50#3-v50#4,v51#2-v51#4 checked 1/2/2010

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IEEE Transactions on Electronics Packaging Manufacturing
IEEE XPLORE (v22#1-) RU fondren TK7870.I643 UK online & eng TK7869.I1850 UM online UT online & hodges TK7800.I544 UTo online & carlson WSU online & sci (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
v18#1-v21#2,v22#1-v33#1 checked 2/28/2010

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IEEE Transactions on Microwave Theory and Techniques
IEEE XPLORE (v1#1-) Lexmark UK online UM online & aael TK5700.I58m UT online (many other universities also subscribe to IEEE XPLORE)
(3 items found as of 1/5/2010)
v50#12-v57#12 checked 1/5/2010

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IEEE Transactions on Plasma Science
IEEE XPLORE (v1#1-) OSU online & sel QC717.6I3 UC eng TA2001.I18 UD online & roesch 2nd UK online & eng TA2001.I18a UL online & TA2001.I18 UM online & aael TK5700.I58 UT online & hodges QC717.6.I44
(0 items found as of 2/28/2010)
v36#1-v38#2 checked 2/28/2010

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IEEE Transactions on Reliability
IEEE XPLORE (v12#1-) UK online UM online? (many other universities also subscribe to IEEE XPLORE)
(5 items found as of 2/28/2010)
v34#1(1985)-v58#4 checked 2/28/2010

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IEEE/ASME Journal of Microelectromechanical Systems
IEEE XPLORE (v1#1-) UK online UM online (many other universities also subscribe to IEEE XPLORE)
(2 items found as of 2/28/2010)
v1#1-v19#1 all checked 2/28/2010

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Nth IEEE/CPMT International Electronic Manufacturing Technology Symposium
IEMT
IMC
Nth IEEE/CHMT European International Electronic Manufacturing Technology Symposium
Nth IEEE/CHMT International Electronic Manufacturing Technology Symposium
Nth IEEE/CPMT International Electronics Manufacturing Technology Symposium
IEEE/CPMT/SEMI Nth International Electronics Manufacturing Technology Symposium
Nth IEMT/IMC Symposium
xxxx IEMT/IMC Symposium
Nth International Conference on Electronics Manufacturing and Technology
Nth International Electronic Manufacturing Technology
Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference
Proceedings of xxxx Japan International Nth IEEE/CPMT International Electronic Manufacturing Technology Symposium
Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology Symposium
Proceedings of the Nth IEEE/CPMT International Electronic Manufacturing Technology Symposium
Proceedings of xxxx Japan International Electronic Manufacturing Technology Symposium
IEEE XPLORE (1-2,4-9,11-13,15-18,21-24,26-) AU online & rbd TK7836.I334 FSU dirac TK7881.I34 GIT online Lexmark MSU eng TK7881.I5 NWU online OSU online & sel TS176.I463 PU hicks 621.381In8p UC online & microfiche 64 97CM 3606-8 UCB eng TK7881.I51 & pascal TK7881.I51 UCF main TK7836.I55 UF online UH TK7881.I23 UK online & eng TK7801.I18 & TK7881.I420 UM online UT hodges TK7836.I55 (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 3/4/2010)
1-9,11-32 checked 3/4/2010

," (10th IEMT), Tokyo, Japan, 1991.

(9th in Washington D.C. was Oct. 1-2, 1990) (11th was Sept. 16-18, 1991) Proceedings of the 1991 Japan International Electronic Manufacturing Technology Symposium, Tokyo, Japan, June 26-28, 1991.

Proceedings from the 10th IEEE (1991 Japan) International Electronics Manufacturing Technology (IEMT) Symposium,. Tokyo,. Japan, June, 1991.

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IEEE/CPMT International Symposium on Advanced Packaging Materials
APM
Nth IEEE International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
Nth International Symposium on Advanced Packaging Materials
Proceedings of the Nth International Symposium on Advanced Packaging Materials
IEEE XPLORE (97-) UK online UM online WSU online & sci TK7881.I2 (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
97-07 checked 2/28/2010

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xxxx IEEE/CPMT Photonic Devices and Systems Packaging Symposium

John H. Lau / Agilent Technologies, Inc., CA S. W. Ricky Lee "Thermal Analysis of Vertical-Cavity Surface-Emitting LED/VCSEL Assembly with Lead-Free Flip Chip Interconnects ," 2002 IEEE/CPMT Photonic Devices and Systems Packaging Symposium , Palo Alto, CA, July 14-16, 2002, pp. .

J. Lau, Z. Mei, S. Pang, C. Amsden, J. Rayner and S. Pan "Nonlinear Time and Temperature Dependent Analysis of the Lead-Free Solder Sealing Ring of Photonic Switch ," 2002 IEEE/CPMT Photonic Devices and Systems Packaging Symposium , Palo Alto, CA, July 14-16, 2002, pp. .

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IEEE/SEMI Advanced Semiconductor Manufacturing Conference
ASMC
IEEE XPLORE (90-) UK online UM online? (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
90-09 checked 2/28/2010

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IEEJ Transactions on Industry Applications
priority

(new references 12/30/2008)
Hamane, Hiroto, Wajima, Kenji, Hayashi, Yoichi, Komiyama, Eiichi, Tachibana, Toshiaki, Miyazaki, Kazuyoshi .Pb-free soldering iron temperature controller IEEJ Transactions on Industry Applications, v 127, n 3, 2007, p 322-329+15 Language: Japanese, English

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(new source name 9/21/2009)
IEEJ Transactions on Power and Energy
Denki Gakkai ronbunshi. B, Enerugi
IU online LH closed MST online OSU online SDSU online SU online UMc online USF online
v129#1-v129#9 checked 10/5/2009 priority

(new references 2/11/2009)
Chung-Seog Choi, Kil-Mok Shong, Dong-Ook Kim, Dong-Woo Kim, and Young-Seok Kim, Analysis of Dispersive Characteristics and Structures of Copper Wire Melted by Overcurrent IEEJ Transactions on Power and Energy Vol. 125 (2005) , No. 12 pp.1327-1331

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IET Circuits, Devices & Systems
IEEE XPLORE (v1#1-) UD online UK online UM online VU online (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
v1#1-v4#1 all checked 2/28/2010

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IET Communications Engineer
IEE Communications Engineer
http://www.iee.org/oncomms/sector/communications/magazine.cfm IEEE XPLORE (v1#1-) NWU online OSU online UD roesch UK online UL online & kersey TK6540.R262322 UM online & aael TK5101.A1C76 UT hodges TK5101.A1C64 (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
v1#1-v5#6(Jan08) all checked 2/28/2010

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IET Electronics Systems and Software
IEEE XPLORE (v1#1-) UM online? (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
v1#1-v5#6(07) all checked 2/28/2010

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IET Manufacturing
Manufacturing Engineer
IEEE XPLORE (v73#1-) IU online NWU online OSU online PU online & eng 670.5P942 UC eng TJ1180.A1A6 UCI online UIC online UK online UL online UM online & aael TS1.I59 UT online (many other universities also subscribe to IEEE XPLORE)
(13 items found as of 2/28/2010)
v73#1-v86#6 checked 2/28/2010

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IMAPS Advanced Passive Technology Workshop
priority

(new references 6/8/2009)
H. Windlas, P.M. Raj, S. Bhattacharya and Rao R Tummala, "Optimized Suspension Formulations for Improved Dielectric Properties of Ceramic-polymer Nanocomposites for Integral Capacitor, " IMAPS Advanced Passive Technology Workshop, Denver, CO, April 2000.

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IMAPS Advanced Technology Workshop on Integrated Passives
Proceedings of the Advanced Technology Workshop on Passive Integration
priority

(new references 6/8/2009)
S. Bhattacharya, S. Dalmia, D. Balaraman, P. M. Raj, F. Ayazi, M. Swaminathan and R. Tummala, "Fabrication and RF Characterization of Embedded High Q Inductors and Capacitors on Organic Laminates for System-on-Package (SOP) Application", Proceedings of the Advanced Technology Workshop on Passive Integration, Ogniguit, ME, June, 2002.

Raghuveer, R., S. Burkett, L. Schaper, R. Ulrich, B. Rogers, and R. Geil, "Decoupling Capacitors by Reactive Sputtering and Anodization Processes," Proc. IMAPS Advanced Technology Workshop on Passive Integration, Marco Island, FL, January 2005.

Schaper, L., and R. K. Ulrich, "Electrical Performance Limitations of On-Package Decoupling Capacitors," IMAPS Advanced Technology Workshop on Integrated Passives, January 2005.

Ulrich, R., L. Schaper, and V. Joshi, "Decoupling Simulation for Embedded Capacitors," IMAPS Advanced Technology Workshop on Integrated Passives, January 2005.

P. Markondeya Raj, Devarajan Balaraman, Vinu Govind, Isaac Robin Abothu, Swapan Bhattacharya, Madhavan Swaminathan and Rao Tummala, "supercapacitive nanocomposite thin films suitable for embedded decoupling capacitors", Accepted for International Workshop on Integrated Passives, Marco Island, International International Microelectronics and Packaging Society, to be held during January 25-26, 2005.

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IMAPS International Conference on Emerging Microelectronics
priority

(new references 6/8/2009)
O. Misman, Swapan Bhattacharya, Ahmet Erbil, and Rao Tummala, "PWB Compatible Thick and Thin Film Integral Capacitors, " IMAPS International Conference on Emerging Microelectronics, EMIT 2K, Bangalore, India, February 2000, TP6-1, pp. 143-150.

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IIE Annual Conference and Expo
AU rbd T55.45.I57 GIT T55.45.I49 MST wilson T55.45.I49 OkSU main 658.506A512pd UC eng cdrom T55.45.I145 UM CDROM UmX175 UOk online UTA eng cdrom 902
priority

(new references 12/30/2008)
Greene, Christopher M., . Using regression analysis in the stencil printing process 2 and Expo 2007 - Industrial Engineering's Critical Role in a Flat World - Conference Proceedings, IIE Annual Conference and Expo 2007 - Industrial Engineering's Critical Role in a Flat World - Conference Proceedings, 2007, p 572-577

Subbarayan, Guhan, Tsai, Pei-Fang Jennifer, Srihari, Krishnaswami, Kinyanjui, Robert, Damodaran, Purushothaman .Effect of lead-free PCB surface finishes on the formation of microvoids and kirkendall voids 2 and Expo 2007 - Industrial Engineering's Critical Role in a Flat World - Conference Proceedings, IIE Annual Conference and Expo 2007 - Industrial Engineering's Critical Role in a Flat World - Conference Proceedings, 2007, p 1208-1213

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III-Vs Review
MST online OkSU online OSU online PU online & chem 621.3815205T4133 SDSU online UC online UCI online UCSD online UD online UM online UOk online UT online UTo online
(1 items found as of 4/19/2009)

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Implementing Lead-Free Electronics Workshop
(1 items found as of 4/19/2009)

-------------------------------------------------------
Indian Journal of Pure & Applied Physics
MST online OkSU online OSU depository QC1I3915 SIUC morris 52815-5301 UCSD s&e QC1.I3935 UK king QC1.I53 UOk bizzell QC1.I53
(1 items found as of 4/19/2009)

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Industrial and Engineering Chemistry
MST online NWU online & sci 660.5A613 OSU sel TP1J861 & depos TP1J861 PU eng 624.1Am28a & 660.05An78 & hicks 660.5In2 & 660.5In2n SDSU online SIUC online SIUE storage UAr mullins TP1.C35 UCSD online UD roesch UE UIC daley TP1.C35 & warehouse TP1.I6 UL kersey TP1.I6 & TP1.C35 & TP1.I615 UM online & shapiro TP1.I62 & buhr RA421.I38 & buhr TP1.I62 USD online UT online & hodges closed TP1.I6
(1 items found as of 4/19/2009)
checked 6/23/2008

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Industrial Control Design Line
http://www.industrialcontroldesignline.com/
(>=20 items found as of 4/19/2009)
checked 4/4/2009

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Industrial Finishing
AU rbd TT325.A1I6 FIT online GIT online & main TT300.I45X MST online OkSU stillwater 698.305I42 PU eng 667.605In2 SIUC morris 52825-6671 UAR mullins per microfiche UK online UL kersey TT325.A1I6 UM online UOk online USD online UT online WSU online & storage
(2 items found as of 4/19/2009)

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Industry Week
http://www.industryweek.com/ MST online OkSU online SDSU online SIUC online SIUE lovejoy microfiche UAr online UCSD online UOk online USD online
(4 items found as of 4/19/2009)
Jan04-Apr09 checked 4/3/2009

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Information Display
Lexmark PU hicks 001.55505In3 SIUC morris 52837-6211 UAr online UCSD s&e TK1.S2 UTor eng TK7882.I6I6 UWa davis TK7882.I6I6
(2 items found as of 4/19/2009)
v19#1-v25#5 checked 10/23/2009 low priority

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(new source name 9/21/2009)
Conferencia Internacional Ciclo de Vida
InLCA/LCM Internet Conference
International Life Cycle Assessment and Management xxxx
http://lcacenter.org/LCA8/program.html checked 4/4/2009 http://www.lcacenter.org/InLCA2007/program.html checked 4/4/2009 http://www.lcacenter.org/InLCA2006/sessions.html checked 4/4/2009 http://www.lcacenter.org/cilca2005.html http://www.lcacenter.org/InLCA2004/sessions.html checked 4/4/2009 http://lcacenter.org/InLCA-LCM03/Technical_Program.htm checked 4/4/2009 http://www.lcacenter.org/lca-lcm/index.html checked 4/4/2009 http://www.lcacenter.org/InLCA/agenda.htm checked 4/4/2009 BYU online IU online
(4 items found as of 4/19/2009)

00-04,06-08 checked 4/4/2009 priority

," Conferencia Internacional Ciclo de Vida, San Jose, Costa Rica, Apr. 25-28, 2005, pp. .

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Innovation
http://www.shimadzu.com/about/magazine/index.html UAr online UCSD online USD online
(1 items found as of 4/19/2009)
#26-#37 checked 4/4/2009 priority

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Inorganic Materials
KYVL MST online NWU sci 620.11I58 OkSU online OSU online & depos TN4A51 PU online & chem 620.11In7 SDSU online SIUC morris 56056-5461 UAr online UC online UCSD online UD roesch UIC online & warehouse TN4.A334643 UK online UL kersey TN4.A334643 UM online USD online UT online
(2 items found as of 4/19/2009)

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The Institute
SIUC online UCSD online
(0 items found as of 11/9/2009)
v33#2 checked 11/9/2009

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Instruments and Experimental Techniques
AU online BYU hbll QC53.P213 FSU online GIT online IU online LH closed LU gray QC53.P213 MoSU QC53.P2132 MST online NWU online OGI online OkSU online OrSU valley QC53P72 OSU online PU online RU fondren QC53.P213 SDSU online SU online SIUC online UAB sterne QC53.P213 UAH online UAr online UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UK online UM online & shapiro QC1.P893 & buhr Q184.P943 UMC online UNF online UOk online USD online USF online USU online UT online UTA online UTo online WrSU online
(1 items found as of 12/28/2009)
v48#1-v52#6 checked 12/28/2009

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Insulation/Circuits
OSU depository TK1.I55 PU hicks 621.305In7 SIUC storage 56143-6211 UIC warehouse TK1.I46 UM buhr TK1.I597 UT hodges TK3331.I68
(1 items found as of 4/19/2009)

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Intel Halogen Free Symposium
(>=20 items found as of 4/19/2009)
08 checked 9/22/2008 priority

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Interface Science
MST online OkSU online OSU online & sel QD506.A1I55 PU online SDSU online SIUC online UC online UCSD online UD online UIC online UM online USD online UT online
(2 items found as of 10/22/2009)
v1#1-v12#4 (2004 ended) all checked 10/22/2009

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Intermetallics
AU online FSU online GIT online LH closed MST online NWU online OkSU online OSU online PU online RU online SDSU online UC online UCF online UCI online UCSD online UDe online UF online UIC online UK online UM online & aael TN689.I541 UMC online UOk online USD online USF online USU online UT online UTA online UTo online WrSU online
(6 items found as of 12/28/2009)
v15#7,v16#9,v17#1-v18#2 Articles in Press to Oct. 21, 2009 checked 12/28/2009

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Internal Conference on Lead Free Electronics

Use of Lead Free Solder Alloys in Electrical & Electronic Devices for the Automotive Industry Internal Conference on Lead Free Electronics, Soldertec. IPC. Junio 2003 pag 409.

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3rd International Brazing and Soldering Conference, Apr. 23-27, 2006, San Antonio, TX.

Martin, J. J. ; Vianco, Paul Thomas ; Hlava, Paul Frank ; Rejent, Jerome Andrew ; Susan, Donald Francis Evaluation of the effects of Au content on intermetallic compound layer growth in Pb-Sn and Sn-Ag-Cu solder joints.

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2002 International Conference on Advanced Packaging and Systems
GIT UCSD s&e TK7870.15.I5733 UOk bizzell TK7870.15.I38 UTor eng TK7870.15.I574 UWa davis TR5.S6x
(3 items found as of 4/19/2009)
02 priority

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International Conference on Crystal Growth
SDSU microform NAS 1.26:190919 & NAS 1.26:190920 UTo carlson microform NAS1.26:190919

Kawanara, R. S. Nango, T. Hascgawa, and M. Ohtani, "Role of Lead in Growth Suppression and Growth Mechanism of Tin Proper Whisker", International Conference on Crystal Growth ...(ICCGCPS), vol. 10, n. 2, 148-156 1983

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International Conference on Digital Printing Technologies
AU rbd Z252.5.N46I57 GIT main Z252.5.N64I58x Lexmark Z252.5.N64I58
priority

(new references 12/30/2008)
Seeley, Todd, .Ensuring compliance to the RoHS and WEEE directives International Conference on Digital Printing Technologies, v 2006, NIP22: 22nd International Conference on Digital Printing Technologies - Final Program and Proceedings, 2006, p 521

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Nth International Conference on Electronic Measurement and Instruments
ICEMI
IEEE XPLORE (07,09) UK online UM online (many other universities also subscribe to IEEE XPLORE)
(2 items found as of 2/28/2010)
07,09 checked 2/28/2010

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International Conference on Electronic Packaging Technology & High Density Packaging
ICEPT
xxxx Nth International Conference on Electronic Packaging Technology
Nth International Conference on Electronic Packaging Technology
(various cities in China) IEEE XPLORE (03-) UK online UM online (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
03-09 checked 2/28/2010

(new references 6/7/2009)
R. Tummala, S. Dalmia, D. Balaraman, J. Hobbs, H. Windlass, A. Bavisi, P. M. Raj, S. H. Lee, S. Bhattacharya, G. White, F. Ayazi, M. Swaminathan, ]]A. Erbil and T. Ogawa "Recent Advances in Integral Passives Research at Georgia Tech", International Conference on Electronic Packaging, Tokyo, Japan, pp 116-123, April 2002.

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Nth International Conference on the Enhancement and Promotion of Computational Methods in Engineering and Science
FSU dirac TA329.I56 GIT main-5e TA329.I56x RU fondren TA329.I56 UTo online WrSU online
(1 items found as of 4/19/2009)

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Nth International Conference on Information Technology Based Higher Education and Training
ITHET
IEEE XPLORE (04-06) UK online UM online (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
04-06 checked 2/28/2010

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International Conference on Lead Free: Electronic Components and Assemblies
IPC/Jedec International Conference on Lead Free Electronic Components and Assemblies
(>=20 items found as of 4/19/2009)
3,5,7-8,12 priority

Schetty, R, , "Tin Whisker Growth & The Metallurgical Properties of Electrodeposited Tin", IPC/JEDEC International Conference on Lead-Free Electronic Assemblies, Mar. 2002, pp. 137-145

Bergman, David W, "Why Industry Needs a Life Cycle Environmental Impact Evaluation of Tin-lead and lead-free solder", International Conference on Lead Free: Electronic Components and Assemblies, San Jose, CA, May 1-2, 2002, pp. 24.

Lal, S, , "Tin Whiskers: Their Appearance and Reduction in Electronic Connectors", 2nd IPC-JEDEC International Conference on Pb-Free Electronic Components and Assemblies, Taipei, Taiwan, Dec. 10, 2002, pp. 107-126

Freedman, M, and Lycoudes, N. JEDEC's Lead-Free Position Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 356 (2002)

Goudarzi, V. Lead-Free Solder Paste Evaluation and Implementation in Personal Communication Products Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 182 (2002)

Nimmo, K. Review of European Legislation and Lead-Free Technology Roadmap Internat. Conf. On Lead-Free Electronic Comp. And Assem, p.18 (2002)

Prasad, S. NEMI Pb-Free Task Group Report Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 68 (2002)

Romm, D. and Abbott, D. Component Issues for Lead-Free Processing Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 200 (2002)

Schetty, R. Tin Whisker Growth and the Metallurgical Properties of Electrodeposited Tin Internat. Conf. On Lead-Free Electronic Comp. And Assem, p. 139 (2002)

R. Schetty, "Tin whisker growth \\\& the metallurgical properties of electrodeposited tin," in Proc. IPC/JEDEC Pb-Free Conf., May 2002, pp. 1-25.

R. Schetty, Y. Zhang, and K. Hwang, "Whisker growth: The substrate effect and beyond," presented at the IPC-JEDEC Pb-Free Conf. Taipei, Taiwan, pp. 1-5, Dec. 2002.

S. Madra, "Thermo-mechanical characterization of lead-free tin plating: X-ray diffraction measurements and correlation with analytical and numerical models," in Proc. IPC-JEDEC Conf. Frankfurt, Germany, Jun. 2003.

K. Whitlaw, A. Egli, and M. Toben, "Preventing whiskers in electrodeposited tin for semiconductor lead frame applications," in IPC Int. Conf. Lead-Free Electronics Brussels, Belgium, Jun. 2003.

Geiger, D, , Arra, M, , and Shangguan, D, , Evaluation of Sn-Zn Solder Paste. Proceedings of IPC/JEDEC 2004 International Conference on Lead-Free Electronic Assemblies and Components, Singapore, Aug. 18-20, 2004.

Bixenman, Mike, Miller, Erik, and Rueda, Fernando, mike_bix@kyzen.com "Lessons Learned and Best Practices Developed for Cleaning Lead-Free Flux Residues from Printed Circuit Assemblies and Advanced Packages" (IPC/Jedec International Conference on Lead Free Electronic Components and Assemblies, Boston, MA, Dec. 5-7, 2006)

Kato, Takahiko, Akahoshi, Haruo, Nakamura, Masato, Hashimoto, Tomoaki, and Nishimura, Asao, "Effect of Cu Leadframe Substance on Whisker Initiation from Electrodeposited Sn/Cu Coating" (IPC/Jedec International Conference on Lead Free Electronic Components and Assemblies, Boston, MA, Dec. 5-7, 2006)

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Nth International Conference on Lead Free Electronics
(>=20 items found as of 4/19/2009) priority

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International Conference on Lead-free Soldering
(>=20 items found as of 4/19/2009)
05-06 checked 4/28/2007 priority

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Nth International Conference on Recent Advances in Space Technologies
ICAST
RAST
Nth International Conference on Advances in Space Technologies
IEEE XPLORE (03-) UK online UM online (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
03-09 checked 2/28/2010

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International Conference on Soldering and Reliability
SMTA International Conference on Soldering and Reliability
(>=20 items found as of 11/6/2009)
07-09 checked 11/6/2008 priority

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Nth International Conference on Solid-State Sensors, Actuators and Microsystems
TRANSDUCERS
xxxx International Solid-State Sensors, Actuators and Microsystems Conference
IEEE XPLORE (91,95,97,03,05,07,09) UM online (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
91,95,96,97.03,05,07,09 checked 2/28/2010

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International Heat Treatment and Surface Engineering
priority

(new references 12/31/2008)
Casteletti, L.C., Nucci, Rafael, Neto, A. Lombardi, Arnoni, E.A.B., Totten, G.E. .Hard chromium substitution using HVOF coatings International Heat Treatment and Surface Engineering, v 2, n 1, March, 2008, p 27-31

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International Journal of Adhesion and Adhesives
MST online OkSU online OSU online SDSU online UC online UCI online UCSD online UD online UK online SD UM online & aael TP967.I565 UOk online UT online UTo online WSU online
(>=20 items found as of 10/22/2009)
v1#1-v30#1 Articles in Press to Oct. 4, 2009 all checked 10/22/2009

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International Journal of Advanced Manufacturing Technology
IU online MST online OkSU online OSU online PU online & eng 670.4205In8 SDSU online SIUC online UAr online UC online UCI online UCSD online UD online UK online UOk online UT online UTo online & carlson
(1 items found as of 4/19/2009)

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International Journal of Cast Metals Research
LH closed MST wilson TS228.99.C371 UCSD online UM aael TS228.99.C37
(1 items found as of 4/19/2009)

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International Journal of Computer Integrated Manufacturing
AU online BYU online FSU online GIT online IU online LH closed MoSU TS155.6.I593 MST online NWU online OGI online OkSU online OrSU online OSU online PU online SDSU online SIUC online SU online UAH online UAr online UC online UCF online UCI online UCSD online UDe online UF online UIC online UK online & eng TS155.6.I593 UMC online UOk online USD online USF online USU online UT online UTo online WrSU online
(2 items found as of 12/28/2009)
v20#1-v22#12 checked 12/28/2009

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International Journal of Damage Mechanics
MST online MSU online NWU online OkSU online OSU online SDSU online SIUC online SIUE lovejoy UCSD online UD online UIC online UM online & aael TA409.I481 UOk online USD online UTo online WSU online
(1 items found as of 4/19/2009)

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International Journal of Electronics
MST online NWU online OkSU online OSU online & sel TK7800.J6 PU online SDSU online SIUC online SIUE lovejoy UAr online UC eng TK7800.J6 UCSD online UD roesch UE UIC online UM online & aael TK7815.A1J86 UOk online USD online UT online
(1 items found as of 4/19/2009)
v73#5

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International Journal of Environment and Pollution
GIT main-5e TD1.I573
(2 items found as of 4/19/2009)
02

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International Journal of Environmental Technology and Management
LH closed UMC umk mnl UTor online
priority

(new references 12/31/2008)
Gamberini, Rita, Gebennini, Elisa, Grassi, Andrea, Mora, Cristina, Rimini, Bianca .An innovative model for WEEE recovery network management in accordance with the EU directives International Journal of Environmental Technology and Management, v 8, n 4, March, 2008, p 348-368

Cagno, Enrico, Magalini, Federico, Trucco, Paolo .Modelling and planning of Product Recovery Network: The case study of end-of-life refrigerators in Italy International Journal of Environmental Technology and Management, v 8, n 4, March, 2008, p 385-404

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International Journal of Fatigue
AU online FSU online GIT online LH closed MST online NWU online OkSU online OrSU valley TA418.38.I6 OSU online PU online RU online SDSU online TTU UAr mullins TA418.38.I53 UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UK online & eng TA418.38.I53 UM online & aael TA418.38.I531 UMC online UOk online USF online USU online UT online UTA online UTo online WrSU online
(6 items found as of 12/28/2009)
v27#1-v32#4 Articles in Press to Dec. 28, 2009 checked 12/28/2009

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International Journal of Fracture
AU online BYU hbll TA409.I5 FSU online GIT online IU online LH closed LU gray TA409.I5 MoSU TA409.I5 MST online NWU online OGI online OkSU online OrSU online OSU online PU online RU online SDSU online SIUC online SIUE lovejoy SU online TTU UAB sterne TA409.I5 UAH n1 UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UK online & eng TA409.I5 UM online & aael TA409.I62 UMC online UNF online UOk online USD online USF online UT online UTA online UTo online WrSU online
(4 items found as of 12/28/2009)
v137#1-v161#1 online First to Dec. 28, 2009 checked 12/28/2009

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International Journal of Life Cycle Assessment
AU online FSU online GIT online IU online MST online NWU online OGI online OkSU online OrSU online OSU online PU online SDSU online SIUC online UC online UCI langson HF5415.155.I58 UCSD online UDe online UF online UK online UM online UMC online UOk online USD online USF online UTA online UTo online WrSU online
(9 items found as of 12/28/2009)
v1#1-v14#7 online First to Dec. 28, 2009 all checked 12/28/2009

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International Journal of Materials and Product Technology
GIT main-5e TA401.I788 LH closed PU hicks 20.1105In8 UM aael TA401.I657 UTor online
(0 items found as of 5/19/2009)
v15#1-v27#4,v31#1-v34#2 checked 5/13/2009 priority

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International Journal of Materials and Structural Integrity
priority

(new references 12/29/2008)
Abdulhamid, Mohd F., Li, Shidong, and Basaran, Cemal, .Thermomigration in lead-free solder joints International Journal of Materials and Structural Integrity, v 2, n 1-2, June, 2008, p 11-34

Erinc, Muge, Schreurs, Piet J. G., and Geers, Marc G. D., .Impact of miniaturisation on solder joint reliability International Journal of Materials and Structural Integrity, v 2, n 1-2, June, 2008, p 35-46

Ghaffarian, Reza, .Reliability of PWB microvias for high density package assembly International Journal of Materials and Structural Integrity, v 2, n 1-2, June, 2008, p 47-63

Tunga, Krishna, and Sitaraman, Suresh K., .Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cycling International Journal of Materials and Structural Integrity, v 2, n 1-2, June, 2008, p 173-192

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International Journal of Materials Research
International Journal of Materials Research and Advanced Techniques
Materials Research and Advanced Technologies
Zeitschrift fur Metallkunde
AU rbd TN3.Z45 CSM lakes FSU remote 660.5Z48 GIT main TN3.Z45 IU b-alf TN3.Z48 LH closed MSU eng TN3.Z45 NWU sci L669.05Z48 OrSU valley TN3.Z4 & storage TN3.Z4 OSU sel TN3Z48 PU eng 669.05Z3 & hicks 669.05Z3 RU fondren TN3.Z45 TTU microform UC online & eng TN1.Z45 & eng TN3.Z45 UCF main TN3.Z45 UCSD s&e TN1.Z489 UDe penrose TN3.Z45 & pascal TN3.Z45 UF sci TN3.Z45 UIC warehouse TN3.Z45 UIUC eng Q.669.05IN UK eng TN603.Z483 & remote TN603.Z483 UL eng TN603.Z483 UM aael TN3.Z48 (v37-) UMC depos 669.105In8 USF center E-8271 UT online & hodges TN3.Z45 UTA eng 669.05Z37 UTor eng TN3.Z452 WrSU dunbar TN3.Z45 WSU sci
(>=20 items found as of 5/20/2009)
v81#1-v100#3 checked 5/13/2009 priority

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International Journal of Microcircuits and Electronic Packaging
http://www.imaps.org/journal/index1.asp PU eng 621.3817In7 & 621.38104605J826 UC cdrom TK7870.15.I58 & eng TK7870.15.I58 UM aael TK7870.15.I581 WSU sci
(>=20 items found as of 5/19/2009)
v15#1-v25#3 checked 5/13/2009 priority

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International Journal of Microelectronic Packaging Materials and Technologies

Li, Li, Morris, J.E. "Introduction to electrically conductive adhesives International Journal of Microelectronic Packaging Materials and Technologies, vol. 1 no. 3, 1998, pp. 159-175.

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International Journal for Multiscale Computational Engineering
priority

(new references 12/31/2008)
Geers, Marc G. D., Ubachs, R.L.J.M., Erinc, M., Matin, M.A., Schreurs, P.J.G., Vellinga, W.P. .Multiscale analysis of microstructural evolution and degradation in solder alloys International Journal for Multiscale Computational Engineering, v 5, n 2, 2007, p 93-103

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International Journal of Physical Distribution & Logistics Management
IU online MST online NWU online OSU online & bus HF5415.7.I572 PU hicks 658.7805In8 SDSU online SIUC online UAr online UC online & langsam HF5415.7.I55 UCSD online UD online UIC online & daley HF5415.7.I552 UK online UL ekstrom HF5415.7.I61 UM online UOk online USD online UT online & hodges HF5415.6.I68
(1 items found as of 4/19/2009)

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International Journal of Production Research
MST online NWU online & sci L658.505I61 OSU online & sel T175A1I54 PU online & eng 658.5705In8 & hicks 658.5705In8 SDSU online SIUC online UAr online UC online & eng TS155.A1I64 UCSD online UD roesch UIC online & daley TS155.A1I64 UK online & eng TS155.A1I64 UL kersey TS155.A1I64 UM online & aael TS155.A1I62 UOk online USD online UT online & hodges HD28.I59
(4 items found as of 12/28/2009)
v45#18-v47#24 checked 12/28/2009

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International Journal of Services and Standards
LH closed
(1 items found as of 4/19/2009)

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International Journal of Solids & Structures
MST online OkSU online OSU online & TA349I5 SDSU online SIUC online SIUE lovejoy UAR mullins TA349.I5 UCSD online UK online sd & eng TA349.I5 UL online & kersey TA349.I5 UOk online UT online
(4 items found as of 12/28/2009)
v36#1,v42#1-v47#5 Articles in Press to Dec. 28, 2009 checked 12/28/2009

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International Journal of Thermophysics
MST online OkSU online OSU online PU online & eng 620.11296In7 SDSU online SIUC online UAr mullins QC192.I57 UC online & phys QC192.I57 UCI online UCSD online UD online UK online & eng QC192.I57 UM online & shapiro QC192.I615 UOk online USD online UT online & hodges QC192.I57 UTo online
(8 items found as of 12/28/2009)
v24#1-v30#6 online First to Dec. 28, 2009 checked 12/28/2009

------------------------------------------------------
International SAMPE Electronics Conference
AU rbd TK7871.I577 PSU millar TK7871.I577a SDSU TK7871.I577 UD roesch TK7871.I577 USU lee TK7871.I577 UT hodges TK7871.I577
(5 items found as of 4/19/2009)
87-93,98-00,02 priority

Barbieri, R.; Coppari, G.; Rudland, D. Use of adhesive technology in the replacement of solder for the manufacture of the new fiat 500 ignition system International SAMPE Electronics Conference, vol. 7, 1994, pp. 51-56

McCormack, M.; Jin, S. Design and properties of new, Pb-free solder alloys International SAMPE Electronics Conference, vol. 7, 1994, pp. 394-404

Li, Lin, Chung, D.D.L. "Z-axis anisotropic electrically conducting polymer-matrix composite film International SAMPE Electronics Conference, vol. 7, 1994, pp. 482-486

Jackson, A.M. ; Artakl, I. ; Vianco, P.T. Manufacturing feasibility of several lead-free solders for electronic assembly Conference: 7. International Society for the Advancement of Material and Process Engineering materials processes electronics conference,Parssipany, NJ (United States),21-23 Jun 1994; Other Information: PBD: [1994]

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International SAMPE Symposium and Exhibition
Nth International SAMPE Symposium and Exhibition
SIUC morris TA401.3.I585a OSU sel TA401.3N36 UM aael TL950.S63 (also pre-v32) & aael CDROM UnX212 RyU TA401.3.I585 UOk eng TA401.3.I583 UTA eng TA401.3.I585A
(1 items found as of 8/13/2009)
v32-v49 checked 8/19/2009 priority

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International SAMPE Technical Conference
nth International SAMPE Technical Conference
OkSU main 629.134206S678p OSU sel TL950A1N32 SDSU TL953.I58 SIUC online SIUE lovejoy cdrom TA401.3.I584 UC depository TA401.3.I584 & eng TA401.3.N37 UCB eng TL698.N294 UCI sci TA418.9.C6I5935 UCSD s&e TA401.3.I584 UM aael TA401.3.S675 UOk eng various UTA eng TA401.3.I59 UTo depos TL698.N28 UTor eng TA401.3.I67 WSU sci TA401.3.I584
(5 items found as of 4/19/2009)
69-70,74-02 checked 8/19/2009 priority

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Nth International Spring Seminar on Electronics Technology
IEEE XPLORE (01,03-) UK online (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
01,03-09 checked 2/28/2010

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International Symposium on High Density Packaging and Microsystem Integration
HDP
Proceedings of the Nth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
Proceedings of International Symposium on High Density Packaging and Microsystem Integration xxxx
IEEE XPLORE (04-08) OSU online UK online (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
04-09 checked 2/28/2010

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International Symposium on Microelectronics
International Microelectronics Symposium
Proceedings xxxx International Symposium on Microelectronics
Proceedings of the Nth International Symposium on Microelectronics
Proceedings of the xxxx International Symposium on Microelectronics
AU rbd TK7874.I59 FSU dirac TK7874.I5925 GIT main TK7874.I5925 Lexmark TK7874.I5918 UCB eng TK7874.I5918 UCF main TK7874.I592 UCSD s&e TK7874.I592 UF sci TK7874.I5918a UOk bizzell TK7874.I59 UTor eng TK7874.I567 UWa davis TK7874.S9 & TR5.S6x WSU sci TS510.P76
(>=20 items found as of 10/23/2009
71-03 checked 10/23/2009 low priority

(new references 6/7/2009)
P. Chahal, R. R. Tummala, and M.G. Allen, "Integrated Capacitors using Polymer-Ceramic Comp. For MCM -L, "3 rd International Symposium on Microelectronics, pp. 126-131, 1996.

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Nth International Symposium on the Physical and Failure Analysis of Integrated Circuits
IPFA
Proceedings of the Nth International Symposium on the Physical and Failure Analysis of Integrated Circuits
IEEE XPLORE (95-) UM online (many other universities also subscribe to IEEE XPLORE)
(16 items found as of 2/28/2010)
95-09 checked 2/28/2010

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International Symposium on Tantalum and Niobium
LH closed TN490.T2I54 UTA eng TN490T2I58 UTor eng TN490.T2I54
priority

(new references 6/5/2009)
Nakata, Takehiko, Morimoto, K., Saiki, Y., and Nishiyama, T., "History of the Development of Tantalum Capacitor and Future Trend," International Symposium on Tantalum and Niobium, Goslar, Germany, Sept. 1995.

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International Symposium for Testing & Failure Analysis
Advanced Techniques in Failure Analysis Symposium (ATFA)
Conference Proceedings from the International Symposium for Testing and Failure Analysis
ISTFA Proceedings
Proceedings of the Nth International Symposium on Testing and Failure Analysis
LH CDRM OrSU valley TK7871.I591 OSU sel TK7870.A38 & sel TK7870.A3822 UC eng TK7871.I48 UCB eng TK7871.I595 UM aael TK5.I12 & aael TK401.I581 UNL eng TK7871.85.A244 UOk eng various UT hodges TK7871.85.A39 & hodges TK7871.I4735 UTA eng cdrom 381 UTor eng TK7871.I59
(8 items found as of 4/19/2009)
76-78,81,91,93-07 checked 3/22/2009 priority

(new references 12/30/2008)
Evans, K. L, Anderson, T. A.; Kirkman, D. C. COMPARATIVE ANALYTICAL TECHNIQUES FOR THE DETERMINATION OF Pb IN SOLDER PLATED LEADS. AFTA Inc, 1984, pp. 247-253

Williams, Esther H. tin whiskers on flat pack lead plating between solder dip and sealing glass. AFTA, 1985, pp. 16-21

Williams, E. H, , "Tin Whiskers on Flat Pack Lead Plating Between Solder Dip and Sealing Glass," ISTFA Proceedings, pp. 16-21, 1985.

Westerhuyzen, D. H. Van, , Backes, P. G, , J.F. Linder, S.C. Merrell and R.L. Poeschel, "Tin Whisker Induced Failure in Vacuum," l8th International Symposium for Testing & Failure Analysis, v. 18, pp.407 - 412, Oct. 17, 1992.

Armendariz, Norman J, Paulraj, Prawin Materials Characterization of Lead Free Compositions for Minimum Temperature SMT Processes at the SLI-Second Level Interconnect Solder Joint ISTFA 2004: 30th International Symposium for Testing and Failure Analysis, Boston, MA, USA, 14-18 Nov. 2004. pp. 261-266. 2004

Kurella, Anil, Munukutla, Aravind, Lewis, J.S. .PCB related field failures with ImAg surface finishes Conference Proceedings from the International Symposium for Testing and Failure Analysis, ISTFA 2007 - Proceedings of the 33rd International Symposium for Testing and Failure Analysis, 2007, p 293-297

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Nth International Symposium on Tin Whiskers
(4 items found as of 4/19/2009) priority

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Nth International Wafer-Level Packaging Congress
Nth International Wafer Level Packaging Congress
http://www.smta.org/knowledge/knowledge.cfm
(12 items found as of 11/6/2009)
04-08 checked 11/6/2009 priority

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Nth International Zurich Symposium on Electromagnetic Compatibility
EMC Zurich
EMC-Zurich
IEEE XPLORE (06-) UK online? UM online? (many other universities also subscribe to IEEE XPLORE)
(16 items found as of 3/4/2010)
06-09 checked 3/4/2010.

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InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
ITHERM
xxxx Nth IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
IEEE XPLORE (88-) FSU dirac TK7870.25.I6 OSU sel TK7870.25.I44 UK online & eng TK7870.25.I56 UM online & aael TK5.I12 UT hodges TK7870.25.I68 (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
88-08 checked 2/28/2010

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IPC Brussels
(8 items found as of 5/25/2009)
08 checked 5/25/2009 priority

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IPC Conference
GIT main-6e TK7868.P7I56X
81

Schetty, R, "Whisker Growth Studies". Proceedings of IPC Annual Meeting, Session Y, paper B, Oct. 2001, Orlando, PL, USA.

Egli, A, , W Zhang, J Heber, F. Schwager, M. Toben, "Where Crystal Planes Meet: Contribution to the Understanding of the Tin Whisker Growth Process", IPC Conference (New Orleans), Nov. 2002
A. Egli, W. Zhang, J. Heber, F. Schwater, and M. Toben, "Where crystal planes meet: Contribution to the understanding of the whisker growth process," in IPC Annu. Meeting, Nov. 2002, pp. S08-3-1-S-8-3-5.

Kumar, G. Achut, , "Lead-Free Matte-Sn Termination for Lead Frame Packages" , IPC-JEDEC Conference, Taipei, Taiwan Dec. 2002 pag 38.

Shangguan, D, , Managing Compatibility Issues For Transitioning To vol. Manufacturing For Lead-Free Pcb Assembly. Keynote session presentation. Proceedings of 2003 International Printed Circuit & Electronics Assembly Fair Technical Conference and

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xxxx IPC Midwest Show

Chris Hunt, x "Tin Allotropic Transformation ~ Tin Pest," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

Ning-Cheng Lee, x "A Compliant and Creep Resistant SAC-Al(Ni) Alloy," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

Lei Nie, Michael Osterman, Michael Pecht, Fubin Song, Jeffrey Lo, and Ricky Lee, x "Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

M. Brizoux, A. Grivon, P. Snugovsky, and B. J. Smith, x "Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

Hikari Murai, x "The Evaluation of CAF Property for Narrow TH Pitch PCBs," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

H. K. Lee, Y. C. Chu, M. H. Chun, S. H. Jeon, and K. H. Kim, x "A Study of Reliability between Solder Alloy and Pad Materials," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

John Andresakis, Jin Hwang, and Pranabes Pramanik, x "Embedded Capacitor Material and Design Considerations for High Frequency Modules," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. .

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IPC Printed Circuits Expo
http://www.pwbrc.org/ GIT main TK7868.P7I63X Lexmark TK7868.P7I63
(>=20 items found as of 4/19/2009)
94,98 checked 4/4/2008 priority

," IPC Expo, San Diego, CA, May 2-4, 1995, pp. .

," IPC Printed Circuits Expo, San Jose, CA, Mar. 3-7, 1996, pp. .

," IPC/SMTA Electronics Assembly Expo 1998, Providence, RI, Oct. 24-29, 1998, pp. .

," IPC Printed Circuits Expo 1999, Long Beach, CA, Mar. 14-18, 1999, pp. .

," Printed Circuits Expo 2000, San Diego, CA, Apr. 2-6, 2000, pp. .

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IPC Review
(>=20 items found as of 5/24/2009)
Dec05-Sept06,Nov06-Apr09 checked 5/24/2006 priority

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IPC Works '99
http://www.pwbrc.org/
(12 items found as of 4/19/2009)
checked 4/4/2009 priority

," IPC Works '99, Minneapolis, MN, Oct. 23-28, 1999, pp. xx-xx.

R. Schetty, "Minimization of tin whisker formation for lead-free electronics finishing," in Proc. IPC Works Conf. Miami, FL, 2000, pp. S-02-R-S-02-3-6.

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IPC/iNEMI Reliability Summit
(1 items found as of 4/19/2009) priority

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IPC/JEDEC Global Conference on Lead-Free Reliability and Reliability Testing for RoHS Lead-Free Electronics

Cavanaugh, David, "Impact of Surface Finish Choice on Reliability Test Results: Data Analysis of HALT Testing on the Reliant TV-3" (IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, Apr. 10-12, 2007)

de Sousa, Isabel, Henderson, Donald W., Patry, Luc, and Martel, Robert, donwhend@us.ibm.com. "Characterization and Reliability of Increased Cu Levels in SAC Alloys" IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, Apr. 10-12, 2007)

Faure, Christiane, Elkins, Mark, Bath, Jasbir, Unterborn, Aaron, Mainwaring, Stephen, Willie, Dennis, Zhou, Xiang, and Watson, Doug, christianefaure@fr.slr.com. "Shrinkage Hole Effect on Lead-Free Pin Through-Hole Solder Joint Reliability" (IPC/JEDEC Global Conference on Lead-Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, Apr. 10-12, 2007)

Ma, L., Donaldson, A., Walwadkar, S., Hsu, I., alan.w.donaldson@intel.com. "Reliability Challenges of Lead-Free (LF) Plated Through-Hole (PTH) Mini-pot Rework" (IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, Apr. 10-12, 2007)

Nishikawa, Hiroshi, Miki, Kousuke, and Takemoto, Tadashi, "Evaluation of Sn-3.5Ag Based Solder Joint by Ball Impact Test" (IPC/JEDEC Global Conference on Lead-Free Reliability and Reliability Testing for RoHS Lead-Free Electronics, Boston, MA, Apr. 10-12, 2007)

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IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics
(12 items found as of 4/19/2009)
08 checked 9/20/2008 priority

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It's Not Easy Being Green
(9 items found as of 4/19/2009)
09 checked 4/26/2009 priority

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56th IWCS Conference - Proceedings of the International Wire and Cable Symposium
http://ecadigitallibrary.com/conference.php?cid=17
(6 items found as of 7/10/2009)
05-08 checked 7/10/2009 priority

(new references 12/30/2008)
Kiddoo, David B., .Cable component material innovations for stringent fire safety and environmental compliance requirements 56th IWCS Conference - Proceedings of the International Wire and Cable Symposium, Inc., IWCS 2007, 56th IWCS Conference - Proceedings of the International Wire and Cable Symposium, Inc., IWCS 2007, 2007, p 204-211

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Izvestiya Vysshikh Uchebnykh Zavedenii
AU rbd QA1.I9941 FSU storage 530.5I99Y GIT storage QA1.A3493 LH closed MST depos 510.5R92 OkSU main 510.5S7295 PU hicks 510.5So89 SDSU QA1.A3493 SIUC storage 54135-5101 SIUE storage TTU UAr mullins QA1.A3493 UC math QA1.A462 UCSD s&e QA1.S732 UD remote UH QA1.A3493 UK king QA1.R7813 UL ekstrom QA1.A3493 UM shapiro QA1.R973 UCF online & main QA1.S684 WSU sci

D. M. Vasil"ev and V. K. Glazunova, "The X-ray analysis of residual stresses in tin coatings," Izv. Vyssh. Uchebn. Zaved., Chern. Metall., vol. 9, no. 15, pp. 151-154, 1965.

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JJJJ

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Jahrbuch der Kaiserlich-Koniglichen Geologischen Reichsanstalt
MST depos 554.36Au79j UM shapiro QE266.A3 & buhr QE266.A3 UOk geol QE266.A165
(1 items found as of 4/19/2009)

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Jane's Defence Weekly
CPL washington IU wells UF530.J35 OSU online & main UF530J36 SDSU UF530.J35 UAr mullins UF530.J35 UCSD ssh UF530.J35 UK young UF530.J35 UM online
(1 items found as of 4/19/2009)

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Japanese Journal of Applied Physics
MST online OkSU online OSU online & sel TA4J34 SDSU online SIUC online SIUE lovejoy UAr online UCSD online UK online & chem/phys QC1.J39 UM online & aael QC1.J344 UOk online UTo online & carlson WSU sci
(10 items found as of 6/25/2009)
v46#11,v47#8 checked 6/25/2009

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JEDEX

Vo, N, , "Whisker Growth Evaluations of Tin-Based Plating Finishes", JEDEX 2002 Conference, Santa Clara, CA, Mar. 25, 2002

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Nth Joint FAA/DoD/NASA Aging Aircraft Conference
http://www.agingaircraftconference.org/ SIUE lovejoy microfiche NAS1.55:208982 UOk gov NAS1.55:208982/PT1- SDSU gov NAS1.55:208982/PT1 UCSD s&e TL671.1.J65 UTor aero NASA CP 1999 208982
(4 items found as of 4/19/2009)
97,06 checked 10/5/2009 priority

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JOM
http://doc.tms.org/ MST wilson TN1.A513 NWU online & sci 669.05.86 OkSU online OSU online & TN1J62 PU hicks 669.05J82 SDSU online SIUC online UAr mullins per microfilm TN1.A513 UC eng TN1.J68 & depository TN1.J68 UCSD online UE microform UIC online & warehouse TN1.A513 UK online & eng TN1.A513 UL kersey TN1.A513 UM online & aael TN1.J87 UOk online USC online UT online & hodges TN1.A513
(>=20 items found as of 12/28/2009)
v43#6-v61#10,v61#12 checked 12/28/2009

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Journal of Adhesion Science and Technology
OkSU online OSU online PU online & eng 547.7P7695 SDSU online SIUC online UA online UC online & eng QC183.J65 UCSD online UIC online UK online & eng QC183.J650 UM aael QD381.9.S97P659 UOk online USD online UT online UTo online WSU sci
(>=20 items found as of 12/28/2009)
v1#1-v23#16 all checked 12/28/2009

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Journal of Alloys and Compounds
Journal of the Less-Common Metals
IU bloomington alf TN1.J88 MST online NWU online & sci 669.05J861 OkSU online OSU online & sel TN1J7 & sel TN1J72 PU hicks 669.9J82 SDSU online SIUC online SIUE storage UC online & phys N1.J7 UCSD online UD online UIC online & sci UK online sd & chem/phys TN1.J7 & king TN1.J7 UL online & kersey TN1.J7 UM online & shapiro TN1.J89 & buhr TN1.J89 UOk online UT online & hodges TN1.J7 & closed TN1.J7
(>=20 items found as of 12/28/2009)
v330#1-v489#2 articles in press to Dec. 28, 2009 checked 12/28/2009

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Journal of the American Chemical Society
IU online & bloomington chem QD1.A5 MST online NWU online & sci 540.5A51 OCU online OkSU online OSU online & sel QD1A54 PU online & chem 540.6Am3j & hicks 540.5Am32 & 540.5J816 SDSU online SIUC online SIUE online UAr online UC online & chem QD1.A5 UCSD online UD online & roesch UE online UIC online & sci UK chem/phys QD1.A5 UL online & kersey QD1.A5 UM online & aael QD1.A512j UOk online USD online UT online & hodges QD1.A5
(1 items found as of 4/19/2009)

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Journal of Analytical and Applied Pyrolysis
AU online FSU online GIT main QD281.P9J68X IU online LH closed MST online NWU online OkSU online OrSU online OSU online PU online RU online SDSU online UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UM online UMC online UNF online UOk online USF online USU online UT online UTo online WrSU online
(1 items found as of 4/19/2009)

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Journal of Analytical Atomic Spectrometry
AU online FIT evans GIT online IU online LH closed MST online NWU online OkSU online OrSU online OSU online PU chem 543.085J826 RU online SDSU online SIUC online UAr online UC online UCI online UCSD online UF online UIC online UIUC online UK online UM online & shapiro QD96.A8A611 UMC online UOk online USF online UT online UTA online UTo online WrSU online
(1 items found as of 4/19/2009)
v22#10 checked 1/23/2009

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Journal of Applied Electrochemistry
IU online MST online NWU online OkSU online OSU online & sel TP250J68 PU online & eng 660.29705J826 SDSU online SIUC online UAr online UC online & eng TP250.J68 UCSD online UD online UIC online UK online & chem/phys TP250.J68 UL kersey TP250.J68 UM online & buhr QD551.J86 UOk online USD online UT online & hodges TP250.J68
(1 items found as of 4/19/2009)

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Journal of Applied Physics
KYVL Lexmark MST online MSU eng QC1.J83 NWU online & sci 530.5J86 OkSU online OSU online & sel QC1P5742 PU online & phys 530.5P564 & eng 538.06C76p SDSU online SIUC online SIUE online UAr online UC online & geo QC1.P6 UCSD online UE UIC online & periodical UK online & chem/phys QC1.J83 UL kersey QC1.J83 UM aael QC1.J863 USD online UT online & hodges QC1.J83 UTo online & carlson & depos WSU online & sci
(>=20 items found as of 4/19/2009)

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Journal of Applied Polymer Science
LU gray TP156.P6J6 MST wilson TP156.P6J6 OkSU online RU online & fondren TP156.P6J6 SDSU online SIUC online SIUE lovejoy TTU online UAr online UCI online UCSD online UH online UM online & aael TP156.P6J86 & aael QD471.J85 UOk online USD online UT online UTo online & carlson & depos UWa online VU online WSU online & sci
(15 items found as of 10/23/2009)
v56#7-v115#2 checked 10/23/2009 low priority

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Journal of Applied Surface Finishing
(1 items found as of 5/25/2009) priority

Brooman, Eric W., "Nickel- and Cobalt-based Nanocomposite Chromium Coating Alternatives," Journal of Applied Surface Finishing, vol. 1 no. 1, pp. xx-xx, Jan.-Mar. 2006.

Lal, S., and Moyer, T. D., "Tin-Bismuth Finishes and the Phenomenon of Whiskers," Journal of Applied Surface Finishing, vol. 1 no. 1, pp. xx-xx, Jan.-Mar. 2006.

Olsen, K. P., and Ivey, D. G., "Pulsed Electrodeposited Sn-Cu Alloys for Use as Pb-Free Component Finishes in Microelectronic Applications," Journal of Applied Surface Finishing , vol. 1 no. 1, pp. xx-xx, Jan.-Mar. 2006.

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Journal of Beijing University of Technology
Beijing Gongye Daxue Xuebao
UCSD online UOk online UTo online UTor online
priority

(new references 12/30/2008)
Xu, Dong-Xia, Lei, Yong-Ping, Zhang, Bing-Bing, Li, Guo-Wei, Xia, Zhi-Dong, Guo, Fu, Shi, Yao-Wu .Preparation and study of a VOC-free, no-clean soldering flux Beijing Gongye Daxue Xuebao / Journal of Beijing University of Technology, v 33, n 12, December, 2007, p 1320-1325 Language: Chinese

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Journal of Central South University
Zhongnan Daxue Xuebao
LH closed OSU sel TN600.J68 UCSD online UOk online UTor online
priority

(new references 12/30/2008)
Han, Zong-Jie, Ju, Jin-Long, Xue, Song-Bai, Fang, Dian-Song, Wang, Jian-Xin, Yao, Li-Hua Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering Zhongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Central South University (Science and Technology), vol. 37 no. 2, Apr. 2006, p 229-234 Language: Chinese

Li, Xiao-Yan, Yang, Xiao-Hua, Wu, Ben-Sheng, Yan, Yong-Chang .Evolution of intermetallic compounds in SnAg and SnAgCu lead-free solder joints during aging Zhongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Central South University (Science and Technology), v 38, n 1, February, 2007, p 30-35 Language: Chinese

Jiang, Li, Yang, Ke-Ling, Zhou, Jie-Min, Xiang, Ke, Wang, Wen-Jie .In situ measuring electronic-resistance strains of Sn-.5Ag solder joints creep Zhongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Central South University (Science and Technology), v 39, n 1, February, 2008, p 80-85 Language: Chinese

-------------------------------------------------------
Journal of Chemical & Engineering Data
Journal of Chemical and Engineering Data
AU online CBU FSU online GIT online LH closed MST online NWU online OCU online OGI online OrSU online OSU online PU online SDSU online SIUC online SIUE lovejoy SPU online SU online TTU online UAB online UAH n1 UAr online UC online UCF online UCI online UCSD online UD online UDe online UE online UF online UIC online UK online UM online & aael TP1.J867 UMC online USD online USF online USU online UT online UTA online UTo online WrSU online
(5 items found as of 4/19/2009)
checked 6/23/2008

-------------------------------------------------------
Journal of Chemical Education
CBU 540.7M6 Lexmark MST online NWU sci 540.28J86 & 540.78T343 OCU beam OkSU online OSU online & sel QD1J865 PU chem 540.5J82 SDSU online SIUC online SIUE online TTU UAr online UC chem QD1.J9 UCSD online UD roesch UE online UIC online & sci UK online & chem/phys QD1.J93 UL kersey QD1.J93 UM online & aael QD3.J86 UMe online & chem USD online UT online & hodges QD1.J93
(0 items found as of 4/19/2009)

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Journal of the Chemical Industry (USSR)

Ivanova and Fedorchenko, J. Chem Ind. (USSR) 18, No. 15-16, 40 (1941).

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Journal of Chemical Industry and Engineering (China)
LH closed
(1 items found as of 4/19/2009)

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Journal of Chemical Physics
CBU IU online & bloomington chem QD1.J836 MST online NWU online & sci L541.05J863 OkSU online OSU online & sel QC1J87 PU online & chem 530.5J821 & phys 530.5J821 SCSU online SIUC online SIUE online TTU online UAr online UC online & chem QD1.J94 & phys QD1.J94 UCSD online UD online & roesch UE UIC online & sci UK chem/phys DQ1.J94 UL kersey QD1.J94 UM online & aael QD1.J867 UMe online & chem UOk online USD online UT online & hodges QD1.J94
(3 items found as of 4/19/2009)

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Journal of the Chinese Institute of Engineers
Chung-Kuo Kung Ch'eng Hsueh K'an
Zhongguo gong cheng xue kan (Online) AU rbd TA4.C3578 BYU hbll TA1.C48x IU online LH closed MST wilson TA1.C45 OkSU online OrSU valley TA1.C44 OSU sel TA4.C45 PU eng 620.005C472 & hicks 620.005C472 SDSU online UAr online UC eng TA4.C3478 UCI sci drum TA1.C387 UCSD online UDe online UF online UIUC eng 620.5JOC UM aael TA4.C35781 UMC online UOk online USU merrill-cazier UT hodges TA4.C3578 UTo online UTor eng TA1.C47
(2 items found as of 8/14/2009)
v1#1-v32#5 all checked 8/14/2009 priority

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Journal of Cleaner Production
AU online FSU online GIT online IU online LU gray NWU online OGI online OkSU online OSU online PU online RU online SDSU online UC online UCF online UCI online UCSD online UDe online UF online UIC online UM online UMC online UNF online UOk online USF online USU online UT online UTo online UTor online UWa online WrSU online
(>=20 items found as of 10/22/2009)
v1#1-v17#18 Articles in Press to Apr. 15, 2009 checked 10/22/2009 low priority

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Journal of Computational and Theoretical Nanoscience
NWU sci L620.505J86 PU online RU online UC biol T174.7.J676 UM aael T174.7.J676
(3 items found as of 5/8/2009)
v1#1-v5#12 checked 5/8/2009 priority

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Journal of Crystal Growth
MST online OkSU online OSU online & sel QD921J6 SDSU online SIUC morris 53065-5481 UAr online UCSD online UK online sd & eng QD921.J6 UL online & ekstrom QD921.J67 UM online sd UOk online UT online & hodges QD901.J68
(6 items found as of 4/19/2009)

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Journal of Dalian University of Technology
Dalian li gong da xue zhu ban
LH closed UCSD online UOk online UTor online
(1 items found as of 4/19/2009) priority

(new references 12/29/2008)
Liu, Xiao-Ying, Ma, Hai-Tao, Wang, Lai .Effect of super-fine oxide powders on mechanical properties and microstructures of Sn-58Bi Dalian Ligong Daxue Xuebao/Journal of Dalian University of Technology, v 48, n 1, January, 2008, p 51-57 Language: Chinese

Zhao, Ning, Wang, Jian-Hui, Pan, Xue-Min, Ma, Hai-Tao, Wang, Lai .Effect of Cu content on microstructure and interfacial reactions of Sn-based lead-free solders Dalian Ligong Daxue Xuebao/Journal of Dalian University of Technology, v 48, n 5, September, 2008, p 661-667 Language: Chinese

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Journal of Electroanalytical Chemistry
MST online OkSU online OSU online & QD115A1J6 SDSU online SIUC morris 51557-5403 SIUE lovejoy UAr online UCSD online UK online sd & chem/phys QD551.J6 UL kersey QD551.J6 UMe chem UOk online UT online
(1 items found as of 4/19/2009)

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Journal of Electroceramics
AU online FSU online GIT online IU online LH closed MST online OGI online OkSU online OrSU online OSU online PU online SDSU online SIUC online SU online UC online UCF online UCI online UCSD online UD online UDe online UF online UIC online UIUC online UK online UM online UMC online UOk online USD online USF online UTA online WrSU online
(3 items found as of 3/5/2010)
v13#1-v13#3,v22#1-v24#1 Online First to Mar. 4, 2010 checked 3/4/2010

*** here for UK *** --------------------------------------------------------
Journal of the Electrochemical Society
MST online OkSU online OSU online & sel TP250E5 SDSU online SIUC online SIUE online TTU UAr online UC eng TP250.E5 UCSD online UE UK online sd & chem/phys TP250.E595 UL kersey TP250.E542 UM online & aael TP250.E37 UMe chem UOk online UT online
(9 items found as of 4/19/2009)

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Journal of Electronic Materials
http://www.tms.org/pubs/journals/JEM/jem.html IEEE XPLORE (v23#1-) OSU sel TK7871J66 PU eng 621.38105 J826 SDSU online TTU online UAr online UCSD online UIC daley periodicals UK online & eng TK7871.J66 UL kersey TK7871.J66 UM online & aael TK7871.J86 USD online
(many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 11/9/2009)
v12#1-v38#11 online First to July 9, 2009 checked 11/9/2009

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Journal of Electronic Packaging
American Society of Mechanical Engineers, EEP
ASME Journal of Electronic Packaging
CBU GIT online & main-6e TK7870.J68X MST online NWU online OkSU online OSU online & TK7870J58 PU online & eng 621.381046J826 SDSU TK7870.J656 SIUC online SIUE lovejoy TTU online UAB online & sterne TK7870.J656 UAr online UCF online & main TK7870.J656 UCI online & sci TK7870.J656 UCSD online UF online & sci TK7870.J656 UH online UIC online & daley TK7870.J656 UK online & eng TK7870.J656 UL kersey TK7870.J656 UM online UOk online UT online VU online & TK7870.J656
(>=20 items found as of 12/28/2009)
v111#1-v131#4 checked 12/28/2009

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Journal of Electronics Manufacturing
OkSU online OSU online SDSU online UAr online UCSD online UK online UOk online USD online UT online UTo online
(9 items found as of 12/28/2009)
v9#1-V11#2 checked 12/28/2009

Watanabe, Itsuo, Takemura, Kenzo, Shiozawa, Naoyuki, Watanabe, Osamu, Kojima, Kazuyoshi, Ohta, Tomohisa, "Flip-chip interconnection to various substrates using anisotropic conductive adhesive films," Journal of Electronics Manufacturing, vol. 5 no. 4, Dec. 1995, pp. 273-276.

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(new source 1/6/2010)
Journal of Environmental Management
UK online

(new reference 1/6/2010)
Townsend, T., Musson, S., Dubey, B., Pearson, B. (2008) "Leachability of printed wire boards containing leaded and lead free solders" Journal of Environmental Management. 88, 926-931..

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Journal of Environmental Quality
MST online OkSU online OSU faes S1J863 SDSU online SIUC online SIUE online TTU online UAr online UCSD online UE UK young S1.J780 UL ekstrom S1.J78 UMe law UOk online USD online UT online
(1 items found as of 4/19/2009)
v5#4 checked 4/4/2008

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Journal of Environmental Science and Health - Part C
GIT online & main RC268.5.J68 MST online OkSU online OSU online PU life 301.3105En95c SDSU online SIUC online UAr online UC sw depos TD172.E564 UCF online UCI online UCSD online UK online UM online & aael RA565.A1J861 UOk online USD online UT online UTo online
(1 items found as of 4/19/2009)

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Journal of Experimental and Theoretical Physics
Zhurnal eksperimentalnoi i teoreticheskoi fiziki
AU online BYU lee QC1.Z472 FIT online FSU online GIT online IU b-swain QC1.S73 LH closed LU gray QC1.Z5 MST wilson QC1.Z472 MSU remote QC1.Z472 & sci QC1.Z472 NWU online & sci L530.5Z63X OGI online OrSU online OSU online & sel QC1S67902 PU online & phys 530.5So1E & hicks 530.5Z58p & 530.6R92 RU online SDSU online SIUC morris 54139-5302 & storage 530.5Z63 SU online UAb sterne QC1.Z472 UAh online UAr storage QC1.Z472 UC online UCB mathphysics QC1.Z472 & pascal QC1.Z472 UCF online UCI online UCSD online UD online UDe online UF online UIC online & warehouse QC1.Z47 UIUC online UK online UL online & kersey QC1.Z472 UM online & shapiro QC1.Z62 & buhr QC1.Z62 UMC online UOk bizzell QC1.Z472 USD online USF online UT hodges QC1.Z472 UTA online UTo online VU online & sci QC1.Z472 WrSU online WSU sci

A. Komar and K. Ivanov, Exptl. Theoret. Phys. (USSR) {Zhurnal Eksperimentalnoi i teoreticheskoi Fiziki} 6, 256 (1936).

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Journal of Failure Analysis and Prevention
OkSU online SDSU online UCI online UCSD online UOk online USD online UTor online UWa online
(1 items found as of 10/23/2009)
v1#1-v9#5 Online First to Oct 22, 2009 checked 10/23/2009 low priority

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Journal of the Franklin Institute
CBU MST online NWU online OkSU online OSU online & depository T1.F83 PU online & hicks 605J82 SDSU online SIUC storage 52526-6002 SIUE storage TTU UAr storage T1.F8 UC eng T1.F8 UCSD online UE UIC online & daley T1.F8 UK online sd & young T1.F8 & S2 Reel 282-287 UL kersey T1.F8 UM online & aael T1.F834j UOk online USD online UT online & hodges T1.F8
(1 items found as of 4/19/2009)

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Journal of Functional Materials
Gongneng Cailiao
priority

(new references 12/29/2008)
Effect of cooling rates on the microstructure and mechanical behavior of Sn-Ag solder Shen, Jun; Gao, Hou-Xiu; Liu, Yong-Chang; Wei, Chen; Yang, Yu-Qin Gongneng Cailiao/Journal of Functional Materials, vol. 36 no. 1, Jan. 2005, pp. 47-49 Language: Chinese

Liu, Peng, Gao, Yuan, Guo, Fu, Lei, Yong-Ping, Xia, Zhi-Dong, and Shi, Yao-Wu, "Progress and research in lead-free composite solder," Journal of Functional Materials, vol. 37 no. supplement, pp. 823-826, Sept. 2006.

Zhang, Jin-Song, Li, Juan-Juan, Wu, Feng-Shun, Zhu, Yu-Chun, An, Bing, Wu, Yi-Ping .Behavior of whisker growth from the pure Sn coating under the temperature cycling condition Gongneng Cailiao/Journal of Functional Materials, v 38, n 11, November, 2007, p 1837-1840 Language: Chinese

Li, Wen-Bu, Wang, Luo-Li, Yu, Jie, Wang, Chen .Study on preparation and properties of anisotropic conductive adhesive film Gongneng Cailiao/Journal of Functional Materials, v 39, n 1, January, 2008, p 57-59+63 Language: Chinese

Zhang, Zhi-Hao, Shi, Li-Yi, Dai, Kai, Yu, Xing-Xin, Zhu, Wei-De .Study on preparation and properties of a new nano-size conductive adhesive Gongneng Cailiao/Journal of Functional Materials, v 39, n 2, February, 2008, p 337-340 Language: Chinese

Xu, Dong-Xia, Lei, Yong-Ping, Zhang, Bing-Bing, Zhu, Lei, Xia, Zhi-Dong, Shi, Yao-Wu, Guo, Fu .Wettability evaluation of new soldering fluxes for Sn-Zn lead-free solder Gongneng Cailiao/Journal of Functional Materials, v 39, n 4, April, 2008, p 701-704 Language: Chinese

Lei, Gang, Yang, Wen-Bin, Wei, Ming, Zhou, Yuan-Lin, Xie, Chang-Qiong, He, Fang-Fang, Zhang, Bing-Jie, Zhang, Xin-Chao .Study on electroless Ni-P plating of glass fiber Gongneng Cailiao/Journal of Functional Materials, v 39, n 7, July, 2008, p 1128-1130 Language: Chinese

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Journal of Functional Materials and Devices
Gongneng Cailiao yu Qijian Xuebao

Zhang, Dong-Mei, Ding, Gui-Fu, Wang, Hong, Jiang, Zheng, Yao, Jin-Yuan Low temperature hermetic bonding process based on electrodeposited Sn/Bi alloy Gongneng Cailiao yu Qijian Xuebao/Journal of Functional Materials and Devices, v 12, n 3, June 2006, p 211-214 Language: Chinese

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Journal of Hazardous Materials
FSU online & dirac 660.5J8633 GIT online & main T55.3.H3J68 IU online MST wilson T55.3.H3J68 OkSU online OSU online PU online & eng 628.532D433 & eng 363.1705J826 SDSU online SIUC online UAr online UC online & eng T55.3.H3J68 & sw depos T55.3.H3J68 UCF online UCI online & sci T55.3H3J6 UCSD online UD online UK eng T55.3.H3J68 UM online & aael T55.3.H3J86 UOk online UT online & hodges T55.3.H3J68 UTo online & carlson UTor online UWa online
(15 items found as of 8/13/2009)
v136#3,v139#3,v161#1-vv166#3,v168#1-v170#3 articles in press to May 13, 2009 checked 10/23/2009 low priority

(new reference 1/6/2010)
Vann, Kevin, Musson, Stephen, and Townsend, Timothy, "Evaluation of a modified TCLP methodology for RCRA toxicity characterization of computer CPUs," Journal of Hazardous Materials, vol. 129 no. 1-3, pp. 101-109, Feb. 28, 2006.

(not at UK) -------------------------------------------------------
Journal of Hebei University of Science and Technology
Hebei ke ji da xue xue bao
LH closed UCSD online UOk online

Hua, Man (Material Sci. & Eng. Coll., Henan Sci. & Technol. Univ., Luoyang, China); Zhang Ke-Ke; Yang Jie; Cheng Guang-Hui; Huang Jin-Liang Present situation of microjoining lead-free solder and application of rare earth Journal of Hebei University of Science and Technology, v 26, n 1, Feb. 2005, p 10-13

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Journal of Henan University of Science and Technology (Natural Science)
Henan Keji Daxue Xuebao (Ziran Kexue Ban)
UCSD online UOk online

Influence of Ag on Microstructure and Mechanical Properties of Sn-57Bi Lead-Free Solder Henan Keji Daxue Xuebao (Ziran Kexue Ban) / (Journal of Henan University of Science and Technology) (Natural Science) (China), vol. 25, pp. 10-13, June 2004

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Journal of High Temperature Society of Japan
Koon Gakkai shi
LH closed OkSU online
(1 items found as of 4/19/2009)

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Journal of Huazhong University of Science and Technology (Natural Science Edition)
Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)
LH closed UOk online UTo online UTor online
priority

(new references 12/30/2008)
Wu, Fengshun, Zhang, Weigang, Zhang, Jinsong, Wu, Yiping .Four-point probe measurement of electromigration failure Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition), v 35, n 6, June, 2007, p 85-88 Language: Chinese

Zhang, Jinsong, Zhu, Yuchun, Li, Juanjuan, Wu, Yiping .Relations between the chemical composition of Sn finish and Sn whisker growth under temperature cycling Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition), v 36, n 3, March, 2008, p 24-27 Language: Chinese

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Journal of Hunan University Natural Sciences
Journal of Hunan University (Natural Sciences)
Hunan Daxue Xuebao
UOk online UTo online UTor online
priority

(new references 12/30/2008)
Yang, Shi-Qiang, Lei, Xiao-Juan, Li, Yuan-Shan, Chen, Zhen-Hua .Microstructure and physical properties of Sn-20Bi-X lead-free solders Hunan Daxue Xuebao/Journal of Hunan University Natural Sciences, v 34, n 3, March, 2007, p 49-52 Language: Chinese

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Journal of Industrial Ecology
CPL washington IU online KYVL MST online OkSU online OSU online & sel TS161.J68 PU online & eng 658.408J826 SDSU online SIUC online UAr online UC online & daap TS1.J68 UCSD online UIC online UK online UM online & shapiro TS161.J681 UOk online USD online UT online
(17 items found as of 12/28/2009)
v3#1-v13#4 checked 12/28/2009

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Journal of the Institute of Metals
MST depos 671In7 NWU sci 660.6I591j OkSU stillwater 669.06I59j OSU sel TN1I5 PU hicks 669.06In7 & 669.005M57 SDSU compact TN1.I57 SIUC morris 54571-6691 TTU UAr mullins per-microfilm TS200.J67 UC eng TS200.I5 & sw depos TS200.I5 UCSD s&e TN1.I605 UD roesch UIC warehouse TS200.I5 UK eng TS200.I5 UM buhr TN1.I59j UOk bizzell TS200.I5 UT hodges closed TS200.I5 UTo carlson WSU sci
(2 items found as of 4/19/2009)

Brinson and Moore, J. Inst. Metals, 1951, 79, 429. *** not applicable ***

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Journal of the Japan Institute of Energy
Nihon Enerugi Gakkaishi
IU online LH closed NWU online OSU online SDSU online SU online UF online UK online UMC online
(0 items found as of 6/28/2009)

v86#1-v88#7 checked 10/5/2009 priority

(new references 12/31/2008)
Fukuda, Teruo .European Union's System to reduce environmental impact of Electrical and Electronic Equipment Nihon Enerugi Gakkaishi/Journal of the Japan Institute of Energy, v 80, n 12, 2001, p 1122-1130 Language: Japanese

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Journal of Japan Institute of Light Metals
Keikinzoku
AU online LH closed MST online NWU online OSU online SDSU online SU online UCB online UCI online UCSD online UDe online UK online UMC online VU online
(7 items found as of 6/28/2009)
v44#1-v59#4 checked 6/28/2009

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Journal of the Japan Institute of Metals
Journal of Japan Institute of Metals
Nihon Kinzoku Gakkai
Nihon Kinzoku Gakkaishi
Nippon Kinzoku Gakkaishi
GIT main TN4.N48X LH closed MST depos 20.1605N627 NWU sci L669.06J35n PU eng 669.06J27j & hicks 669.06J27j RU fondren TN4.N5 UC eng TN4.J6 UF online UH TA459.N54 UK online UTor eng TN4.N45
(6 items found as of 4/19/2009)
v38#10,v53#3,v54#1-v54#4,v58#1-v68#12 checked 4/16/2009 priority

(new references 2/28/2009)
Hirohisa Matsuki, Hiroshi Ibuka, and Hiroyasu Saka, x "A TEM Observation of Solder Joints of an Electronic Device," Journal of the Japan Institute of Metals, vol. 64 no. 3, pp. 213-217, 2000.

Fumie Seki, x "Detection of High Density of Cube Oriented Grains in a pure Aluminum Sheet for Capacitor," Journal of the Japan Institute of Metals, vol. 64 no. 3, pp. 218-219, 2000.

Yamaguchi, Atsushi, Yamashita, Yuhei, Furusawa, Akio, Nishida, Kazuto, Hojo, Takashi, Sogo, Yosuke, Miwa, Ryoko, Hirose, Akio, Kobayashi, Kojiro F, Properties of Sn-Ag-Bi-In Solder Joints Journal of the Japan Institute of Metals. Vol. 69, no. 1, pp. 139-146. Jan. 2005

Interfacial reaction layer and reliability of CSP solder joints using Sn-8Zn-3Bi solder and Ni/Au planting pad Yamaguchi, Atsushi; Furusawa, Akio; Nishida, Kazuto; Iwanishi, Hiroaki; Hojo, Takashi; Sogo, Yosuke; Hirose, Akio; Kobayashi, Kojiro F. Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, vol. 69, n 1, Jan. 2005, pp. 132-138 Language: Japanese

Properties of Sn-Ag-Bi-In solder joints Yamaguchi, Atsushi; Yamashita, Yuhei; Furusawa, Akio; Nishida, Kazuto; Hojo, Takashi; Sogo, Yosuke; Miwa, Ryoko; Hirose, Akio; Kobayashi, Kojiro F. Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, v 69 no. 1, Jan. 2005, pp. 139-146 Language: Japanese

Machida, Junichi, Esaka, Hisao, Tamura, Manabu, Shinozuka, Kei, "Characterization of coupled-zone in Sn-Cu binary eutectic alloys using unidirectional solidification," Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, vol. 70 no. 1, Jan. 2006, p 73-79 Language: Japanese

Yamaguchi, Masahiko (Graduate School of Engineering, Tohoku University); Ichitsubo, Tetsu; Matsubara, Eiichiro; Kimura, Hisamichi; Sasamori, Kenichiro; Irie, Hisao; Kumamoto, Seishi; Anada, Takaaki "Atomizing effect on Sn-Zn based solder alloy," Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, vol. 70 no. 2, Feb. 2006, pp. 162-165 Language: Japanese.

Matsuda, Kenji, Mizuhira, Manabu, Yamamoto, Nobuo .High-sensitive and nondestractive determination of trace toxic metals in brass by using energy dispersive X-ray fluorescence spectrometer with 3-dimentional polarization optics Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, v 70, n 2, February, 2006, p 107-109 Language: Japanese

Hayashida, Yoshitou (Tamura Kaken Corporation); Takahashi, Yoshiyuki; Ohno, Takao; Shohji, Ikuo "Whisker-free Pb-free solder through alloying," Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, vol. 70 no. 3, Mar. 2006, pp. 220-225 Language: Japanese.

Kawamoto no. aoyuki, Murakami, Yasukazu, Shindo, Daisuke, Kim, Keunsoo, Suganuma, Katsuaki Advanced transmission electron microscopy on silver-based conductive adhesive Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, vol. 70 no. 4, Apr. 2006, p 384-388 Language: Japanese

Nishikawa, Hiroshi, Piao, Jin Yu, Takemoto, Tadashi Microstructure of interface between Sn-Cu solder with Ni and Cu plate Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, vol. 70 no. 5, May 2006, p 427-433 Language: Japanese

Shishido, Itsuroh, Matsuo, Akihiko, Toyoyama, Hirokazu, Mizuno, Masataka, Araki, Hideki, Shirai, Yasuharu Influence of lattice defects introduced in copper during electroplating on the interlayer reaction to Sn-3.0Ag-0.5Cu lead free solder Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, vol. 70 no. 7, July 2006, p 548-553 Language: Japanese

Okumura, Tomohiro, Saitoh, Mitsuo, Nishikawa, Kazutaka, Furusawa, Akio, Suetsugu, Kenichiro .Atmospheric pressure plasma treatment and non-flux lead-free-soldering of Cu wire and strand Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, v 71, n 2, February, 2007, p 304-311 Language: Japanese

Tokuda, Tarou, Suzumura, Fumihiro, Ohtani, Kozo, Sato, Kimitoshi, Kido, Mitsuo .Application of soldering tips on ceramics/metal composite Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, v 71, n 3, March, 2007, p 330-335 Language: Japanese

Murakami, Koji, Hino, Makoto, Takamizawa, Masao, Nakai, Kiyomichi .Mechanism of generation and growth of whiskers on tin electroplating Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, v 72, n 3, March, 2008, p 168-175 Language: Japanese

Takamizawa, Masao, Naka, Toshihide, Hino, Makoto, Murakami, Koji, Mitooka, Yutaka, Nakai, Kiyomichi . Effect of lead co-deposition on the whisker growth on electrodeposited tin film Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, v 72, n 3, March, 2008, p 229-235 Language: Japanese

Tohei, Tomotake, Shohji, Ikuo, Yoshizawa, Keisuke, Nishimoto, Masaharu, Kawano, Takayuki, Mizutani, Yumiko, Ohsaki, Yoshihiko .Thermal fatigue life evaluation of lead-free solder joint of chip size package with underfill Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, v 72, n 3, March, 2008, p 244-248 Language: Japanese

Okamoto, Naoki, Fujii, Yuko, Kurihara, Hiroaki, Kondo, Kazuo .Effect of the structures within the substrates for Sn whisker formation Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, v 72, n 6, June, 2008, p 413-419 Language: Japanese

Miyauchi, Yoshiko, Esaka, Hisao, Tamura, Manabu, Shinozuka, Kei .In-situ observation of microstructure evolutions during solidification of Sn-Cu alloys using a laser confocal microscope Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, v 72, n 6, June, 2008, p 440-447 Language: Japanese

Miyauchi, Yoshiko, Esaka, Hisao, Tamura, Manabu, Shinozuka, Kei .Characterization of solidification process in Sn-Cu alloys using an interrupted tests Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, v 72, n 10, October, 2008, p 804-811 Language: Japanese

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Journal of Japan Research Institute for Advanced Copper-Base Materials and Technologies
LH closed
(1 items found as of 4/19/2009) priority

Takemoto, T Interfacial reaction between copper and lead-free solder and reliability of solder joint. Journal of Japan Research Institute for Advanced Copper-Base Materials and Technologies. Vol. 43, pp. 6-11. 2004

Kodama, A, Shibuya, Y, Honda, J, Kimura, N, Nobuyoshi, R, Whisker growth on lead-free plating. Journal of Japan Research Institute for Advanced Copper-Base Materials and Technologies. Vol. 43, pp. 246-250. 2004

Uenishi, K, Hirose, A, Kobayashi, K F Effect of platings on Cu surface on reliability of micro joints using Sn-Ag based lead free solders. Journal of Japan Research Institute for Advanced Copper-Base Materials and Technologies. Vol. 43, pp. 251-255. 2004

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Journal of the Japan Society for Heat Treatment
Netsu Shori
LH closed
(1 items found as of 4/19/2009)

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Journal of Japan Society of Mechanical Engineers

Yoshimura, J, Umeda, H, Nakayama i, T, Aoyama i, K, Design engineering - system Journal of Japan Society of Mechanical Engineers. Vol. 106, no. 1017, pp. 626-629. Aug. 2003

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Journal of the Japan Society of Powder and Powder Metallurgy
Funtai Oyobi Fummatsu Yakin
GIT main TN695.F8X LH closed UCI online
priority

(new references 12/30/2008)
Sugiyama, Masaharu, Igarashi, Takanori, Fukumoto, Masahiro, Kimura, Hisamichi, Inoue, Akihisa .Formation of Fe-based metallic glass coating films produced by High Velocity Oxy-fuel spraying process and their applications Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy, v 54, n 11, November, 2007, p 784-789 Language: Japanese

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Journal of the Japan Welding Society
Yosetsu Gakkai Shi
LH closed OkSU online OSU sel TS227.A1Y676 UF online UIUC eng Q.671.5205YOS UK online
(13 items found as of 4/19/2009)

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Journal of the Korean Institute of Metals and Materials
LH closed
(1 items found as of 4/19/2009)

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Journal of Manufacturing Science and Engineering
AU online BYU online CBU FIT online FSU online GIT online IU online Lexmark LH closed LU gray TJ1.A7 MST online NWU online OCU beam microfilm OkSu ONLINE OrSU online OSU online PU online SDSU TA1.J634 SIUC online SIUE online SU online TTU UAB online UAH n1 UAr online UC online UCF online UCI online UCSD online UDe online UE online UF online UIC online UIUC online UK online & eng TA1.J634 UM online & aael TA1.J83 UMC online USF online USU online UT online UTA online UTo online
(1 items found as of 12/28/2009)
v127#1-v131#6 checked 12/28/2009

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Journal of Materials Chemistry
http://www.rsc.org/Publishing/Journals/jm/ AU online BYU online FSU online GIT online IU online LH online MST online NWU online OkSU online OrSU online OSU online PU online RU online SDSU online SIUC online SIUE online TTU UAr online UC online UCF online UCI online UCSD online UD online UDe online UF online UIC online UIUC online UK online UM online UMC online UMe online UOk online USF online UTA online UTo online WrSU online
(1 items found as of 6/6/2009)

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Journal of Materials Engineering
Cailiao Gongcheng
OkSU main 620.1105J86531 RU fondren TA401.J675 SIUC storage 53165-6262 UCSD s&e TA1.J8283 UTor eng TA401.J6852
(11 items found as of 4/19/2009) priority

(new references 12/30/2008)
Wang, Da-Yong, Gu, Xiao-Long, Zhang, Li-Min Sn-Bi-Sb lead free solder Cailiao Gongcheng/Journal of Materials Engineering, n SUPPL., July 2006, p 229-231+235 Language: Chinese

Wang, Jian-Xin, Xue, Song-Bai, Han, Zong-Jie, Yu, Sheng-Lin, Chen, Yan, Study on wettability of Sn-Ag-Cu-Ce solder and mechanical properties of soldered joints Cailiao Gongcheng/Journal of Materials Engineering, n 9, September, 2008, p 5-8 Language: Chinese

Han, Zong-Jie, Xue, Song-Bai, Wang, Jian-Xin, Zhang, Liang, Yu, Sheng-Lin .Study on wettability and spreadability of lead-free solder with diode laser soldering process Cailiao Gongcheng/Journal of Materials Engineering, n 9, September, 2008, p 76-79 Language: Chinese

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Journal of Materials Engineering and Performance
AU rbd TA401.J6752 GIT online & main TA401.J674 OkSU online OSU sel TA401J623 SDSU online UC eng TA401.J674 UCI online & sci TA401.J676 UCSD online UL kersey TA401.J674 UOk online USD online UTor online UWa online VU online
(17 items found as of 10/23/2009)
v1#1-v18#8 online first to Oct. 22, 2009 all checked 10/23/2009 low priority

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Journal of Materials Processing Technology
MST online OkSU online SDSU online UCSD online UK online sd UM online UOk online UT online & hodges TJ1.J67
(3 items found as of 12/28/2009)
v152#3,v183#1,v192-193,v200#1-v210#3 Articles in Press to Dec. 28, 2009 checked 12/28/2009

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Journal of Materials Research
AU rbd TA404.2.J68 FSU dirac 620.5J86423 GIT online & main-5e TA404.2.J68 MST wilson TA404.2.J68 OkSU online OSU sel TA410M38 SIUC online UC eng TA401.J675 UCF online & main TA404.2.J68 UCI online & sci TA404.2J68 UCSD online UH TA404.2.J68 UK online & chem/phys TA404.2.J68 UL online & ekstrom TA404.2.J68 UM aael TA404.2.J86 UOk online UT online & hodges TA404.2.J68 UTor eng TA404.2.J68 UWa online
(>=20 items found as of 12/28/2009)
v1#1-v24#12 all checked 12/28/2009 low priority

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Journal of Materials Science
FSU dirac 620.5J8648 GIT online & main TA401.J68x KYVL MST online OkSU online OSU online & sel TK7871J665 SDSU online SIUC online TTU UAB online & sterne TK7871.J665 UAr storage TA401.J68 UC online & sw depos TA401.J684 UCF online & main TA401.J68 UCI online & sci TA401.J68 UCSD online UD online & roesch UK online & TK7871.J60 UL online & kersey TA401.J68 UM online & aael TA401.J8623 UOk online USD online UT online & hodges TK7871.J665
(>=20 items found as of 12/28/2009)
v1#1-v45#4 online First to Dec. 28, 2009 all checked 12/28/2009

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Journal of Materials Science and Technology
http://www.jmst.org/EN/article/showTenYearOldVolumn.do LH closed NWU online RU fondren TA459.C48 UF sci TA401.J683 UIUC eng Q.669.05CH1 UK online UTo online
(11 items found as of 4/29/2009)
v15#1-v25#2 checked 4/29/2009

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Journal of Materials Science: Materials in Electronics
FSU online & dirac 620.5J86482 GIT online & main TK7871.J665 MST online NWU online & sci L 621.38105J864 OkSU online OSU online & sel TK7871J665 PU online & eng 621.38105J8265 SDSU online SIUC online UAB online & sterne TK7871.J665 UAH salmon UC online & eng TA401.J684 UCF online & main TA401.J684 UCI online & sci TK7870.J687 UCSD online UD online & roesch UIC online & daley TK7871.J68 UK online & eng TK7871.J60 UL kersey TK7871.J665 UM online & aael TA401.J8623 UOk online USD online UT online
(>=20 items found as of 12/29/2009)
v1#1-v21#1 online First to Dec. 29, 2009 all checked 12/29/2009

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Journal of Mechanical Engineering
Strojniski Vestnik
LH closed
priority

(new references 12/30/2008)
Ostojic, Gordana, Lazarevic, Milovan, Stankovski, Stevan, Cosic, Ilija, Radosavljavic, Zoran .Radio frequency identification technology application in disassembly systems Strojniski Vestnik/Journal of Mechanical Engineering, v 54, n 11, 2008, p 759-767

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Journal of the Mechanics and Physics of Solids
IU online & bloomington swain QC1.J884 & alf QC1.J884 MST online OkSU online OSU online & sel QC1J886 PU online & eng 530.5J825 & phys 530.5J825 SDSU online SIUC online SIUE lovejoy TTU online UC online & eng TA350.J6 UCSD online UD online & roesch UIC online & sci TA350.J68 UK eng TA350.J68 UL online UM online & aael QC1.J88 UOk online UT online & hodges TA350.J68
(1 items found as of 4/19/2009)

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Journal of Metals
IU bloomington alf TN1.J86 MST wilson TN1.A513 NWU online & sci 669.05J86 OkSU stillwater north_boomer 669.05J86 OSU sel TN1J6 PU eng 672M564h & 669.05J82 & hicks 669.05J82 SDSU compact TN1.J6 SIUC morris 51828-6711 UAr mullins per-microfiche TN1.A513 UC eng TN1.J67 & sw depos TN1.J67 UCSD s&e TN1.J829 UD roesch UE UIC online & daley TN1.A516 UK eng TN1.A513 UL ekstrom TN1.A513 UM online & aael TN1.J87 UMe mcwherter UOk bizzell TN1.A513 USD online UT hodges TN1.A513
(0 items found as of 4/19/2009)

Frye, Stansbury and McElroy, J. Metals, 1953, 5, 219. *** not applicable ***

Probst and Sinnott, J. Metals, 1955, 7, 215. *** not applicable ***

D. W. White, J. Metals 7, 1221 (1955). *** not applicable ***

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Journal of Microelectronics and Electronic Packaging
http://www.imaps.org/jmep/jmep.asp PU eng 621.3817In7 & 621.38104605J826 UAr mullins TK7870.15.I581 UM online & aael TK7870.15.I581
(14 items found as of 4/19/2009)
v1#1-v5#3 all checked 4/3/2009 priority

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Journal of Micromechanics and Microengineering
IU online MST online NWU online & sci L620.105J865 OSU online PU online SIUC online UAr online UC online & eng QC176.8.M5J687 UCSD online UD online UIC online & sci QC176.8.M5J68 UK online & eng QC176.8.M5J68 UL kersey QC176.8.M5J6 UM online & aael C176.8.M5J86 UOk online USD online UT online & hodges QC176.8.M5J68
(5 items found as of 12/29/2009)
v15#1-v20#2 checked 12/29/2009

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Journal of Micro/Nanolithography, MEMS, and MOEMS
Journal of microlithography, microfabrication, and microsystems
AU online FSU online IU online LH closed MST online NWU online OGI online OkSU online PU online RU online SDSU online UC online UCI online UCSD online UDe online UF online UIUC online UK online UM online & aael TK7874.J68 UMC online UOk online UT online UTA eng TK7874J6668 UTo online
(1 items found as of 12/29/2009)
v1#1-v8#4 all checked 12/29/2009

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Journal of Non-Crystalline Solids
MST online NWU online & sci 541.05J8635 OkSU online OSU online & sel TP845J65 PU chem 666.105J826 & phys 666.105J826 & hicks 666.105J826 SDSU online SIUC online TTU UAr online UC online & phys TP845.J65 UCSD online UD online UIC online & daley TP845.J65 UK online sd & eng TP845.J65 UL online & kersey TP845.J65 UM online & shapiro QC1.J8695 & buhr TP845.J86 UOk online UT online & hodges TP845.J65
(8 items found as of 12/29/2009)
v354#1-v356#2 checked 12/29/2009

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Journal of Nuclear Materials
MST online NWU online OkSU online OSU online & sel QC770J62 PU online & eng 621.48J826 & hicks 621.48J826 SDSU online SIUC storage P000105 UAr storage TK9185.A1J6 UC online & eng TK9185.A1J6 UCSD online UD online UIC online & sci TK9185.A1j6 UK eng TK9185.A1J6 UL online & ekstrom TK9185.A1J6 UM online & aael TK9001.J86 UOk online UT online & hodges TN4.J68
(0 items found as of 4/19/2009)

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Journal of Phase Equilibria and Diffusion
Bulletin of Alloy Phase Diagrams
Journal of Phase Equilibria
GIT online & main-6e TS650.B84x MST wilson TN689.B84 NWU sci L669.9405B936 OkSU online OSU sel TN689.J68 PU eng 669.9405J826 SDSU online UCSD online UL kersey TN689.B84 UM online & aael TN689.B942 UOk online USD online UT hodges TN690.B84 UTo carlson UTor online UWa online VU online
(>=20 items found as of 10/22/2009)
v10#4-v30#5 online first to Oct. 21, 2009 checked 10/22/2009 low priority

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Journal of Physical Chemistry B
MST online SDSU online SIUC online SIUE online UAr online UCSD online UE online UK chem/phys QD1.J85 & king QD1.J85 UM aael QD1.J8715 UMe chem UOk online USD online UT online & hodges QD1.J952 UTo online & bowman-oddy & carlson WSU online
(2 items found as of 4/19/2009)

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Journal of the Physical Society of Japan
IU bloomington alf QC1.T62 MST online NWU online & sci L530.5P577j OkSU online OSU online & sel QC1P5749 PU online & phys 530.6P56 & 530.6P557j SDSU QC1.P47 SIUC morris 53779-5301 SIUE lovejoy TTU UAr online UC online & phys QC1.N5 UCSD online UD roesch UIC sci UK chem/phys QC1.P559 & king QC1.P559 UL kersey QC1.P47 UM online & shapiro QC1.P5815 & buhr QC1.P5815 UOk online UT hodges QC1.P47
(1 items found as of 4/19/2009)

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Journal of Physics and Chemistry of Solids
MST online NWU online & sci 539.2P578 OkSU online OSU online & sel QC176P35 PU online & phys 530.5So44 & hicks 530.5P5641 SDSU online SIUC online SIUE online TTU UAr online UC online & phys QC176.P45 UCSD online UD online UIC online & sci & warehouse QC176.A1J6 UK online & chem/phys QC176.A1J6 & king QC176.A1J6 & remote QC176.A1J6 UL online & kersey QC176.A1J6 UM online & shapiro QC1.P58282A6 & buhr QC173.P57 UMe mcwherter UOk online UT online & hodges QC171.P39
(2 items found as of 4/19/2009)
v69#5-5 checked 2/5/2009

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Journal of Physics D: Applied Physics
AU online BYU online FIT online FSU online GIT online IU online LH closed LU gray QC1.J848 MoSU QC1.I55 MST online NWU online OGI online OrSU valley QC1.B7 OSU online PU online RU online SDSU QC1.I5482 IUC online SIUE lovejoy SU online UAB online UAr online UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UK online & remote QC1.J848 UM online & aael QC1.B86 & shapiro QC1.B86 & buhr QC1.B86 UMC online UMe mcwherter UOk online USD online USF online USU online UT online UTA online UTo online WrSU online
(5 items found as of 4/19/2009)

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Journal of Physics, USSR
MST depos 530.5J826 NWU sci L530.5J863 OkSU online OSU sel QC1J88 PU phys 530.5J822 & hicks 530.05J826 SIUC storage 55707-5301 UC phys QC1.J87 UCSD s&e QC1.J832 UK chem/phys QC770.J67 UM buhr QC1.J87 UT online & hodges QC1.J846
(1 items found as of 4/19/2009)

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Journal of Polymer Science, Part A: Polymer Chemistry
Lexmark MST wilson QD471.J64 NWU online & sci L541.7J861 OkSU online OSU online & sel QD1J83212 PU hicks 540.5J828a1 & 540.5J828b SDSU online SIUC online SIUE lovejoy UAr mullins QD471.J6425 UC online & chem QD471.J6425 UCSD online UD online UIC daley QD471.J642 UK online & chem/phys QD281.P6J82 UL kersey QD471.J6425 UM aael QD471.J87 & shapiro QD1.J8722 UOk online USD online UT online
(1 items found as of 4/19/2009)

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Journal fur Praktische Chemie, Chemiker-Zeitung
NWU online & sci 540.5J86 OkSU stillwater 540.5J8551 OSU online & sel TP1J84 & sel compact TP1.J84 PU online & chem 540.5J81 & hicks 660.5C424 SDSU online SIUE storage UAr online UC chem (Oesper Rm) TP1.J66 UCSD online UD online UIC online & sci QD1.J75 UK chem/phys QD1.J75 UL kersey QD1.J81 & microform UM online & shapiro QD1.J873 & hatcher QD1.J862 & buhr QD1.J862 UOk online UT online & hodges & closed QD1.J6 UTo online & bowman-oddy WSU online & storage 780.82D659 Ser1v16 & sci
(2 items found as of 4/19/2009)

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Journal of Quality Technology
AU online BYU hbll TS156.Q3 J65 CBU FIT online FSU online GIT online IU online Lexmark LH closed LU gray TS156.Q3J65 MST online NWU online OkSU online OrSU valley TS156.Q3J6 OSU sel TS156.Q3J65 PU online RU fondren TS156.Q3J65 SDSU online SIUC online TTU online UAB sterne TS156.Q3J65 UAH n1 UAr online UC eng TS156.Q3J65 UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UK online & remote TS156.Q3J65 UM online & aael TS156.Q3J86 UMC online UNF online UOk online USF online USU merrill-cazier TS155.A1I6 UT hodges TS155.A1J68 UTA eng 658.56205J826 UTo carlson WrSU dunbar TS156.Q3J65
(1 items found as of 4/19/2009)
v40#4 checked 2/5/2009

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Journal of Rare Earths
LH closed OkSU online UTor online VU online
(4 items found as of 4/19/2009)
v24#1-v26#4 checked 10/16/2008 priority

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Journal of Reinforced Plastics and Composites
BYU online FSU online GIT online & main-5e TA418.9.R4568X IU online LH closed MST online NWU online OGI online OkSU online OSU online PU online RU online SDSU online SIUC online SU online UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UM online & aael TA455.P55J68 UMC online UOk online USD online USF online USU online UTo online WrSU online
(1 items found as of 4/19/2009)

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Journal of the Reliability Information Analysis Center
http://quanterion.com/RIAC/index.asp UTor online
(7 items found as of 11/9/2009)
4Q07-3Q09 checked 11/9/2009 priority

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Journal of Shanghai Jiaotong University
Shanghai Jiaotong Daxue Xuebao
LH closed OSU online SDSU online UC online UCSD online UIUC oak Q4.S488 UM shapiro Q4.S52 UMC online UOk online USF online UTo online UTor online WrSU online
priority

(new references 12/29/2008)
Xu, Dong-Xia, Lei, Yong-Ping, Xia, Zhi-Dong, Guo, Fu, Shi, Yao-Wu .Current status and trends in research on soldering flux for lead-free solder in electronic assembly Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n SUPPL., April, 2007, p 53-57+61 Language: Chinese

Zhang, Jin-Song, Wu, Yi-Ping, Zhu, Yu-Chun, Li, Juan-Juan, Wu, Feng-Shun, An, Bing .Whisker formation on pure Sn coating of leadframe under temperature cycling condition Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n SUPPL., April, 2007, p 62-65 Language: Chinese

Li, Feng-Hui, Li, Xiao-Yan, Yan, Yong-Chang .Growth of IMC in SnAgCu/Cu butt solder joint during thermal aging Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n SUPPL., April, 2007, p 66-70 Language: Chinese

Jiang, Yan-Feng, Zhang, Xiao-Bo .Interfacial reactions and reliability with lead (Pb)-free solders Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n SUPPL., April, 2007, p 71-74 Language: Chinese

Li, Xiao-Xia, Zhu, Rong-Lin .Effect of lead-free soldering technology on the reliability of PCB Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n SUPPL., April, 2007, p 95-99+105 Language: Chinese

Gao, Feng, Wang, Cui-Ping, Liu, Xing-Jun .CALPHAD method and its applications in Pb-free solders Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n SUPPL., April, 2007, p 100-105 Language: Chinese

Su, Xi-Ran, Yang, Dao-Guo, Zhu, Lan-Fen, Kang, Xue-Jing .Effect of temperature, moisture and vapor pressure on delamination in a PBGA during reflow soldering process Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n SUPPL., April, 2007, p 106-110 Language: Chinese

Zhou, Bin, Pan, Kai-Lin, Yan, Yi-Lin .Thermal distortion simulation of lead free PCB assembly during reflow soldering process Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n SUPPL., April, 2007, p 111-115 Language: Chinese

Pan, Kai-Lin, Zhao, Xiao-Yun, Yan, Yi-Lin, Zhou, Bin .EU RoHS directive compliance operation guidance Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n SUPPL., April, 2007, p 116-119 Language: Chinese

Luo, Dao-Jun, Zou, Ya-Bing .Copper-diffusion induced failure of lead-free solder joints Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n SUPPL., April, 2007, p 120-122+126 Language: Chinese

Shuai, Di, Jin, Xing, Guo, Shi-Da, Yu, Kwangsu .Reliability analysis of Sn-Bi plating chips Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, v 41, n SUPPL., April, 2007, p 154-156

Niu, Xiao-Yan, Li, Zhi-Gang, Yuan, Guo-Zheng, Shu, Xue-Feng .Dynamic compressive properties of lead-free solder Journal of Shanghai Jiaotong University (Science), v 13, n SUPPL., April, 2008, p 74-77

Lin, Wei-Cheng, .Void-free vacuum reflow soldering of ball grid array Journal of Shanghai Jiaotong University (Science), v 13, n SUPPL., April, 2008, p 82-86

Sun, Li, Qi, Fang-Juan, Hou, Zhe-Zhe, Qin, Cha .Prediction of Sn-Ag solder properties based on BP algorithm of artificial neutral network Journal of Shanghai Jiaotong University (Science), v 13, n SUPPL., April, 2008, p 138-140

Fan, Ping-Yue, Qi, Bo, Wang, Jia-Ji .Fatigue behavior of BGA soldering under board level drop test Journal of Shanghai Jiaotong University (Science), v 13, n SUPPL., April, 2008, p 141-144

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Journal of Shenyang University of Technology (China)
Shenyang Gongye Daxue Xuebao
LH closed UCSD online

Effect of alloying elements on properties and microstructure of Sn-Bi-Sb-Ag-Cu-Re lead-free solder Shenyang Gongye Daxue Xuebao (Journal of Shenyang University of Technology) (China), vol. 27, pp. 377-380, Aug. 2005

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Journal of the Society of Chemical Industry
Kogyo kagaku zasshi
IU bloomington alf TP1.S6 MST depos TP1.S6 & depos 660.5J82s OkSU stillwater 660.6S678j OSU depos TP1S66 PU hicks 540.5B77 & 660.6So1j SDSU TP1.S599 SIUC morris microfilm SIUE lovejoy UAr storage TP1.S6 UC sw depos TP1.S6 UCSD s&e QD1.N63 UIC warehouse TP1.K59 UK king TP200.J68 UL kersey TP1.S6 UM aael TP1.K79 & buhr TP1.S677j UOk bizzell 660.5So13j UTo depos WSU sci & storage
(1 items found as of 4/19/2009)

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Journal of the Society for Information Display
GIT online & main TK7882.I6568 Lexmark LH closed NWU sci 621.3987J86 OkSU online PU online SIUC morris TK7882.I6J68 UC eng TK7882.I6J68 UIUC eng 621.3805JOU UTA pcl TK5103.5N342
priority

(new references 12/31/2008)
Govaerts, Jonathan, Vandecasteele, Bjorn, Vanfleteren, Jan . Interconnecting drivers to flexible displays Journal of the Society for Information Display, v 16, n 7, July, 2008, p 765-775

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Journal of the Society of Materials Science
Zairyo
LH closed NWU online UIUC eng 620.105ZA UK online UTor eng TA401.Z3
(3 items found as of 6/28/2009)
v53#1-v58#6 checked 6/28/2009 priority

HIYOSHI, Noritake, KATOH, Akihisa, SAKANE, Masao, and TSUKADA, Yutaka, "Low Cycle Fatigue Lives of Sn-37Pb and Sn-3.5Ag Solders at Low Temperatures," Journal of the Society of Materials Science, vol. 58 no. 2, pp. 155-161, 2009.

HIYOSHI, Noritake, ITOH, Takamoto, and SAKANE, Masao, "Development of Thermal Mechanical Fatigue Testing Machine for Solders," Journal of the Society of Materials Science, vol. 58 no. 2, pp. 162-167, 2009.

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Journal of Solar Energy Engineering
AU online BYU hbll TJ810.J83x FIT online GIT online IU online LH closed LU gray TJ1.A7 MoSU TJ810.S6 MST online NWU online OCU beam microfiche OkSU online OrSU online OSU online PU online RU online SDSU TJ810.T69 SIUC online SIUE lovejoy UAB online UAH n1 UAr online UC online UCF online UCI online UCSD s&e TJ1.J828 UDe online UE online UF online UIC online UIUC online UK online & eng TJ810.T69 UM online & aael TJ810.J83 UMC online UOk online USF online USU online UT online UTA online UTO online
(1 items found as of 4/19/2009)
v130#2 checked 2/5/2009

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Journal of Solid State Electrochemistry
FSU online GIT online MST online NWU online OkSU online OSU online SDSU online SIUC online UC online & depos QD551.J68 UCF online UCSd online UD online UOk online USD online UT online UTor online UWa online
(>=20 items found as of 10/23/2009)
v9#1-v13#12 Online First to Oct. 22, 2009 checked 10/23/2009 low priority

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Journal of Solid Waste Technology and Management
GIT main-5e TD785.J86 LH closed OSU online PU eng 628.405J826 UAr mullins TD785.N35 UCF main TD785.J86 UCSD online UOk online USF tampa TD785.J68 UTo online WrSU online
(2 items found as of 4/19/2009)

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Journal of South China University of Technology
Huanan Ligong Daxue Xuebao
LH closed UCSD online UOk online UTo online UTor online
priority

(new references 12/30/2008)
Zeng, Zhen-Ou, Zou, Jin-Guang, Zhao, Guo-Peng, Liu, Jian-Ping .Performance of trivalent and hexavalent chromium passivation films based on zinc plating Huanan Ligong Daxue Xuebao/Journal of South China University of Technology (Natural Science), v 35, n 5, May, 2007, p 104-108 Language: Chinese

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Journal of Southeast University (Natural Science Edition)
Dongnan Daxue Xuebao (Ziran Kexue Ban)
AU rbd FSU strozier 959.005J864 GIT main T1.T84 LH closed OSU depos T1.T84 UCSD online UOk online UTo online UTor online & eng T1.J842
priority

(new references 12/30/2008)
Xue, Feng, Zhou, Jian, Li, Peipei, Fang, Yili .Effect of interface reaction and interface tension on wettability of Sn-Zn-Bi solders Dongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Southeast University (Natural Science Edition), v 37, n 4, July, 2007, p 634-638 Language: Chinese

Wang, Changliang, Zhou, Jian, Sun, Yangshan, Fang, Yili .Investigation on oxidation resistance of Sn-8Zn-3Bi lead-free solder alloys Dongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Southeast University (Natural Science Edition), v 38, n 4, July, 2008, p 693-697 Language: Chinese

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Journal of the Surface Finishing Society of Japan
Hyomen Gijutsu
NWU online OkSU online SDSU online UCI online UCSD online UTor online
(>=20 items found as of 10/25/2009)
v54#1-v60#2 checked 10/25/2009 low priority

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Journal of Synchrotron Radiation
OkSU online OSU online SDSU online SIUC online UAr online UC chem QC793.5.E627J68 UCSD online UL online UOk online USD online
(1 items found as of 4/19/2009)

--------------------------------------------------------
Journal of Technical Physics (USSR)
GIT main TA355.P75 & storage TA355.P75 IU bloomington alf QA935.A2P7 LH closed MST depos 534.05P941 PU hicks 620.101P941 UC eng & sw depos TA355.P75 UCB mathphys TA355.P75 UCSD s&e TA1.P962 UIC daley TA355.P75 UM aael QC1.P912B

V. I. Kostenetz and A. M. Ivanchenko, "Mechanical Properties of Metals and Alloys in Tension at Low Temperatures (-196 and -253 C): Part IV - Solders," Journal of Technical Physics (USSR), vol. 16 no. 5, pp. 551-554 (1946).

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Journal of Testing and Evaluation
MST wilson TA401.J862 OkSU main 620.004405J86 OSU sel TA401.J65 SIUC morris 53285-6202 SDSU TA401.J672 SIUE online TTU online UAr mullins TA401.J672 UCSD online UK eng TA401.J67 UL kersey TA401.J672 UMe online & mcwherter UOk online UT online & hodges TA401.J683 UTor online UWa davis TA401.J675x
(3 items found as of 10/25/2009)
v27#1-v32#6,v35#1-v37#6 checked 10/25/2009 priority

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Journal of Thermal Analysis and Calorimetry
AU online BYU hbll QD515.J65 FSU online GIT main QD515.J65 IU online LH closed MST online NWU online OGI online OkSU online OrSU online OSU online PU online RU online SDSU online SIUC online SU online UAH online UAr online UC online UCF online UCI online UCSD online UDe online UF online UIC online UK online UM online & shapiro QD515.J86 UMC online UNF online USD online USF online USU online UT online UTA online UTo online WrSU online
(6 items found as of 12/29/2009)
v87#1-v98#3 online First to Dec. 29, 2009 checked 12/29/2009

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Journal of Thermal Stresses
AU online FSU online GIT online & main TA418.58J68 IU online LH closed MoSU TA418.58.J68 MST online NWU online OGI online OrSU online OSU online PU online SDSU online SIUC online UAH online UAr mullins per-microfiche TA418.58.J68 UC eng TA418.58.J68 UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UK online & eng TA418.58.J68 UM online & aael TA418.58.J86 UMC online UOk online USD online USF online UT online UTA online UTo online WrSU online
(1 items found as of 4/19/2009)

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Journal of Tribology
Journal of Lubrication Technology
CBU MST online MSU online & eng TJ1075.A2J6 NWU online & sci L621.06A51Ser.F OCU beam OkSU online OSU online PU eng 621.06Am3F SDSU TJ1075.A2J68 SIUC online SIUE lovejoy TTU online UAr online UC online & eng TJ1.A7Ser.F UCSD online UE online UIC daley TJ1075.A2J682 UK eng TJ1075.A2J68 UL kersey TJ1075.A2J69 UM online & aael TJ1075.A2J86 UOk online UT online & hodges TJ1075.A2J6 UTo online & carlson WSU online
(1 items found as of 4/19/2009)

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Journal of University of Science and Technology Beijing
Beijing ke ji da xue xue bao
LH closed OkSU online OSU sel TS300.P45 PU eng 669.105J826 UCSD online UOk online
(1 items found as of 4/19/2009)

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Journal of Vacuum Science and Technology
Zhenkong Kexue yu Jishu Xuebao
LH closed MST wilson TJ940.J67 SDSU online SIUC online SIUE storage UCSD online UOk online USD online UTor online UWa online
v27#3 checked 10/3/2009 priority

(new references 1/31/2008)
Jin, Hao, Ma, Yuanyuan, Wang, Demiao .Growth of lead-free welding films on ferrite substrate by magnetron sputtering Zhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology, v 28, n 4, August, 2008, p 341-345 Language: Chinese

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Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
Zhenkong Kexue yu Jishu Xuebao
Lexmark MST wilson TJ940.J67 OkSU online OSU TJ940A1J6 SDSU online SIUE online TTU UAr online UCSD online UK chem/phys TJ940.J67 UL kersey TJ940.J6 UMe online & mcwherter UOk online USD online UT online UTor online UWa online
(1 items found as of 10/23/2009)
v25#1-v27#6 checked 10/23/2009 low priority

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Journal of Vibration and Shock
Zhendong yu Chongji
UTo online
priority

(new references 12/30/2008)
Liu, Fang, Meng, Guang, Zhao, Mei .Progress in research of SMT solder joint reliability during drop impact Zhendong yu Chongji/Journal of Vibration and Shock, v 26, n 10, October, 2007, p 92-95 Language: Chinese

Liu, Fang, Meng, Guang, Zhao, Mei, Zhao, Jun-Feng .Finite element analysis for lead-free solder joints under a board level drop impact Zhendong yu Chongji/Journal of Vibration and Shock, v 27, n 2, February, 2008, p 75-77 Language: Chinese

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Journal Wuhan University of Technology
Journal of Wuhan University of Technology
Wuhan Ligong Daxue Xuebao
LH closed UCSD online UOk online UTor online
priority

(new references 12/29/2008)
Yan, Qin-Yun (School of Physics Science and Technology, Central South University); Zhou, Ji-Cheng; Yang, Dan "Research on bonding properties of electrically conductive adhesives for hybrid microcircuits application," Wuhan Ligong Daxue Xuebao/Journal of Wuhan University of Technology, vol. 28 no. 3, Mar. 2006, pp. 18-21 Language: Chinese.

Zheng, Xiaoling, Zhang, Lulu, You, Min, Wu, Jianhao, Yu, Haizhou, Yang, Derong, Mao, Yuping .Effect of curing procedure on the properties of copper-powder-filled conductive adhesives Journal Wuhan University of Technology, Materials Science Edition, v 23, n 3, June, 2008, p 323-325

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KKKK

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Kawasaki Steel Technical Report
NWU sci 669.14K422 SIUC online UTA eng TS300.K282
(1 items found as of 4/19/2009)
v1-v47 checked 9/18/2009 priority

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Kemet TechTopics
(5 items found as of 6/10/2009) priority

(new references 6/5/2009)
Moore, John, "Ultra-Low ESR Tantalum Chip Capacitor," Kemet TechTopics, vol. 7 no. 3, pp. xx-xx, Sept. 1993.

Moore, John, and Marshall, Jim, "T495 - Low ESR, Surge Tantalum Surface Mount Capacitor," KEMET TechTopics , vol. 3 no. x, pp. xx-xx, Sept. 1997.

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KEMET Update
priority

(new references 6/5/2009)
Prymak, John, "Update - Ceramic versus Tantalum," KEMET Update, Sept. 2004.

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Key Engineering Materials
MST online NWU various OkSU stillwater 620.1105K44 OSU sel various PU eng 620.11292M465a UC online & eng TA404.8.M433 UCSD online UD roesch various UK online & eng TA401.M42 UM online & aael TA404.8.M481 UT hodges TA404.8.M433 UTo carlson TA401.M42 WSU sci TA401.M42
(>=20 items found as of 12/29/2009)
v340-341,v345-356,v353-358,v364-366,v373-374,v385-387,v415,v421-v422 checked 12/29/2009

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KG Technical Conference

Jordan, Manfred, Max Scholotter, Electroplating of Lead-Free Tin Alloys, GMBH & Co. KG Technical Conference Taipei, Taiwan Dec. 2002 pag 48.

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Korean Journal of Materials Research
priority

(new references 12/30/2008)
Lim, Gi-Tae, Lee, Jang-Hee, Kim, Byoung-Joon, Lee, Ki-Wook, Lee, Min-Jae, Joo, Young-Chang, Park, Young-Bae .Effect of thermal aging on intermetallic compound growth kinetics of Au stud bump Korean Journal of Materials Research, v 18, n 1, January, 2008, p 45-50 Language: Korean

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Kunststoffe Plast Europe
GIT main TP1101.K82X LH closed PU eng 660.5K96b UC sw depos TP1101.K91
priority

(new references 12/30/2008)
Mark, Frank E., .Verwerten von altkunststoffen aus E+E (Recovery of used plastics from E+E) Kunststoffe Plast Europe, v 92, n 9, September, 2002, p 6-9+22-24+26-27 Language: German, English

Vorspohl, Klaus, Sartorius, Ingo .Kunststoffe in elektro- und elektronikgeraten (Plastics in electric and electronic appliances) Kunststoffe Plast Europe, v 93, n 12, 2003, p 28-31+57-61 Language: German, English

Weber, Martin .Produkte fur innovative Verfahren (Products for innovative processes) Kunststoffe Plast Europe, v 94, n 12, 2004, p 98-101 Language: German

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LLLL

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Langmuir
MST online OkSU north_boomer 541.34505L284 RyU online SDSU online SIUC online TTU online & QD506.A1L35 UAr online UCSD online UE online UM online & shapiro QD506.A1L284 UOk bizzell QD506.A1L284 USD online UT online UTo online & carlson UWa online WSU sci
(2 items found as of 10/22/2009)
v21#8,v24#16-v25#20 Articles ASAP to Oct. 21, 20009 checked 10/22/2009 priority

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Lead-Free Connection
http://www.kester.com/en-us/leadfree/lfs_lfconnection.aspx
(>=20 items found as of 4/19/2009)
v1#1-v4#1 all checked 4/3/2009 priority

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Lead-Free Magazine
http://www.leadfreemagazine.com/subscribe.htm
(>=20 items found as of 4/19/2009)
checked 4/3/2009

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Lead Free Soldering Summit
http://www.aciusa.org/leadfree/LFS_SUMMIT-PDF/
(14 items found as of 4/19/2009)
05 checked 4/3/2009 priority

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Lead-Free Solders

Noctor, D, Whitten, G, Handwerker, C. A. (METALLURGY DIVISION - 855) Reliability of Lead-Free Solders Lead-Free Solders - Dec. 1, 2001

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xxxx Lead Free Symposium Conference Proceedings
http://www.smta.org/knowledge/knowledge.cfm
(14 items found as of 11/6/2009)
00 checked 11/6/2009 priority

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xxxx Lead-Free Technology Workshop
(10 items found as of 4/19/2009)
06 priority

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Lecture Notes in Computer Science
AU rbd various CBU online GIT various LU gray various MST wilson various NWU sci various OGI various OkSU online OrSU valley various OSU sel various PU online RU fondren various SDSU various SIUC morris various SIUE lovejoy various SPU various SU leml various TTU online UAB sterne various UAH online UAr mullins QA75.5.L42 UC math various UCF online UCI online UCSD online UDe penrode various UF online UIC online UIUC eng various UK online UM misc UMC various UMe math UOk online USF online USD online UTA pcl various UTo carlson various WrSU swdepos various
(1 items found as of 4/19/2009)
v5315 checked 2/8/2009

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letsrecycle.com
(1 items found as of 4/19/2009)

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Lighting Journal
LH closed PU hicks 621.326IL6i UM aael TP700.L72
(1 items found as of 4/19/2009) priority

(new references 12/29/2008)
Howard, Allan .Advisory notes on the WEEE Directive Lighting Journal (Rugby, England), v 70, n 5, September/October, 2005, p 44-45

Anon .Last word from westminster Lighting Journal (Rugby, England), v 70, n 6, November/December, 2005, p 52

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Lightwave
CPL washington IU online MST online NWU online OkSU online OSU online SDSU online SIUC online UAr online UCSD online UIC online UK online UL kersey TA1800.L55 UOk online USD online UT online
(1 items found as of 4/19/2009)

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MMMM

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Machine Design
http://machinedesign.texterity.com/machinedesign/20081211/?u1=texterity CBU CPL washington IU online KYVL Lexmark MST online NWU sci 621.05M149 OSU sel TJ1.M138 PU eng 621.05M176 SDSU online SIUC morris 53359-6251 TTU online UAr online UC eng TJ1.M18 UCSD online UD roesch UE online UIC daley TJ1.M15 UK online & eng TJ1.M15 UL kersey TJ1.M15 UM online & aael TJ1.M15 USD online UT hodges TJ1.M15
(4 items found as of 4/19/2009)

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Macromolecular Rapid Communications
AU online BYU online FSU online GIT online IU online LH closed MST online NWU online OGI online OkSU online OrSU online OSU online PU online RU online SDSU online SIUC online SU online UAB online UAr online UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UK online UM online & aael QD471.M233 UMC online UNF online UOk online USD online USF online USU online UT online UTA online UTo online WrSU online
(1 items found as of 4/19/2009)
v29#3 checked 2/8/2009

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Macromolecules
CBU MST online RyU online SIUC online TTU online & QD380.M32 UAr online UCSD online UE online UM aael QD471.M177 USD online UT online UTor online UWa online
(1 items found as of 10/23/2009)
v42#1-v42#20 checked 10/23/2009 low priority

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Magnesium technology xxxx
FSU dirac TN799.M2M26 LH TN799.M2 MST wilson TN799.M2M2595 NWU sci 669.723M1964 OSU sel TN799.M2M26 PU eng 669.723Em56p & 669.723M274 RU fondren TN799.M2M258 TTU TN799.M2M26 UCF main TN799.M2M258 UH TN799.M2M26 UK eng TN799.M2M26 UM aael TN799.M2M561 UOk eng TN799.M2M272 UTo carlson TN799.M2M26
86,87,00,02-03,07 checked 8/14/2009

Magnesium technology 2005 : proceedings of the symposium held during the 2005 TMS Annual Meeting in San Francisco, California, U.S.A., Feb. 13-17, 2005 /

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Manufacturing Business Technology
http://www.mbtmag.com/ IU online Lexmark NWU online OkSU main 670.5M29411 OSU online PU eng 670.285M319 SDSU online SIUC online UAr online UCSD online UIC online UM aael TS155.A1M391 UOk online USD online UT online
(4 items found as of 10/6/2009)
-Jun09 checked 10/6/2009

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Manufacturing Computer Solutions

WEEE won't come you'll just have easy to wait Dwyer, John Manufacturing Computer Solutions, vol. 11 no. 3, Mar. 2005, pp. 36-37

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Manufacturing Engineering
CBU Lexmark MST online OkSU online OSU sel TJ1180A1P92 SDSU online SIUC morris 53371-6214 SIUE lovejoy microfiche TTU UAr online UCSD online UE UK online & eng TJ1180.A1A6 UL kersey TJ1180.A1A6 UT online
(3 items found as of 4/19/2009)

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Marb. Ber.

Marbach? Marbacher? F. Richarz, Marb. Ber. 1904, S. 61.

A. Wigand, Marb. Ber. 1904, S. 61.

F. Richarz, Marb. Ber. 1904, S. 66.

A. Wigand, Marb. Ber. 1906, S. 196.

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Materia Japan
Bulletin of the Japan Institute of Metals
Nihon Kinzoku Gakkai kaiho
LH closed RU fondren TN4.M5
(1 items found as of 4/19/2009)
v43#8

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Material Science and Technology
Cailiao Kexue yu Gongyi
LH closed UF online UTo online
priority

(new references 12/30/2008)
Wu, An-Ru, Xia, Chang-Qing .Study of the property of Sn-Ag-Sb-Zn lead-free solder containing trace elements Cailiao Kexue yu Gongyi/Material Science and Technology, v 15, n 5, October, 2007, p 730-733 Language: Chinese

Tian, Jun, Hao, Hu, Shi, Yao-Wu, Lei, Yong-Ping, Xia, Zhi-Dong .Microstructure and performance of SnAgCuEr lead-free solders with rare earth Cailiao Kexue yu Gongyi/Material Science and Technology, v 16, n 2, April, 2008, p 281-283 Language: Chinese

Huang, Hui-Zhen, Zhou, Lang, Wei, Xiu-Qin, Ye, Zhe-Chuan .Microstructures of solidified Sn-9Zn lead-free solder alloy and their evolution in aging Cailiao Kexue yu Gongyi/Material Science and Technology, v 16, n 3, June, 2008, p 374-377 Language: Chinese

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Materials and Corrosion
Werkstoffe und Korrosion
AU online BYU online FSU online GIT online LH closed LU gray TA401.W45 MST online NWU online OrSU online OSU online PU eng 691.7W49 & hicks 691.7W49 RU online SDSU online SIUC online UAB online UAr online UC online UCF online UCI online UCSD online UIC online UIUC online UK online UM online & buhr TS200.W48 UMC online UNF online USF online USU online UTA storage 669.05W493 UTo online WrSU online
(3 items found as of 12/29/2009)
v57#1-v60#12 Early View to Dec. 29, 2009 checked 12/29/2009

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Materials and Design
AU online GIT online & main-5e TA401.M375X LH closed MST wilson TA401.I79 NWU online OkSU online OrSU online OSU online PU online RU online SDSU online UC online UCI online UDe online UF online UIC online UIUC online UM online & aael TA401.I66 UMC online USD online USU online UTA online UTo online WrSU online
(2 items found as of 4/19/2009)

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Materials and Manufacturing Processes
OkSU online SDSU online SIUC online UAr online UCSD online UM online & aael TS183.M42 UOk online USD online UT online
(1 items found as of 4/19/2009)
v17#6

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Materials Australia
LH closed UM online sd
(1 items found as of 4/19/2009)
v46#2-v46#3

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Materials Chemistry and Physics
OkSU online OSU online RyU online SDSU online UCSD online UM online sd UT online UTor online UWa online
(>=20 items found as of 10/4/2009)
v110#1-v118#3 Articles in Press to Oct. 16, 2009 checked search terms up through v109 checked 10/22/2009 low priority

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Materials Engineering
CBU Lexmark MST wilson TN1.M34 OkSU stillwater TN1.M34 SDSU TN1.M34 TTU UAr mullins TN1.M34 UCSD s&e TN1.M4253 UE UK eng TN1.M34 UL kersey TN1.M34 OSU sel TN1M58
(14 items found as of 4/19/2009)

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Materials Letters
FSU online & dirac 620.5M4255 GIT online & main-5e TA401.M377X IU bloomington swain TA401.M37 NWU online OkSU online OSU online & sel TA401M289 PU eng 620.1105M418 & hicks 620.1105M418 RU fondren TA401.M328 RyU online SDSU online UAr online UC online & eng TA401.M37 UCF online UCSD online UD online & roesch UIC online UM online & aael TA401.M434 UOk online UT online UTor online UWa online VU online
(>=20 items found as of 10/222009)
v38#1-v63#30 Articles in Press to Oct. 21, 2009 checked 10/22/2009 low priority

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Materials for Mechanical Engineering

Zhou, Jian, Sun, Yang-Shan, Xue, Feng Current status and trends in research of lead-free solders in electronics. Mater. Mech. Eng. Vol. 29, no. 3, pp. 11-13, 21. Mar. 2005

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Materials Performance
MST wilson TA462.M373 OkSU main 620.1122M4271 OSU TA462A1M322 SDSU TA462.M373 SIUC morris 53392-6203 UAr mullins TA462.M373 UCSD s&e TA1.M426 UK eng TA462.M373
(1 items found as of 4/19/2009)
v29#4

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Materials Research Society Symposium Proceedings
Materials Research Society Symposia Proceedings
AU rbd various FSU dirac various GIT online & main-5e various MST wilson various OkSU main 621.381046A244 OSU book TA418.6.B42 SDSU various SIUC morris various TTU various UAB sterne various UAH salmon various UAr mullins verious UC eng TA401.3.C637 UCF main various UCSD online UF sci various UH TK7801.15.E44 UM various UMe mcwherter various USF various UT various UTo various WSU various
(>=20 items found as of 4/19/2009) priority

(new references 12/29/2008)
Liang, Cai, Mathison, Leslie, Prorok, Barton C. .Mechanical property measurement of interconnect materials by magnetostrictive sensors Materials Research Society Symposium Proceedings, v 968, Advanced Electronic Packaging, 2007, p 133-138

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Materials Science and Engineering: A
AU online MST wilson TA401.M3612 OkSU online OSU sel TA401.M34 SIUC online TTU UAB sterne TA401.M384 UAr mullins TA401.M384 UCF online UCSD online UK online sd & eng TA401.M382 UM online & aael TA401.M4381 UT online & hodges TA401.M38
(>=20 items found as of 12/29/2009)
v419#1-v527#4 articles in press to Dec. 29, 2009 checked 12/29/2009

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Materials Science and Engineering B: Solid-State Materials for Advanced Technology
MST online NWU online & sci L620.105M4251b OkSU online OSU online & sel TA401.M342 PU hicks 620.105M419b SIUC morris 56989-6201 TTU UAr mullins TA401.M3842 UC online & eng TA401.M3944 UCSD online UD online UIC online & daley TA401.M386 UK online sd UL online & kersey TA401.M3833 UM online & aael TA401.M4381 UT online & hodges TA401.M342
(14 items found as of 12/29/2009)
v148#1-3,v161#1-3 checked 12/29/2009

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Materials Science and Engineering C
MST online NWU online & sci L620.1105M4254 OkSU online OSU online & sel TA401M343 PU hicks 620.105M419c TTU UC online & eng TA401.M3862 UCSD online UD online UIC online UK online sd UL online & kersey TA401.M3834 UM online & aael TA401.M4382 UT online & hodges TA401.M343
(0 items found as of 4/19/2009)

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Materials Science and Technology
AU rbd TS200.M4742 CBU online MST online NWU online & sci 669.05M58a OkSU stillwater 669.05M425 OSU sel TA401.M34 PU online SDSU online SIUC online UAB online & sterne TA459.M42 UAH online UAr online UC eng TA459.M42 UCSD online UK online UL kersey TA401.M383 UM online & aael TN1.M42 USD online UT online & hodges TN1.M492
(>=20 items found as of 12/29/2009)
v2#1-v25#12 checked 12/29/2009

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Materials Science Forum
ISU online MST wilson TA401.M29 NWU sci 620.112M4255 OSU sel various UAR verious UC online & various UCSD online UIC daley TA401.3.M3793 UK eng TA401.3.M3793 UM online & various UMe mcwherter UNL eng TA401.3.P33 UT hodges TA401.3.M3793 & various UTo carlson TA401.3.M3793 WSU sci TN695.I593
(>=20 items found as of 4/19/2009)
v534-536,v539-545,v561-565,v575-578,v580-582 checked 4/15/2009 priority

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Materials Science in Semiconductor Processing
AU online FSU online GIT online LH closed MST online NWU online OGI online OkSU online OrSU online OSU online PU online RU online RyU online SDSU online UAr online UCF online UCI online UCSD online UDe online UF online UIUC online UM online & aael TK7872.S4S4731 UMC online UNF online USF online USU online UT online UTA online UTo online UWa online WrSU online
(1 items found as of 10/22/2009)
v10#4-v11#6 Articles in Press to Oct. 17, 2009 checked 10/22/2009 low priority

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Materials Science Research International
LH closed
(1 items found as of 4/19/2009)

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Materials Technology
OSU online UC online UM aael TA403.6.D42 UT hodges TA401.M25
(6 items found as of 4/19/2009)
v22#3 checked 3/9/2009

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Materials, Technology and Reliability for Advanced Interconnects
Materials, Technology and Reliability of Advanced Interconnects (MRS Proceedings)
FSU dirac TK7871.85.M36783 PU eng 621.38152M41895 SDSU TK7871.85.M384 UAr mullins TK7871.85.M3454 UC eng TK7871.85.M3454 UCSD s&e TK7871.85.M35 & TK7871.85.M369 & TK7871.85.M3692 UM online & aael TK7871.85.M367831 UOk eng TK7871.85.M3454 UTor eng TK7871.85.M36783 UWa davis TK7871.85.M3454x
(3 items found as of 4/19/2009)
00-01,03-05 checked 3/31/2008 priority

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Materials Transactions
Materials Transactions, JIM
LH closed NWU sci 669.06J35t OkSU main 669.06N719tb OSU sel TN4.N53 PU eng 669.06J27t & hicks 669.06J27t RU fondren TN4.N52 SIUC morris 52963-6693 UC eng TN4.N5 UCI sci TN4.N5 UCSD s&e TN1.N7 UM aael TN4.N72 UMe online & mcwherter UOk bizzell TN4.N5 UT hodges TS300.N56 UTor eng TN4.N462 & TN4 .N4622 WSU online & sci
(>=20 items found as of 5/20/2009)
v30#1-v50#2 checked 5/13/2009 priority

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Materials World
Materials world the journal of the Institute of Materials
BYU hbll TP785.B863x FIT online FSU online GIT main TN1.M3737 LH closed MST online NWU online OkSU stillwater 669.05M4255 OSU online PU eng 620.1005M4184 & eng 669.05M5766 SDSU online SIUC online SU online TTU UCI online UCSD online UDe online UIUC eng Q.620.1105MAT UK online & remote TN1.M51543 & TN1.M3737 UM aael TA401.M46 UMC online UNF online UOk online USD online USF online UT hodges TN1.M3737 UTA online WrSU online
(14 items found as of 4/29/2009)
v1#1-v13#3,v13#5-v17#4 checked 4/29/2009

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Materialwissenschaft und Werkstofftechnik
MST online OkSU online OSU online SDSU online SIUC online UAr online UC online & sw depository TA401.Z38 UCSD online UD online UL online wiley UM online UOk online USD online UT online
(2 items found as of 4/19/2009)

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Measurement and Control
GIT storage TJ212.M37 & main-5e TA165.M4X LH closed LU gray TJ1313.I9 NWU sci L620.7805M484 OkSU main 629.805M4843 OSU sel TJ212.M4 PU hicks 629.805M463 SIUC morris 51555-6812 UCI sci drum TJ212M372 UCSD s&e TK1.M484 UIUC eng 629.805ME UM online & buhr TA165.A1M48 UMe mcwherter UTA online WrSU online
(1 items found as of 4/19/2009) priority

(new references 12/30/2008)
Wade, Martin .Recycling Waste Electrical and Electronic Equipment Measurement and Control, v 38, n 7, September, 2005, p 212

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Mechanics of Advanced Materials and Structures
AU online FIT online GIT online & main-5e TA418.9.C6M42 IU online LH closed MST online NWU online OGI online OkSU online OrSU online OSU online PU online SDSU online SIUC online SU online UAH online UAr online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UK online UM online UMC online UOk online USD online USF online USU online UT online UTo online WrSU online
(1 items found as of 12/29/2009)
v14#1-v16#8 checked 12/29/2009

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Mechanics of Materials
AU online FSU online GIT online & main-5e TA409.M424X LH closed NWU online OkSU online PU online UC online UCF online UCI online UCSD online UD online UDe online UIC online UM online & aael TA405.M491 USF online UTA online UWa online
(3 items found as of 10/22/2009)
v11#1-v26#4,v39#7,v41#1-v41#12 In Press to Oct. 21, 2009 checked 10/22/2009 low priority

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Medical Device & Diagnostic Industry
http://www.devicelink.com/mddi/index.html RyU online SDSU online
(3 items found as of 12/25/2009)
v30#7-v31#12 checked 12/25/2009 priority

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Medical Electronics Manufacturing
http://www.devicelink.com/mem/archive/05/10/contents.html SDSU online
(3 items found as of 12/25/2009)
checked 12/25/2009

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xxxx Medical Electronics Symposium Conference Proceedings
http://www.smta.org/knowledge/knowledge.cfm
(6 items found as of 11/6/2009)
04-08 checked 11/6/2009 priority

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Medical Product Manufacturing News
http://www.devicelink.com/mpmn/ SDSU online
(4 items found as of 12/25/2009)
Mar97-Dec09 checked 12/25/2009

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Memoires de l'Academie de St. Petersbourg
M‚moires de l'Acad‚mie imp‚riale des sciences de St.-P‚tersbourg
ISU storage Q7AK14M7 IU bloomington wells AS262.A3 MSU oversize K321.R8 NWU sci L520.6A313 OSU sel MICROFICHE3AS7 UC phys AS262.L443M UCB pascal 506Ak13mser.7 UCSD rare oversize QL613.Z35 UM buhr various VU annex 506.A312m

Fritzsche, J., Mem. Acad. St. Petersbourg (1), 7 nr. 5, pp. 15 (1870).

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Metal Finish

INDIRA KS; UDUPA HVK SULFAMATE BATHS FOR LEAD AND LEAD ALLOY DEPOSITION Metal Finish, vol. 69 no. 1, Jan. 1971, pp. 94-101

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Metal Finishing
http://www.metalfinishing.com/ Lexmark OkSU online OSU online & sel TS550M5 SDSU online UC online & eng TS550.M4 UCSD online UK eng TS213.B7 & king TS550.M3 UM online sd & buhr TS200.M5873 UT online & hodges TS550.M3 UTor online UWa online VU online
(>=20 items found as of 10/4/2009)
v73#1-v107#5 checked 10/4/2009 priority

(new references 4/3/2009)
Walker, R. "Internal Stress in Electrodeposited Metallic Coatings," Metal Finishing Monograph, p. 32, 1968.

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Metal Industry
MSU remote TS200.M35 NWU sci L671.05M5871 OSU depos TS550M52 PU eng 669.05M558 & hicks 669.05M558 UC sw depos TS550.M4 UK king TS550.M3 UM buhr TS200.M587 UT hodges closed TS550.M3 WSU sci & storage
(2 items found as of 4/19/2009)

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Metal Progress
MST wilson TS200.M36 OSU sel TS200A76 SDSU TS200.M36 SIUC morris 53451-6711 TTU UAr mullins TS200.M36 UCSD s&e TS1.M587 UE UK online & UK eng TS200.M36 UL kersey TS200.M36 UOk bizzell TS200.M36 UT hodges & storage TS200.M36 UTo carlson & storage WSU sci & storage
(2 items found as of 4/19/2009)

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Metal Science and Heat Treatment
MST online OkSU online SDSU online SIUC online UAr online UC online & eng TN671.M4 UCSD online UK online & eng TN4.M3213 UM online & aael TN4.M563 USD online UT online & hodges TN4.M4
(1 items found as of 4/19/2009)

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Metalloberflaeche
AU rbd TS200.M464 LH closed UM buhr TS200.M5899
(1 items found as of 4/19/2009)

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Metallurgical Analysis
Yejin Fenxi
LH closed
priority

(new references 12/30/2008)
Zhang, Jia-Qi, Zhu, Zi-Ping, Wang, Jun-Xiang .Comparison of methods for stripping steel sheet coating and determining hexavalent chromium Yejin Fenxi/Metallurgical Analysis, v 28, n 2, February, 2008, p 59-62 Language: Chinese

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Metallurgical and Materials Transactions A
CPL MST online OkSU online OSU sel TS200.M6192 PU eng 669.005M5641a RyU online SDSU online SIUC morris 51829-6693 TTU online UAr online UC eng TN1.M481 pt.A UCI online & sci TS300.M4 UCSD online UH TN1.M531 UK online & eng TN689.M47 UL kersey TN689.M47 UM online & aael TN1.M572 UOk online USD online UT hodges TS300.M475 UTor online UWa online VU online
(>=20 items found as of 12/29/2009)
v28A#1-v41A#1 online First to Dec. 29, 2009 checked 12/29/2009 low priority

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Metallurgical Review of MMIJ
UU marriott TN1.M4725
(0 items found as of 4/19/2009)

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Metals and Alloys
IU indianapolis OkSU north_boomer 669.05M588 OSU sel TN1M582 & depos TN1M58 & TN1M582 PU hicks 669.05M556 SDSU compact TN1.M34 SIUE lovejoy UAr mullins TN1.M34 UC sw depos TS200.M4 UCSD s&e TN1.M4253 UD roesch UIC warehouse TN1.M35 UL kersey TN1.M34 UM buhr TN690.M587m UT hodges microfilm TN1.M34
(0 items found as of 4/19/2009)

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Metals and Materials
NWU sci 669.005M587 & 669.05M5876 OkSU main 669.05M58758 OSU depos TN1M507 PU hicks 669.06In7b & 669.005M563 SDSU TN1.M4 SIUC morris 54561-6691 UAr mullins TN1.M435 UC online & eng TN1.M482 UCSD s&e TN1.M5878 UD roesch UIC warehouse TN1.M5756 UK eng TN1.M5756 UM aael TN1.M58265 UT hodges TN1.M483
(1 items found as of 4/19/2009)

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Metalurgija
AU online FIT online FSU online IU online LH closed MST online NWU online OGI online Oksu online OrSU online SDSU online SIUC online SU online UD online UDe online UF online UIC online UIUC oak Q.669.05MEG UK online UMC online UTo online WrSU online
(1 items found as of 4/19/2009)

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Metaux et Corrosion
LH closed PU hicks 669.05M5605 MWU sci L620.1122M587 UK eng TN1.M480 UM buhr TS200.M63 WSU storage
(0 items found as of 4/19/2009)

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MICRO
http://www.micromagazine.com/ OkSU online SDSU online SIUE lovejoy UAr mullins QA76.5.M52153 UCSD ssh annex QA75.5.M5 UM aael TK5.I12
(1 items found as of 4/19/2009)
Jan1997-July2006 (ended publication) checked 4/3/2009

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Microelectronic Engineering
OkSU online OSU online PU online & eng 621.38413405M583 RyU online SDSU online UC online & eng TK7871.85.M5 UCI online & sci TK7871.85M527 UCSD online UD online UM online & aael TK7874.M6355 UOk online UT online UTo online UTor online UWa online
(>=20 items found as of 10/222009)
v65#1-v86#12 In Press to Oct. 21, 2009 checked 10/22/2009 low priority

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Microelectronics International
MST online NWU online OkSU online OSU online RyU online SDSU online UAr online UC online UIC online UK online UM online UOk online UT online UTor online UWa online
(>=20 items found as of 12/29/2009)
v13#1-v26#3 checked 12/29/2009 low priority

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Microelectronics Journal
IU online MST online OkSU online OSU online PU online & eng 621.381705M584 SDSU online UAr online UC online & eng TK7874.M476 UCSD online UD online UIC online UK online sd UL online & kersey TK7874.M476 UM online UOk online UT online
(8 items found as of 12/29/2009)
v32#1-v40#12 Articles in Press to Dec. 29, 2009 checked 12/29/2009

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Microelectronics News
http://www.npl.co.uk/server.php?show=nav.636 SDSU online
(>=20 items found as of 4/19/2009)
#16-#24 checked 4/3/2009 priority

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Microelectronics Reliability
Microelectronics and Reliability
AU online & rbd TK7870.M456 MST depos 621.381El25m NWU sci L621.3805E3852 OkSU online OSU online PU online & eng 621.381EL255 & hicks 621.381EL255 RU fondren TK7870.M48 SDSU online RyU online SIUC online UAB online UC online & eng TK7870.M456 UCF online & main TK7870.M456 UCSD online UD online UIC online & UIC warehouse TK7870.M456 UK king TK7870.M456 UM online & aael TK7815.A1E47 UOk online UT online & hodges TK7800.E54 UTor online UWa online VU online WSU online
(>=20 items found as of 10/22/2009)
(1990)v30#1-v49#11 In Press to Oct. 3, 2009 checked 10/22/2009 low priority

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Microelectronics Reliability and Qualification Workshop
http://www.aero.org/conferences/mrqw/
(8 items found as of 4/19/2009) priority

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Microsystem Technologies
Microsystem technologies sensors, actuators, systems integration
AU online FSU online GIT online IU online MST online NWU online OGI online OkSU online OrSU online OSU online PU online RU online SDSU online SIUC online UC online UCF online UCI online UCSD online UDe online UF online UIC online UK online UM online & aael TK7874.M526 UMC online UNF online UOk online USD online USF online UT online UTA online UTo online
(14 items found as of 12/29/2009)
v11#1-v16#3 online First to Dec. 29, 2009 checked 12/29/2009

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Microwave Engineering Europe
IU online MSU online NWU online OkSU online OSU online SDSU online SIUC online UAr online UCB online UIC online UOk online USD online VU online WSU online

"High frequency passives roundup - Integration and packaging," Microwave Engineering Europe no. FEB., Feb. 2006, p 16-18

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Microwave Product Digest
(1 items found as of 1/2/2010)
May09,Aug09-Dec09 checked 1/2/2010

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Microwaves & RF
http://mwrf.com/Issues/ MST online OCU beam microfiche OkSU online SDSU online SIUC online TTU UAr online UCSD online UOk online USD online
(4 items found as of 12/25/2009)
-v48#11,v48#13 checked 12/25/2009

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Military & Aerospace Electronics
http://mae.pennnet.com/ IU bloomington alf UG485.M484 KYVL MST online NWU online OkSU online OSU online SDSU online SIUC online UAr online UCSD online UIC online UK online UOk online USD online UT online
(>=20 items found as of 12/29/2009)
Jan00-v20#12(Dec09) checked 12/29/2009

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Mineral Processing
Aufbereitungs-Technik
SDSU online UIUC main Q.620.105AU USU online
(2 items found as of 4/19/2009) priority

(new references 12/29/2008)
Anon .Einsatz von fritsch labormuhlen fur WEEE und RoHS-tests (Application of fritsch laboratory mills for WEEE and RoHS tests) Aufbereitungs-Technik/Mineral Processing, v 47, n 6, June, 2006, p 48 Language: German, English

Schunicht, Jorg .Ruckgewinnung von Metallen aus E-Schrott-Moderne Sortierverfahren in der Praxis (Recovery of metals from waste electrical and electronic equipment - Modern separating processes in the field) Aufbereitungs-Technik/Mineral Processing, v 48, n 9, September, 2007, p 4-10 Language: German, English

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Minerals Engineering
IU online MST online OkSU online OSU online SDSU online SIUC online UC online UCSD online UD online UIC online UK online sd UL online UM online UOk online UT online
(1 items found as of 4/19/2009)

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Mobile Handset DesignLine
http://www.mobilehandsetdesignline.com/
(1 items found as of 4/19/2009)
checked 4/3/2009

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Modeling, Control, and Optimization in Ferrous and Non-Ferrous Industry
LH TN605.M62 MST wilson TN605.M57
(1 items found as of 4/19/2009)

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Modelling and Simulation in Materials Science and Engineering
http://www.hindawi.com/journals/mse/contents.html AU online BYU online FIT online GIT online IU online LH closed MST online NWU online OGI online OkSU online OrSU online OSU online PU online RU online SIUC online SU online UAB online UAr online UC online UCI online UCSD online UD online UDe online UIC online UIUC online UK online UM online UMc online UOk online USD online USU online UT online UTA online UTo online WrSU online
(1 items found as of 4/19/2009)

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Modern Chemical Industry
Xiandai Huagong
LH closed

Lin, Xiao, Cao, Hong-Bin, Li, Yu-Ping, Zheng, Shi-Li, Zhang, Yi Advances in precious metal recovery from WEEE Xiandai Huagong/Modern Chemical Industry, vol. 26 no. 6, June 2006, p 12-16

Language: Chinese

-------------------------------------------------------
Modern Plastics Worldwide
http://www.plasticstoday.com/mpw AU online BYU hbll TP1101.M63x FIT online FSU online GIT online & main-6e TP986.A1M6 IU online LH closed LU gray TP986.A1M6 NWU sci L660.5M689 OCU beam microfiche OrSU valley TP986.A1M6 OSU online PU online RU fondren TP986.A1M6 SDSU TP986.A1M6 SIUC morris 53510-6732 SU online TTU UAr mullins TP986.A1M63 UC cas TP986.A2M58 UCF main TP986.A1M6 UDe online UF online UIC daley TP986.A1M6 UM online UMC online UNF online UOk bizzell TP986.A1M6 USF online USU merrill-cazier TP1101.M622 UTA online UTo online WrSU online
(1 items found as of 12/25/2009)
v83#9,v86#9-v86#10 checked 12/25/2009

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Molecular Physics
AU online FSU online LH closed MST online NWU online OGI online OkSU online OrSU valley QC173.M57 OSU sel QC173.A1M6 PU online RU online SDSU online SIUC online SIUE lovejoy SU online UAB online UAr online UCF online UCI drum QC173.M57 UCSD online UD online UDe online UF online UIC online UIUC online UM online UMc online UMe online USF online USU online UTA online UTo online WrSU online
(1 items found as of 4/19/2009)

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Monatshefte fur Chemie und verwandte Teile anderer Wissenschaften
IU bloomington chem QD1.M7 & alf QD1.M7 MST depos 540.5M742 NWU online & sci 540.5M736 OkSU stillwater 540.5M736 OSU online & sel QD1M73 PU online & chem 541.378M7325 & hicks 540.5M74 SDSU QD1.M58 SIUC mclafferty 540.5M736 UAr storage QD1.M7 UC online & chem QD1.M7 UCSD online UD online UIC sci UK chem/phys QD1.M7 & young S92-79 UL kersey QD1.M7 UM online & shapiro QD1.M74 & hatcher FILM X3067 UOk chem/math QD1.M7 USD online UT online & hodges QD1.M6
(1 items found as of 4/19/2009)

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MRS Bulletin
OkSU online OSU sel TA401.M97 UCSD online UM online & aael TA404.2.M115 UTor online UWa online
(2 items found as of 10/22/2009)
v32#4,v34#1-v34#10 checked 10/22/2009 low priority

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MX
http://www.devicelink.com/mx/ MST online OkSU online SDSU online SIUC online UAr online USD online
(2 items found as of 4/19/2009)
-Dec08 checked 4/3/2009

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NNNN

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Nanotechnology and Precision Engineering
Nami Jishu yu Jingmi Gongcheng
LH closed UTo online
priority

(new references 12/30/2008)
Xu, Hong-Bo, Li, Ming-Yu, Kim, Jong-Myung, Kim, Dae-Won .Interfacial reaction and shear properties of lead-free Sn.5Ag solder bumps reflowed by induction self heating Nami Jishu yu Jingmi Gongcheng/Nanotechnology and Precision Engineering, v 5, n 3, September, 2007, p 157-163

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NASA Tech Briefs
http://www.techbriefs.com/ AU online BYU hbll TL521.3.T4U551x FIT govdocs FSU online GIT gov NAS1.29/3-2 IU various LH closed LU gray documents MoSU online MST online NWU main NAS1.29/3-2 OCU beam OkSU online OrSU valley TL521.A5391 OSU sel TL521.N23 & sel TL521.N177 PU online RU fondren gov NAS1.29/3-2 SDSU online SIUC online UAH n1 UAr mullins TL521.A3523 UC online UCF online UCI online UCSD s&e TL521.A3263 UD online UDe online UF online UIC online UIUC online UK various UM online & aael T1.U574 UMC online UMe mcwherter UNF online USF online USU merrill-cazier NAS1.29/3 UT online UTA pcl T1N3855 UTo online WrSU online
(2 items found as of 12/25/2009)
v32#2-v33#12 checked 12/25/2009

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National Bureau of Standards Report
UCSD s&e Q1.U60185 UM aael QD511.A1U582 & hatcher QD511.A1.U582 & buhr Z699.I493x UW suzallo govpub us C13.38:NBS-4576

J. H. Becker, p. 4576 NBS-4576? (1956).

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National Relay Conference
UK eng TK2851.N27
(1 items found as of 4/19/2009)
02 priority

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National Research Council of Canada
UCSD srlf Q1.N2963

Paatsch, W, Kiesner, A. FORMATION OF HIGHLY CORROSION RESISTANT CONVERSION LAYERS BY ZINC ANODIZING. Natl Research Council of Canada, 1984, pp. 107-108, 389-391

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Nature
CPL MST online OkSU online SIUC morris 53572-5001 UAr online UCSD online UD roesch UE UIC online UK online & chem/phys Q1.N2 & king Q1.N2 & young Q1.N2 & med W1NA81 UL kersey Q1.N2 UM aael Q1.N285 USD online UT online & hodges Q1.N2
(4 items found as of 4/19/2009)

J. W. Price nature, 169 (1952), p. 792. *** not applicable ***

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NCMS Embedded Capacitance Conference
(2 items found as of 4/19/2009) priority

--------------------------------------------------------
NEC Technical Journal
NEC giho
http://www.nec.co.jp/techrep/en/journal/index.html GIT main QC501.N112 LH closed MST online OSU sel TK4.N222 UCSD srlf TK7800.N42 UTor online UWa online
(4 items found as of 4/19/2009)
v1#1-v4#1 all checked 4/3/2009 priority

--------------------------------------------------------
Nederlands Tijdschrift voor Natuurkunde
GIT storage QC1.N4 LH closed OSU sel QC1N37 RU fondren QC1.N39 UM hatcher QC1.N377 & buhr QC1.N377 WSU storage
(1 items found as of 4/19/2009)
v20

--------------------------------------------------------
NEPCON Shanghai xxxx
http://www.smta.org/knowledge/knowledge.cfm
(12 items found as of 11/6/2009)
07-08 checked 11/6/2009 priority

Shangguan, D, , Key Topics in Lead-Free Solder PCB Assembly. Proceedings of NEPCON Shanghai, China, 2003, pp. 111-121.

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xxxx NEPCON West - Fiberoptic Expo Conference Proceedings
National Electronic Packaging and Production Conference
Proceedings of NEPCON
Proceedings of the Technical Program NEPCON
http://www.smta.org/knowledge/knowledge.cfm http://www.smartgroup.org/members/seminar.asp GIT main-6e TK7874.N33X IU indianapolis TK7874.N33 Lexmark TK7874.N35 LH TK7870.N3 OkSU main 621.3819N277p SDSU TS195.I58 UCSD s&e TK7874.N33 UL kersey TK7870.15.N46 UM aael TK7870.N29 & buhr TK7870.N29 UT hodges TK7870.N34 UTo depos TK7874.N33
(>=20 items found as of 11/6/2009)
64,71,74,79-81,83,85,90,02,east89,east92,east94-east97,east99,west87, west91-west92,west94-west00 checked 11/6/2009 priority

NEPCON, Birmingham, Oct. 1-3, 2002, pp. xx-xx.

NEPCON South, Brighton, Apr. 2-3, 2003, pp. xx-xx.

NEPCON North, Harrogate, Sept. 16-17, 2003, pp. xx-xx.

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Neue Museumskunde
UMc depos AM49.N46
priority

(new references 2/11/2009)
W. Kurzmann, Neue Museumskunde 1960, 3, 56.

M. Keáler, Neue Museumskunde 1960, 3, 60.

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New Electronics
http://www.newelectronics.co.uk/ http://www.neon.co.uk/
(19 items found as of 4/19/2009)
v36#7-v36#19,v40#1 checked 4/3/2009 priority

(new references 12/30/2008)
Nevison, Gary .You must comply! New Electronics, v 37, n 6, Mar 23, 2004, p 47-48

Knivett, Vanessa .A 'green' partnership New Electronics, v 38, n 1, Jan 11, 2005, p 23-24

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Nikkei Electronics Asia
http://techon.nikkeibp.co.jp/article/HONSHI/20081229/163420/
(11 items found as of 4/19/2009)
checked 4/3/2009

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Nippon Steel Technical Report
OSU TS300N566 RyU online UTA eng TS300.N566 UTor online
(1 items found as of 4/19/2009) v21-v86 checked 9/18/2009 priority

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NPL
National Physical Laboratory
http://publications.npl.co.uk/npl_web/search.htm
-CMMT(A)297, -DEPC-MN038, -DEPC-MPR060, -MAT18, -MATC(A)164, -MATC(MN)57, -MN02
(>=20 items found as of 4/19/2009)
checked 2/1/2009

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NS Electronics Bangkok Technical Conference

Layson, Arlene V, , Qualification of Matte Tin as an Alternative for Tin lead no. S Electronics Bangkok Technical Conference Taipei, Taiwan Dec. 2002 pag 61.

--------------------------------------------------------
NSTI Nanotechnology Conference and Trade Show
UM aael T174.7.N3735 UOk bizzell T174.7.N368 UTor eng T174.7.N373752 UWa davis TK7874.N3195x
(1 items found as of 4/19/2009)
04 checked 9/15/2008 priority

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Nuclear Instruments and Methods in Physics Research, Section A
IU online MST online OkSU online OSU online & sel QC786A1N83 PU online & phys 539.7N877a SDSU online SIUC storage 50962-6814 UAr mullins QC786.N75 UC online & phys QC786.N754 UCI online & sci QC785.5N824 UCSD online UD online UK chem/phys QC785.5.N82 UL ekstrom QC786.N76 UM online & aael QC770.N951 UOk online UT hodges QC786.N75 UTo online & carlson
(2 items found as of 4/19/2009)
v577#3 checked 2/8/2009

-------------------------------------------------------
Nuts and Volts
SIUC online
(1 items found as of 12/25/2009)
May09-Dec09 checked 12/25/2009

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OOOO

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Oberflachen Polysurfaces
LH closed
(1 items found as of 4/19/2009)

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OEN

WEEE update and industry comment [electronic product recycling] oen, June 2005, p 16-18

--------------------------------------------------------
Official Board Markets
AU online FIT online FSU online GIT online & main-4w HD9839.P3O33 IU online OSU online SIUC online SU online UCSD online UDe online UF online UM online UMC online UNF online UOk online USF online UTo online WrSU online
(0 items found as of 4/19/2009)

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Optics and Laser Technology
MST online OkSU online OSU online SDSU online TTU Uar online UCSD online UK online sd UL online & kersey QC350.O66 UOk online UT online
(1 items found as of 12/29/2009)
v41#1-v42#2 Articles in Press to Dec. 29, 2009 checked 12/29/2009

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Overcoming the Reliability Challenge: An IPC Summit
(15 items found as of 4/19/2009)
08 checked 9/21/2008 priority

--------------------------------------------------------
PPPP

--------------------------------------------------------
Pacific Rim International Conference On Advanced Materials and Processing
PRICM
AU rbd TA401.3.F57 UT hodges TA401.3.M3793 UTor eng TA401.3.P33
(1 items found as of 4/19/2009)
92 priority

Boettinger, W. J. Handwerker, C. A. Johnson, C. E. Moon, K. Stafford, G. R. Williams, M. E. (METALLURGY DIVISION - 855) The Formation of Whiskers on Electroplated Tin Pacific Rim International Conference On Advanced Materials and Processing , Dec. 11-15, 2001 , Honolulu, HI - Dec. 1, 2001

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Pakkred Technical Conference

Sriyarunya, Anocha, , Lead-Free Plating on Integrated Circuits, AMD(Thailand) LTD. Pakkred Technical Conference Taipei, Taiwan Dec. 2002 pag 94

Stoney, G. G, , Proc. R. Soc, 82, 173, 1909.

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xxxx Pan Pacific Symposium Conference Proceedings
xxxx Pan Pacific Microelectronics Symposium & Exhibit
http://www.smta.org/knowledge/knowledge.cfm
(>=20 items found as of 11/6/2009)
99-09 checked 11/6/2009 priority

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PCB Design Conference East xxxx
PCB West

Maria Leet Socolof, and Jack R. Geibig, "Life Cycle Assessment of Lead-Free Solder," PCB Design Conference East 2004, Manchester, NH, Oct. 5-6, 2004. E-mailed 11/19/2007

Geibig, Jack, and Socolof, Maria, jgeibig@utk.edu. "Lifecycle Assessment of Lead-free Solders in the Electronics Industry: Application and Insights" (PCB Design West, Mar. 2005)

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PCB007
http://www.pcb007.com/
(>=20 items found as of 4/19/2009)
checked 4/3/2009

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PCIM Inter `98 Japan Conference
priority

(new references 6/5/2009)

Prymak, John, "Low ESR Tantalum Developments for SMPS Applications," PCIM Inter `98 Japan Conference, Japan, Apr. 1998.

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Philosophical Magazine
London, Edinburgh and Dublin Philosophical Magazine and Journal of Science
KU anschulz Q1.P5 MST depos 505P54 MSU remote Q1.P5 NWU sci 530.5L84 OkSU online OSU online & Q1P586 PU phys 530.5P54s SDSU Q1.P5 SIUC online TTU UAr online UC phys Q1.P5 UCF online UCSD online UIC warehouse Q1.P5 UK online & chem/phys QC1.A36 UL kersey Q1.P5 UM online & aael QC1.L855 UOk online UT online & hodges Q1.P5 UTo depos WSU sci & storage WUSL westc QC1.P36
(10 items found as of 4/19/2009) priority

(new references 5/30/2009)
D.R. Overcash, E. P. Stillwell, M. J. Skove and J. H. Davis, "Deformation Twinning in Zn, Sn, and Bi Single Crystal Whiskers", Phil. Mag., Vol. 25, No. 6, 1481-1488, 1972.

-------------------------------------------------------
Philosophical Magazine Letters
IU online & swain QC176.A1P49 MST online OkSU online OSU online & sel QC1P47 PU online & phys 530.5P54L SIUC online SIUE lovejoy UAr online UC online & phys Q1.P52 UCI online & sci Q1P512 UCSD online UK online & chem/phys QC176.A1P4420 UM online & aael QC176.A1P567 UOk online USD online UT online & hodges Q1.P53 UTo online & carlson
(2 items found as of 4/19/2009)

-------------------------------------------------------
Photonics Spectra
http://www.photonicsspectra.com/google/ CPL washington IU QC350.O624 MST wilson TS510.O6 NWU sci 535.8405O62 OkSU stillwater 681.405P575 PU hicks 535.05Op71 SIUC storage 56191-6811 SIUE lovejoy UC phys QC350.O66 UCSD s&e QC1.O6186 UD roesch UIC warehouse TS510.O6 UM shapiro QC350.O622 UT online & hodges TS510.O6
(0 items found as of 4/19/2009)
-Dec08 checked 1/27/2009

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Photonics Tech Briefs
http://www.ptbmagazine.com/
(1 items found as of 4/19/2009)
-Mar09 checked 4/3/2009

-------------------------------------------------------
Physica B: Condensed Matter
IU online & bloomington swain QC1.P4532 & alf QC1.P4532 MST online NWU online & sci 530.5P5784 OkSU online OSU online & sel QC1P5619213 PU online SDSU online SIUC online SIUE lovejoy TTU UAr online UC online & phys QC1.P45 UCSD online UD online UIC sci QC1.P38332 UK online sd UL online & kersey QC1.P3832 UM online & shapiro QC1.P578131 UMe mcwherter UT online & hodges QC1.P3814
(2 items found as of 4/19/2009)

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Physica Status Solidi
IU bloomington alf QC176.A1P522 MST online NWU online & sel 539.205P578 OkSU online OSU sel QC1P564 PU online & phys 530.5P562 & 530.4105P569a & 530.4105P569b SDSU QC176.A1P5 SIUC online SIUE storage TTU UAr mullins QC176.A1P5 UC online & phys QC176.A1P4 UCSD online UD online & roesch UIC warehouse QC176.A1P5 UK online & chem/phys QC176.A1P5 UL kersey QC176.A1P5 & QC176.A1P513 UM online & aael QC176.A1P58 & shapiro QC1.P579 UOk online UT online & hodges & closed QC176.A1P5
(4 items found as of 4/19/2009)

-------------------------------------------------------
Physical Review
CBU MST online NWU sci L530.5P578 OkSU online OSU online & sel QC1S6805 SDSU online SIUC online SIUE online TTU online UAr online UCSD online UE UK chem/phys QC1.P4 UL kersey QC1.P4 UOk online USD online UT online & hodges QC1.P4
(6 items found as of 7/10/2009)

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Physical Review Letters
IU online & bloomington swain QC1.P51 & alf QC1.P51 MST online NWU online & sci L530.5P57811 OkSU online OSU online & sel QC1P571 & depos QC1P571 PU online & chem 530.5P56a & phys 530.5P56a & hicks 530.5P56a SDSU online SIUC online SIUE online TTU online UAr online UC online & phys QC1.P48 UCSD online UD online & roesch remote UE UIC sci UK chem/phys QC1.P4 & QC1.P43 UL kersey QC1.P4315 & QC1.P432 UM online & aael QC1.P5813 & shapiro QC1.P5813 & buhr QC1.P5813 UOk online USD online UT online & hodges QC1.P43
(3 items found as of 4/19/2009)

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Physics Letters A
IU online MST online OkSU online OSU online PU online & chem 530.5P56415a & phys 530.5P56415a SDSU online SIUC online SIUE online UAr online UC online UCI online & sci QC1.P656 UK online & chem/phys QC1.P45 UM online & aael QC1.P58293 UOk online UT online & hodges QC1.P653 UTo online & carlson & nw depos
(1 items found as of 4/19/2009)

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Physics Today
CBU IU online & bloomington swain QC1.P54 & alf QC1.P54 KYVL MST online NWU online & sci 530.5P5787 OCU beam OcSU online OSU online & sel QC1P5753 PU phys 621.05In25 & 530.5P5642 & chem 530.5P5642 SDSU online SIUC online SIUE lovejoy TTU UAr online UC phys QC1.P65 UCSD online UD roesch UE UIC online & sci QC1.P658 UK online & chem/phys QC1.P658 UL kersey QC28.I49 & QC1.P658 UM online & aael QC1.P583 & shapiro QC1.P583 UOk online USD online UT online & hodges QC1.P658
(1 items found as of 4/19/2009)

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Physikalische Zeitschrift der Sowjetunion
IU bloomington alf QC1.P574 NWU sci 530.5P5785 OSU sel compact QC1P582 PU phys 530.5P568 UAr storage QC1.P77 UC phys QC1.P75 UM buhr QC1.P587 UOk bizzell QC1.P77
(1 items found as of 4/19/2009)

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Plant Engineer (London)
AU rbd TJ164.I643 LH closed

Cork, Laura Recovery position Plant Engineer (London), vol. 50 no. 3, May/June 2006, p 22-23

-------------------------------------------------------
Plastics Additives and Compounding
Plastics, Additives & Compounding
MST online OkSU online OSU online SDSU online UCF online UCSD online UM online UT online
(1 items found as of 4/19/2009)

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Plastics Engineering
AU online CBU FSU online GIT online & main-6e TP1101.52X Lexmark LH closed LU gray TP986.A1S573 MST online NWU sci L668.405S111 OCU beam OkSU online OrSU valley TP986.A1S2 OSU sel TP986.A1S62 PU eng 668.45So15 & hicks 668.45So15 RU online SDSU online SIUC morris 53832-6732 SU online UAr online UC eng TP986.A1S15 UCF main TP986.A1S573 UCSD s&e TP1.S64 Ude online UF online UIC online UIUC online UK eng TP1101.P513 UM online & aael TP986.A1S67 UMC online UNF online USF online UTA online UTo carlson WrSU dunbar TP1101.P513
(6 items found as of 10/5/2009)
v62#1-v65#8 checked 10/5/2009

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Plastics Technology
http://www.ptonline.com/ IU online Lexmark MST online NWU online & sci 668.405P717 OSU online & sel TP986A1P72 PU eng 668.45P698 & hicks 668.45P698 SDSU online SIUE online UAr online UC cas TP1101.P557 & eng TP1101.P557 UCSD online UD roesch UIC online & warehouse TP1101.P557 UK online & eng TP1101.P557 & eng microfilm S-33 UL kersey TP986.A1P529 & film x31TO22 UM online & aael TP986.A1P74 & buhr TP986.A1P74 USD online UT online
(9 items found as of 12/29/2009)
-v55#12(Dec09) checked 12/29/2009

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Plating & Surface Finishing
Monthly Review American Electroplaters Society
Plating
Plating: Monthly Review American Electroplaters Society
AU rbd TS670.P5 IU indianapolis Lexmark MST wilson TS670.A3 MSU eng TS670.A1P5 NWU sci L671.7305P716 OkSU main 671.05P7161 OSU depos TS670A1A5 SIUC morris 53835-6712 UC depository TS670.A3 & eng TS670.A3 UCSD s&e TS1.P73 UD roesch 2nd UH TS670.A1P55 UIC warehouse TS670.A3 UM shapiro TS670.A1A5 & buhr TS670.A1A5 & buhr TS670.A1A51 & buhr TS670.A1A51B UWa annex TS670.A3
(>=20 items found as of 8/14/2009)
v11-v12,v18,v31,v34-v94#11 checked 8/14/2009 priority

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Pollution Engineering
MST online OCU beam OkSU online OSU online PU eng 628.505P766 SDSU online SIUC online UAr online UCI online & sci TD172P66 UD roesch UK online UL TD172.P66 UM aael TD172.P78 USD online UT online & hodges TD172.P66 UTo online & carlson
(1 items found as of 4/19/2009)

-------------------------------------------------------
Polymer
MST online SDSU online SIUC online UAr storage TP156.P6P6 UCSD online UK online sd UM aael TP156.P6P67 USD online UT online
(1 items found as of 4/19/2009)

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Polymer Degradation and Stability
AU online FSU online GIT online LH closed MST online NWU online OrSU valley QD380P637 OSU online PU online RU online SDSU online UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UK online & eng QD380.P637 UM online UMC online UNF online UOk online USF online USU online UT online UTA online UTo online WrSU online
(1 items found as of 4/19/2009)
v88#1 checked 2/8/2009

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Polymer Engineering and Science
IU online & bloomington alf TP986.A1S5722 Lexmark MST online NWU online & sci L668.405P783 OCU beam microfiche OkSU online OSU online & sel TP986A1S7 PU online & eng 668.405So13 & hicks 668.405So13 SDSU online SIUC online UAr online UC online & eng TP986.A1S25 UCSD online UD online & roesch UIC online & daley TP986.A1S5722 UK eng TP986.A1.S5722 UL kersey TP1101.P564 & film x31TP23 UM online & aael TP986.A1S674 & buhr TP986.A1S674 UOk online USD online UT online & hodges TP986.A1S5722
(1 items found as of 4/19/2009)

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Polymer Preprints (American Chemical Society)
CBU FSU dirac 540.5A5121 GIT online & QD281.P6A53c IU online MST online SIUC storage P001350 TTU QD281.P6A53 UAr mullins QD281.P6A53 UCF main QD281.P6A53 UCSD s&e QD1.A505 UIC online UOk online
(1 items found as of 4/19/2009)

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Polymeric Materials Science and Engineering
Gaofenzi Cailiao Kexue Yu Gongcheng
LH closed MST wilson TP934.C63 NWU sci 668.905P7834 OkSU main 668.905P783 UAH n1 UCSD s&e TP1105.C6 UF sci TP935.A515 UTo online UTor eng TP156.C57A53 UWa davis TP935.A515
priority

(new references 12/30/2008)
Peng, Jun-Hua, Wu, Bo-Lin, Feng, Xiao-Ming, Tan, Song-Ting .Surface morphology and electrical conductive properties of Cu-coated polyester powder prepared by electroless plating Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering, v 24, n 7, July, 2008, p 74-76+81 Language: Chinese

--------------------------------------------------------
Polymers for Advanced Technologies
AU online BYU online FSU online GIT online IU online LH closed MST online NWU online OkSU online RU online SDSU online SIUC online UAB online UAr online UC online UCF online UCI online UCSD online UF online UIC online UIUC online UK online wiley UM online & aael TP1080.P661 UMC online UNF online UOk online USD online USF online USU online UT online UTo online WrSU online
(1 items found as of 4/19/2009)
v19#7 checked 2/12/2009

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Polymers Paint Colour Journal
MSU online NWU online OSU online SIUC online UIC online UT online WSU online & sci
(1 items found as of 4/19/2009)

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Power Electronics Technology
http://powerelectronics.com/ IU online MST online NWU online OkSU online OSU online PU eng 621.381505P87 SDSU online SIUC online UCSD online UIC online UK online UOk online USD online UT online
(12 items found as of 1/2/2010)
v34#6-v35#12 checked 1/2/2010

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Practical Metallography
Praktische Metallographie
AU rbd TN690.P65 LH closed OSU sel TN690.A1P7 UF sci TN690.P65 UIUC main 669.9505PR UK remote TN690.P65 UTor eng TN690.P73
(1 items found as of 10/25/2009)
v44#10 checked 10/25/2009 priority

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Printed Circuit Design and Fab
Printed Circuit Design and Manufacture
Printed Circuit Design

http://www.pcdandf.com/ AU online MSU online OkSU online RyU online SDSU online UCI sci TK7867.P756 UF online UNF online UOk online USD online UT online UTo online UTor online WSU online
(>=20 items found as of 12/25/2009)
v18#7-v26#8,v26#10-v26#11 checked 12/25/2009 priority

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Printed Circuit Fabrication
AU online FIT online GIT online & main-6e TK7874.P75X Lexmark LH closed MSU online NWU online OkSU online OSU online RyU online SDSU online SIUC online UCB online & eng TK7868.P7P75 UCF online UCI online & sci TK7868.P7P75 UCSD online UF online UM online UNF online UOk online USD online UT online UTA online & eng TK7868.P7P75 UTor online VU online WSU online
(16 items found as of 10/25/2009)
v6#1-v7#6,v8#1-v26#3(end) checked 10/25/2009 priority

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Proceedings - A&WMA Annual Meeting
Proceedings of the Air & Waste Management Association's ... Annual Meeting
CBU online GIT main-5e TD881.A52C (CDROM) OSU sel file TD884.A1S6 UC online UCI sci TD881.A345

Raybourn, Michael, Weber, Jo Ann Proposition #65 risk assessment for arsenic and hexavalent chromium Proceedings - A&WMA Annual Meeting, vol. 4, 1989, 23p

Freeman, Gary R, Holliday, Ronald B. Toxic materials and flight safety. The aerospace industry struggles with chromium substitution Proceedings - A&WMA Annual Meeting, vol. 5, 1989, 17p

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Proceedings of the Academy of Science of the USSR
Doklady Akademii nauk SSSR
AU rbd closed Q60.A52 FSU online & dirac 550.5A3131y GIT main AS262.S3663 KU anschulz AS262.S3663 MSU eng TP185.A4 & sci QD453.A1 A37 NWU online & sci 541.06A313p OkSU stillwater 550.6A313d OSU sel QA1.S6819 & sel QD1A318 & sel QD1.A325 & depos AS262A6257SERA PU hicks 550.6Ak1pGE SIUE storage UAB sterne AS262.S3663 UAr mullins TP1.A34 UC chem QD1.A35 & lloyd AS262.S3663 UCF main QK1.A35913 UD online & roesch storage UF sci Q4.A42x UI main fAS262.A623 UIC daley TP1.A34 & various UK eng TP1.A34 & King AS262.S3663 UL ekstrom QD1.A352 & UL kersey QD1.A352 UM online & buhr QE1.A2783 & buhr TP1.A323 & shapiro QE1.A2783 & shapiro QD1.A353 & shapiro QD1.A353 & hatcher AS262.P53 UNL ldrf AS262.S3663 UT hodges QE1.A25183 UTo carlson WSU sci
(2 items found as of 4/19/2009)

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Proceedings of the ACS Division of Polymeric Material
Polymeric Materials: Science and Engineering
UM aael TP935.P65 UTor eng TP156.C57A53
(0 items found as of 4/19/2009)
01 priority

Iezzi, Robert A, CRITICAL PROCESS PARAMETERS AFFECTING THE CORROSION RESISTANCE OF ZINC-RICH ORGANIC COATINGS. Polymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Material, vol. 51, 1984, p 243

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Proceedings AESF/EPA Conference for Environmental Excellence
http://www.nmfrc.org/subs/conf.cfm IU bloomington wells
93-95,97-04

," 7th AESF/EPA Conference on Pollution Control for the Metal Finishing Industry, Orlando, FL, Jan. 27-29, 1986, pp. xx-xx.

," 8th AESF/EPA Conference on Pollution Control for the Metal Finishing Industry, Sept. 1987, pp. xx-xx.

," 9th, 1988, pp. xx-xx.

," 10th AESF/EPA Conference on Environmental Control for the Metal Finishing Industry, 1989, pp. xx-xx.

," 11th AESF/EPA Conference on Environmental Control for the Surface Finishing Industry, 1990, pp. xx-xx.

," Proceedings of the 12th Annual AESF/EPA Conference on Environmental Control for the Surface Finishing Industry, Orlando, FL, Jan. 28-30, 1991. pp. xx-xx.

," Proceedings 13th AESF/EPA Conference on Environmental Control for the Surface Finishing Industry, Orlando, FL, Jan. 27-29, 1992, pp. xx-xx.

." Proceedings 14th AESF/EPA Conference on Environmental Control for the Surface Finishing Industry, Jan. 1993, pp. xx-xx.

," 15th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Jan. 24-27, 1994, pp. xx-xx.

," 16th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Feb. 13-15, 1995, pp. xx-xx,

," 17th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Feb. 5-7, 1996, pp. xx-xx.

," 18th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Jan. 27-29, 1997, pp. xx-xx.

," Proceedings of the 19th AESF/EPA Pollution Prevention and Control Conference, Orlando, FL, Jan. 26-28, 1998, pp. xx-xx.

," Proceedings of the 20th AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 25-29, 1999, pp. xx-xx.

Keith Legg & Bruce Sartwell Hard Chrome Alternatives Team Update Improving Performance While Reducing Cost, ," 21st AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 17-19, 2000, pp. xx-xx.

Dr. Brent Lee & Stephen M. Koelzer; Vacuum Deposition of Chromium as an Alternative to Hexavalent or Trivalent Chromium Plating, 2000, Jan, 21st AESF/EPA Conference ," 21st AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 17-19, 2000, pp. xx-xx.

," 21st AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 17-19, 2000, pp. xx-xx.

," 22nd AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 29-Feb. 1, 2001, pp. xx-xx.

T. Naguy, M. Klingenberg, M. Neidbalson, M. Pavlik & D. Schario Non-line-of-sight (NLOS) Hard Chromium Alternatives Status Report, 2002, Jan, ," 2002 AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

Michael Kane " Environmentally Acceptable Technologies For the Replacement of Cadmium Coatings for Defense Applications, 2002, Jan, ," 2002 AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

Craig Matsdorf Trivalent Chromium Pretreatments for Defense Applications, 2002, Jan, ," 2002 AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

J.L. McCrea, G. Palumbo, M. Marcoccia & U. Erb Electrodeposited Nanocrystalline Cobalt-Iron Alloys As an Environmentally Benign Replacement to Hard Chrome Plating, 2002, Jan, ," 2002 AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

," 2002 AESF/EPA Conference for Environmental Excellence, Orlando, FL, Jan. 28-30, 2002, pp. xx-xx.

," Proceedings 2003 AESF/EPA Conference for Environmental & Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. xx-xx.

," Proceedings 2003 AESF/EPA Conference for Environmental & Process Excellence, Daytona, FL, Feb. 3-7, 2003, pp. xx-xx.

," Proceedings 2004 AESF/EPA Conference for Environmental & Process Excellence, Orlando, FL, Jan. 26-29, 2004, pp. xx-xx.

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Proceedings of the Annual Holm Conference on Electrical Contacts
2009 Proceedings of the 55th IEEE Holm Conference on Electrical Contacts
Holm Conference
IEEE XPLORE (88-) OSU online UK online & eng TK2831.I530 (many other universities also subscribe to IEEE XPLORE)
(18 items found as of 2/28/2010)
88-09 checked 2/28/2010

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Proceedings of the Annual Reliability and Maintainability Symposium
Nth Annual Reliability & Maintainability Symposium
RAMS
IEEE XPLORE (84,88-) OSU sel TS173.S92 UK online (many other universities also subscribe to IEEE XPLORE)
(18 items found as of 2/28/2010)
84,88-09 checked 2/28/2010

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Proceedings, Annual Technical Conference - Society of Vacuum Coaters
LH closed UC eng cdrom TS695.S621 UCB online UCSD online UOk online UTA cdrom 526 VU online

Weis, M, Manty, B. Overview of hexavalent chromium plating alternatives Proceedings, Annual Technical Conference - Society of Vacuum Coaters, 1995, pp. 325-330

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xxxx Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
BYU hbll TA174.A475 UTor eng TA174.D465 UWa davis TA174.A3174
priority

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Proceedings of the xxxx ASME International Mechanical Engineering Conference & Exposition
Proceedings of the ASME International Mechanical Engineering Congress and Exposition
MST wilson TA190.E66 UH TK7870.15.A66 & TKt870.15.A67 USF various UTor eng TJ5.I573 UWa davis TJ5.I53
priority

(new references 12/30/2008)
Lau, J, , R. Lee and Shangguan, D, , Thermal Fatigue Life Prediction of Lead-Free Solder Joints. Proceedings of ASME International Mechanical Engineering Conference & Exposition no. ov. 13-19, 2004, Anaheim, CA.

Tang, Zhenming, Park, Seungbae, Lee, H. .Effect of board-level reflow on adhesion between lead-free solder and underfill in flip-chip BGA packages ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 9-14

Mukherjee, Shantanu, Tsai, Pei-Fang Jennifer, Castro, Manuel, Srihari, Krishnaswami, Van Nguyen, D. .PB-free wave soldering of thick printed circuit boards using no-clean VOC free flux ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 143-147

Ramkumar, S. Manian, Srihari, Krishnaswami .Modeling and experimental verification of the contact resistance of a novel anisotropic conductive adhesive ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 149-157

Cuddalorepatta, Gayatri, Dasgupta, Abhijit .Viscoplastic behavior of hypo-eutectic Sn.0Ag.5Cu PB-free alloy under creep loading conditions ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 159-166

Bhate, D., Chan, D., Subbarayan, G., Chiu, T.C., Edwards, D., Gupta, V. .Constitutive behavior of Sn.8Ag.7Cu and Sn.0Ag.5Cu alloys at creep and low strain rate regimes ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 183-196

Faizan, Mohammad, Wang, Guo-Xiang .Effect of thermal processing on the dissolution of micro/nano-size metal particles in lead-free composite solders ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 263-268

Miyauchi, Hiroki, Yu, Qiang, Shibutani, Tadahiro, Shiratori, Masaki .A study on evaluation technique for the fatigue life scatter of lead-free solder joints ASME International Mechanical Engineering Congress and Exposition, Proceedings, v 5, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007, 2008, p 325-332

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xxxx Proceedings of the ASME Pressure Vessels and Piping Conference
BYU hbll TJ930.P74x GIT main-5e TJ930.P73 LH open OrSU valley TJ930.P73 PU eng 681.76041P941 RU fondren TJ930.P83 UCSD s&e TA654.6.A86 UIUC eng 620P926p UM aael TJ930.P73 UTA eng TJ930P73 UTor eng TJ930.P83 UWa davis TJ930.P73
priority

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Proc. Brit. Assoc. Refridgeration

J. E. Daniels, D. J. Macnaughton, Proc. Brit. Assoc. Refridgeration, 33 (1936-37), p. 78.

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Proceedings of CALCE International Symposium on Tin Whiskers
(3 items found as of 4/19/2009) priority

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Proceedings of Nth CIRP International Conference on Life Cycle Engineering
IU online PU online UC eng HF5414.155.C57 UCF main TS176.C57 UCI sci bar TS176.C534 UCSD online UIUC online & eng 658.5C496i UM online UT online UTA online UTo online UWa online WrSU online
(2 items found as of 4/19/2009)
07 priority

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Proceedings from Components for Military and Space Electronics xxxx
priority

(new reference 6/5/2009)
Prymak, Antoniades, Blais, Hill, Lai, Riedl, Schmidt, Sloka, and Staubli, "Flexible Termination - Reliability in Stringent Environments," Proceedings from Components for Military and Space Electronics 2009, San Diego, CA, Feb. 2009.

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Proceedings of the Nth Congress International Surface Engineering
Proceedings of the International Surface Engineering Congress
UCSD s&e TA418.7.I548 UM aael TA418.7.I57

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Proceedings of EcoDesign xxxx
EcoDesign
Eco Design
Nth International Symposium on Environmentally Conscious Design and Inverse Manufacturing
IEEE XPLORE (99-) UK online (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
99-05 all checked 2/28/2010

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Proceedings of Electronic Circuit World Convention

F. Wolfert and N. Vo, "Assessment of Pb-free finishes for leadframe packaging," in IPC Elec. Circuits World Convention, 2002, paper IPC56.

Shangguan, D, , Optimization of Lead-Free Soldering Processes for vol. Manufacturing. To appear in Proceedings of Electronic Circuit World Convention 10, Feb. 21-24, 2005, Anaheim, CA.

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xxxx Proceedings Nth Electronic Components & Technology Conference
ECTC
Nth Electronic Components & Technology Conference
Electronic Components & Technology Conference
Electronic Components Conference
IEEE Electronic Components Conference
Proceedings of Electrical Components Conference
Proceedings - xxxx Nth Electronic Components Conference
IEEE XPLORE (88-) http://ecadigitallibrary.com/conference.php?cid=17 MSU eng TK7801.A5 OSU online & sel & compact TK7801.A5 RU fondren TK7801.A5 UCB online UK online & eng TK7801.A5 & TK7869.E43 UM online & aael QC1.A516 & TK5.I12 USU merrill-cazier TK7801.A5 UT hodges TK7801.A5 WUSL westc TK7801.A5 (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 2/28/2010)
56-58,64,66-74,76-09 checked 2/28/2010 priority

S. M. Arnold, "The growth of metal whiskers on electrical components," in Proceedings of the IEEE Electronic Components Technology Conf., 1959, pp. 75-82.

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Proceedings of the Nth Electronic Packaging Technology Conference
EPTC
Nth Electronics Packaging Technology Conference
xxxx Nth International Conference on Electronic Packaging Technology
xxxx Electronics Packaging Technology Conference
Proceedings of Nth Electronics Packaging Technology Conference
Proceedings of the xxxx Nth Electronic Packaging Technology Conference
(Singapore)
IEEE XPLORE (97-) NWU online UIC daley TK7870.15.E426 UK online & eng TK7870.15.E4298 (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 3/5/2010)
97-09 all checked 3/5/2010

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Proceedings of the Electronics Goes Green Conference
priority

(new reference)
Turbini, L., G. Munie, D. Bernier, J. Gamalski, D. Bergman. "Assessing the Environmental Implications of Lead-Free Soldering,", Proceedings of the Electronics Goes Green Conference, Berlin, Sept. 2000, 37-42.

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Proceedings of the 5th European Conference on Additives and Colors
priority

(new references 12/30/2008)
Tange, Lein, Borms, R., Goebelbecker, S., Georlette, P., Reznick, G., Yaakov, Y. Bar .Sustainable use of brominated flame retardants in plastics Proceedings of the 5th European Conference on Additives and Colors, Proceedings of the 5th European Conference on Additives and Colors, 2007, 5p

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Proceedings of the Nth European Microwave Integrated Circuits Conference
EuMIC
Gallium Arsenide and Other Semiconductor Application Symposium
IEEE XPLORE (06-) UM online (many other universities also subscribe to IEEE XPLORE)
1 items found as of 3/4/2010)
05-09 checked 3/4/2010

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Proceedings of the High Level SMT Conference

Shangguan, D, , Strategy for Environmental Leadership in Electronics Manufacturing: Lead-Free and Beyond. Proceedings of the High Level SMT Conference, Shanghai, China, Apr. 2004.

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Proceedings of the 2nd IAASS Conference
UTor eng cdrom TL867.I58
priority

(new references 12/31/2008)
Barr, Stephanie, .Mitigating and preventing the growth of tin and other metal whiskers on critical hardware European Space Agency, (Special Publication) ESA SP, n SP-645, July, 2007, Proceedings of the 2nd IAASS Conference: Space Safety in a Global World, 9p

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Proceedings of the IEEE xxxx International Interconnect Technology Conference
IITC
IEEE XPLORE (98-) UK online (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 3/4/2010)
98-09 checked 3/4/2010

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Proceedings IEEE International Symposium on Electromagnetic Compatibility
IEEE XPLORE
(3 items found as of 7/9/2009)

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Proceedings of IMAPS (International Microelectronics And Packaging Society)
UAH salmon TK7874.I5725 UOk bizzell TK7874.I59
(1 items found as of 4/19/2009) priority
(new references 6/7/2009)
Leidecker, H, and Kadesch, J. S, "Effects of Uralane Conformal Coating on Tin Whisker Growth," Proceedings of IMAPS Nordic, Sept. 10-13, 2000, pp. 108-116.

H. Windlass, P. Raj, D. Balaraman, S. Bhattacharya and Rao R Tummala, "Colloidal Processing of Polymer Ceramic Nanocomposites for Integral Capacitors, " Proceedings of the IMAPS International Symposium on Advanced Packaging Materials, pp. 393-398, Braselton, GA, April 2001.

D. Balaraman, P. Markondeya Raj, S. K. Bhattacharya and R. R. Tummala, "Novel Hydrothermal Processing of Ceramic-polymer Composites for Integral Capacitor Applications, " Presented at IMAPS 2002, International symposium on packaging materials, processes and interfaces, Stone Mountain, Georgia, March 3-5, 2002.

Sjoberg, J, Geiger, D. A, Shangguan, D, and Castello, T, "Alternative Assembly Methods for Lead-Free Solder Flip Chips on FR-4 Substrates," Proceedings of IMAPS Nordic, 2004.

Arra, M, Geiger, D, Shangguan, D, and Sjoberg, J, "Study Of Component Self-Alignment During Reflow Using Sn/Pb And Sn/Ag/Cu Solders," Proceedings of IMAPS Nordic, 2004.

Lau, J. H, Lee, S. W. Ricky, Shangguan, D, Lau, D, and Kung, T, "Thermal-Fatigue Life Prediction Equations for Lead-Free Solder Joints on Lead-Free Printed Circuit Board (PCB)," Proceedings of IMAPS 2004 , Long Beach, CA no. ov. 2004.

Lau, J, Castello, T, Shangguan, D, Dauksher, w, Smetana, J, Horsley, R, Love, D, Menis, I, and Sullivan, B, "Failure Analysis of Lead-Free Solder Joints for an 1657 CCGA (Ceramic Column Grid Array) Package," Proceedings of IMAPS, Long Beach, CA, 2004.

K. Lee, R. Pucha, M. Varadarajan, S. Bhattacharya, S. Sitaraman, R. Tummala, "Reliability assessment of embedded capacitors in multi-layered microvia organic substrates", Proceedings of the IMAPS International Symposium on Microelectronics, Philadelphia,September 2005, pp 98-104.

P. Muthana, M. Swaminathan, R. Tummala, V. Sundaraman, L. Wan, S. Bhattacharya, E. Engin, P. Raj, "Design, modeling, and measurement of embedded decoupling capacitors for power delivery in the mid-frequency", Proceedings of the IMAPS International Symposium on Microelectronics, Philadelphia, September, 2005, pp 506-511.

P. Markondeya Raj, Devarajan Balaraman, Vinu Govind, Isaac Robin Abothu, Swapan Bhattacharya, Madhavan Swaminathan and Rao Tummala, "supercapacitive nanocomposite thin films suitable for embedded decoupling capacitors", Accepted for International Workshop on Integrated Passives, Marco Island, International International Microelectronics and Packaging Society, to be held during January 25-26, 2005.

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Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture
AU online BYU hbll TJ1.P862 FIT online FSU online GIT online IU online LH closed MST online NWU online OCU beam OGI online OkSU online OrSU online OSU online PU online RU fondren TJ1.I5pt.B SDSU online SIUC online SIUE lovejoy microfiche SU online UAB sterne TJ1.I5 pt.B UAH online UAr online UCF online UCI online UCSD online UDe online UE UF online UIC online UK online & eng TJ1.I5pt.B UM online & aael TJ1.I5913 UMC online UOk online USD online USF online USU online UTA online UTo online WrSU online
(1 items found as of 4/19/2009)
v222#5 checked 2/8/2009

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Proceedings of International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing
IEEE XPLORE (98,00) UK online UM online (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 3/4/2010)
98,00 checked 3/4/2010

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Proceedings of 7th International Conference on EcoBalance
(1 items found as of 4/19/2009) priority

," Proceedings of 7th International Conference on EcoBalance, Tsukuba, Japan, Nov. 14-16, 2006, pp. .

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Proceedings of the International Conference on Electroceramics
priority

(new references 6/8/2009)
Devarajan Balaraman, P. Markondeya Raj, Lixi Wan, Michael Sacks, Sid Dalmia, Madhavan Swaminathan and Rao Tummala, "BaTiO 3 films by low-temperature hydrothermal techniques for next-generation packaging applications", Proceedings of the International Conference on Electroceramics, MIT, Cambridge, August 4-6, 2003

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Proceedings of International Conference on Electronics Packaging
(4 items found as of 4/19/2009) priority

," Proceedings of International Conference on Electronics Packaging , Tokyo, Japan, Apr. 19-21, 2006, pp. .

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Proceedings xxxx International Conference on High-Density Packaging and MCMs
Proceedings of the International Conference on Multichip Modules and High Density Packaging
Proceedings of the xxxx IEEE Multi-Chip Module Conference
IEEE XPLORE (92-99) MSU eng TK7870.15.I34 OSU sel TK7869.I44 & sel TK7869.I49 UC eng TK7874.I59433 UD roesch TK7870.15.I3238 UK online UM online? & aael TK7870.15.I575 (many other universities also subscribe to IEEE XPLORE)
(12 items found as of 3/4/2010)
92-99 checked 3/4/2010

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Proceedings of xxxx Nth International Conference on Microelectronics
ICM
MIEL
IEEE XPLORE (95-) UCI online (many other universities also subscribe to IEEE XPLORE)
(3 items found as of 3/4/2010)
95-08 checked 3/4/2010

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Proceedings of the International Conference on Restoration, Recycling and Rejuvenation

Bonoli, Alessandra, Goldoni, Silvia WEEE treatment and recycling processes: A case study about mobile telephones batteries recycling project Proceedings of the International Conference on Restoration, Recycling and Rejuvenation Technology for Engineering and Architecture Application, Proceedings of the International Conference on Restoration, Recycling and Rejuvenation Technology for Engineering and Architecture Application, 2004, pp. 287-296

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Proceedings of the Nth International Conference on Surface Modification Technologies
UTA eng TN689.2.S97

Etcheverry, B., Le Coz, F., Alexis, J., Paris, J.-Y., Petit, J.A., Bonino, J.P. Mechanical properties of electroless co-deposited Ni-P/talc composite coatings Proceedings of the 18th International Conference on Surface Modification Technologies, vol. 2006, 2006, p 355-363

-------------------------------------------------------
Proceedings of the Nth International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
EuroSime
Proceedings of the nth International Conference on Thermal and Mechanical Simulation
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Nth International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems
IEEE XPLORE (04-) UK online (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 3/4/2010)
04-09 checked 3/4/2010

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Proceedings of the 1993 International Electronics Packaging Conference
4th International Electronic Packaging and Technology Conference
Proceedings of the technical conference: Nth annual International Electronics Packaging Conference
UCSD s&e TK7870.15.I5735 & TK7870.I6138 UTor eng TK7870.15.J65 UWa online
(13 items found as of 4/19/2009) priority

MatsUOka, H, Tsukagoshi, I. "New type of anisotropic conductive film with high connection reliability and finer pitch densities Proceedings of the 1993 International Electronics Packaging Conference, 1993, pp. 489

Devarajan Balaraman, P. Markondeya Raj, Ravindra Tanikella, Swapan Bhattacharya, Paul Kohl, and Rao Tummala, "Low Temperature Synthesis (100řC) Hydrothermal Synthesis of High-K Low Loss BaTiO 3 Films for Integral Capacitors", 4 th International Electronic Packaging and Technology Conference, Singapore, pp. 79-84, December 10-12, 2002.

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Proceedings of xxxx International IEEE Conference on Asian Green Electronics
AGEC
IEEE XPLORE (04-05) UK online (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 3/4/2010)
04-05 checked 3/4/2010

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Proceedings International IEEE Conference on Business of Electronic Product Reliability and Liability
International Conference on Business of Electronic Product Reliability and Liability
IEEE XPLORE (04) UK online (many other universities also subscribe to IEEE XPLORE)
(7 items found as of 3/4/2010)
04 checked 3/4/2010

R. Schetty, Y. Zhang, and K. Hwang, "Whisker growth: The substrate effect and beyond," in Proc. IEEE Conf. Electronic Product Reliability and Liability Shenzen, China, Jan. 2003, pp. 1-5.

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Proceedings of the 6th International Metal Finishing Conference
(1 items found as of 4/19/2009) priority

S. C. Britton and M. Clarke, "Effects of diffusion from brass substrates into electrodeposited tin coatings on corrosion resistance and whisker growth," in Proc. 6th Int. Metal Finishing Conf., May 1964, pp. 205-211.

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Proceedings of the 4th International Microelectronic System 95 Conference

Garj, V. K, , Reliability on surface mount solder joint, Proc. 4th. Int. Microelectronic System 95 Conf,19 (1995).

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Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials
APM
IEEE XPLORE (97-) OSU sel TK7870.15.I586 UK online (many other universities also subscribe to IEEE XPLORE)
(>=20 items found as of 3/4/2010)
97-07 checked 3/4/2010

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Proceedings of xxxx International Symposium on Electrical Insulating Materials
ISEIM
International Symposium on Electrical Insulating Materials
Proceedings of the Nth Symposium on Electrical Insulating Materials
IEEE XPLORE (88,95,98,01,05,08) UK online (many other universities also subscribe to IEEE XPLORE)
(13 items found as of 3/4/2010)
88,95,98,01,05,08 checked 3/4/2010

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Proceedings of the Second International Symposium on Electronic Packaging Technology
(0 items found as of 4/19/2009)
97-98,03 priority

Shangguan, D, and G. Gao, Environmentally Conscious Manufacturing Technologies for Automotive Electronics. Proceedings of the Second International Symposium on Electronic Packaging Technology (ISEPT '96), Dec. 1996, Shanghai, China, pp. 391-402.

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Proceedings of the Nth International Symposium on Power Semiconductor Devices & IC's
ISPSD
IEEE XPLORE (90-) UCI online UK online (many other universities also subscribe to IEEE XPLORE)
(3 items found as of 3/4/2010)
90-09 checked 3/4/2010

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Proceedings of the International Symposium, Recycling and Reuse of Waste Materials
UTor eng TD794.5.I64 UWa davis TD785.R43x
priority

(new references 12/30/2008)
Siikamaki, L.A. Raija .End-of-life Cathode Ray Tube glass as a raw material for hollow ware glass products Recycling and Reuse of Waste Materials, Proceedings of the International Symposium, Recycling and Reuse of Waste Materials, Proceedings of the International Symposium, 2003, p 743-750

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Proceedings of the 18th International Technical Meeting of the Satellite Division of The Institute of Navigation
AU rbd TL798.N3I58
priority

(new references 12/30/2008)
Paynter, Gord, Banas, Vince .Compliance of NovAtel's GPS-702L antenna to the European union's new WEEE (Waste Electrical and Electronic Equipment) and RoHS (Restriction of the use of Certain Hazardous Substances) directives Proceedings of the 18th International Technical Meeting of the Satellite Division of The Institute of Navigation, ION GNSS 2005, v 2005, Proceedings of the 18th International Technical Meeting of the Satellite Divisionof The Institute of Navigation, ION GNSS 2005, 2005, p 2253-2262

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Proceedings - International Test Conference
ITC
xxxx IEEE International Test Proceedings
IEEE XPLORE (88-) UM online? (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 3/4/2010)
88-09 checked 3/4/2010

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Proceedings of the xxxx International Thermal Spray Conference
Proceedings of the International Thermal Spray Conference
OkSU main 671.734N2775 UCI sci TS655.I63 UM aael TS655.U551 UOk eng TS655.I635 UT hodges TS655.I63 UTor eng TS655.I63 UWa davis TS655.I63
(7 items found as of 10/23/2009)
92,98,00-04 checked 10/23/2009 low priority

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Proc. IPC Annual Meeting and Technical Conference
(1 items found as of 4/19/2009) priority

R. Schetty, "Whisker growth studies," in Proc. IPC Annu. Meeting and Technical Conf., Oct. 2001, pp. S03-7-1-S03-7-4.

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Proceedings, Soldertec

Maire, O. et al, "Backward Compatibility of Lead-Free BGA: Microstructural Characterization and Reliability," Proceedings IPC Soldertec, Malmo, Sweden, 2006.

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Proceedings of the koninklijke Nederlandsche Akadamie von Wetenschappen
Koninklijke Akademie van Wetenschappen te Amsterdam
Koninklijke Nederlandse Akademie van Wetenschappen
Verslag koninklijke Nederlandsche Akadamie von Wetenschappen, Amsterdam
Proceedings of the Academy of Science, Amsterdam
Proceedings of the Section of Sciences
AU rbd closed Q57.A532 FSU remote 505.A313 GIT main-4e QC1.A538X IU b-geol Q57.A5 LH closed MoSU Q57.A535 MSU main Q57.A5SerB NWU online & sci L506A32p OrSU valley Q57.A5 OSU online PU online & phys 506Ak1pB & 506Ak1pD & hicks 5]06Ak1pC RU fondren Q57.A451 UC swdepos AS244.A532 UCSD s&e Q1.A3055 UD remote UIUC biol 069AM2E UK king Q57.P76 UM shapiro QC1.A3114 & hatcher AS244.A433 & buhr AS244.A433 & buhr Q57.A74 & buhr Q57.A73 UT hodges closed AS244.A536 UTA life Q1K655K UTo online VU annex QA1.A45
(>=20 items found as of 4/19/2009) priority

E. Cohen and C. van Eijk, Versl. Akad. Amsterdam, 8, 36, 102 (1899).

Versl. Kon. Acad. v. Wet. te Amsterdam 21, 661 (1912).

E. Cohen and W. A. T. Cohen de Meester, Verslag koninklijke Nederlandsche Akadamie von Wetenschappen, Amsterdam, 90 (1938), p. 9.

E. Cohen and W. A. T. Cohen de Meester, Verslag koninklijke Nederlandsche Akadamie von Wetenschappen, Amsterdam, 91 (1938), p. 5, 8.

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Proceedings of the National Aerospace and Electronics Conference
NAECON
IEEE XPLORE (88-98,00,08) LH TL695.N3 NWU sci L629.1326N277p OSU sel TL693N3 PU eng 621.38406N206p & hicks 621.38406N206p UC sw depos TL693.N3 UCB pascal TL693.N3 UIC electronic & daley TL693.N3 UK online UM online & aael TK5.I12 & TL693.N31 UT hodges TL693.N3 (many other universities also subscribe to IEEE XPLORE)
(4 items found as of 3/4/2010)
88-98,00,08 checked 3/4/2010

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Proceedings of the Physical Society
IU online & bloomington alf QC1.P53 MST online NWU online OkSU online OSU online & sel QC1P574 PU online & hicks 530.05J826 & 530.4105J826 & 530.6L84 SDSU compact QC1.P5 SIUC online SIUE storage TTU UAr online UCSD online UD roesch UIC online & warehouse QC1.P5 UK king QC1.P5 UL kersey QC1.P5 UM online & aael QC1.P5821 & buhr QC1.P5821 UOk online USD online UT hodges closed QC1.P5
(5 items found as of 4/19/2009)

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Proceedings of Radio and Wireless Conference
RAWCON
RWS
xxxx IEEE Radio and Wireless Symposium
IEEE XPLORE (98-04,06-)
(2 items found as of 3/4/2010)
98-04,06-09 checked 3/4/2010

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Proceedings of the Royal Society of London
IU online & bloomington alf Q41.R82 MST online MSU online NWU online & sci 506R89 OSU online & sel Q41L82 & depos Q41L82 PU online & hicks 506R81p SDSU online SIUC online TTU UAr online UC online & biol Q41.L82 UCSD online UD online UE UIC online & warehouse Q41.L84A2 UK online & chem/phys Q41.L7 UL online & kersey Q41.L7 UM online & shapiro QC1.R888 & hatcher Q41.L8P8 & buhr Q41.L8P8 UOk online USD online UT online & hodges closed Q41.L7 UTo carlson microform WSU storage
(7 items found as of 4/19/2009)

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Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics xxxx
LH closed TTU TA648.3.S633 UC eng TA648.3.S633 UM CDROM UmX229 UOk eng TA349.I485a
priority

(new references 12/30/2008)
Liang, Cai, Prorok, B.C. .Determination of thin film elastic modulus by magnetostrictive sensor and finite element simulation Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007, v 2, Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007, 2007, p 1025-1031

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Proceedings of SPIE
Lexmark various MST wilson various MSU various NWU online OSU sel various & TS155.7.E585 PU eng 621.381D4945 RyU various SDSU various SIUC morris various SIUE lovejoy various TTU QC370.5.S64 UAr mullins various UC eng QD139.P6X72 UCB eng TK7874.I5918 UCSD online UK eng various UL Kersey various UM online & various UMe mcwherter various UT hodges various UTo various UTor eng various UWa online WSU various
(>=20 items found as of 4/19/2009) priority

(new references 12/31/2008)
Chinnabhandar, Anil, Narasimha Murthy, H.N., Krishna, M. .Effect of dispersing nano - Materials into structural adhesive on the electrical and mechanical properties Progress in Biomedical Optics and Imaging - Proceedings of SPIE, v 6799, BioMEMS and Nanotechnology III, 2008, p 67991H

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Proceedings of the Technical Conference IPC/SMEMA Council APEX xxxx Conference
APEX
xxxx IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings
IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings xxxx Technical Conference
http://www.pwbrc.org/
(>=20 items found as of 4/19/2009)
04,06,08 checked 4/3/2009 priority

," APEX 2000, Long Beach, CA, Mar. 14-16, 2000, pp. .

Arra, M, Shangguan, D, Yi, S, Fockenberger, H, and Thalhammer, R, "Development of Lead-Free Wave Soldering Processes," Proceedings of APEX 2002, San Diego, CA, Jan. 2002, pp. 4(1)-4(10).

I. Boguslavsky, P. Bush, E. Kam-Lum, M. Kwoka, J. McCullen, and N. Vo, "Tin whisker project," in Proc. APEX Conf., Apr. 2002.

Freedman, Martin G, "JEDEC's Lead-Free Position," IPC SMEMA Council's APEX 2002, San Diego, CA, Jan. 19-24, 2002, pp. 242?

Lal, S, "Lead-Free Development of Electronic Connectors," Proceedings of the IPC SMEMA Council APEX, Jan. 2002, pp. S01-1-1 to S01-1-14.

Zhang, Y, Xu, C, Fan, C, Abys, J, and Vysotskaya, A, "Understanding Whisker Phenomenon: Whisker Index and Tin/Copper, Tin/Nickel Interface," Proceedings of the IPC SMEMA Council APEX, Jan. 2002, pp. S06-1-1 to S06-1-11.

Zhang, Y, Xu, C, Pan, C, Abys, J, and Vysotskaya, A, "Understanding Whisker Growth Phenomenon _ Part 1, Growth Kinetics," Proceedings of the APEX Meeting, San Diego, CA, Jan. 2002.

Xu, C, Zhang, Y, Fan, C, Abys, J, Hopkins, L, and Stevie, F. Understanding Whisker Phenomenon: Driving Force for the Whisker Formation IPC SMEMA Council APEX 2002, S06 2-1

Zhang, Y, Xu, C, Fan, C, Abys, J, and Vysotskaya, A. Understanding Whisker Phenomenon IPC SMEMA Council APEX 2002, S06 1-1

Y. Zhang, C. Xu, C. Fan, J. Abys, and A. Vysotskaya, "Understanding whisker phenomenon: Whisker index and tin/copper, tin/nickel interface," in Proc. IPC SMEMA APEX Conf., Jan. 2002, pp. S06-1-1-S06-1-10.

Bush, P, Jones, G, and Boguslavsky, I, "Relationships of Copper Diffusion and Surface Oxide Formation to Tin Whisker Growth," APEX 2003, Anaheim, CA, Apr. 1, 2003.

Colfax, Richard, O'Keefe, Matthew, Amick, Patricia, Kleine, David, Vetter, Steve, and Murry, Dale, mjokeefe@umr.edu. "Perspectives on Repaired Lead-Free Solder Joints" Apex, Anaheim, CA, Feb. 22-24, 2005

Geiger, David, Shangguan, Dongkai, Sj”berg, Jonas, and Castello, Todd, dongkaishangguan@flextronics.com. "Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials" Apex, Anaheim, CA, Feb. 22-24, 2005

Gleason, Jerry, Schroeder, Valeska, and Henshall, Gregory, Lau, John, Dauksher, Walter, and Sullivan, Bob, "Design, Materials and Assembly Process of High-Density Packages with a Low-Temperature Lead-Free Solder (SnBiAg)" (Apex, Anaheim, CA, Feb. 22-24, 2005

Tanaka, Hirokazu, "Corrosion Factor and Effects of Tin-Zinc Lead-Free Solder on Copper Substrate in Environmental Tests" Apex, Anaheim, CA, Feb. 22-24, 2005

Woolley, Mark, and Choi, Jae, woolleym@avaya.com. "The Use of SAC Solder and Pb-Free Materials in the Repair Scenario" Apex, Anaheim, CA, Feb. 22-24, 2005

Bath, Jasbir, Chih, Pan Wei, Saludsod Jr., Hamlet, Jay, Roger, and Chou, Tzu-Chein, jasbirbath@ca.slr.com. "Use of EDXRF for RoHS Compliance Screening in PCBA Manufacturing" (IPC Printed Circuits Expo, APEX and the Designers Summit, Los Angeles, CA, Feb. 20-22, 2007)

Kumar, Rakesh, rkumar@scscoatings.com "Parylene as a Suppressant for Tin Whiskers Growth on Printed Circuit Boards" (IPC Printed Circuits Expo, APEX and the Designers Summit, Los Angeles, CA, Feb. 20-22, 2007)

Long, Gary, Embree, Todd, Mukadam, Muffadal, Parupalli, Satish, and Vasudevan, Vasu, gary.b.long@intel.com. "Lead-Free Assembly Impacts on Laminate Material Properties and `Pad Crater' Failures" (IPC Printed Circuits Expo, APEX and the Designers Summit, Los Angeles, CA, Feb. 20-22, 2007)

Nandagopal, Bala, Teng, Sue, and Watson, Doug, sue.teng@cisco.com "Effect of OSP Chemistry on the Hole Fill Performance During Pb-Free Wave Soldering" (IPC Printed Circuits Expo, APEX and the Designers Summit, Los Angeles, CA, Feb. 20-22, 2007)

Snugovsky, Polina, Bagheri, S., Bagheri, Z., and Romansky, M., polina@celestica.com "The New Lead-Free Assembly Rework Solution Using Low Melting Alloys" (IPC Printed Circuits Expo, APEX and the Designers Summit, Los Angeles, CA, Feb. 20-22, 2007)

Jing Fan, Art Ackerman, Doug Katze, Jayesh Shah, Matthew Eveline, Nishitha Andra, and Daniel Blazej, x Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications ," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. .

Hector Steen, and Brian Toleno, x Development of a Lead-Free Alloy for High-Reliability, High-Temperature Applications ," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. .

Ravikumar Sanapala, Bhanu Sood, Diganta Das, and Michael Pecht, x Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates ," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. .

L. G. Pymento1, W.T. Davis, Ben Kim, and Surangkana Umpo, x "Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. .

Quyen Chu, Girish Wable, Anthony Babasa, Evan Doxtad, Michael Lapitan, Michael Santos, Josh Solon, Ken Hubbard, Gnyaneshwar Ramakrishna, Greg Henshall, Ahmer Syed, Ranjit Pandher, and Chrys Shea "Low-Silver BGA Assembly Phase I - Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and Assembly Process Sensitivities," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. .

Matthew Kelly, Mitchell Ferrill, Polina Snugovsky, Rupen Trivedi, Gaby Dinca, Chris Achong, and Zohreh Bagheri, x Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points ," 2009 IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. .

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Proceedings of Technical Papers - xxxx International Microsystems, Packaging, Assembly and Circuits Technology Conference
IMPACT
International Microsystems, Packaging, Assembly Conference Taiwan
IEEE XPLORE (06-) UM online? (many other universities also subscribe to IEEE XPLORE) UT online
(>=20 items found as of 2/28/2010)
06-09 checked 2/28/2010

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Proceedings of the University of Durham Philosophical Society Series A Science
IU bloomington wells Q41.D9 MSU main Q111.D8 UC lloyd AS122.D895 UM buhr Q41.D96 UTA storage 506.D934P WSU storage

I. A. Richmond and J. A. Smythe, Proc. Univ. Durham Phil. Soc. 10, 48 (1938).

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Process Engineering (London)
CBU CPL washington IU online MST online NWU sci 660.5P963 OkSU online OSU online & sel TP1P7 SDSU online SIUC online TTU online UAr online UCSD online UD roesch UK online UL online & kersey TP1.P6835 UM online & aael TS176.P95 USD online UT online & hodges TS155.A1P76
(1 items found as of 4/19/2009)

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Product Design & Development
http://www.pddnet.com/ MST online OkSU online SDSU online SIUC online UAr online UCI online UCSD online USD online UT online
(8 items found as of 7/28/2009)
Oct05-Apr09,Jun09 checked 7/28/2009

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Product Engineering
CBU MST depos 621.05P942m OSU sel TS1P96 SDSU TS1.P7 SIUC storage 56404-6701 TTU UAr storage TS1.P7 UE UK eng TS1.P7 UL kersey TJ184.C53

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Product Finishing
AU online GIT online NWU online OSU online SDSU online UAH online UAr online UCB online UCI online UCSD online UF online UK online UOk online USD online UT online UTo online VU online WSU storage
(1 items found as of 4/19/2009)
v54#6

"Tin plating: report on application of US process," Product Finishing , vol. 27 no. 10, pp. 10-11, 14, Oct. 1974.

Anon NEW TRIVALENT CHROMIUM PLATING PROCESS. Product Finishing (London), vol. 28 no. 8, Aug. 1975, pp. 30-32

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Products Finishing
http://www.pfonline.com/ AU online & rbd TS200.P73 KSU hale TS200.P73 MST online MSU online NWU online OkSU online OSU online SDSU online SIUC online UAH online UAr online UC cas microfilm 60 UCI online UCSD online UF online & sci TS200.P73 UK online UL kersey TS200.P73 UM online & buhr TS200.P96 & aael microfilm EX29 UNF online UOk online USD online UT online UTo online VU online & annex TS200.P73 WSU online & storage
(>=20 items found as of 12/29/2009)
v65#5-v74#2 checked 12/29/2009

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Professional Engineering
IU online KYVL MST online MSU online & eng TJ1.R7 NWU online OkSU online OSU online PU eng 621.06In7cp SDSU online SIUC online SIUE lovejoy microfiche UAr online UC eng TJ1.C6 UCI sci TJ.I527 UIC online UK online & eng TJ1.J820 UM online & aael TJ1.P96 USD online UT online UTo online & carlson WSU online
(7 items found as of 12/29/2009)
v12#10-v16#11(2003),v18#19,v22#1,v22#5,v22#7-v22#10 checked 12/29/2009

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Progress in Materials Science
AU online BYU hbll TN690.P76x FIT TN1.P76 FSU online GIT online LH closed LU gray TN1.P76 MST online NWU online OkSU online OrSU online OSU online PU online RU online SDSU online SIUC online SIUE online TTU UAB sterne QC1.P884 UAR mullins QC1.P884 UC online UCF online UCI online UCSD online UDe online UE TN1.P76 UF online UIC online UIUC online UK online & eng QC1.P884 UM online & aael TA459.P96 UMC online UMe eng TN1P76 UNF online UOk online USF online UTA online UTo online WrSU online
(0 items found as of 4/19/2009)
v53#5 checked 2/8/2009

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Progress in Photovoltaics: Research and Applications
AU online BYU online FSU online GIT online IU online MST online NWU online OkSU online OrSU online OSU online RU online RyU online SDSU online SIUC online UAB online UAr online UC online UCF online UCI online UCSD online UF online UIC online UIUC online UK online wiley UM online UMC online UNF online UOk online USD online USF online USU online UT online UTo online WrSU online
(1 items found as of 10/25/2009)
v16#2,v17#7 checked 10/25/2009

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Progress in Rubber Plastics Recycling Technology
Progress in rubber, plastics and recycling technology
FIT online IU online LH closed OkSU online OSU online SDSU online UDe online UF online UM online UTor online
priority

(new references 12/31/2008)
Goodship, V., Cain, R.L., Reynolds, N., Pharaoh, M.W. .The WEEE directive: Information and opportunities for plastics recycling Progress in Rubber Plastics Recycling Technology, v 18, n 3, 2002, p 161-172

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Prometheus
LH closed MST online OkSU online SDSU online SIUC online UAr mullins L11.P954 USD online UT online UTo online UTo online
(1 items found as of 4/19/2009)

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Protection of Metals
Zashchita metallov
IU online MST online MSU online OkSU online OSU online & sel TA462A1P7 PU online & eng 620.105Z19E SDSU online SIUC online UAr online UC online UCSD online UD online UK online & eng TA462.P76 UM online UOk online USD online UT online UTo online WSU storage
(4 items found as of 12/29/2009)
v20#3-v44#7 checked 12/29/2009

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PRWeb
http://www.prweb.com/ MST online
(14 items found as of 4/19/2009)
checked 4/3/2009

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Publications de l'Institut de Recherches de la Siderurgie, IRSID

Philbert, Publications de l'Institut de Recherches de la Siderurgie, IRSID, A, 1956, 139.

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Purchasing
http://www.purchasing.com/ CPL IU online Lexmark MST online OkSU online OSU bus HF5001.P985 SDSU online SIUC online TTU UAr mullins HF5001.P8 UC langsam HF5001.P8 UCSD online UE UK online UL ekstrom HF5001.P8 UM online USD online UT online
(>=20 items found as of 12/29/2009)
Jan15,98-v138#11(Nov09) checked 12/29/2009

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QQQQ

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Quality and Reliability Engineering International
AU online BYU TA168.Q83x FSU online GIT online IU online LH closed MST online NWU online OGI online OkSU online OrSU online OSU online SDSU online SIUC online SU online UAB online UAr online UC online UCF online UCI online UCSD online UD online UDe online UF online UIC online UIUC online UK online UL online & robotic TA169.Q34 UM online & aael TS156.Q3Q213 UMC online UNF online UOk online USD online USF online USU online UTo online WrSU online
(1 items found as of 4/19/2009)

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Quality Digest
http://www.qualitydigest.com/ Lexmark
(13 items found as of 5/6/2009)
-v29#4 checked 5/3/2009

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xxxx Quantum Electronics and Laser Science Conference
QELS
IEEE XPLORE (94-) NWU online PU eng 621.366Qu254p & hicks 621.366Qu254p UC phys QC685.Q82 UD roesch QC685.Q36 UK online & eng QC685.I58 UM online & aael TA1673.Q36 & aael TK5.I12 UT hodges QC685.Q82 (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 4/19/2009)

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Quarterly Journal of the Japan Welding Society
Yosetsu Gakkai Ronbunshu
LH closed OSU sel TS227.A1Y676 RyU online SDSU online UCB online UCSD online UF online UTA online UTor online VU online
(11 items found as of 10/25/2009)
v20#1-v27#4 checked 10/25/2009 priority

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Quarterly Rep. (Batelle Memorial Institute)

Quarterly Rep. no. ov. 1949.

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RRRR

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Radiation Effects and Defects in Solids
AU online GIT online & main QD601.A1R254 IU online KYVL MST online OkSU online OSU online & sel QD625.R344 PU phys 548.05C889 SDSU online SIUC online UAB sterne QD601.A1R254 TTU UAH online UAr online UC phys QD601.A1R28 UCF online UCSD online UF online UK online UM online & aael QD601.A1R12 UOk online USD online UT online & hodges QC770.R23 UTo online WSU sci
(7 items found as of 4/19/2009)

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Rare Metal Materials and Engineering
Xiyou Jinshu Cailiao yu Gongcheng
LH closed OkSU online
(1 items found as of 4/19/2009) priority

(new references 12/30/2008)
Xia, Zhidong, Lei, Yongping, Shi, Yaowu An analysis of patent situation, impurity control and standard of lead-free solders Xiyou Jinshu Cailiao yu Gongcheng (Rare Metal Materials and Engineering). Vol. 33, Suppl. 2, pp. 147-151. Dec. 2004

Zhou, Jian (Southeast University), Sun, Yangshan, Xue, Feng "Influence of indium on wetting behaviors of Sn-8Zn-3Bi lead-free solders," Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, vol. 35 no. 4, Apr. 2006, pp. 613-616 Language: Chinese.

Zhang, Keke, Wang, Yaoli, Fan, Yanli, Zhu, Yaomin, Zhang, Xin, Yan, Yanfu .Effect of Ce-La mixed rare earth content and environment conditions on the creep rupture life of SnAgCu solder joints Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, v 36, n 8, August, 2007, p 1473-1476 Language: Chinese

Yu, Yang, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan, Chen, Shujun .Relation between the surface condition and microstructure of solder balls Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, v 37, n 6, June, 2008, p 1092-1094 Language: Chinese

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Recycled Paper News
GIT main-6e TS1120.5.R448
(0 items found as of 4/19/2009)

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Recycling Today
MST online MSU online OSU online UOk online USF online UTo carlson WSU online
(5 items found as of 4/19/2009)

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Renewable Energy
MST online OSU online PU eng 621.04205R293 SDSU online UC online & depos TJ807.R465 UCSD online UD online UIC online UK online sd UL online & kersey TJ810.S782 UM online & aael TJ807.R46 UT online UTo online WSU online
(1 items found as of 4/19/2009)

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Resources, Conservation and Recycling
IU online OkSU online OSU online & sel TP995.A1R4322 PU online & eng 639.905R7655 RyU online SDSU online UC online & geo TD794.5.C663 UCSD online UD online UIC online UM online & shapiro TD794.5.R46 UT online UTor online UWa online
(>=20 items found as of 10/25/2009)
v28#1(2000)-v54#1 Articles in Press to Oct. 24, 2009 checked 10/25/2009 priority

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Reviews of Modern Physics
CBU IU online & bloomington swain QC1.R3 & alf QC1.R3 MST online NWU online & sci 530.5R454 OkSU online OSU online & sel QC1P572 PU online & phys 530.5R315 SDSU online SIUC online SIUE online TTU online UAr online UC online & phys QC1.R43 UCSD online UD online & roesch UE online UIC online & sci UK online & chem/phys QC1.R4 UL kersey QC1.R4 UM online & aael QC1.R454 & shapiro QC1.R454 & buhr QC1.R454 UOk online USD online UT online & hodges QC1.R4
(0 items found as of 4/19/2009)

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Revue Roumaine de Physique
KU anschulz QC1.R43 MSU remote QC1.R43 & sci QC1.R43 PU hicks 530R328 SIUC storage 53960-5301 UK king QC1.R43 UM shapiro QC1.R473 WSU sci
(1 items found as of 4/19/2009)

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RF Design
http://rfdesign.com/ MST online SDSU online
(1 items found as of 4/19/2009)
checked 4/3/2009

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Risk Analysis
MST online OkSU online OSU online SDSU online SIUC online UC online UCSD online UK young T174.5.R55 UL online & kersey T174.5.R54 USD online UT online
(4 items found as of 4/19/2009)

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Route
http://dc.ipc.org/Route.htm
(>=20 items found as of 4/19/2009)
Jan98-Jun08 checked 4/3/2009 priority

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Rubber Expo 03:

Kang, Donghee, Desai, Keyur, Ho, Kicherl, Sung, Changmo, Mead, Joey LEAD FREE ELASTOMER STABILIZATION FOR WIRE AND CABLE APPLICATIONS Rubber Expo 03: 2003 Technical Meeting of the American Chemical Society, Rubber Division, Cleveland, OH, USA, 14-17 Oct. 2003. 2003

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Russian journal of applied chemistry
Zhurnal Prikladnoi Khimii
IU bloomington alf TP1.A35 MST depos 660.5J826b MSU remote TP1.Z6313 NWU online & sci 660.5Z63 & 660.5Z63X OkSU stillwater 660.5Z63 OSU online & sel TP1.K45 PU chem 540.5Z9E SDSU online SIUC storage 660.5Z63 UC online UD online UIC online & sci TP1.Z6314 UK king TP1.Z6313 UM shapiro TP1.Z65 & buhr TP1.Z653 UOk online USD online UT hodges TP1.A35
(1 items found as of 4/19/2009)

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SSSS

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Sadhana - Academy Proceedings in Engineering Sciences
AU online BYU online FIT online FSU online GIT online LH closed MST online OGI online OkSU online OSU online PU online SDSU online SIUC morris 52797-6202 SU online UAB online UC online UCI online UCSD online UDe online UF online UF online UIC online UIUC online UK online UM online UMC online USD online USF online USU online UTo online WrSU online
(1 items found as of 4/19/2009)
v33#3 checked 2/8/2009

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SAE Journal
MST wilson TL1.S5 OkSU stillwater 629.105S111 OSU sel TL1S671 SDSU TL1.S5 SIUC morris 51601-6292 UAr mullins TL1.S5 UCSD online UK eng TL1.S5 UL kersey TL1.S6 UMe mcwherter UOk bizzell TL1.S5
(0 items found as of 4/19/2009)

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SAE Technical Paper Series
LH closed MST wilson microfiche TL1.S552 MSU various OSU sel reference microform MICROFICHE2TL1 SDSU various TTU various UAr mullins TL240.S3 UC eng microfiche SAE UCSD sio TC1662.A46 UK eng microfiche & CDROM CS 95-2 UM online & aael TL1.S68A454 & aael microfilm UmX & aael CDROM EX22 UMe mcwherter various UT hodges Microfiche TL1.S6 UTA microform WSU sci

Iezzi, Robert A, CRITICAL PROCESS PARAMETERS AFFECTING ZINCROMETAL PERFORMANCE. SAE International Congress and Exposition, Detroit, Michigan, Feb. 27-Mar. 2, 1984. SAE Technical Paper Series, 1984, 840209p

*** NOT APPLICABLE *** --------------------------------------------------------
SAE Transactions
MST wilson TL1.S6 OkSU stillwater microfiche OSU sel TL1S62 SDSU TL1.S6 SIUC morris oversize TL1.S6 SIUE lovejoy TL1.S6 TTU UAr mullins TL1.S6 UC eng TL1.S6 UCSD s&e TL1.S6934 UE TL1.S6 UK eng TL1.S6 UL kersey TL1.S6 UMe mcwherter TL1.S6 UOk bizzell TL1.S6
(0 items found as of 4/19/2009)

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SAMPE Journal
Journal of Advanced Materials
SAMPE Quarterly
OSU sel TL950.S57 SDSU TA401.S617 SIUC morris 53995-6201 UC depository TL950.S5825 UCSD s&e TL1.S3 UK eng TL950.S5825 UM aael TA401.M433 UOk eng TL950.S583 UT hodges TA401.S46 UTA eng TL950.S5825 UTor eng TL950.S5 WSU sci
(3 items found as of 8/19/2009)
v1#1-v45#4 checked 8/19/2009 priority

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Science
OkSU online SDSU Q1.S35 UAr online UCSD online UD roesch UE online UIC online UK online & chem/phys Q1.S35 & eng Q1.S35 & king Q1.S35 & young Q1.S35 UL online & kersey Q1.S35 UM online & aael Q1.S394 & aael Q1.S39 & shapiro Q1.S394 & buhr Q1.S39 USD online UT online Q1.S39
(2 items found as of 4/19/2009)

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Science and Technology of Advanced Materials
MST online OkSU online OSU online SDSU online SIUC online UAr online UC online UCSD online UD online UK online UM online sd USD online UT online UTo online WSU online
(1 items found as of 4/19/2009)

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Science and Technology of Welding and Joining
AU online BYU online FSU online GIT online IU online LH closed NWU online OGI online OkSU online OrSU online OSU online RyU online SDSU online SIUC online SU online UAH online UAr online UCI online UCSD online UDe online UF online UIC online UK online UMC online UOk online USD online USF online USU online UT online UTo online UTor online UWa online WrSU online
(6 items found as of 12/29/2009)
v8#1-v14#8 checked 12/29/2009 low priority

(new references 12/31/2008)
Effect of fine dispersoids and anisotropic nature of b-Sn on thermal fatigue properties of flip chips connected by Sn–xAg–0·5Cu (x: 1, 3 and 4 mass-%) lead free solders.Preview By: Terashima, S.; Tanaka, M.. Science & Technology of Welding & Joining, Jul2009, Vol. 14 Issue 5, p767-774, 8p; DOI: 10.1179/136217109X437169; (AN 38910359) (not at uk)

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Science of the Total Environment
MST online MSU online & main TD172.S35 NWU online OkSU online OSU online & vet RA565S375 PU online & eng 363.7305Sci27 SDSU online SIUC online SIUE online UC online & sw depos UCSD online UD online UIC online & sci RA565.S365 UK online & chem/phys RA565.S365 UL online UM online & pub health RA421.S423 UT online UTo online & carlson WSU online & sci
(1 items found as of 4/19/2009)

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Scrap
http://www.scrap.org/ GIT main HD9575.A1S37 LH closed
(1 items found as of 4/19/2009)

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Screen Printing
LH closed RyU TT273.A1S33 UOk bizzell TT273.S33
(3 items found as of 4/19/2009) priority

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Scripta Materialia
Scripta Metallurgica et Materialia
MST online NWU OkSU online OSU online & sel TN1.S443 PU online & eng 669.005Scr34 RyU online SDSU online SIUC online TTU UC online UCI online & sci TN.S3 UCSD online UD online UK online sd & eng TN1.S36 UL online & kersey TN1.S36 UM online & aael TN600.S43 UOk online UT online & hodges TN1.S36 UTo online UTor online UWa online WSU online & sci
(>=20 items found as of 12/29/2009)
v25#10,v48#8-v62#5 Articles in Press to Dec. 29, 2009 checked 12/29/2009 priority

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Scripta Metallurgica
MST wilson TN1.S4 OkSU online OSU sel TN1.S44 SDSU compact TN1.S3 SIUC storage 54043-6691 TTU UCI online & sci TN1.S3 UCSD online UK eng TN1.S31 UL kersey TN1.S36 UOk online UT online UTO depos WSU sci
(0 items found as of 4/19/2009)
v8

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SEI Technical Review
http://www.sei.co.jp/tr_e/ UTor online
(4 items found as of 10/25/2009)
53-69 checked 10/25/2009 priority

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SEMICON
SEMICON West
UM buhr TK7871.85.S45411
(1 items found as of 4/19/2009) priority

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Semiconductor International
IU online KYVL Lexmark MST online NWU online OkSU online OSU online PU eng 621.3815205Se52 SDSU online SIUC online UAr online UC eng TK7871.85.S44 UCSD online UIC online & daley TK7871.85.S464 UK online UL kersey TK7871.85.S464 UM online USD online UT online
(16 items found as of 4/19/2009)

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Sensors and Actuators
MST online OkSU online OSU online & TK7881.2S46 TTU UCSD online UK online sd & eng TL272.S480 & TK7881.2.S46 UL kersey TK7881.2.S46 UMe UT online
(4 items found as of 4/19/2009)

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Sensors Magazine
IU online MSU eng TA165.S458 NWU online OSU online PU eng 681.205Se59 UIC online UK online & eng TA165.S458 UL kersey TJ212.S42 UT online WSU sci
(1 items found as of 4/19/2009)

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Nth Siberian Russian Workshop and Tutorial on Electron Devices and Materials
Nth Annual xxx International Workshop and Tutorial on Electron Devices and Materials
Nth Annual xxx International Siberian Workshop and Tutorial on Electron Devices and Materials
Nth Annual xxx International Siberian Workshop on Electron Devices and Materials
Nth Annual xxxx Siberian Russian Workshop on Electron Devices and Materials
International Conference and Seminar on Micro/Nanotechnologies and Electron Devices
Nth International Workshop and Tutorials on Electron Devices and Materials
IEEE XPLORE (00-) UK online UM online? (many other universities also subscribe to IEEE XPLORE)
(1 items found as of 2/28/2010)
00-09 all checked 2/28/2010

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SID Conference Record of the International Display Research Conference
91

Watanabe, Itsuo, Gotoh, Yasushi, Kobayashi, Kouji "Packaging technologies using anisotropic conductive adhesive films in FPDs SID Conference Record of the International Display Research Conference, 2001, pp. 553-556

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Sitzungberichte der Eosterreichischen Akadamie der Wissenschaften in Wien

Hasslinger, Sitzb. Akad. Wien, 117, 501 (1908).

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Sitzungsberichte der koniglich Akadamie der Wissenschaften zu Amsterdam
UT hodges closed AS142.V33

Sitzungsberichte der konigl. Akadamie der Wissenschaften zu Amsterdam June 24, 1899

Sitzungsberichte der konigl. Akadamie der Wissenschaften zu Amsterdam Sept. 30, 1899

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SMART Group
http://www.smartgroup.org/members/seminar.asp
(>=20 items found as of 4/19/2009)
99-01,03-04 priority

*** here sometime *** ," SMART Group Lead Free and 0201 Assembly and Soldering Seminar, High Wycombe, United Kingdom, Feb. 14, 2002.

," Design For Manufacture Considerations for Lead-Free, Cork, Ireland, Dec. 2, 2004.

," SMART Group 7th Annual Lead Free Seminar, High Wycombe, United Kingdom, Feb. 2005.

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SMARTer
http://www.smartgroup.org/
(1 items found as of 4/19/2009)
Dec08 checked 4/9/2009

--------------------------------------------------------
SMEMA Council

Zhang, Y, , C. Chen, C. Fan, J .A. Abys &, A. Vysotskaya, WC SMEMA Counci] , S06-1, 2002.

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SMT Web Exclusive Article
http://smt.pennnet.com/display_category/35/2008/HMST/3/Home-Page/
(>=20 items found as of 4/19/2009)
98-09 checked 4/3/2009

"," SMT Web Exclusive Article.

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SMTA China East Technical Conference xxxx
(5 items found as of 4/19/2009)
08 checked 6/21/2008 priority

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xxxx SMTA International Conference Proceedings
xxxx Surface Mount International Conference Proceedings
http://www.smta.org/knowledge/knowledge.cfm Lexmark TK7868.P67S87 LH closed & open UK eng TK7868.P7S870 UTA eng TK7868P7S935
(>=20 items found as of 10/16/2009)
92-93,95-09 checked 10/16/2009 priority

Dimock, Fred C., Mattson, Kristen M., Yin, Wusheng, and Lee, Ning-Chen, fdimock@btu.com. "The Effect of Cooling Rate on the Shear Strength of Lead-Free Flip-Chip Assemblies Using No-Flow Underfill" (SMTAI, Sept. 2005)

JCAA/JGPP Consortia Pb-free Solder Project, ddhillma@rockwellcollins.com. "Report on JCAA/JGPP Consortia Pb-Free Solder Project" (SMTAI, Sept. 2005)

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SMTAnews & Journal of Surface Mount Technology
SMTA Journal
Journal of SMT
Journal of Surface Mount Technology
http://www.smta.org/
(>=20 items found as of 12/25/2009)
v12#1-v22#4 checked 12/25/2009 priority

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Solar Energy Materials and Solar Cells
AU online FIT evans FSU online GIT online & main-5e TJ812.7.S64 LH closed MST online NWU online OkSU online OrSU online OSU online PU online RU online SDSU online UAr online UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UM online & aael TJ810.S673 UMC online UNF online UOk online USF online USU online UT online UTA online UTo online WrSU online
(2 items found as of 4/19/2009)

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Soldering & Assembly Technology

Baudry, I, and Kerros, G, "Focused Ion Beam in Microelectronics Packaging Applications - Leadfree Plating Analysis," Soldering &, Assembly Technology, vol. 3 Nov. 3, 2001.

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Soldering & Surface Mount Technology
AU online FIT online FSU online GIT online IU online LH closed MSU online NWU online OkSU online OSU online RyU online SDSU online UA online UAr online UC online UCB online UCF online UCSD online UD online UF online UK online UL online UM online UMC online UNF online UOk online UT online UTo online UWa online VU online WSU online
(>=20 items found as of 3/4/2010)
v1#1-v9#2,v10#1-v22#1 checked 3/4/2010 priority

(new references 4/11/2009
Ren, W., Lu, M., Liu, S., and Shangguan, D., "Thermal Mechanical Property Testing of Lead-Free Solder Joints," Soldering &am; Surface Mount Technology, vol. 9 no. 3, pp. 37-40, 1997.

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Soldering Science & Technology Club

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Solid State Communications
MST online OkSU online OSU online & sel QC176A1S6 SDSU online SIUC online SIUE online UAr online UK online sd & chem/phys QC176.A1 UL online & kersey QC176.A1S6 UMe online & mcwherter UOk online USD online UT online
(1 items found as of 4/19/2009)

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Solid State Physics
CBU 539.2So44 MST wilson QC173.S477 NWU various OkSU stillwater 531.7S686 PU eng 539.2So4 & phys 539.2So4 & hicks 530.4105J826 SIUE lovejoy QC173.S477 UAr phys QC1.S797 & QC173.S477 UC phys QC173.S48 UCSD online UD roesch QC173.S686 UK chem/phys QC173.S477 UL kersey QC1.J622 UM online & aael QC1.P58212S6 & aael QC176.S693 UMe mcwherter USD cl QC173.S477 UT hodges QC173.S477
(3 items found as of 4/19/2009)

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Solid State Technology
Lexmark MST wilson TK7872.S4S44 OkSU online OSU online & sel TK7872.S4A1S4 PU phys 537.22Se55 SDSU online SIUC morris 54108-6213 TTU UAr online UCSD online UD roesch UK online & eng TK7872.S4S45 UL kersey TK7872.S4S44 UM online & aael TK7872.S4S475 USD online UT online
(18 items found as of 12/29/2009)
v15#1-v27#8,v28#2-v29#11,v33#1,v33#3-v33#8,v48#1-v52#11 checked 12/29/2009

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Soviet Physics - Crystallography
Crystallography Reports
Kristallografiia
Kristallografiya
AU rbd QD901.K7135 FSU online & dirac 540.5K92Y & storage 540.5K92Y GIT online & main QD901.K7 & storage QD901.K7 IU bloomington alf QD901.K92 MST wilson QD901.K7135 OSU online & geo QD901K719 SDSC compact QD901.S6 SIUC storage 54137-5481 SIUE lovejoy UAr storage QD901.K7135 UC online UCF online UCSD s&e QD1.S7321 UD online & roesch UK online & storage QD901.K7135 UL online & QD901.K7135 UM online & shapiro QD901.S73 & buhr QD901.S73 UNL ldrf QD901.K1135 UOk bizzell QD901.K7135 USD online UT hodges QD901.S63 UTo online & carlson
(1 items found as of 4/19/2009)

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Soviet Physics Uspekhi
AU online BYU lee QC1.U812 FIT online FSU online GIT 4e QC1.U812 IU online LH online MST depos 530.5 So89u NWU online OGI online OkSU main 530.5S7297 OrSU valley QC1.U83 OSU sel QC1.U82 PU online SDSU QC1.U812 SIUC storage 54143-5301 SIUE lovejoy SU online TTU UAB sterne QC1.U812 UAr online UC geomathphys QC1.U812 UCF online UCI sci drum QC1.U812 UCSD s&e QC1.S7328 UD remote UDe online UF online UIC online UIUC oak 530.5US2 UK sci QC1.U812 UM online UMe mcwherter UOk online USF online UTA physmath QC1U812 UTo online UTor online UWa davis QC1.U812 WrSU dunbar QC1.U812
(1 items found as of 7/9/2009) priority

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Space 2005
UM aael TL787.I4651
priority

Barnes, Charles E, Sampson, Michael J, LaBel, Kenneth A, The NEPP and NEPAG Programs: Providing Parts Assurance for Space Systems Success Space 2005, Long Beach, CA, USA, 30 Aug.-1 Sept. 2005. 21 pp. 2005

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Space News
UCB eng TL787.S6724 UM shapiro QB1.S77385 VU sci TL787.S6724
priority

Silverstein, S, , "Reasons for Failure Lost With Galaxy 4," Space News, pp.3 and pp.20, Aug. 17 - 23, 1998.

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Special Casting and Nonferrous Alloys
Tezhong Zhuzao Ji Youse Hejin
LH closed
priority

(new references 12/31/2008)
Huang, Huizhen (Nanchang University), Huang, Qisen, Peng, Shu, Zhou, Lang "Effects of Ag addition on properties of Sn-9Zn lead-free solder alloys," Tezhong Zhuzao Ji Youse Hejin/Special Casting and Nonferrous Alloys, vol. 26 no. 3, Mar. 2006, pp. 179-181 Language: Chinese.

Fan, Yanli, Zhang, Keke, Wang, Yaoli, Zhu, Yaomin, Zhang, Xin, Yan, Yanfu .Effects of Ni on the performance of Sn.5Ag.7Cu.1RE solder alloy and its solder joints Tezhong Zhuzao Ji Youse Hejin/Special Casting and Nonferrous Alloys, v 27, n 8, August, 2007, p 651-653 Language: Chinese

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Spectrochimica Acta - Part B Atomic Spectroscopy
AU online BYU hbll QD95.S633Pt.B FSU online GIT online IU online LH closed LU gray MoSU QD95.A1S62B MST wilson QD95.A1S62 NWU online OrSU online OSU online RU online SDSU QD95.A1S623 SIUC online SIUE lovejoy UAr mullins chem od QD95.S634 UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UK online & sci QD95.S634 UM online & shapiro QD1.S74 & buhr QD1.S74 UMC online UMe online & chem UNF online UOk online USF online USU online UT online UTA online UTo online WrSU online
(1 items found as of 4/19/2009)
v62#2 checked 2/8/2009

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Spectroscopy
AU online FSU online GIT online MST online NWU online OGI online OkSU online OrSU valley QC451.B2 OSU online PU chem 543.085805Sp31 SDSU online SIUC online SU online TTU QC451.S63 UAH online UAr online UC online UCI online UCSD online UDe online UF online UIC online UK online & sci QC450.S637 & sci QD1.F58no.86 UM online & shapiro QC450.S63 UMC online UMe mcwherter UNF online USD online USF online UTA online UTo online WrSU online
(1 items found as of 4/19/2009)
v22#7 checked 2/8/2009

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Spectroscopy and Spectral Analysis
Guang Pu Xue Yu Guang Pu Fen Xi
UTA storage QD95G836 UTo online
priority

(new references 12/30/2008)
Hua, Li, Wu, Yi-Ping, An, Bing, Lai, Xiao-Wei .Determination of heavy metals for RoHS compliance by ICP-OES spectrometry coupled with microwave extraction system Guang Pu Xue Yu Guang Pu Fen Xi/Spectroscopy and Spectral Analysis, v 28, n 11, November, 2008, p 2665-2670 Language: Chinese

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Standardization News
ASTM Standardization News
AU rbd 410.M382 FSU dirac 620.5A51263 Lexmark MST wilson TA368.A517 OkSU online OSU sel TA368A5 PU eng 620.004Am35 & hicks 620.004Am35 RyU TA404.5.A1S83 SDSU compact TA401.A684 SIUC online SIUE lovejoy TTU UAr online UC eng TA401.A51 UCI sci TA368A517 UD roesch UF sci TA368.A517 UH TA401.A43 UK eng TA368.A519 UL TA368.A517 UT hodges TA401.A693 UTo carlson UTor eng TA410.A44 UWa davis TA401.A55x
(8 items found as of 10/23/2009)
v8#1-v37#2 checked 10/23/2009 low priority

-------------------------------------------------------
Steel Times
MST wilson TN1.I7 OkSU stillwater north_boomer 672.05 OSU online & sel TS300.I69 SIUC online UCSD online UK online UT online
(1 items found as of 4/19/2009)

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Steel Times International
MST online OSU online & sel TS300.S845 SDSU online SIUC online UCSD online UK online UOk online USD online UT online
(1 items found as of 4/19/2009)

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Studien zur Erhaltung von Musikinstrumenten
UTor music ML460.S915

priority

(new reference 2/11/2009)
A. Eckert, in: F. Hellwig, Ed., Studien zur Erhaltung von Musikinstrumenten - Ko"lner Beitra"ge zur Restaurierung und Konservierung von Kunst- und Kulturgut, Vol. 17 , Siegl Verlag, Mu"nchen 2006, pp. 181-292, ISBN 978-3-935643- 33-7.

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Studies in Conservation
Etudes de conservation
IU online & bloomington fine N8560.S853 MST online NWU online & deering 708S933 OkSU online OSU online & fine N8560A1S75 SDSU online SIUC online UAr online UC online & class AM1.A7 UCSD online UD online UE online UIC online & daley N8560.S82 UK online & fine arts N8560.S82 UL art N8560.S82 UM online & fine arts N1.S92 & buhr N1.S92 UMe online & mcwherter USD online UT online
(2 items found as of 4/19/2009)

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Successful Lead-Free/RoHS Strategies Conference
(17 items found as of 4/19/2009)
07 checked 4/3/2009 priority

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Supply Chain Manufacturing & Logistics
Supply Chain Systems Magazine
http://66.195.41.11/index.php?option=com_frontpage&Itemid=1
(1 items found as of 4/19/2009)
checked 4/3/2009

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Supply & Demand Chain Executive
http://www.sdcexec.com/ MST online OkSU online SDSU online SIUC online UAr online UCSD online UOk online USD online
(>=20 items found as of 4/19/2009)
-Mar09 checked 4/3/2009

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Supply Management
http://www.supplymanagement.com/ AU online GIT online MST online NWU online PU online SDSU online UAr online UM online UMc online
(2 items found as of 4/19/2009)

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Surface and Coatings Technology
MST online OkSU online OSU online SDSU online SIUC online UAr online UC depository TS670.A1E43 UCSD online UK online sd UL online & kersey TS670.A1E43 UOk online UT online
(19 items found as of 4/19/2009)

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Surface Coatings International Part B: Coatings Transactions
AU rbd TP934.O53 LH closed MST online MSU online SIUC morris 58964-5001 UL kersey TP934.O382
(1 items found as of 4/19/2009)

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Surface Engineering
OSU sel TA418.7.S88 SDSU online SIUC online UAr online UC online UCSD online UK online USD online UT online
(2 items found as of 10/6/2009)
v24#5 checked 10/6/2009

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2000 Surface Finishes Forum Conference Proceedings
http://www.smta.org/knowledge/knowledge.cfm
(5 items found as of 11/6/2009)
00 checked 11/6/2009 priority

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Surface Mount Technology (SMT)
Surface Mount Technology online Article
http://smt.pennnet.com/ Lexmark MST online OSU online SDSU online SIUC online UCSD online UK online UOk online USD online UT online & hodges TK1.A3I462 UTo online
(>=20 items found as of 12/29/2009)
v7#1-v23#6 checked 12/29/2009

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Surface Science
AU online FSU online GIT online LH closed LU gray QD506.S8 MST online NWU online OGI sci OkSU online OrSU valley QD506.S9 OSU online PU online RU online SDSU online SIUC online TTU UAB sterne QD506.S8 UAr online UC online UCF online UCI online UCSD online UDe online UF online UIC online UIUC online UK online & remote QD506.S8 UM online & shapiro QC1.S955 & buhr QD1.S95 UNC online UMe online & mcwherter UNF online USF online UTA online UTo online WrSU online
(2 items found as of 4/19/2009)

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Surface World & Product Finishing

Jordan, Manfred Lead-free tin-alloy plating for mass-production. Surface World. Vol. 11 no. o. 1, pp. 40-42, 44, 46. Jan.-Feb. 2004

MacDermid "Iridite NCP" - a non-chrome aluminium passivate for RoHS, WEEE and ELV compliance. Surface World &, Product Finishing. Vol. 12 no. o. 6, pp. 44, 46, 48. June 2005

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Synthetic Metals
MST online OkSU online SDSU online UCSD online UD online UK online sd UM online & shapiro QC1.S9888 UMe online & mcwherter UOk online UT online
(2 items found as of 4/19/2009)

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Symposium on the Mechanism of Phase Transformations in Metals
UK eng TN600.I570 no.18
(0 items found as of 4/19/2009)

Hardy and Heal, Symposium on the Mechanism of Phase Transformations in Metals, Inst. Metals, 1955, p. 1. *** not applicable ***

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TTTT

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TDK Tech Briefs
(1 items found as of 4/19/2009) priority

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Technic Technical Conference

Schetty, Rob, , Tin Whisker Growth &, the Metallurgical Properties of Electrodeposited, Tin. Technic Technical Conference San Jose,CA May 2002 pag. 242.

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xxxx Technical Meeting of the American Chemical Society

Kang, Dong-Hee, Desai, Keyur, Lee, Jingu, Hwang, Sinyoung, Sung, Changmo, Mead, Joey the electrical properties of metallocene epdm for wire and cable applications 2004 Technical Meeting of the American Chemical Society, Rubber Division, Grand Rapids, MI, USA, 17-19 May 2004. 2004

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Technological Forecasting and Social Change
IU online MST online NWU online & main 658.05T252 OkSU online OSU online & sel T174A1T42 PU online & manage 658.4005T226 & hicks 658.4005T226 SDSU online SIUE online UAr mullins T174.T38 UC online & eng T174.T38 UCSD online UD online UIC online & daley T174.T38 UK online sd UL online & ekstrom T174.T38 UM online & aael T174.T25 UOk online UT online & hodges T174.T43
(1 items found as of 4/19/2009)

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Techonline
http://www.techonline.com/
(6 items found as of 4/19/2009)
checked 4/3/2009

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Technology Review
http://www.technologyreview.com/magazine/ AU online CBU FSU online GIT online Lexmark LH closed LU gray T171.M47 MST online NWU online OGI online OkSU online OrSU valley microfilm T1.T4 OSU online PU online RU fondren T171.M47 SDSU online SIUC online SIUE lovejoy SU online TTU UAB sterne T171.M47 UAH online UAr online UC online UCF online UCI online UCSD online UDe online UE online UF online UIC online UIUC online UMC online UNF online USD online USF online USU auto T171.M37 UTA online UTo online WrSU online
(2 items found as of 4/19/2009)

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Teknisk Ugeblad
AU rbd T4.T3 LH closed RyU online UM buhr T4.T47 UTor sci T4.T3
(1 items found as of 4/19/2009) priority

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2002 Telecom Hardware Solutions Conference Proceedings
http://www.smta.org/knowledge/knowledge.cfm
(2 items found as of 11/6/2009)
02 checked 11/6/2009 priority

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Test & Measurement World
http://www.reed-electronics.com/tmworld/ IU online MST online NWU online OkSU online OSU online PU eng 621.38154805T2869 SDSU online SIUC online UAr online UCSD online UIC online UK online UM online UOk online USD online UT online
(14 items found as of 1/5/2010)
-v29#11(Jan10) checked 1/5/2010

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Thermochimica Acta
AU online BYU online FIT online FSU online GIT online IU online LH closed MST online NWU online OkSU online OrSU valley QD1.T53 OSU online PU online RU online SDSU online TTU UC online UCF online UCI online UCSD online UD online UDe online UF online UIC online UIUC online UK online & storage QD510.T5 UL online & robotic QD510.T5 UM online & shapiro QD510.T42 UMC online UNF online UOk online USD online USF online USU online UT online UTA online UTo online WrSU online
(3 items found as of 4/19/2009)
v472#1-2 checked 2/8/2009

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Thermophysical Properties
UK eng QC175.3.S950

A METHOD OF MEASURING THERMAL CAPACITY OF PARTS TO BE MOUNTED ON A PRINTED WRUNG BOARD AND ITS APPLICATION TO REFLOW SIMULATION Thermophysical Properties, pp. 89-91, 2003

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Thin Films Science and Technology
Passivity of Metals and Semiconductors
OSU sel QD501.I597 PU eng 546.3In85p UC sw depos QD501.I6345 UM aael QC176.84.S49T441 WSU sci QD501.I6345
(0 items found as of 4/19/2009)

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Thin Solid Films
MST online OkSU online OSU online & sel TA407A1T4 SDSU online SIUC online TTU UAr mullins QC378.T44 UCB online UCI online & sci QC378.T45 UK online sd & eng TK7871.15.F5T45 UL online & kersey QC176.A1T47 UM online sd & shapiro QC1.T44 UMe online & mcwherter UOk online UT online UTo online & carlson WSU online & sci
(>=20 items found as of 12/29/2009)
v1#1-v518#5 Articles in Press to Dec. 29, 2009 all checked 12/29/2009

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Tin and its Uses
IU bloomington alf TN793.A1T4 MST wilson TN793.A1T4 NWU sci L669.6T5871 OkSU north_boomer 671.05T587 OSU depos TN793.A1T58 PU eng 669.6In8 SIUC storage 54238-6691 TTU TN793.A1T4 UM buhr TP245.T8A1T6 UOk bizzell TN793.A1 UTo carlson VU sci TN793.A1T4 WSU sci
(>=20 items found as of 4/19/2009)
#1-#165 all checked 7/11/2006

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Tin World
http://www.tininformation.com/TinWorld.htm
(>=20 items found as of 11/9/2009)
1-2,4,7,Apex,11-28 checked 11/9/2009 priority

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TMS Annual Meeting
UT hodges various
priority

(new references 12/30/2008)
Snugovsky, P. et al, "Microstructure, Defects, and Reliability of Mixed Pb-free/SnPb Assemblies" TMS Annual Meeting 2008 New Orleans, LA

Antrekowitsch, H., Potesser, M., Spruzina, W., Prior, F. .Metallurgical recycling of electronic scrap TMS Annual Meeting, v 2006, EPD Congress 2006 - Proceedings of Sessions and Symposia sponsored by the Extraction and Processing Division of The Minerals, Metals and Materials Society held during the 2006 TMS Annual Meeting, 2006, p 899-908

Kuo, Chen-Ming, Hsu, Esher .Waste home appliances recycling in some European and Asian countries TMS Annual Meeting, Recycling and Waste Processing 2007 - Proceedings of Symposium held during the 2007 TMS Annual Meeting, 2007, p 111-120

Powers, Mike, .An investigation of hexavalent-free chromate conversion coatings for test and measurement instrumentation TMS Annual Meeting, v 3, TMS2008 - 137th Annual Meeting and Exhibition Supplemental Proceedings: Materials Processing and Properties, 2008, p 295-300

Hui, Zhao, Nalagatla, Dinesh Reddy, Sekulic, Dusan P. .Wetting kinetics of eutectic lead and lead-free solders: Spreading over Cu surface TMS Annual Meeting, v 1, TMS2008 - 137th Annual Meeting and Exhibition Supplemental Proceedings: Materials Processing and Properties, 2008, p 619-624

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TMS Letters
http://doc.tms.org/
(4 items found as of 4/19/2009)
v1#1-v3#2 all checked 11/29/2007 priority

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TMS Light Metals
LH closed & open UK eng TN773.L53 UM aael TN773.A512 & aael CDROM UmX206 USU merrill-cazier TN 799.M2M259
priority

(new references 12/30/2008)
Mester, A., Fraunholcz, N., Van Schaik, A., Reuter, M.A. .Characterization of the hazardous components in end-of-life notebook display TMS Light Metals, Light Metals 2005 - Proceedings of the Technical Sessions Presented by the TMS Aluminium Committee, 2005, p 1213-1216

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Transactions of the American Institute of Mining and Metallurgical Engineers
IU bloomington alf TN1.A5 & indianapolis TN1.A5 MST wilson TN1.A5 MSU eng TN1.A5 NWU sci 622.06A51 OkSU stillwater 622.06A512t PU hicks 622.06Am3 & 622.06Am3m SDSU compact TN1.A52 SIUC mclafferty 622.062A512T UAr storage TN1.A5 UC sw depos TN1.A5 UIC warehouse TN1.A5 UK eng TN1.A5 UMe earth TN1A5 UOk geol TN1.S7 UT hodges TN1.A5 UTo depos WSU sci
(1 items found as of 4/19/2009)

Johnson and Mehl, Trans. Amer. Inst. Min. Met. Eng., 1939, 135, 416. *** not applicable ***

Bunshah and Mehl, Trans. Amer. Inst. Min. Met, Eng., 1953, 197, 1251. *** not applicable ***

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Transactions of American Society for Metals
CSM lakes IU indianapolis MST wilson 669.105Am3 MSU eng TS200.A76 OkSU stillwater 669.06A512t OSU sel TS200A75 PU hicks 669.106Am33 SDSU compact TS300.A76 TTU UC sw depos TS300.A76 UCSD s&e TN1.A5378 UD roesch UK eng TS300.A76 UL kersey TS300.A76 UM aael TS300.A565t & buhr TS300.A565t UMC online UOk bizzell TS300.A76 UTo depos WSU sci
(0 items found as of 4/19/2009)

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Transactions of the China Welding Institution (China)
Hanjie Xuebao
LH closed
(1 items found as of 4/19/2009) priority

(new references 12/30/2008)
Interfacial reaction between lead-free solder and Cu pad Hanjie Xuebao/Transactions of the China Welding Institution, vol. 26, pp. 9-12, 2005

Han, Zong-Jie, Xue, Song-Bai, Wang, Jian-Xin, Wang, Shao-Bo .Effects of Sn-Cu-Ni-Ce solder on mechanical properties of micro-joints soldered with diode-laser soldering system Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 1, January, 2007, p 33-36 Language: Chinese

Wang, Jian-Xin, Xue, Song-Bai, Huang, Xiang, Han, Zong-Jie, Yu, Sheng-Lin .Effects of N2 protection on wettability of Sn-Cu-Ni-Ce lead-free solder Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 1, January, 2007, p 49-52 Language: Chinese

Zhang, Xinping, Yu, Chuanbao, Zhang, Yupeng, Zhu, Min .Creep-resistant performance of two lead-free solders and comparison with Sn60Pb40 solder Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 2, February, 2007, p 1-4 Language: Chinese

Wei, Guoqiang, Kuang, Min, Yang, Yongqiang .Interfacial reaction of Sn-9Zn/Cu joint with Cu particle-rein forced composite solder Sn-9Zn Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 5, May, 2007, p 105-108 Language: Chinese

Wang, Hui, Xue, Songbai, Chen, Wenxue, Wang, Jianxin .Effect of Ag, Al, Ga addition on wettability of Sn-9Zn lead-free solder Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 8, August, 2007, p 33-36+44 Language: Chinese

Yan, Yanfu, Ji, Lianqing, Zhang, Keke, Yan, Hongxing, Feng, Lifang .Foundation of steady state creep constitutive equation of SnCu soldered joints Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 9, September, 2007, p 75-79 Language: Chinese

Zhang, Liang, Xue, Songbai, Lu, Fangyan, Han, Zongjie .Finite element analysis on soldered joint reliability of QFP device with different solders Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 10, October, 2007, p 45-48+52 Language: Chinese

Meng, Gongge, Yang, Tuoyu, Chen, Leida .Microstructure and melting property of Sn-.5Ag-.7Cu-XGe solder Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 10, October, 2007, p 65-68 Language: Chinese

Han, Zongjie, Xue, Songbai, Zhang, Xin, Wang, Jianxin, Fei, Xiaojian, Yu, Shenglin .Diode laser soldering for chip resistor component Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 11, November, 2007, p 49-52 Language: Chinese

Shi, Yiping, Xue, Songbai, Wang, Jianxin, Gu, Liyong, Gu, Wenhua .Effects of Ce on spreadability of Sn-Cu-Ni lead-free solder and mechanical properties of soldered joints Hanjie Xuebao/Transactions of the China Welding Institution, v 28, n 11, November, 2007, p 73-77 Language: Chinese

Zhang, Xin, Xue, Songbai, Han, Zongjie, Han, Xianpeng .Influence of diode-laser soldering procedure on mechanical properties and microstructure of Sn-Ag-Cu soldered joint Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 2, February, 2008, p 22-26 Language: Chinese

Yu, Chun, Xiao, Junyan, Lu, Hao .Effects of .0% Zn or Ni additions on interfacial reaction and growth of intermetallics in Sn-.5Ag/Cu joint Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 3, March, 2008, p 81-83 Language: Chinese

Xue, Songbai, Wang, Jianxin, Yu, Shenglin, Shi, Yiping, Han, Zongjie .Effects of thermal cycling on mechanical property of chip resistor joints soldered with Sn-Cu-Ni-Ce solder Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 4, April, 2008, p 5-8 Language: Chinese

Chen, Wenxue, Xue, Songbai, Wang, Hui, Han, Zongjie .Effects of Ga on properties of Sn-9Zn lead-free solder Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 4, April, 2008, p 37-40 Language: Chinese

Han, Zongjie, Xue, Songbai, Wang, Jianxin, Yu, Shenglin, Fei, Xiaojian, Zhang, Liang .Thermal cycling of rectangular chip resistor joints soldered with lead-free solder by diode laser Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 5, May, 2008, p 53-56 Language: Chinese

Chen, Leida, Meng, Gongge, Liu, Xiaojing, Li, Zhengping .Influence of Sb on Sn-.7Cu solder's melting point and soldering interface Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 5, May, 2008, p 105-108 Language: Chinese

Wang, Lifeng, Sun, Fenglian, Liu, Xiaojing, Liang, Ying .Design of Sn-Ag-Cu-Bi solder alloy and analysis on microstructure and properties Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 7, July, 2008, p 9-12 Language: Chinese

Meng, Gongge, Yang, Tuoyu, Chen, Leida, Wang, Shizhen, Li, Caifu .Effect of Ge on the SnAgCu/Cu soldering interface Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 7, July, 2008, p 51-53+56 Language: Chinese

Chen, Wenxue, Xue, Songbai, Wang, Hui, Hu, Yuhua .Wettability of lead-free solders of Sn-Zn-xAl Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 8, August, 2008, p 37-40+44 Language: Chinese

Fang, Yili, Zhou, Jian, Xue, Feng, Sun, Yangshan .High-temperature oxidation behavior of Sn-8Zn-3Bi-P and its effect on properties Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 8, August, 2008, p 89-92+96 Language: Chinese

Zhang, Liang, Xue, Songbai, Han, Zongjie, Yu, Shenglin, Sheng, Zhong .Investigation of mechanical property and fracture morphology of lead-free soldered joints of fine pitch devices Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 9, September, 2008, p 35-38 Language: Chinese

Meng, Gongge, Li, Caifu, Yang, Tuoyu, Chen, Leida .Effect of germanium on shearing strength and fracture surface of SnAgCu/Cu soldering joint Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 9, September, 2008, p 59-62 Language: Chinese

Sun, Fenglian, Hu, Wengang, Wang, Lifeng, Ma, Xin .Influence of Bi on the melting point and wettability of Sn-.3Ag-.7Cu lead-free solder Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 10, October, 2008, p 5-8 Language: Chinese

Zhang, Liang, Xue, Songbai, Zeng, Guang, Han, Zongjie, Yu, Shenglin .Study on mechanical properties and numerical simulation of fine pitch devices soldered joints Hanjie Xuebao/Transactions of the China Welding Institution, v 29, n 10, October, 2008, p 89-92 Language: Chinese

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Transactions of the Faraday Society
CBU IU online & bloomington alf TK1.F2 MST online NWU online & sci 540.6F219 OSU sel QD71F21 & depos QD71.F21 PU online & chem 541.3F22 & hicks 541.3F22 SIUC online SIUE storage TTU QD450.F21 UAr online UC chem (Oesper Rm) TK1.F25 UCSD online UD roesch UE UIC warehouse QD1.C585 UK chem/phys QD450.F21 UL kersey QD1.C6152 UM shapiro QD1.C5239 UOk online UT hodges closed TK1.F25
(1 items found as of 4/19/2009)

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Transactions of the Institute of Metal Finishing
LH closed MST wilson TS653.I55 OrSU valley TS200.I47 SIUC morris 52856-6711 UM aael TS670.A1I57 (v37-) & buhr TS670.A1I57 UOk online UTor online UWa annex TS200.I475A2 WSU storage
(>=20 items found as of 10/25/2009)
v31,v37-v61,v66#1-87#5 checked 10/25/2009 priority

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Transactions of the Institute of Mining & Metallurgy
OkSU online UK eng TN1.I6 OSU sel TJ4.O86
(0 items found as of 4/19/2009)

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Transactions of the Japan Society of Mechanical Engineers
Nihon Kikai Gakkai Ronbunshu, A Hen
Nippon Kikai Gakkai Ronbunshu, A Hen
LH closed NWU sci 621.06S678tserA PU eng 621.06 RyU online UT hodges TJ4.J3
priority

(new references 12/30/2008)
Kim, Young-Bae no. oguchi, Hiroshi, and Amagai, Masazumi, "Fatigue characteristics of solder joints in BGA-IC package due to vibration," Nippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A, vol. 70 no. 12, pp. 1725-1732, Dec. 2004.

Kim, YoungBae, Noguchi, Hiroshi, Amagai, Masazumi "Evalution of drop strength due to thermal degradation for BGA-IC package," Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A, vol. 72 no. 2, Feb. 2006, pp. 186-191 Language: Japanese.

Kaneko, Kenji, Usui, Shinya, Enomoto, Kazuki .Study on elastic-viscoplastic deformation behavior of Sn-Pb and Sn-Ag-Cu solder alloys Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A, v 73, n 8, August, 2007, p 897-904 Language: Japanese

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Transactions of the Japanese Institute of Metals

Handwerker, C. A. (METALLURGY DIVISION - 855) Research Trends in Lead-Free Soldering in the U.S.: NCMS Lead-Free Solder Project and the NEMI Lead-Free Solder Project Transactions of the Japanese Institute of Metals - Dec. 1, 1999

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Transactions of the Metallurgical Society of AIME
Transactions of the American Institute of Mining Engineers
BYU lee TN23.A5154x IU bloomington geo TN1.A5 & geo TN600.M375 & alf TN1.A5 MST depos 622.06Am3 MSU eng TN1.A5 & eng TN600.M37 NWU sci 622.06A51 & sci 622.06A51me OkSU stillwater 669.06M587t OSU various PU hicks 669.005M5641 & hicks 669.05J82 & hicks 622.06Am31m & hicks 669.106Am33 SDSU compact TN1.A51 SIUC morris 51829-6691 UAr mullins TN1.M4 UC sw depos TN1.A5 UIC warehouse TN600.M375 UK eng TN1.A5 & eng TS300.A76 UOk bizzell 669.05 M5652t UT hodges TN1.A5 UTo depos WSU sci
(2 items found as of 4/19/2009)

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Transactions of the Newcomen Society
Transactions - Newcomen Society for the Study of the History of Engineering and Technology
OkSU stillwater 620.9N541t SIUC online UMe mcwherter T1N47 UOk online UTo carlson UU marriott T1.N47
(1 items found as of 4/19/2009)

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Transactions of Nonferrous Metals Society of China (English Edition)
LH closed OkSU main 669.05T772 RU fondren TN758.T72 RyU online UTor online VU online
(14 items found as of 10/25/2009)
v16#s1-v16#s2,v16#1-v19#5 checked 10/25/2009 priority

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TUV Rheinland World News
http://www.us.tuv.com/news_and_events/newsletter/index.html
(9 items found as of 4/19/2009)
Jan2001-Oct2006 checked 4/3/2009 priority

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UUUU

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U. S. Tech
http://www.us-tech.com/
(3 items found as of 4/19/2009)
-Mar09 checked 4/3/2009

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Ukrainskij Fizychnyl Zhurnal
KSU hale QC1.U35

A. I. Bichovs'kij, Ukrainskij Fiz. Zh., 7 (1963) 609.

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Ultrasonics Sonochemistry
MST online NWU sci L534.05U471 OkSU online OSU online & sel QD801.U48 PU online & eng 541.305UL85 SDSU online SIUC online UC online UCSD online UD online & roesch UI online UIC online UK online sd & eng QD801.U48 UL online & kersey QD801.U48 UM online & aael QD801.U481 UOk online UT online
(1 items found as of 4/19/2009)

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UPB Scientific Bulletin, Series B: Chemistry and Materials Science
priority

(new references 12/30/2008)
Mandea, Florentina, Jitaru, Ioana .Chromate-free pretreatment for metallic surface UPB Scientific Bulletin, Series B: Chemistry and Materials Science, v 69, n 3, 2007, p 3-8

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Update Intertek
(1 items found as of 4/19/2009)
08-1 checked 4/6/2009 priority

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VVVV

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VDI Berichte
AU rbd TA3.V15 LH closed NWU sci L620.6V4892 PU hicks 620.5Z3a TTU UAB sterne TA3.V15 UAr mullins TA3.V15 UCI various UCSD srlf TA1.V489 UM online & buhr TA3.V39 UTor eng TA3.V516
priority

(new references 12/31/2008)
Ehrhardt, H., Becker, R., Rupp, Th., Wolff, J. .Die Bedeutung der Applikation fur die Zuverlassigkeit von Bleifreien Steuergeraten (Mission profile and reliability of lead free control units) VDI Berichte, n 2000, 2007, p 549-561 Language: German

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Vestnik metallopromyshlennosti
LH closed OSU depos HD9506.S652V47 UM buhr TJ4.V58

P. P. Belyaev and S. P. Markova, Vestnik Metalloprom. 17, 111 (1937).

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WWWW

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Wafer & Device Packaging and Interconnect
http://www.waferpackaging.com/
v1#1-v1#2 checked 11/9/2009

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Wafer-Level Congress and Exhibition Conference Proceedings
(8 items found as of 4/19/2009)
04 priority

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(new source 1/6/2010)
Waste Management

(new reference 1/6/2010)
Vann, K., Musson, S., Townsend, T. (2006) "Factors Affecting TCLP Lead Leachability From Computer CPUs." Waste Management. 26:293-298.

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Waste Management and Research
MST online NWU online OkSU online OSU online PU online & eng 628.405W288 SDSU online SIUC online UAr mullins TD896.W35 UC online & eng TP995.A1W39 UCSD online UD online UK online sd UM online UOk online USD online UT online
(14 items found as of 12/29/2009)
v1#1-v27#10 all checked 12/29/2009

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Waste News
http://www.wastenews.com/headlines.html MST online SDSU online SIUC online UAr online UCSD online UOk online USD online
(14 items found as of 4/19/2009)
checked 4/3/2009

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Welding Design and Fabrication
AU online BYU hbll TS227.A168 FIT online IU online LH closed LU gray microfilm TS227.A168 MST online NWU online OGI online OkSU online OrSU valley TS227.A15I6 OSU online PU eng 669.173In25 & hicks 669.173In25 RU Fondren TS227.A16 SDSU online SIUC online SU online TTU UAr mullins TS227.A168 UC eng TS227.A168 UAH online UCI online UDe online UF online UIC daley TS227.A168 UIUC online UK online & remote TS227.A168 UM online & aael microfilm EX19 UMC online UOk online USD online USU online UT online UTA online UTo online WrSU online
(4 items found as of 12/29/2009)
v78#1-v82#8 checked 12/29/2009

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Welding in the World
AU rbd TS227.A28 LH closed OkSU stillwater 671.5205W445 OSU online UC online UD online UT hodges TS227.A183 UTo online
(1 items found as of 4/19/2009)

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Welding Journal
AU rbd TS227.A15 MST wilson TS227.A15 OkSU stillwater 671.05W4455 OSU sel TS227A5 RU fondren TS227.A15 SDSU TS227.A15 SIUC online SIUE lovejoy TTU online UAr mullins TS227.A15 UC eng TS227.A15 UCSD online UD roesch 2nd UK online UL kersey TS227.A15 UOk bizzell TS227.A15 & eng TS227.A15 UT hodges TS227.A15 UTA eng 671.06.AM35 VU sci TS227.A15
(4 items found as of 4/19/2009)
v80#10,v85#3,v86#3,v86#9

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Wire & Cable Technology International
(5 items found as of 4/19/2009) priority

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Wire Journal
LH closed MST depos 671.84W743j MSU eng TS270.A1 W57 OkSU stillwater 671.8405W7981 PU hicks 671.8405W744 & eng 671.8405W744 SIUC storage 51095-6711 UM buhr TS270.A1W82
(1 items found as of 4/19/2009) priority

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Wire Journal International
NWU online OkSU stillwater 671.8405W7982 PU eng 671.8405W744 & hicks 671.8405W744 SIUC online UCI online UCSD online UIC warehouse TS270.A1W57 UM online WSU online
(1 items found as of 4/19/2009) priority

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Wireless Design & Development
http://www.wirelessdesignmag.com/Default.aspx?CommonCount=0 MST online OkSU online SDSU online SIUC online UAr online UCSD online UOk online USD online
(2 items found as of 12/25/2009)
-Dec08,May09-Dec09 checked 12/25/2009

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Works Management
IU online MST online NWU online OkSU online OSU online SDSU online SIUC online UAr online UCSD online UK online UM online USD online UT online
(1 items found as of 4/19/2009)

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Workshop on Devices, Interconnects, and Packaging for Next Generation Computing and Communication Applications
http://www.cpmt.org/mem/
(1 items found as of 4/19/2009)
03 checked 4/3/2009 priority

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World of Metallurgy
ERZMETALL
LH closed MST wilson TN3.Z42 PU eng 669.05Z28 & hicks 669.05Z28
(1 items found as of 4/19/2009) priority

(new references 12/30/2008)
Vanbellen, Francis, Chintinne, Mathias ."Extreme makeover": UPMR's Hoboken plant World of Metallurgy - ERZMETALL, v 61, n 1, January/February, 2008, p 14-19

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XXXX

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X-Ray Spectrometry
IU online LH closed MST online MSU online NWU online & sci L537.5352X13 OkSU online OSU online SDSU online SIUC storage 54355-5351 UAr online UC online & geo QC481.X16 UCSD online UD online UIC online UK geol QC481.X16 UM online & shapiro QC481.X161 USD online UT online & hodges QC173.X75 UTo online & carlson WSU online & sci
(1 items found as of 4/19/2009)

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YYYY

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Yazawa International Symposium
MST wilson TN605.Y39 UM aael TN605.T39
(5 items found as of 4/19/2009)
03 checked 3/31/2008

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ZZZZ

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Zeitschrift fur anorganische und allgemeine Chemie
IU online & bloomington chem QD1.Z37 & alf QD1.Z37 MST online MSU online & sci QD1.Z4 NWU online & sci 546.05Z48 OSU online & sel QD1Z473 & depos QD1Z473 SDSU online SIUC storage 54363-5402 SIUE lovejoy TTU UAr online UC online & chem (Oesper Rm) QD1.Z4 UCSD online UD online UIC online & sci QD1.Z4 UK chem/phys QD1.Z4 UL online & kersey QD1.Z4 UM online & shapiro QD1.Z5 UOk online USD online UT online & hodges & closed QD1.Z4
(2 items found as of 4/19/2009)

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Zeitschrift fur Elektrochemie
IU bloomington alf QD1.Z48 MST depos 541.175Z3 MSU remote TP250.D4 NWU sci 660.5Z48 OkSU stillwater 660.5Z48 OSU sel TP250Z48 PU hicks 540.5Z3 SDSU compact TP250.Z6 SIUC storage 51544-6212 UC chem (Oesper Rm) TP250.Z6 UCSD online UD roesch UIC warehouse TP250.Z6 UK chem/phys TP250.Z6 UL kersey TP250.Z6 UM shapiro QD1.Z52 & buhr QD1.Z52 UOk storage TP250.Z6 UT hodges closed TP250.Z6 WSU sci
(5 items found as of 4/19/2009)

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Zeitschrift fur Physik
IU bloomington swain QC1.Z4 & alf QC1.Z4 MST online NWU sci 530.5Z484 OkSU main 530.5P57832 OSU sel QC1Z48 PU phys 530.5Z373b SDSU compact QC1.Z37 SIUC morris 54376-5392 SIUE lovejoy TTU UAr storage QC1.Z45 UC phys QC1.Z4 UCSD online UD online UIC sci QC1.Z48 UK chem/phys QC1.Z48 & king QC793.Z450 UL kersey QC1.Z412 & QC1.Z4 UM online & aael QC1.Z48 & shapiro QC1.Z48 & buhr QC1,Z48 UOk online UT hodges & closed QC1.Z44 UTor sci QC1.Z4502 UWa online
(2 items found as of 10/3/2009)
v37#2 checked 10/3/2009 priority

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Zeitschrift fur Physikalische Chemie
IU bloomington chem QD1.Z46 & alf QD1.Z46 MST wilson QD1.Z46 MSU sci QD1.Z45 NWU online & sci 541.05Z481 OkSU stillwater 540.5Z485 SDSU QD1.Z45 & QD1.Z455 SIUC morris 54379-5401 SIUE lovejoy TTU UAr storage QD1.Z45 UC chem (Oesper Rm) QD1.Z46 & QD1.Z45 UCSD s&e QD1.Z491 UD roesch remote UK chem/phys QD1.Z46 & king QD1.Z46 & young S 92-85 UL kersey QD1.Z46 & microforms UM shapiro QD1.Z56 UOk chem-math QD1.Z46 UT hodges & storage QD1.Z45 UTo bowman-oddy WSU sci
(>=20 items found as of 4/19/2009)

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Zhang, Y Tin Whiskers: Modeling Whisker Programme at ITRI Aug. 17, 2001, Letter to D. Dittes @ ITRI found on NEMI Web

Zhang, Y Tin Whiskers: Modeling Meeting Minutes Sept. 12, 2001 Zhang, Y, Vo no. , Lal, S, Oberle, B. Tin Whiskers: Modeling Meeting Minutes Sept. 19, 2001 Aug. 17, 2001, Letter to D. Dittes @ ITRI found on NEMI Web page:

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Olsen, D. Lead-Free Coating Technology: Review of Tin Whiskers and Recommendations Consultant report contracted by ON Semiconductor, Dec. 31, 2000

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Carsem (Malaysia) Elimination of Lead (Pb) on External Lead Finishing for Electronic Components Presentation c.a 2001

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Strube, Gernot, , X-Ray Diffraction and whisker growth. Is there any correlation? SCHLOTTER Internal Conference on Lead Free Electronics. Soldertec. IPC. Junio 2003 pag 158.

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Thermo mechanical fatigue of solder joint: A new comprehensive test method.

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Toben, Michael, Egli, Andre, , Jochen Heber, Anja Vinckier, Felix Schwager Tin Whiskers In Electrodeposits: An Overview of the Mechanisms, Shipley Company, LLC, Freeport no. Y Shipley Schweiz AG, Lucerne .

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Seeling, Karl, and David Suraski. Lead-Free Technology: A New Material Challenge,

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http://www.sae.org/technical/standards/AIR5444 SAE International, "Investigation of Whisker Formation on Tin Plated Conductors", SAE Standard AIR5444, Dec. 1998.

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Schetty, Rob, , Egli, Andre, , Jochen Heber, Anja Vinckier, Lead-Free Finishes Whisker Studies and Practical Methods for Minimizing the Risk of Whisker Growth, Shipley report.

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Product/Process Problem Alert Bulletin 9202, The Aerospace Corporation, May 14, 1992.

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Park, H. S, , "Requirements to Preclude the Growth of Tin Whiskers," NASA Memo no. ASA Parts Project Office-Code 310, Goddard space Flight Center to QR/Director, Reliability, Maintainability, and Quality Assurance Divisin, Feb. 14, 1992.

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Moore, D. E, , "Tin Whisker Problem on Military Specifications Items," Oct. 1 , 1992. 14. H.S.

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Lin, C. M, "Tin Whisker Growth on IC Lead Finish-A Review," AT&T Bell Laboratories Technical Memorandum: TM52221-840709-01, July 9, 1984.

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Lead-Free Soldering for Surface Mount Technology Applications

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Inter-Office Memo, "Elimination of Tin Whisker Growth of Tin Plated Chip Capacitors", Murata Erie North America Inc. (internal report), Apr. 1987.

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Helber, D, , "Tin Whisker Formation ", A Presentation at Aerospace Corporation no. ov. 19, 1992.

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Gauldin, R, , "Tin whiskers on Hybrid Power Converter Lids," JPL Failure Analysis Laboratory (SEM log 7370), July 22, 1998.

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Brooks, P. J, , "JC-13.2 New Business item: Addition of Matte Tin Final Lead or Terminal Finish to MIL-PRF-38535", Addendum to JC-13.2 Agenda at January 2001 Meeting, San Antonio, Texas, Jan. 11, 2001.

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Conwell, D, , "Zinc Whisker Shorting in Vacuum", LMAO Astronautics Mission Success, July 20, 2001.

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Backes, P. G, "Selected Programs Shorting Failure Investigation Final Report (FASS 1298)," Hughes Technical Internal Correspondence, Oct. 16, 1991.

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Morose, Greg, Harriman, Liz, et al, greg@turi.org. New England Lead Free Electronics Consortium--Phase III Efforts" --------------------------------------------------------
"How to Avoid Metallic Growth Problems on Electronic Hardware," IPC Tech Report IPC-TR-476, 1977.

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"Slide Presentation: Tin Whiskers: Re-emergence of an Old Problem with Potentially Catastrophic Consequences," Oct. 6, 1998.

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"Tin Whisker Technical Assessment," Aerospace/AF SSD.

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"Tin Whiskers Formation in Electronic Components," Lessons Learned Notice by Lockheed Martin Astronautics (internal report) no. otice # LLN-98-06, pp. 1-4, July 1998.

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Understanding Stencil Printing Requirements for a Lead-free Mass Imaging Process --------------------------------------------------------
Boguslavsky, I Tin Whiskers: Modeling Meeting Minutes Sept. 12, 2001 Telcon#5 Sept. 12, 2001, Telcon#5:

Boguslavsky, I NEMI Whisker Modeling Group DOE (1-24-02) NEMI Whisker Modeling Group DOE (1-24-02)

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Schloetter SLOTOTIN 40 Plating Description www.schloetter.co.uk/electronics/s22.html

Whisker Test Method Confirmation for ChipPac's Matte Tin Chemistry ChipPac Jul 18, (2002) presented at NEMI

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Product Liability Directive ( 85/374/EEC), amended by Directive 1999/34/EC (no changes 12/18/2008) End of Life Vehicles Directive (ELV Directive, 2000/53/EC) Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Directive ( RoHS Directive, 2002/95/EC) Council Decision COM(2004) 606, adopted Sept. 23, 2004) Commission Decision 2005/618/EC, published August 19, 2005 first amendment, which was published in volume 48 issue L214 page 65 second amendment to the RoHS Directive was published in volume 48 issue L271 Commission Decision 2005/747/EC, published Oct. 25, 2005 third amendment to the RoHS Directive was published in volume 48 issue L280 Commission Decision 2006/310/EC, published Apr. 26, 2006, fourth amendment to the RoHS Directive was published in volume 49 issue L115 Commission Decision 2006/691/EC, published Oct. 12, 2006 fifth amendment to the RoHS Directive was published in volume 49 issue L283 Commission Decision 2006/692/EC, published October 12, 2006, sixth amendment to the RoHS Directive was published in volume 49 issue L283 Commission Decision 2006/690/EC, published Oct. 12, 2006 seventh amendment to the RoHS Directive was published in volume 49 issue L283 Waste Electrical and Electronic Equipment Directive (WEEE Directive, 2002/96/EC) Directive 2003/108/EC, published in volume 46 issue L345 Commission Decision 2004/249/EC is a questionaire Commision Decision 2005/369/EC on rules Restrictions on the Marketing and Use of Certain Dangerous Substances and Preparations Directive (Directive 76/769/EEC) Batteries and Accumulators Containing Certain Dangerous Substances Directive (Battery Directive, 91/157/EEC) in volume xx issue L78 Directive 98/101/EC, published in volume 42 issue L1 Energy-using Products (EuP) Directive (EuP Directive, 2005/32/EC) in Volume 48 issue L191 Batteries and accumulators and waste batteries and accumulators (new Batteries Directive, 2006/66/EC) in volume 49 issue L266 Management Methods for the Prevention and Control of Pollutants from Electronic Information Products law, often referred to as "China RoHS ". "Measures for Administration of the Pollution Control of Electronic Information Products," May 9, 2006. REACH Directive 1907/2006 of 18 December 2006. http://eur-lex.europa.eu/LexUriServ/LexUriServ.do?uri=OJ:L:2006:396:0001:0849:EN:PDF E-waste laws: (Argentina) (Australia) (Brazil) (California) Health and Safety Code 108920-108923 PBB, PBDE (California) Rechargeable Battery Recycling Act of 2006 July 1, 2006 (California) Electronic Waste Recycling Act Jan 2007 (Canada - Nova Scotia) (China) Reduction of Hazardous Substances March 1, 2007 (China) Management Methods on Controlling Pollution by Electronic Information Products (Connecticut) (EPA) Management of Electronic Waste in the United States (EU) revision to 1991 Battery Directive Sept 2008 (Japan) J-MOSS (Korea) The Act for Resource Recycling of Electrical/Electronic Products and Automobiles July 1, 2007 (Korea) The Act for Resource Recycling of Electrical and Electronic Equipment and Vehicles (Maine) (Malaysia) (Maryland) (Massachusetts) (Minnesota) (New Jersey) Electronic Waste Recycling Act Jan 1, 2009 (New York) (New York City) (New Zealand) (Oregon) (Taiwan) (Texas) (Thailand) (Washington) HR 2595

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U. S. Representative Burgess introduced (111th Congress) H. R. 2420 Environmental Design of Electrical Equipment (EDEE) Act on May 14, 2009.

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Huang, Yu-chih, Wu, Kuang-siang, and Chen, Sinn-wen, "Size and substrate effects upon undercooling of Pb-free solders," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 662-665.

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Jong, W. R., Tsai, H. C., and Lau, C. C., "Designs of Temperature Loads on the Fatigue Life Analysis of Lead-Free Solder in IC Packages," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 423-426.

Jong, W. R., Tsai, H. C., and Huang, G. Z., "The influences of temperature cycling parameters on the reliability of the solder joints in the high-density package assemblies by Taguchi Method," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 27-30.

Khong, Chee Houe, Yu, Aibin, Zhang, Xiaowu, Kripesh, V., Pinjala, D., Kwong, Dim-Lee, Chen, Scott, Chan, Chien-Feng, Chao, Chun-Chieh, Chiu, Chi-Hsin, Huang, Chih-Ming, and Chen, Carl, "Sub-modeling Technique for Thermo-Mechanical Simulation of Solder Microbumps Assembly in 3D Chip Stacking," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 591-595.

Lee, Chien-Chen, Lee, Chang-Chun, and Chiang, Kuo-Ning, "Electromigration Characteristic of SnAg3.0Cu0.5 Flip Chip Interconnection," IEEE Transactions on Advanced Packaging, vol 33 no. 1, pp. 189-195, Feb. 2010.

Lee, Hwa-Teng, Chen, Yin-Fa, Hong, Ting-Fu, and Shih, Ku-Ta, "Effect of Cooling Rate on Ag3Sn Formation in Sn-Ag Based Lead-Free Solder," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 875-878.

Lee, Jun-Kyu, Park, Yun-Mook, Kang, In-Soo, Kwon, Yong-Min, and Paik, Kyung-Wook, "Improvement of Drop Shock and TC Reliability for Large Die Wafer Level Packages in Mobile Application," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 673-678.

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Lim, Shu Min, Chen, Zhong, Ng, Hun Shen, Tee, Tong Yan, Khoo, Choong Peng, Chng, Vincent, Liu, Fu Lin, and Tsai, Kuo Tsing, "Development of High Speed Board Level Bend Tester for Drop Impact Applications," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 244-248.

Lin, Han-wen, Chen, Chih, Kuo, J. C., and Chen, C. C., "Effects of electromigration on grain rotation behavior of SnAg solders," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 166-168.

Ling, Law Wai, Erfe, Eric, Vaquilar, Aldrin, Khor, Lily, Thong, K. C., Yong, Nicole, Nam, Ng Peng, Winster, Tony, Hong, Xuan, and Israel, Jonathan, "Wafer Backside Coating of Electrically Conductive Die Attach Adhesives for Small IC Packaging," 11th Electronics Packaging Technology Conference , Singapore, Dec. 9-11, 2009, pp. 750-753.

Liou, Wei-Kai, Yen, Yee-Wen, and Jao, Chien-Chung, "Aging Effects on Interfacial Reactions between Cu Addition into the Sn-9Zn Lead-Free Solder and Au Substrate," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 271-273.

Liu, D. S., Hsu, C. L., Kuo, C. Y., Lin, C. Y., Chen, Y. R., and Shen, G. S., "Effect of Solder Pad Opening Size and Various Pad Metallization Substrates on Sn-Ag-Cu Solder Joint under High Speed Shear Test," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 525-528.

Liu, Weiping, Lee, Ning-Cheng, Porras, Adriana, Ding, Min, Gallagher, Anthony, Huang, Austin, Chen, Scott, and Lee, Jeffrey ChangBing, "Shock Resistant and Thermally Reliable Low Ag SAC Solders Doped with Mn Or Ce," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 49-63.

Liu, Yao-Ren, Song, Jenn-Ming, Lai, Yi-Shao, and Chiu, Ying-Ta, "Effect of minor alloying additions on the BIT reliability of SnAgCu solder joints," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 501-504.

Lo, Shao-cheng, Hsieh, Yu-Ping, and Yen, Yee-wen, "Interfacial Reactions and Mechanism Properties between SAC 405 and SACNG Lead-free Solders with Au/Ni(P)/Cu Substrates Reflowed by CO2 Laser," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 224-226.

Loher, Thomas, Seckel, Manuel, Vieroth, Rene, Dils, Christian, Kallmayer, Christine, Ostmann, Andreas, Aschenbrenner, Rolf, and Reichl, Herbert, "Stretchable Electronic Systems: Realization and Applications," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 893-898.

Mallik, S., Thieme, J., Bauer, R., Ekere, N. N., Seman, A., Bhatti, R., and Durairaj, R., "Study of the Rheological behaviours of Sn-Ag-Cu Solder pastes and their Correlation with Printing Performance," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 869-874.

Meng-Chieh, Liao, Hai, Tang, and Wang, Ricky, "Failure analysis of (DIMM hole) solder void in lead free process used OSP coated PCB," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 617-619.

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Muller, Wolfgang H., and Worrack, Holger, "Experimental Studies of the Temperature Dependence of Mechanical Solder Material Properties Using Nanoindentation," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 64-69.

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Ng, Wayne Chee Weng, Marbella, Baterna Carlo, and Koh, Liang Kng Ian, "Evaluation of ENEPIG Substrate for Handheld Product Application," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 305-310.

Nishimura, Yuji, Yu, Qiang, and Maruoka, Toshiaki, "Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Shape Dispersion," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 838-845.

Ong, Siong Chiew, Choi, Won Kyoung, Premachandran, C. S., Liao, Ebin, and Xie, Ling, "Thin Die Stacking by Low Temperature In/ Au IMC based bonding method," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 464-468.

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Osenbach, John W., Reynolds, Heidi L., Henshall, Gregory, Parker, Richard Dixon, and Su, Peng, "Tin Whisker Test Development- Temperature and Humidity Effects Part II: Acceleration Model Development," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 1, pp. 16-24, Jan. 2010.

Panashchenko, Lyudmyla, "Evaluation of Environmental Tests for Tin Whisker Assessment," Tin Whisker Group, Jan. 20,2010.

Park, Yong-Sung, Kwon, Yong-Min, Moon, Jeong-Tak, Lee, Young-Woo, Lee, Jae-Hong, and Paik, Kyung-Wook, "Effects of Fine Size Lead-Free Solder Ball on the Interfacial Reactions and Joint Reliability," 11th Electronics Packaging Technology Conference , Singapore, Dec. 9-11, 2009, pp. 321-324.

Paulasto-Krockel, M., Laurila, T., and Vuorinen, V., "Understanding Materials Compatibility Issues in Electronics Packaging," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 494-499.

Peng, Hsin-Ying, and Chen, Chih, "Shape Effect of Passivation Opening on the Electric Behavior in Flip-chip SnAg Solder Joints under Electromigration," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 384-388.

Peng, S. P., Lin, Dennis, and Ho, C. E., "Comparative Study of Au/Pd/Ni(P) Surface Finish in Eutectic PbSn and Sn3Ag0.5Cu Soldering Systems," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 505-508.

Plumbridge, W. J., "Tin pest in lead-containing solders," Soldering & Surface Mount Technology, vol. 22 no. 1, pp. 56-57, 2010.

Qin, Yi, Liu, Changqing, Wilcox, G. D., Zhao, Kun, and Wang, Changhai, "Electrodeposition of Sn-Ag-Cu Solder Alloy for Electronics Interconnection," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 278-282.

Rao, B. S. S. Chandra, Kumar, K. Mohan, Zeng, K. Y., Tay, A. A. O., and Kripesh, V., "Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders," 11th Electronics Packaging Technology Conference , Singapore, Dec. 9-11, 2009, pp. 272-277.

Reynolds, Heidi L., Osenbach, John W., Henshall, Gregory, Parker, Richard D., and Su, Peng, "Tin Whisker Test Development- Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection," IEEE Transactions on Electronics Packaging Manufacturing, vol. 33 no. 1, pp. 1-15, Jan. 2010.

Sasangka, W. A., Gan, C. L., Thompson, C. V., Choi, W. K., and Wei, J., "Effect of Bonding and Aging Temperatures on Bond Strengths of Cu with 75Sn25In Solders," 11th Electronics Packaging Technology Conference , Singapore, Dec. 9-11, 2009, pp. 336-341.

Schetty, Rob, and Sepp, William, "Minimization of Tin Whisker Growth for Ultra-Low Tin Whisker Applications," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 225-234.

Shimoda, Masayoshi, Hidaka, Noboru, Yamashita, Mitsuo, Sakaue, Kenichi, and Ogawa, Takeshi, "The Effect of Ni,Ge Elements on Microstructure and Mechanical Properties of Sn-Ag-Cu Solders," 11th Electronics Packaging Technology Conference , Singapore, Dec. 9-11, 2009, pp. 725-730.

Shinohara, Kazunori, Yu, Qiang, Fujita, Masato, Ishii, Hideaki, and Ishikawa, Hisao, "Ball Impact Response Based on Modeling Techniques," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 828-833.

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Song, Fubin, Newman, Keith, Yang, Chaoran, and Lee, S. W. Ricky, "Investigation of Lead-free BGA Solder Joint Reliability under 4-point Bending Using PWB Strain-Rate Analysis," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 863-868.

Song, Jenn-Ming, Su, Chien-Wei, Lai, Yi-Shao, and Chiu, Ying-Ta, "Time dependent deformation behavior of interfacial intermetallic compounds in electronic solder joints," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 497-500.

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Sriyarunya, Anocha, Tondtan, Jiraporn, Kittidecha, Witoon, and Tukiman, Hasmani, "Board Level Reliability of Mixed Solder Interconnects," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 249-253.

Su, Yong'An, Tan, Long Bin, Tan, Vincent B. C., and Tee, Tong Yan, "Rate-Dependent Properties of Sn-Ag-Cu Based Lead Free Solder Joints," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 283-291.

Sweatman, Keith, Suenaga, Shoichi, Miyaoka, M., Nozu, Takashi, Nogita, Kazuhiro, and Nishimura, Tetsuro, "Effect of Intermetallic Stabilization on the Impact Resistance of Joints to BGA Packages," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 331-335.

Tai, F. C., and Duh, J. G., "Interfacial Toughness Evaluation of SAC305 Solder Bump with Pendulum Impact Test," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 541-544.

Tan, Kok Ee, and Pang, John H. L., "Fracture Behavior of 96.5Sn3.0Ag0.5Cu Solder Joint under Mixed-Mode Tensile and Shear Loading Conditions," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 296-300.

Tisdale, Stephen, Pfahl, Robert. C., and Fu, Halay, "iNEMI HFR-free Leadership Program," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 594-597.

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Tsai, Chi-Hang, Song, Jenn-Ming, and Fu, Yen-Pei, "Electrochemical corrosion behavior of Pb-free solders for die attachment," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 448-451.

Tseng, H. W., Wang, S. J., and Liu, C. Y., "Cross-Interaction Effect in the Ni/Sn/Cu Solder Joints," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 325-330.

Tseng, H. W., Lu, C. T., Hsiao, Y. H., Liao, P. L., Chuang, Y. C., and Liu, C. Y., "Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 401-405.

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Wang, Junjun, and Wu, Yongming, "Simulating Production Lines of Recycling WEEE Products in eM-Plant," Advanced Materials Research, vol. 97-101, pp. 2287-2290.

Wessling, B., Rischka, M., and Posdorfer, J., "OrmeSTAR Ultra - the organic metal nanofinish," Circuit World, vol. 36 no. 1, 2010, pp. 14-21.

Wessling, Bernhard, and Kenny, Jim, "Nanotechnology for Lead-Free PWB Final Finishes with the Organic Metal," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 554-557.

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Yu, A-Mi, Kim, Jun-Ki, Lee, Jong-Hyun, and Kim, Mok-Soon, "Tensile Properties and Drop/shock Reliability of Sn-Ag-Cu-In Based Solder Alloys," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 679-682.

Yu, Chi-Ko, Chang, Graver, Shao, Tina, Chen, Cherie, and Lee, Jeffrey, "The impact Investigation of CSP IC Packaging on Halogen-free Board Level Performance," 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, Oct. 21-23, 2009, pp. 666-669.

Yu, Da-Quan, Chai, Tai Chong, Thew, Meei Ling, and Ong, Yue Ying, "Electrochemical migration study of fine pitch lead free micro bump interconnect," 11th Electronics Packaging Technology Conference, Singapore, Dec. 9-11, 2009, pp. 389-394.

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Bob Landman

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IPC-1752, Materials Declaration Management Bannockburn, IL: IPC, date?

European Commission Fire Quantas & Air France Airbus www.pcb007.com/pcb.asp

www.pcemagazine.com/

www.epp-online.de/epp/live/start/6.html

http://ec.europa.eu/environment/waste/pdf/rohs_report.pdf

http://www.osha.gov/SLTC/hexavalentchromium/

My overall feelings about the RoHS Directive is summarized very nicely by the following sentence from page 210 of John Guinther's book The Jury in America: "The occasional case of this kind ... should be placed before a legislative body where rationality has never been a necessary criterion for solving anything."

"Perhaps not always. A case can occur which is so complicated that neither a judge nor a jury (or, for that matter, the contesting lawyers and their clients) can understand it. In that event, the judge's supposed superior intelligence if of no moment, and the jury remains the preferable forum, since, even though it will be as bewildered as everyone else, by permitting it we are upholding the Seventh Amendment's implicit purpose of bringing the community's sense of fairness into play, for that reason, its guess may be better than the judge's and could not be worse. The occasional case of this kind-- incomprehensible to any rational person under existant law-- may be inappropriate to adjudication and should be placed before a legislative body where rationality has never been a necessary criterion for solving anything."

From page 19 of A Prairie Home Companion Pretty Good Joke Book: "Never underestimate the power of stupid people in large groups".

From page 139 ditto: "A computer is perfectly reliable until the moment you switch it on."

From page 163 of Arthur Bloch's The Complete Murphy's Law, "Weatherwax's Postulate:
The degree to which you overreact to information will be in inverse proportion to its accuracy."

From page 228, ditto: "Oak's Principles of Law-Making:

  1. Law expands in proportion to the resources available for its enforcement.
  2. Bad law is more likely to be supplemented than repealed.
  3. Social legislation cannot repeal physical laws.

From page 4 of the February 2007 (no. 502) Mensa Bulletin, in a letter by Francis Cartier: "Napoleon also said, "In politics, you must never retreat, never retrace your steps, never admit a mistake - otherwise you are discredited. If you have made a mistake, you must persevere - that will put you in the right.""