Abdelhadi, Ousama Mohamed Omer, Size Effects in Tin-Based Lead-Free Solder
Abtew, Mulugeta, Effect of cooling rate, silver composition, dwell time and
Adeogba, Tonye, Effect of Reflow Variables on the Nanoscale Mechanical Prop
Aggarwal, Indu,
Alipour, Manijeh Mohammad, Thermal diffusivity determination in Sn-based le
Allenby, Braden R., Design for environment: Implementing industrial ecology
Al-Momani, Emad Shehadeh, Reliability Modeling of Lead-Free Electronics Und
Al-Yafawi, Abdullah, Electronic Packages Fatigue Life Predicion under Rando
Anastasio, Onofrio A., An Approach for Impression Creep of Lead-Free Microe
Anglin, Benjamin Stewart, Investigation and Characterization of Thermoelast
Anson, Scott J., Analysis of Lead Free Tin-Silver-Copper and Tin-Lead Solde
Arani, Amirali Shayan, System Level Design of Power Distribution Network fo
Arfaei, Babak, The Effects of Nucleation and Solidification Mechanisms on t
Athavale, Saurabh N., A Comparison of Different Mechanical Testing Protocol
Athavale, Saurabh, Effect of Cu Concentration and Cooling Rate on Microstru
Bai, Guofeng, Low-Temperature Sintering of Nanoscale Silver Paste for Semic
Bangalore, Sudhindra Nagaraj, Evaluation of conductive adhesives for Surfac
Barry, Nathan, Lead-Free Solders for High-Reliability Applications: High-Cy
Basher, Mohamed Abul,
Beaumont, Matthew Hall, Characterization of Indalloy 227 Non Lead Solder
Becker, James Hall, Crystal Growth and Electrical and Optical Properties of
Belbase, Hemant, Lead Free Soldering Materials, Reliability and Process Opt
Benedict, Michael Scott, Heterogeneous Nucleation of Sn in Sn-Ag-Cu Solder
Berger, Barry Nathaniel, Study of the Use of the Weibull Distribution and C
Berrios, Antonio Tavarez, Modeling the Reflow Process of an Actual PCB
Bhalerao, Vikram, Process Development and Reliability Study for 01005 Compo
Bhardwaj, Divya, Development of Lead Free Thermal Fuse Wires Using Ohno Con
Bhave, Aniket, A Leaded and Lead-Free Solder Paste Evaluation Screening Pro
Bierman, Matthew John, Dislocations in One-Dimensional Semiconductor Crysta
Bloomer, Tamara Ellis, Microstructural and mechanical properties of a novel
Boesenberg, Adam James, Development of Al, Mn, & Zn doped Sn-Ag-Cu solders
Bowers, Trevor S., Microstructural Evolution of Nickel-Enhanced Tin-Copper
Brenner, Sidney S., The Growth and Mechanical Properties of Metal Whiskers
Bruno, Felix, An Experimental Study on Voids in Area Array Devices for Mixe
Buchovecky, Eric J., Numerical Simulation of Stress Generation and Whisker
Bukhari, Sarfaraz, Evaluation of the Effects of Processing Conditions on Sh
Busta, Heinz, Uniaxial-tensile-stress-modified Galvanomagnetic Properties o
Caputo, Antonio, Conductive Anodic Filament (CAF) Formation
Chada, Srinivas, Effect of Processing Parameters and Thermal Cycling on the
Chae, Seung-Hyun, Electromigration and Thermomigration Reliability of Lead-
Chai, Fei, Solder Interconnect Life Prediction under Complex Temperature Cy
Chaloupka, Andrew Charles, Lead-Free Electronics Use and Repair Dynamic Sim
Chan, Dennis K., A Maximum Entropy Fracture Model for Low and High Strain-r
Chan, Yuen Sing, Investigation into Characteristics of Thermal Fatigue Mode
Chandler, Gary Jesse Howard, Growth of Whiskers in the Indium-Tin Alloy Sys
Chang, Won, CSP Drop Test Performance Comparison for Different Solder Ball
Chao, Huang-Lin, Electromigration Enhanced Kinetics of Cu-Sn Intermetallic
Chauhan, Preeti Singh, Microstructural Characterization and Thermal Cycling
Chavali, Sri Chaitra Jyotsna, Diffusion Driven Microstructural Evolution an
Chaware, Raghunandan, Underfill Process Development for Lead Free Flip Chip
Chen, Kai, Synchrotron polychromatic X-ray Laue microdiffraction studies of
Chen, Ruiming, Analysis of Modern Power Distribution Networks
Chen, Wei-Hsun, Evaluation of local anisotropic elasticity and thermal expa
Cheng, Jing, Tin Whiskers in Electronic Packaging: Mechanism and Modeling
Chennagiri, Gurudutt, Rework of Lead-Free Area Array Packages Assembled on
Chin, Erica, Templated Synthesis and Characterization for Multi-segmented N
Chin, Melida, Electrical Contact Resistance of Anisotropic Conductive Adhes
Choi, Daechul, Statistical and Physical Analyses of Electromigration-induce
Choi, Myoung Joon, Efficient Broadband Electromagnetic Modeling of the Powe
Choi, Sunglak, An Investigation of Aging Kinetics and Creep Deformation in
Choi, Sunglak, Studies on In-Situ Particulate Reinforced Sn-Ag Composite So
Choi, Woojin, Reliability of Pb-free Solders in Electronic Packaging Techno
Choubey, Anupam, Microstructural Changes Under Isothermal Aging and Their I
Choudhuri, Deep, Influence of Nano-structured Chemicals on the Microstructu
Ciocci, Richard C., Assessing the Migration to Lead-Free Electronic Product
Clore, Nicholas G., Identification and Counting Procedure for Tin Whiskers,
Collins, Andrew, Corrosion Inhibition for an Aluminum Substrate Bonded with
Courey, Karim J., An Investigation of the Electrical Short Circuit Charact
Crandall, Erika R., Factors Governing Tin Whisker Growth
Crandall, Michael Adam, Effect of intermetallic growth on durability of hig
Crum II, John Alan, Production of Tin and Tin-based Alloy Spheres via Multi
Cuddalorepatta, Gayatri, Evolution of the Microstructure and Viscoplastic B
Dakshinamurthy, Sharathchandra,
Dandu, Pridhvi, Finite Element Modeling on Electromigration of Solder Joint
Dang, Tung C., Lead-Free Solders in Surface Mount Electronic Assemblies: De
Darbandi, Payam, Crystal plasticity Finite Element Analysis of Deformation
Desrochers, Brigitte, Reliability of Soldered Joints for Aerospace Applicat
Deubzer, Otmar, Explorative Study into the Sustainable Use and Substitution
Dhakal, Ramji, Failure Mechanism of Lead-Free Sn-Ag-Cu Solder BGA Interconn
Dhakal, Ramji, Microstructure Based Experimental and Finite Element Analysi
Dimitrovska, Aleksandra, Mitigation Strategies of Tin Whisker Growth
Ding, Fei, Flip Chip and Lid Attachment Assembly Process Development
Ding, Min, Investigation of Electromigration Reliability of Solder Joint i
Dong, Jaimee Ilene, The Effects of the Transition from Tin-lead to Lead-fre
Dudek, Martha A., Microstructure, Mechanical and Oxidation Behavior of RE-c
Edington, Joe Don, Development and Characterization of Cerium Oxide Coating
Ege, Efe Sinan, Thermo-mechanical Properties and Integrity of Metallic Inte
Emery, Robert Thomas, Isotropic Conductive Adhesives for Use in the Microel
Enander, Richard Theodore,
Faizan, Mohammad, Experimental Study and Modeling of Metal Dissolution and
Fallah-Adl, Ali, Development of a Robust and Integrated Methodology for Pre
Fang, Tong, Tin Whisker Risk Assessment Studies
Fei, Huiyang, Multiscale Modeling of Mechanical Shock Behavior of Environme
Felton, Lawrence E.,
Fiedler, Brent Alan, Fatigue failure kinetics and structural changes in lea
Flachsbart, Bruce,
Fojas, Paul B., The Influence of Cold Work on the Wettability of Pb-Free So
Forest, Louis, Soudures Sans-Plomb Pour la Microelectronique
Fountoukidis, Evangelos, Thermo-Mechanical Response of Monolithic and NiTi
Frear, Darrel Richard,
Fukuda, Yuki, Experimental Investigations of Whisker Formation on Tin Plati
Gagliano, Robert Andrew, Characterization of the Growth Behavior of Cu-Sn I
Gan, Hua, Polarity Effect of Electromigration on Intermetallic Compound (IM
Gao, Fan, Fundamental Investigation and Development of Lead-Free Nanosolder
Gao, Fan, Lead-free Nano-solders on Metallic Nanowires: Synthesis, Characte
Gao, Mao, The Intermetallic Formation and Growth Kinetics at the Interface
George, Elviz, Thermal Cycling Reliability of Lead-Free Solders (SAC305 and
Ghorbani, Hamid Reza, Analytical Modeling of Thermal Stresses in Solder Joi
Ghosh, Santaneel, A Non-contact Measurement Technique at the Micro Scale
Ghosh, Santanu, Finite Element Analysis of Moisture and Thermal Induced Str
Godbole, Gaurav Vinod, Pad Cratering: Characterizing Crack Propagation and
Goland, Allen Nathan, Thermoelectric Properties of Gray Tin
Goldstein, Julia L. Freer, Microstructural Development and Mechanical Behav
Gopakumar, Sunil, An Experimental Approach to Develop Process Windows for L
Gordon, Matthew, A Nacreous Self-Assembled Nanolaminate for Corrosion Resis
Gosavi, Mridula, Reliability Testing and Modeling of Linear Image Sensor De
Greene, Christopher M., Lead-Free Solder Paste Printing for EMS Providers
Greenlaw, Tamara, Cross-Functional Environmental Initiatives: Addressing Re
Gregory, Patrice Belnora, Comparison of Interconnect Failures of Electroni
Groen, Luiken Jan, Kinetiek van de Allotrope Omzetting in Tin
Guinane, James, Rework Methods for Stacked PCB SMT Assemblies
Guo, Fu, Studies on Lead-Free Solders Reinforced with Mechanically-Incorpor
Guo, Weiqing, Testing Methodology for Reflow Soldering Process Compatibilit
Guruprasad, Pradosh, Comparison of High Speed Impact Test of Solder Joints
Hamed, Fathalla Abdosadik,
Hamid, Mohd Foad Abdul, Thermomigration: An Experimental Damage Mechanics S
Han, Chunfen, Electrodeposition of Pb-free, Sn-based Alloy Solder Films
Han, Jung Kyu, Effect of Thermo-Electromigration on Copper Dissolution and
Han, Sungwon, Assessment of an Electrical Shorting and Metal Vapor Arcing P
Hanchinamani, V., Novel Additives for Conductive Epoxy Adhesive
Haswell, Peter Lewis, Durability Assessment and Microstructural Observation
Hensler, Donald Henry, Oscillatory Microwave Magnetoconductivity in Gray Ti
Hinkley Jr., Everett David, Oscillatory Magnetoresistance in Gray Tin
Hodges, S. LeAnn, Evaluation of Lead Free Solder and No-Clean Flux for Atta
Holloway, Karen Lynne,
Hossain, Mohammad Masum, Development of Constitutive Equation Parameters an
How, Yew Seng, Modeling of Impression Testing to Obtain Mechanical Properti
Huang, Xingjia, Investigation and Analysis on the Solder Ball Shear Strengt
Huang, Zhe, Fracture of Lead-Free Solder Joints for Electronic Applications
Hwang, Tae-Kyung, Effects of microstructure on material behaviors and fatig
Hydro, Ryan Michael,
Ibitayo, Oladimeji Olalekan, Evaluation of Various Die-Attachment Materials
Islam, Md Syful, Peripheral Soldering of Flip Chip Joints on Passive RFID T
Islam, Mohd Nokibul, Investigations on Damage Mechanics and Life Prediction
Iyer, Ganesh R., Role of Intermetallics for Both Tin-Lead and Lead-Free Sol
Iyer, Satyanarayan Shivkumar, Assembly, Reliability, and Rework of Stacked
Jadhav, Susheel Ganeshrao, Stress Relaxation in Lead-Free Solder Joints
Jafreen, Rifat, A Cost Model for Assessing the Transition to Lead-Free Elec
Jain, Sameer, Research and Application of a Thermal Management Device (Cool
Jain, Sujit, Green Synthesis and Applications of Polyaniline Derivatives
Jakkali, Vaidehi,Finite Element Modeling of the Effect of Reflow Porosity o
Janiuk, Szymon, Tin Whisker Growth and Mitigation with a Nanocrysytalline N
Jaradat, Younis, Reliability of SnAgCu and Mixed Solders under Variable Loa
Jiang, Hongjin, Synthesis of Tin, Silver and Their Alloy Nanoparticles for
Jiang, Tong, Modeling of Failure Mechanism and Life Prediction of Lead-Free
Johnson, Michael Roger,
Joshi, Rahul V., Thermo-mechanical Behavior of Tin-Lead and Lead-Free Ceram
Juarez, Joseph Moses, Accelerated Life Testing of Electronic Circuit Boards
Kabade, Rajendra R., Metallurgical Investigation of Ag-Cu-Sn Lead-Free Sold
Kagwade, Sanjay Vasudeo, Surface Analytical and Electrochemical Studies of
Kaila, Rishi, Investigation of Mixed Solder Assemblies & Novel Lead-Fre
Kalkundri, Kaustubh Jayant, Investigation of Electromigration Behavior in L
Kamgaing, Telesphor,
Kao, Hui-Ju, Effect of Cu additives on Sn whisker formation and interfacial
Katsis, Dimosthenis C., Thermal Characterization of Die-Attach Degradation
Kaushik, Muthur Srinath Purushotham, A Statistically Based Evaluation of Cr
Keimasi, Mohammadreza, Flex Cracking and Temperature-Humidity-Bias Effects
Kim, Dong Hyun, Reliability Study of SnPb and SnAg Solder Joints in PBGA P
Kim, Dongwook, Fluxless Flip Chip Bonding Processes and Aerial Fluxless Bon
Kim, Harqkyun, Wetting Kinetics and Interfacial Reaction of Lead(Pb)-based
Kim, Hye-Rim, Growth and Low Frequency Noise Properties of Grey Tin Films
Kim, Jongsung, Fluxless Bonding Technology Using Electroplated Multilayer S
Kim, Patrick Gu-Ho, Wetting Behaviors and Interfacial Reactions of Pb-conta
Kindesjo, Ulrika, Phasing out lead in solders: An assessment of possible im
Kinney, Christopher Charles, The Effect of an Imposed Current on the Creep
Kinyanjui, Robert Kamau, Thermal Processes and Solidification Kinetics of E
Kirill, Dimitri Jay,
Kirkpatrick, Timothy, The Kinetics of Tin Solidification in Lead-Free Solde
Kumar, Santosh, Microvoid Formation and Kirkendall Effect in Lead-Free Sold
Ladani, Leila Jannesari, Damage Initiation and Evolution in Voided and Unvo
Lam, Carl, Integrating Hazardous Materials Characterization and Assessment
Lavine, Charles Frederic, Two-band Galvanomagnetic Effects in Gray Tin
Lee, Jong-Gi, Investigation of Thermomechanical Fatigue (TMF) Behavior in T
Lee, Kyuoh, Development of Thermo-Mechanically Reliable Lead-Free Solder A
Lee, Taekyeong, Electromigration and Solid State Aging of Flip Chip Solder
Lei, Guang Tsai,
Leung, Wai-Bor, Electronic Properties of Gray Tin in the Presence of an Ext
Levo, Timothy James, Drop Test Energy Relationship to Reliability
Li, Binzhi,
Li, Haiying, Study of Thermally Reworkable Epoxy Materials and Thermal Cond
Li, Jing, Evaluation and Improvement of the Robustness of a PCB Pad in a Le
Li, Li, Basic and Applied Studies of Electrically Conductive Adhesives
Li, Shidong, A Multi-Scale Damage Mechanics Framework for Nanoelectronics
Li, Yi, High Performance Electrically Conductive Adhesives (ECAs) for Leadf
Li, Yuquan, Flip Chip and Heat Spreader Attachment Development
Li, Zhaozhi, A Novel Three Dimensional Wafer Level Chip Scale Packaging Te
Limaye, Omkar Deepak,
Lin, Dechao, Development of Lead-Free Solders Reinforced by Nanoparticles
Lin, Xuan, An Environmentally Compliant Cerium-Based Conversion Coating fo
Lindquist, Rolf Eugene, The Infrared Optical Properties of Single-crystal G
Linteau, Mark W., Impression Creep in Near Eutectic Tin-Lead and Tin-Silver
Liu, Pilin, Roles of Interfacial Reaction on Mechanical Properties of Solde
Liu, Wenchao,
Liu, Yueli, Lead-Free Assembly and Reliability of Chip Scale Packages and 0
Liu, Zongrong,
Lohokare, Saurabh, A Novel Conductive-Polymer-Based Integration Process for
Loomans, Michael Eugene, Phase Equilibria in Potential Pb-Free Solder Alloy
Lu, Daoqiang, Fundamental Understanding of Electrically Conductive Adhesive
Lu, Yuan, Effect of Ag and Cu on Sn-x%Ag-y%Cu Interconnects
Lynch, Brian John,
Ma, Hongtao, Characterization of Lead-Free Solders for Electronic Packaging
MacWilliam, Devon Hudson,
Majeed, Sulman, Rework & Reliability of Area Array Components
Mandrekar, Rohan, Modeling and Co-simulation of Signal Distribution and Pow
Mao, Jie, Nucleation Promotion of Sn-Ag-Cu Lead-Free Solder Alloys via Micr
Marone, Matthew John,
Marquez de Tino, Ursula, Reduction of Nitrogen Consumption of Lead-Free Ref
Matin, Md. Abdul, Microstructure evolution and thermomechanical fatigue of
Mavoori, Hareesh, Mechanical Properties and Fatigue Lifetime Prediction of
McCabe, Rodney James, Creep of InSb and SbSn Strengthened Tin-based Alloys:
McDougall, Jeffrey Lee, An Analysis of Global and Localized Creep Strains a
Mei, Yuhai, Stress Evolution in a Conductive Adhesive during Curing and Coo
Mertens, James Charles Edwin, Quantifying Electromigration Processes in Sn-
Miller, Chad M., Development of a new Pb-free solder: Sn-Ag-Cu
Mirza, Fahad, Investigation of the Impact Response of Lead-Free Electronic
Moffitt, Christopher Edward,
Moon, Sungwook, Magnetically Aligned Z-Axis Anisotropic Conductive Adhesive
Morose, Gregory J., Electronics Assembly, Rework, and Reliability Evaluatio
Morris, Eric Leon, Use of Cerium-Based Inhibitors in Electrochemically Dep
Mudge Jr., Wilbur L., Kinetics of the alpha to/from beta Transformation of
Mukherjee, Shantanu, Lead-Free Wave Soldering of 'Thick' PCB Using Sn 3.8%A
Munukutla, Aravind, Tensile Properties of Lead Free Solders
Muthana, Prathap K., Design of High Speed Packages and Boards Using Embedde
Muza, Anthony, Lead-Free Solutions for High and Low Temperature Solder Inte
Na, Nanju, Modeling and Simulation of Planes in Electronic Packages
Nadimpalli, Siva Prasad Varma, Characterization and Prediction of Fracture
Nagarkar, Kaustubh Ravindra, A Systems Approach to Ultra-fine Pitch Flip Ch
Nair, Vineethkumar R., Estimation of Relative Rate of Copper Dissolution in
Nambiar, Sudeep, Process Development of 01005 Assembly
Nergiz, Saide Zeynep,
Neuder, Heather Aurelia, In-Situ Phosphatizing Coatings for Aerospace, OEM
Nguyen, Tung Thanh, Characterization of the Elasto-plastic Behavior of Act
Nie, Lei, Temperature Cycling Reliability of Reballed and Reworked Ball Gr
Obaidat, Mazin, Reliability of Lead-Free Solders under Realistic Service Co
Oberc, Timothy James, Reliability of Lead-Free High Temperature Surface Mo
Padilla, Eric, Characterization of Local Deformation in Pb-free Solder Joi
Panashchenko, Lyudmyla, Evaluation of Environmental Tests for Tin Whisker
Panchagade, Dhananjay R., Damage Prediction of Lead Free Ball Grid Array P
Panlasigui, Rogelio Andres,
Paquette, Beth Miller, Harmonic Vibration Testing of Electronic Components
Park, Tae-Sang, A Study on Mechanical Fatigue Behaviors of Ball Grid Array
Patel, Chandradip Pravinbhai, Performance Assessment of MEMS Gyroscope and
Pedigo, Aaron, The Influence of the Effective Physical Properties of Tin El
Peercy, Paul S., Helicon Propagation in Indium Antimonide and Gray Tin
Pei, Min, Effects of Lanthanum Doping on the Microstructure and Mechanical
Pierce, David Michael, Continuum Damage Mechanics Based Failure Prediction
Pinol, Lesly Agnes, Fundamental Studies of Tin Whiskering in Microelectroni
Plaza, Gustavo Alberto, Impact of board pad finish on the tin-lead and lead
Porta, Gregory Mills,
Powell, John Christopher,
Puthenparambil, Abhilash, Effect of Bonding Pressure on Reliability of Anis
Qasaimeh, Awni, Study of the Damage Evolution Function of SnAgCu in Cycling
Qi, Tingting,
Qi, Yan, Accelerated Thermal Fatigue of SnPb and Pb-Free Solder Joints: Eff
Quintero, Pedro O., Development of a Shifting Melting Point Ag-In Paste Via
Raghavan, Venkatesh Arasanipalai, Pad Cratering: Development of a Test Prot
Rajagopal, Subramanian, Transition of Low-Volume Complex Electronic System
Rajathurai, Karunaharan, Synthesis and Characterization of Tin Nanorods and
Ramkumar, S. Manian, Process Analysis and Performance Characterization of a
Raut, Rahul, Thermal Management of Heat Sensitive Components in Pb-Free Ass
Ready IV, William Judson, Reliability Investigation of Printed Wiring Board
Reinbold, Lucine Kabakian, Kinetics of Interfacial Reaction and Stress Evol
Ren, Fei, Polarity Effect of Electromigration on Mechanical Properties of
Reuse, Rolando, Thermomechanical Behavior of Monolithic Sn-Ag-Cu Solder and
Reynolds, Heidi Linch, Creep of Two-Phase Microstructures for Microelectron
Rhee, Hongjoo, Roles of Service Parameters on the Mechanical Behavior of Le
Robiaee, Ala Al, Evaluation of the Printability of Lead Versus Lead Free So
Rodekohr, Chad L., Material Factors Influencing Metallic Whisker Growth
Rogers, Keith Leslie, An Analytical and Experimental Investigation of Filam
Roman, Bernard John, Stress-Induced Bandgap and Related Phenomena in Gray T
Rowley, Jonathan Gabriel, The Role of Soldering Process Variables on Proper
Rozgonyi, George A., Field Emission Microscope Studies of the Effect of Cry
Sabbagh, N. A. J., Tin Whisker Growth in the Communication Industry
Sadiq, Muhammad, Design and Fabrication of Lanthanum-Doped SN-AG-Cu Lead-Fr
Sajjala, Sandeep Reddy, Optimizing Stencil and Pad Design for 0201 Componen
Sanapala, Ravikumar, Characterization of FR-4 Printed Circuit Board Laminat
Sane, Shantanu Madhavrao, Disturbed State Concept Based Constitutive Modeli
Sani-Bakhtiari, Paymon, Surface Mount DC/DC Converter Attachment to Printed
Sarobol, Pylin, Effects of Local Film Properties on the Nucleation and Grow
Sattiraju, Seshagirirao V., Wetting Studies of Pb-Free Solders on Pb-Free P
Seddon, Michael John, Characterization and Comparison of Creep Properties f
Sellers, Michael S., Atomistic modeling of the microstructure and transport
Selli, Giuseppe, BGA Footprints Modeling and Physics Based Via Models Valid
Selvaraj, Mukesh K., An Experimental Study of Electromigration in Flip Chip
Sengupta, Shirsho, Effects of Solder-Dipping as a Termination Re-finishing
Sha, Chu-Hsuan, Silver Flip Chip Interconnect Technology and Solid State Bo
Shah, Vatsal, Pb-Free Process Development and Microstructural Analysis of C
Shahin, Ahmed M.,
Sharma, Pradeep,
Shirley, Dwayne R., Transient and Steady-State Creep in a Sn-Ag-Cu Lead-Fre
Sidhu, Rajen Singh, Thermomechanical Behavior of Sn-Rich (Pb-Free) Solders
Singh, Harmandeep, Study of Thermal Fatigue of Wafer Level Packages under
Shirazi, Sam Mahin, Toward a Mechanistic Understanding of the Damage Evolut
Smith, Harold Glenn,
So, William W., Fluxless Indium and Silver-Indium Bonding Processes for Pho
Song, Fubin, Experimental Investigation on Testing Conditions of Solder Ba
Song, Ho Geon, Microstructural Evolution of Eutectic Au-Sn Solder Joints (L
Song, Yubao, Study of Pulse Plating and Reaction Mechanism of Trivalent Ch
Spitzner, Matthew James, Response of tin whiskers to dynamic input: Mathema
Srinivas, Vikram, Modeling Rate Dependent Durability of Low-Ag SAC Intercon
Stark, Brian H., Thin Film Technologies for Hermetic and Vacuum Packaging o
Stein, David M., Structure and Properties of Bi-containing Mixed A-site Per
Stinson-Bagby, Kelly, Microstructural Evolution in Thermally Cycled Large-A
Stromswold, Eric Ivan, Characterization of eutectic tin-silver solder joint
Su, Bin, Electrical, Thermomechanical and Reliability Modeling of Electrica
Su, Peng, A Study on the Reliability of Flip Chip Solder Joints
Subbaiyan, Sudharsan, A Physical Model Examination of Micro-brazing Reactio
Subbarayan, Guhan, A Systematic Approach for Selection of Best Pb-Free Prin
Suh, Jongook, Orientation distribution, morphology, and size distribution o
Sullivan, Thomas E.,
Sun, Yong, Micro/nano-scale Investigation on Sn Alloys and SnO2 Nanowires
Tabatabaei, Salomeh, Synthesis and Characterization of Two Component Alloy
Talebanpour, Babak, Microstructural Effects on Creep and Fracture Mechanics
Tan, Wei, Development of Convective Reflow-Projection Moire Warpage Measur
Tang, Zhenming, Interfacial Reliability of Pb-Free Flip-Chip BGA Package
Tanikella, Ravindra Vijay,
Taraci, Jennifer Lyn,
Tashtoush, Tariq H., Effect of Lead-Free Solder Joint's Size and Configurat
Telang, Adwait U., Characterization of Deformation in Sn-Ag Lead-Free Solde
Telang, Adwait U., Characterization of Microstructural Evolution of Crept,
Theeven, J. G. A., Creep and Failure of Lead-Free Solder Alloys
Tonapi, Sandeep Shrikant, Assembly and Reliability of Lead-Free Flip Chips
Tong, Michael Shou-Ming, The Use of Nickel/Aluminum Explosively Reactive Na
Tucker, Jonathon P., Microstructural Effects on Constitutive and Fatigue Fr
Tumne, Pushkraj Satish, Investigation of Bulk Solder and Intermetallic Fail
Tunga, Krishna Rajaram, Study of Sn-Ag-Cu Alloy Reliability Through Materia
Varghese, Joseph, Effect of Dynamic Flexural Loading on the Durability and
Varia, Ronak, Investigations of Polymer-Cored Solder Balls and Fan-Out Tech
Venkatadri, Vikram, Quantitative Assessment of Long Term Aging Effects on
Vijayanath, Vignesh, Assembly process development for fine pitch (0.4 mm) p
Vishwanathan, Krishnan, Process Development and Microstructural Analysis of
Vollweiler, Fred O, P., Intermetallic Growth at the Interface between Coppe
Wagner, Robert John, Free Carrier Reflectivity of Gray Tin Single Crystals
Walleser, Jason Kenneth, Microstructure control of the Sn-Ag-Cu-X solder al
Wang, Daijiao, Experimental Study of Void Formation in Solder Joints of Fli
Wang, Pin J., Fluxless Bonding of Thermal Expansion Mismatch Materials
Wang, Qing, Mechanical Properties and Microstructure Investigation of Sn-Ag
Wang, Wei, Parameter Extraction for Electronic Packaging and Decoupling Met
Wang, Weiqiang, Solder Joint Reliability of Sn and SnBi Finished and Refini
Wang, Yibo, A Numerical Model of Anisotropic Mass Transport Through Grain B
Wang, Ying, Microstructure Evolution and Surface Defect Formation in Tin Fi
Wei, Yong, Electronically Conductive Adhesives: Conduction Mechanisms, Mech
Welch III, Warren Cornelius, Vacuum and Hermetic Packaging of MEMS Using S
Wentlent, Luke Arthur, Evolution of the Deformation Behavior of Sn-Rich Sol
Wentlent, Luke, On the Microstructure of Pb-Free Solder Joints: Implication
Wolfson, Robert George, Transformation Studies of Gray - Tin Single Crystal
Wong, Anthony Yin-Bong, Implementation and Qualification of a Prototype Tes
Wright, William L., Processing of NiTi Reinforced Adaptive Solder for Elect
Wu, Chun-I, Fabrication and Site Specific Growth of Nanowires
Wu, Ji, Electrical Characterization and Reliability Assessment of Lead-Free
Xiao, Qiang, Constitutive Model Development for Lead Free Solder Alloys at
Xie, Huxiao, Properties of Cerium Containing Lead Free Solder
Xing, Yan, Study of Thermal and Chemical Factors Which Influence Solidifica
Xu, Huili, Grain Structure Evolution of Tin-Based Lead-Free Solder Joints i
Xu, Shuangyan, Evaluating Thermal and Mechanical Properties of Electrically
Yang, Fan-Yi Ou, Electromigration and Thermomigration in Pb-free SnAgCu and
Yang, Hong, Mechanical and Thermomechanical Stability Issues of 96.5SN-3.5A
Yang, Linlin, Lead-Free Solder Reliability in Combined Environments
Yang, Quan, Modeling and Characterization for Small-Scale Packaging Applica
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Yang, Wenge, Process-Structure-Property Relationship for Eutectic Sn-Ag Sol
Yao, Wei, Thermomigration in Electronics Packaging Solder Joints under Time
Yao, Yao, Modeling the Mechanical Properties of Intermetallic/Solder Interf
Yazzie, Kyle, Mechanical Shock Behavior of Environmentally-Benign Pb-free S
Ye, Hua, Mechanical Behavior of Microelectronics and Power Electronics Sold
Yoon, Ji-Young, A Research for the Moisture-Induced Properties of ACF Packa
Young, Poh-shien, Measurements of Electrical Conductivity of Filaments of G
Yu, Hao, Combined Thermal, Thermodynamic and Kinetic Modelling for the Reli
Zahedi, Fahad, Reliability of Lead-Free Solder Under Cyclic Bending
Zbrzezny, Adam R., Characterization and Modeling of Microstructural Evoluti
Zhan, Sheng, Surface Insulation Resistance Degradation and Electrochemical
Zhan, Yumei, Micro Zero-Insertion-Force (ZIF) Connector for Multi-Substrate
Zhang, Hongqing, Thermal and Electromigration Induced Strain and Microstruc
Zhang, Qian, Isothermal Mechanical and Thermomechanical Durability Characte
Zhang, Rongwei, Novel Conductive Adhesives for Electronic Packaging Applica
Zhang, Xuefeng, Chip Package Interaction (CPI) and Its Impact on the Reliab
Zhang, Yifei, The Effects of Aging on the Mechanical Behavior of Lead Free
Zhang, Zheming, Ball Grid Array Solder Joint Reliability under Impact Test
Zhang, Zhongqin, Nucleation and Growth Kinetics of Tin and Tin-Silver Alloy
Zhao, Ping, Creep Corrosion over Plastic Encapsulated Microcircuit Package
Zheng, Yunqi, Effect of Surface Finishes and Intermetallics on the Reliabil
Zhou, Bite, Characterization of Tin Crystal Orientation Evolution During Th
Zhou, Jianguo, Processing of Generic Circuits by Conductive Adhesives: Geom
Zhou, Xiaoying, Life Cycle Thinking and Assessment Tools on Environmentally
Zhou, Yuxun, Harmonic and Random Vibration Durability Investigation for Tin
Zribi, Anis, Kinetics of Intermetallic Growth at the Interfaces of Soldered
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I'm still hunting for these theses:
Andersson, Cristina,
Reliability, fatigue and mechanical characterization of lead-free solders for
electronic packaging applications
Ph.D., Chalmers Tekniska Hogskola (Sweden), 2007, 74 pages; AAT C829434
http://publications.lib.chalmers.se/cpl/record/index.xsql?pubid=41646
Bansal, Dhiraj Effect of Voids on Electromigration in Solder Bumps for Power Flip Chips (M.S. Mechanical Engineering) CALCE
Bredee, Thesis (Utrecht, 1928).
Chen, Na, DYNAMIC MECHANICAL PROPERTIES OF LEAD FREE SOLDERS M.S., Beijing University of Technology (People's Republic of China), 2008; AAT H355697
Chi, Yu Cheng, The effect of Bi on the microstructure and shear strength of Sn-3Ag-0.5Cu/Cu solder joints M.S., Dalian University of Technology (People's Republic of China), 2007; AAT H321451
DAVIS, JACK HAYNE, THE EFFECT OF HIGH ELASTIC UNIAXIAL STRAIN ON THE RESISTIVITY AND THE SUPERCONDUCTING TRANSITION TEMPERATURE OF TIN WHISKERS Ph.D., Clemson University, 1966, 73 pages; AAT 6706953
Dekker, K. Douwes, Thesis Utrecht (1927).
Ekvall, Tomas, and Andrae, Anders, Attributional and Consequential Environmental Assessment of the Shift to Lead-Free Solders (10 pp) Corresponding author:: Tomas Ekvall, Division of Energy Technology, Chalmers University of Technology, SE-412 96 G”teborg, Sweden (tomas.ekvall@me.chalmers.se)
Gang, Chen Zhi, Study on the Creep Behavior of SnAgCuRE Solder Joints
Groves, Steven Herr, Transport properties and band structure of gray tin. Harvard Univ DEC 1963 AD0432897 HU 90.8562 Harvard Depository
Gu, Yan Xiao, Study on the Wetting Experiment of Lead-free Solders M.Eng., Beijing University of Aeronautics and Astronautics (People's Republic of China), 2006; AAT H134521
Guo, Fu Kang, Research of Sn-Ag Lead Free Solders M.S., Beijing University of Aeronautics and Astronautics (People's Republic of China), 2007; AAT H307067
He, Ying, Mechanical Behaviors of the Lead-free Solder and Constitutive Model M.Eng., Tianjin University (People's Republic of China), 2008; AAT H297945
KITTERMAN, JOHN HOWARD, GROWTH OF CADMIUM WHISKERS IN INERT ATMOSPHERES Ph.D., Colorado State University, 1970, 231 pages; AAT 7105342
Lee, Yuri, Constitutive property testing and reliability assessment of lead-free solder joint M.S., University of Maryland, College Park, 2010, 85 pages; AAT 1489153
Lin, Feng Jian, Research of some package issues about micro and nano device M.S., East China Normal University (People's Republic of China), 2007; AAT H288935
Linder,Scott L. The Characterization of Whiskers Produced by Electromigration on Suspended Aluminum Linestripes. Master's Thesis Dec. 8, 1986 ADA179383
Liu, C. M., A study on the reaction between the Sn-3.5Ag solder and BGA surface finish, M.S. thesis Chungli City, Taiwan: National Central University, 2000, available in Chinese only as of Nov. 2003.
Liu, Peng, MICROSTRUCTURE AND RESIDUAL MECHANICAL PROPERTY OF THERMOMECHANICALLY-FATIGUED COMPOSITE SOLDER JOINTS M.S., Beijing University of Technology (People's Republic of China), 2007; AAT H347629
MCCANLESS, WILLIAM VOSS, THE SIZE AND TEMPERATURE DEPENDENCE OF THE ELECTRICAL RESISTIVITY OF INDIUM AND ZINC WHISKERS Ph.D., Clemson University, 1971, 77 pages; AAT 7125609
McElroy, Paul Tucker, The construction of a ratio reflectometer and its application to energy band studies in germanium and gray tin. Harvard Univ 1968 HU 90.9403.5 Harvard Depository
MILLER, JOHN RICHARD, MEASUREMENTS OF THE COMPLEX-IMPEDANCE OF ONE-DIMENSIONAL TIN WHISKER CRYSTALS NEAR THE SUPERCONDUCTING TRANSITION-TEMPERATURE Ph.D., University of Virginia, 1973, 84 pages; AAT 7324973
NEWBOWER, RONALD STANLEY, FEMTOVOLT MEASUREMENTS OF THE SUPERCONDUCTING TRANSITION OF TIN WHISKER CRYSTALS Ph.D., Harvard University, 1971; AAT 0237976 HU 90.10023 Harvard Depository
Nishiike, U., Doctor Thesis, University of Tokyo (1975). Japanese
Peng, W, Zeng, K, Kivilahti, J, Performer: Literature Review on Potential Lead-Free Solder Systems Helsinki Univ. of Technology, Espoo (Finland). Dept. of Electrical and Communications Engineering. 2000. 68p. Report: ISBN-951-22-4979-0, HUT-EPT-1
Presche, P., Dissertation, TU Berlin, Berlin 1966.
Qi, Gang Zhi, The Study of Flux-free Active Soldering M.S., Beijing University of Aeronautics and Astronautics (People's Republic of China), 2007; AAT H316920
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Seppala, Anne Kristiina, Flip chip attachment on rigid substrates using anisotropic conductive adhesive films D.Sc.(Tech.), Tampereen Teknillinen Korkeakoulu (Finland), 2003, 105 pages; AAT C815115
Sharon, Gilad, Modeling the physics of failure for electronic packaging components subjected to thermal and mechanical loading Ph.D., University of Maryland, College Park, 2011, 146 pages; AAT 3479068
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SKOVE, MALCOLM JOHN, THE ELASTIC AND PLASTIC PROPERTIES OF ZINC AND CADMIUM WHISKERS Ph.D., University of Virginia, 1960, 62 pages; AAT 6004619
Smith, R. W., Ph. D. Thesis, Birmingham University, 1956.
Sun, Peng, Interfacial reactions and low cycle fatigue of lead-free solders for electronic packaging Ph.D., Chalmers Tekniska Hogskola (Sweden), 2007, 45 pages; AAT C829502
Tan, Tang Fa, Study on Surface and Interface in Silver Filled Electrically Conductive Adhesives Ph.D., Huazhong (Central China) University of Science and Technology (People's Republic of China), 2006; AAT H168141
Wan, Quanhe Exploration of the Mechanisms of Corrosion Creep and Stress Corrosion Cracking University of Rochester, ProQuest, UMI Dissertations Publishing, 2013. 3555071.
Wang, Sheng Zhi, STUDY ON RELIABILITY OF SNAGCU SOLDER JOINTS OF FLIP CHIP M.S., Beijing University of Technology (People's Republic of China), 2005; AAT H341859
Wang, Xu, High Frequency Characterization of Flip Chip Lead Free Joints M.S., Shanghai University (People's Republic of China), 2008; AAT H148250
Xiang, Ke, Research on electronics measurement of lead-free solder joints' reliability under thermal load M.S., Central South University (People's Republic of China), 2008; AAT H209388
Xiao, Min Wei, RESEARCH ON MICRO-MECHANICAL BEHAVIOR OF SnAgCuRE LEAD-FREE SOLDER M.S., Beijing University of Technology (People's Republic of China), 2008; AAT H356465
Xu, Xia Dong, STUDY ON THE PREPARATION OF SOLDERING FLUX FOR LEAD-FREE SOLDER AND ELECTRIC RELIABILITY OF FLUX RESIDUES Ph.D., Beijing University of Technology (People's Republic of China), 2008; AAT H356597
Xue, Lin, Low Cost Flip Chip Bumping Technology by Stencil Printing and Its Application M.S., Tsinghua University (People's Republic of China), 2007; AAT H475304
Yan, L., The effect of bismuth additions on the microstructure and properties of tin electroplates, Ph.D. dissertation, Loughborough Univ., Loughborough, Leicestershire, Sep. 2012.
Yang, Jian, The Synthesis of The New Activator and Applied in The Lead-free Solder Paste M.S., Sichuan University (People's Republic of China), 2006; AAT H333595
Yu, Bao Chuan, Characterization of the elevated temperature creep and fatigue properties of Lead-free solders used in Electronic Packaging M.S., South China University of Technology (People's Republic of China), 2006; AAT H452900
Yu, Yun De, A Research on Electrodeposition of Sn-Cu Lead-free Alloy Solder M.S., South China University of Technology (People's Republic of China), 2007; AAT H461053
Zhang, Gang Wei, The Development of Simulating System for Reflow Profile M.S., Huazhong (Central China) University of Science and Technology (People's Republic of China), 2007; AAT H186698
Zhu, Chun Yu, The Optimized Plating Process for Mitigating Tin Whisker Growth on Lead Frame Finish M.S., Huazhong (Central China) University of Science and Technology (People's Republic of China), 2007; AAT H185031