Bibliography for Tin Whiskers, Zinc Whiskers, Cadmium Whiskers, Indium Whiskers, and Other Conductive Metal and Semiconductor Whiskers

• Books on Conductive Metal and Semiconductor Whiskers (revised 11/23/2011)
• Ph. D. and Master's Theses on Conductive Metal and Semiconductor Whiskers (revised 4/13/2011)
• Papers, Reports, and Magazine Articles on Conductive Metal and Semiconductor Whiskers (revised 12/6/2011)
• Web pages on Conductive Metal and Semiconductor whiskers (revised 12/6/2011)

Fukuda, Mitsuo, Reliability and Degradation of Semiconductor Lasers and LEDs. Boston: Artech House, 1991. ISBN 0890064652.

Gilman, J. J., The Art and Science of Growing Crystals. New York: John Wiley & Sons, 1963.

Henshall, Greg, Bath, Jasbir, and Handwerker, Carol A., Lead-Free Solder Process Development. Hoboken, NJ: John Wiley & Sons, 2011. ISBN 978-0-470-41074-5. $99.95 list price.

Hudson, John B., Surface Science: An Introduction. New York: John Wiley & Sons, 1998. ISBN 0471252395. pp. 304-309.

Levitt, Albert P., Whisker Technology. New York: Wiley-Interscience, 1970. ISBN 471-53150-2.

Licari, James J., and Enlow, Leonard R., Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production, 2nd Edition. Westwood, NJ: Noyes Publications, 1998. ISBN 0815514239. $180.00 list price.

Tan, A. C., Tin and Solder Plating in the Semiconductor Industry. New York: Chapman & Hall, 1993. ISBN 0-412-48240-1.

"A new way to grow microwires," Electronics Manufacture and Test , Feb. 4, 2011.

"Are Zinc Whiskers Growing in Your Computer Room?"

"Back Up Block 1 Whisker on Cu," June 6, 2003.

"Back Up Block 2 Whisker on NiFe," June 6, 2003.

"BMPCOE Strives to Mitigate Tin Whiskers," COTS Journal, vol. xx no. xx, pp. 60-63, Sept. 2003.

"Boeing 601 (f.k.a. Hughes HS 601)."

"Cadmium whiskers on Hubble," finishing.com.

"Close Shave," Printed Circuit Design and Manufacture, vol. 20 no. 8, pp. 10, Aug. 2003.

"Coating to stop tin whisker growth?," Circuitnet, Aug. 14, 2006.

"Comments on Test Methods & Criteria for Tin Whiskers in Surface Mount Passive Devices," EIA/ECA-CB22, Nov. 2005.

"Control of Whisker Growth in Tin Alloy Coatings," ST Microelectronics Application Note AN2035, Nov. 2004.

"Elimination of Lead from Electrical and Electronic Equipment - the Dilemma of Tin-Whisker Growth," Eurocomp, no. 7, pp. 3-6, Autumn 2004.

"European directives vs. Tin Whiskers & Tin Pest," finishing.com .

"Examples of tin-whiskers failures," evertiq, Oct. 11, 2007.

"Getting the Lead Out," Appliance Design, vol. xx no. x, pp. xx-xx, Feb. 2006.

"Glitch silences millions of pagers," Star-Bulletin, May 20, 1998.

"Hot-Dip Tin Process Said to Prevent Whisker Formation," Products Finishing, vol. 73 no. 7, pp. 11, Apr. 2009.

"HP says RoHS making whiskers problem worse," evertiq, Feb. 22, 2005.

"HP's Position Statement on Tin-based Plating for Lead-free Components," Apr. 7, 2003.

"Hughes Satellite Failures Continue To Plague New Owner," Electronics Weekly, Apr. 24, 2001.

"Hughes Seeks To Salvage Satellites," Television Digest with Consumer Electronics, vol. xx no. xx, pp. xx-xx, Sept. 11, 2000.

"Industry Groups Continue Focus on Tin Whiskers," CPMT Society Outlook , vol. 1, pp. 3-4, 2005.

"iNEMI Tin Whisker Accelerated Test Project Test Method for Evaluating Tin Whisker Growth on Plated Surfaces." International Electronics Manufacturing Initiative, June 17, 2004.

"iNEMI tin whisker group publishes updated recommendations," Tin World, no. 17, pp. 11, Spring 2007.

"iNEMI Tin Whisker user group publishes updated recommendations to help reduce risk of tin whiskers," emsnow, Dec. 20, 2006.

"iNEMI Tin Whisker Workshop," Tin World, no. 18, pp. 14, Early Summer 2007.

"iNEMI Updates Tin Whiskers Findings," SMT Web Exclusive Article.

"Inspections, Compliance, Enforcement, and Criminal Investigations Tin Wiskers Problems, Causes, and Solutions," Food and Drug Administration, Mar. 14, 1986.

"Interim Recommendations on Lead-Free Finishes for Components Used in High- Reliability Products,", NEMI, Mar. 2004.

"ITG Subject: Tin Whiskers - Problems, Causes, and Solutions," Department of Health, Education, and Welfare Public Health Service Food and Drug Administration *ORA/ORO/DEIO/IB*, Mar. 14, 1986.

"J-STD-020B, IPC/JEDEC J-STD-020B, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices," Arlington, VA: JEDEC Solid State Technology Association, July 2002.

"J-STD-033A, IPC/JEDEC J-STD-033A, Joint Industry Standard Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices," Arlington, VA: JEDEC Solid State Technology Association, July 2002.

"JEDEC and IPC Release Tin Whisker Acceptance Testing," Tin World , no. 14, pp. 11, 2006.

"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," CircuiTree, vol. 19 no. 5, pp. xx-xx, May 2006.

"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," PCB007, May 4, 2006.

"JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," FPGA and Structured ASIC Journal, vol. xx no. x, pp. xx-xx, May 4, 2006.

"JEDEC and IPC release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline," emsnow, May 5, 2006.

"JEDEC, iNEMI Update Tin Whisker and Lead-Free Surface Finish Guidelines," CircuiTree, vol. 18 no. 7, pp. xx-xx, July 2005.

"JEDEC, IPC Release Tin Whisker Acceptance Testing Standard," Circuitree, vol. 19 no. 6, pp. xx-xx, June 2006.

"JEDEC, IPC Release Tin Whisker Standards," Printed Circuit Design and Manufacture, vol. 23 no. 6, pp. 8, June 2006.

"JEDEC Releases Standard for Tin Whisker Testing and iNEMI User Group Updates Lead-Free Surface Finish Guidelines," PCB007, May 24, 2005.

"JESD201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes," Arlington, VA: JEDEC Solid State Technology Association, Mar. 2006.

"JESD22A121, Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," JEDEC Solid State Technology Association, May 2005.

"JESD22A121.01, Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," JEDEC Solid State Technology Association, Oct. 2005.

"JETRO Releases the Results of its Survey of Japanese Manufacturers in Europe and Turkey," PCB007, May 26, 2006.

"JP002, Current Tin Whiskers Theory and Mitigation Practices Guideline," Arlington, VA: JEDEC Solid State Technology Association and Bannockburn, IL: IPC, Mar. 2006.

"Lead Free Product Testing," Trace Laboratories-East.

"Lead Free Product Testing/Tin Whisker Testing," Trace Laboratories-East.

"Lead-Free solder failure mechanisms," TWI LiveWire, issue 11, Nov./Dec. 2003.

"Lead-Free solder failure mechanisms: What are Tin Whiskers?," LiveWire, no. 11, pp. xx-xx, .Nov./Dec. 2003.

"Lead Free Tin Whiskering Study: Grayhill DIP Switches," Grayhill, May 11, 2004.

"Lead-free: Whiskers on Tin," Tyco Electronics.

"Leadfree Solder and Tin Whiskers Program Guidance (draft)," Lead Free Soldering Summit, Philadelphia, PA, July 13-14, 2005.

"Matte Tin Plating Whisker Data," Lattice Product Bulletin PB1227H, Nov. 2010.

"MAUDE Adverse Event Report," 1996.

"MAUDE Adverse Event Report," 2008.

"Metal Whiskers," Science, New Series, vol. 123 no. 3209, pp. 1165, Jun. 29, 1956.

"Metal Whiskers," finishing.com.

"Metallic Whisker Sources," Worldwide Environmental Services, 2004.

"Nano Whiskers."

"NASA's Suggestions for Reducing Risk of Tin Whisker Induced Failures," Products Finishing, vol. 74 no. 12, pp. 32, Sept. 2010.

"NEMI Group Releases Draft Proposal of Tin Whisker Acceptance Test Requirements," CircuiTree, vol. 17 no. 6, pp. xx-xx. June 2004.

"NEMI Issues Revised Tin Whisker Acceptance Test Requirements," NEMI, Aug. 30, 2004.

"NEMI issues revised tin whisker acceptance test requirements," PCB007, Aug. 30, 2004.

"NEMI team recommends three test conditions for evaluating tin whisker growth," PCB007, Oct. 6, 2003.

"NEMI Team Recommends Three Test Conditions for Evaluating Tin Whisker Growth," CircuiTree, vol. 16 no. 12, pp. xx-xx, Dec. 2003.

"NEMI's Tin Whisker Project reports initial test results, reviews modeling efforts at APEX 2002," PCB007, Feb. 8, 2002.

"New additive limits tin whiskers," Solid State Technology, vol. 51 no. 1, pp. 23, Jan. 2008.

"New Immersion Tin Process PRESA RMK-30: Tin Whisker Issue," Uyemura, Mar. 2007.

"New Standards on Tin Whisker Mitigation," Circuits Assembly, vol. 17 no. 4, pp. 36, Apr. 2006.

"New tin whisker standard," Tin World, no. 18, pp. 16, Early Summer 2007.

"New TWI proposed project: Tin Whiskers - reducing the risk," TWI LiveWire, issue 14, Summer 2004.

"Nickel-coated Components Solve Electrical Problem," Nickel, vol. 20 no. 2, pp. 5, Mar. 2005.

"On Trial In Brazil," Air Safety Week, vol. 21 no. 23, June 11, 2007.

"Other Environmental Requirements."

"Overcoming zinc whisker," finishing.com.

"Plating's Effects on Electronics Assembly," Printed Circuit Design and Fab/Circuits Assembly, vol. 27 no. 7, pp. 40, July 2010.

"Potential Tin Whiskers on Printed Circuit Board Components," Westinghouse Nuclear Tech Bulletin TB-05-4, June 8, 2005.

"Power Supply Failures: The Problem with Zinc Whiskers," Apr. 5, 2005.

Problem Advisory FV5-P-06-01A

"Proposals for Further Exemptions from the Requirements of Article 4(1) of Directive 2002/95/EC for Specific Applications of Lead, Mercury, Cadmium, Hexavalent Chromium," Japan Business Council in Europe.

"Qualification of Lead Free Component Plating Finishes," Nov. 3, 2003.

"Qualification Procedure for Tin Whisker Formation in Lead-free Connector Terminal Finishes," Molex.

"Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products," iNEMI Tin Whisker User Group, Version 3, May 2005.

"Reducing the risk of tin whiskers on lead-free products," RF Design, vol. xx no. x, pp. xx-xx, May 10, 2006.

"Requested Exemption from the requirements of Article 4(1) of Directive 2002/95/EC," Swatch, Jan. 12, 2006.

"Resolution of Generic Safety Issues: Issue 200: Tin Whiskers (NUREG-0933, Main Report with Supplements 1-33)

"Risks of Conductive Whiskers in High-Reliability Electronics and Associated Hardware from Pure Tin Coatings," June 19, 2002.

"RoHS at QP Semiconductor," QP Semiconductor Application Note 114 Rev. 2.0, Feb. 2008.

"Second ECTC iNEMI Tin Whisker Workshop," Components, Packaging, and Manufacturing Technology Society Newsletter, vol. 28 no. 2, pp. 8-9, June 2005.

"Set of recommendations to help reduce risk of Tin Whiskers," evertiq, Dec. 18, 2006.

"Shaving the Risk of Tin Whiskers," NITON Application Bulletin , Mar. 17, 2004.

"Shaving the whiskers for lead-free production," European Semiconductor, vol. 26 no. 11, pp. 17, Nov. 1, 2004.

"Standards aim to reduce the risk of tin whiskers," Test & Measurement World, vol. 26 no. 4, pp. xx-xx, May 4, 2006.

"Standards aim to reduce the risk of tin whiskers," Test & Measurement World, vol. 26 no. 5, pp. 12, June 2006.

"Suppression of Tin Whisker Growth through Optimized Tin Plating Chemistry Formulation Technistan EP," Technic.

"Technical Service Bulletin: Tin Whiskers in MOD10 Relays." GE Power Management, MOD10 SB1-00.03.27, Mar. 27, 2000.

"The Facts about Tin Whiskers," Electronic Components, Assemblies & Materials Association, EIA/ECA-CB19, Aug. 2004.

"The Fusing of Wires and Tin Whiskers," Ver. 4/09.

"The Growth of Tin Whisker," Samsung.

"The Mechanism of Ag2S Formation," Product Engineering & Quality , Oct. 2002, pp. xx-xx.

"The problem of 'tin whiskers' cannot be neglected," Dataweek , vol. xx no. xx, pp. xx-xx, July 28, 2004.

"The Relation between Whisker and Stress," Hynix Semiconductor.

"Thermal cycling test of tin-bismuth and tin plating," Ishihara Chemical Co., 2008.

"Three organizations from US, Europe, Japan cooperating to develop tin whisker test method," PCB007, July 18, 2003.

"Tin-Nickel Alloy Plating Does Not Grow Whiskers in Five Years," Tin and its Uses, no. 64, pp. 15, 1964.

"Tin-Nickel versus Metal "Whiskers"," Tin and its Uses, no. 52, pp. 8, 1961.

"Tin "Noodles"???."

"Tin Whisker Acceptance Test Requirements," NEMI Tin Whisker Users Group, July 28, 2004.

"Tin Whisker Experience - Rocket Motor Initiator Failure Analysis."

"Tin Whisker Experiences," June 19, 2002.

"Tin Whisker Growth Evaluation Results," Kemet, Mar. 30, 2004.

"Tin Whisker Imagery," empfasis, pp. 9, Apr. 2009.

"Tin Whisker Info "Brief"," On Semiconductor Application Note TND311, May 2003.

"Tin Whisker Qualification and Reliability Testing," Printed Circuit Design and Fab/ Circuits Assembly, vol. 28 no. 10, pp. 37,39, Oct. 2011.

"Tin Whisker References."

"Tin Whisker Specs Defined," Metals and Interconnects, vol. 18 no. 7, pp. xx, Aug. 2004.

"Tin Whiskering Borders on Urban Legend," Design News, vol. 60 no. 11, pp. xx, Aug. 15, 2005.

"Tin Whiskers," Electronics Manufacture and Test, vol. xx no. xx, pp. xx-xx, Dec. 7, 2003.

"Tin Whiskers," Sept. 14, 2004.

"Tin Whiskers."

"Tin Whiskers," Circuitnet, May 14, 2007.

"Tin whiskers a problem with immersion tin pwb finishes? ," finishing.com.

"Tin Whiskers and Conversion to Pb-Free," Circuits Assembly, vol. 16 no. 12, pp. 38-40, Dec. 2005.

"Tin Whiskers: Companies Taking Cover Under iNEMI Guidelines," Design News, vol. 60 no. 12, pp. xx, Sept 5, 2005.

"Tin whiskers in electronic," finishing.com.

"Tin Whiskers Syfer Surface Mount Capacitors," Syfer Application Note AN0019 Issue 3.

"Tin wisker might delay RoHS schedule," Industry News, vol. xx no. xx, pp. xx-xx, Mar. 18, 2005.

"TO-220 Lead Free and RoHS Compliance Document," International Rectifier.

"Trace Laboratories-Central Announces Their New Tin Whisker Testing Program (iNEMI-Specified)," Trace Laboratories.

"TW System Failures," NAVSEA, Apr. 3, 2005.

"UCLA Department of Materials Science and Engineering."

"What are Tin Whiskers?."

"What Are Tin Whiskers?"

"What are Tin Whiskers?."

"When Electronics Get Five O'Clock Shadow," Jan. 5, 2005.

"Whisker control plating process YWL SYSTEM," Yuken.

"Whisker Formation on Tin Plated Cu based Leadframes: Results and Conclusions," Oct. 29. 2004.

"Whisker Formation on Tin Plated FeNi42: Results and Conclusions," Oct. 29, 2004.

"Whisker Formation Test Report," Phoenix Passive Components.

"Whisker-free Tin Coatings for Electronic Components," Tin and its Uses , no. 74, pp. 5, 1967.

"Whisker Woes," Air Safety Week, vol. 18 no. 45, pp. xx-xx, Nov. 22, 2004.

"Whiskers Can't Be Eliminated," Design News, vol. 61 no. 9, pp. xx, June 26, 2006.

"Whiskers on Monitor PCBs," Center for Advanced Life Cycle Engineering, Sept. 5, 2008.

"Whiskers on USB housing of PC Mother Board," Center for Advanced Life Cycle Engineering, Sept. 5, 2008.

"Will electronic equipment fail from tin-whisker shorts?," SourceESB, Feb. 9, 2005.

"Zinc Contamination in High Technology Facilities.,"

"Zinc Whiskers Growing on Raised Floor Tiles are Causing Conductive Contamination Failures and Equipment Shutdowns," The Uptime Institute.

Addamiano, Arrigo, and Davey, John E., "A New Type of Gallium Arsenide Whiskers," Journal of Crystal Growth , vol. 10 no. 2, pp. 194-198, July 1971.

Addamiano, Arrigo, "Coiled Crystals of Gallium Arsenide," Journal of Crystal Growth, vol. 11 no. 3, pp. 351-354, Dec. 1971.

Ahn, Jae Hyun, Lee, Jae-Hyun, Koo, Tae-Woong, Kang, MyungGil, Whang, Dongmok, and Hwang, SungWoo, "Synthesis of Small Diameter Silicon Nanowires on SiO2 and Si3N4 Surfaces," IEICE Transactions on Electronics, vol. E93.C no. 5, pp. 546-551, 2010.

Aichele, Thomas, Tribu, Adrien, Sallen, Gregory, Bocquel, Juanita, Bellet-Amalric, Edith, Bougerol, Catherine, Poizat, Jean-Philippe, Kheng, Kuntheak, Andre, Regis, Tatarenko, Serge, and Mariette, Henri, "CdSe quantum dots in ZnSe nanowires as efficient source for single photons up to 220 K," Journal of Crystal Growth, vol. 311 no. 7, pp. 2123-2127, Mar. 15, 2009.

Alam, Khairul, and Sajjad, Redwan N., "Electronic Properties and Orientation-Dependent Performance of InAs Nanowire Transistors," IEEE Transactions on Electron Devices, vol. 57 no. 11, pp. 2880-2885, Nov. 2010.

Appell, David, "CMEs - If The Sun Spits, The Earth Could Fry," Mar. 1, 1999.

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Asrar, Nausha, "Detrimental Effects of Excessive Gold Plating on Lead-Free Solder Joints," Electronic Device Failure Analysis, vol. 13 no. 1, pp. 4,6-8,10-11, Feb. 2011.

Avigal, Y., and Schieber, M., "Hollow Whiskers of Silicon Grown by Pyrolysis of Alkyl-Silicon Compounds on Polycrystalline Quartz Substrates," Journal of Crystal Growth, vol. 26 no. 1, pp. 157-161, Nov. 1974.

Ayers, J. E., and Ghandhi, S. K., "The Epitaxy of Germanium on Gallium Arsenide," Journal of Crystal Growth, vol. 89 no. 4, pp. 371-377, July 1, 1988.

Aspandiar, Raiyo F., "Voids in Solder Joints," 2006 SMTA International Conference Proceedings, Rosemont, IL, Sept. 24-28, 2006, pp. 406-413.

Baated, Alongheng, Kim, Keun-Soo, and Suganuma, Katsuaki, "Effect of intermetallic growth rate on spontaneous whisker growth from a tin coating on copper," Journal of Materials Science: Materials in Electronics, vol. 22 no. 11, pp. 1685-1693, Nov. 2011.

Baated, Alongheng, Hamasaki, Kyoko, Kim, Sun Sik, Kim, Keun-Soo, and Suganuma, Katsuaki, "Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes," Journal of Electronic Materials, vol. 40 no. 11, pp. 2278-2289, Nov. 2011.

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Bakan, Gokhan, Khan, Niaz, Cywar, Adam, Cil, Kadir, Akbulut, Mustafa, Gokirmak, Ali, and Silva, Helena, "Self-heating of silicon microwires: Crystallization and thermoelectric effects," Journal of Materials Research, vol. 26 no. 9, pp. 1061-1071, May 14, 2011.

Balabas, M. V., Sushkov, A. O., and Budker, D., "Rubidium 'whiskers' in a vapour cell," Nature Physics, vol. 3 no. 2, pp. 2, Jan. 2007.

Barth, Sven, Kolesnik, Maria M., Donegan, Keith, Krstic, Vojislav, and Holmes, Justin D., "Diameter-Controlled Solid-Phase Seeding of Germanium Nanowires: Structural Characterization and Electrical Transport Properties," Chemistry of Materials, vol. 23 no. 14, pp. 3335-3340, July 26, 2011.

Bernardin, T., Dupre, L., Burnier, L., Gentile, P., Peyrade, D., Zelsmann, M., and Buttard, D., "Organized porous alumina membranes for high density silicon nanowires growth," Microelectronic Engineering, vol. 88 no. 9, pp. 2844-2847, Sept. 2011.

Bertrand, Nathalie, Desgranges, Clara, Gauvain, Danielle, Monceau, Daniel, and Poquillon, Dominique, "Low Temperature Oxidation of Pure Iron: Growth Kinetics and Scale Morphologies," Materials Science Forum, vol. 461-464, pp. 591-598, 2004.

Bhagat, S. M., and Lubitz, P., "F.M.R. in H.C.P. Cobalt Whiskers," Magnetism and Magnetic Materials - 1972 (18th Annual Conference-Denver) Number, 10 Part 1, Denver, CO, Nov. 28-Dec. 1, 1972, pp. 125-129.

Bhatt, V. P., and Trivedi, S. B., "Chemical and Thermal Etching of Se-Te Whisker Crystals," Journal of Crystal Growth, vol. 37 no. 1, pp. 23-28, Jan. 1977.

Bhimarasetti, Gopinath, and Sunkara, Mahendra K., "Synthesis of Sub-20-nm-Sized Bismuth 1-D Structures Using Gallium-Bismuth Systems," Journal of Physical Chemistry B, vol. 109 no. 34, pp. 16219-16222, Sept. 1, 2005.

Blakely, J. M., and Jackson, K. A., "Growth of Crystal Whiskers," Journal of Chemical Physics, vol. 37 no. 2, pp. 428-430, July 15, 1962.

Bloem, J., "Nucleation and Growth of Silicon by CVD," Journal of Crystal Growth , vol. 50 no. 3, pp. 581-604, Nov. 1980.

Bodiul, P. P., Gitsu, D. V., Dolma, V. A., Miglei, M. F., and Zegrya, G. G., "The Thermopower in Bismuth Whiskers," Physica Status Solidi (a), vol. 53 no. 1, pp. 87-93, May 16, 1979.

Boehme, Mario, and Ensinger, Wolfgang, "From Nanowheat to Nanograss: A Preparation Method to Achieve Free Standing Nanostructures Having a High Length/Diameter Aspect Ratio," Advanced Engineering Materials, vol. 13 no. 5, pp. 373-375, May 2011.

Bojarski, Zbigniew, and Surowiec, Marian, "Morphology and Dislocation Structure of Iron Whiskers," Journal of Crystal Growth, vol. 46 no. 1, pp. 43-50, Jan. 1979.

Bootsma, G. A., and Gassen, H. J., "A Quantitative Study on the Growth of Silicon Whiskers from Silane and Germanium Whiskers from Germane," Journal of Crystal Growth, vol. 10 no. 3, pp. 223-234, Aug. 1971.

Borgstrom, M., Deppert, K., Samuelson, L., and Seifert, W., "Size- and shape-controlled GaAs nano-whiskers grown by MOVPE: a growth study," Journal of Crystal Growth, vol. 260 no. 1-2, pp. 18-22, Jan. 2, 2004.

Borle, W. N., Jayakumar, V., Sharda, G. D., Bal, M., and Seth, G. L., "On the Growth of Silicon Crystals in an Internal Work Coil Type Float Zoner," Journal of Crystal Growth, vol. 19 no. 4, pp. 359-360, July 1973.

Brannagan, D. J., "Enabling Factors Toward Production of Nanostructured Steel On an Industrial Scale."

Brenner, S. S., "Further observations on the growth of silver whiskers from silver chloride," Acta Metallurgica, vol. 7 no. 10, pp. 677-678, Oct. 1959.

Brenner, S. S., "Growth and Properties of "Whiskers"," Science, vol. 128 no. 3324, pp. 569-575, Sept. 12, 1958.

Brenner, S. S., "Metal "Whiskers"," Scientific American, vol. 203 no. 1, pp. 64-72, July 1960.

Brenner, S. S., "Tensile Strength of Whiskers," Journal of Applied Physics, vol. 27 no. 12, pp. 1484-1491, Dec. 1, 1956.

Brenner, Sidney S., "The Growth of Whiskers by the Reduction of Metal Salts," Acta Metallurgica, vol. 4 no. 1, pp. 62-74, Jan. 1956.

Cardetta, V. L., Mancini, A. M., Manfredotti, C., and Rizzo, A., "Growth and Habit of GaSe Crystals Obtained from Vapour by Various Methods," Journal of Crystal Growth, vol. 17, pp. 155-161, Dec. 1972.

Cech, R. E., "The Nucleation of Nickel Whiskers," Acta Metallurgica, vol. 7 no. 12, pp. 787-792, Dec. 1959.

Cech. R. E., "The Role of Halide-Cycle Reactions in the Growth of Nickel Whiskers," Acta Metallurgica, vol. 9 no. 5, pp. 459-463, May 1961.

Cederberg, J. G., Waldrip, K. E., and Peake, G. M., "Pendeoepitaxy of GaAs and In0.15Ga0.85As using laterally oxidized GaAs/Al0.96Ga0.04As templates," Journal of Crystal Growth, vol. 272 no. 1-4, pp. 588-595, Dec. 10, 2004.

Celik, Emrah, Guven, Ibrahim, and Madenci, Erdogan, "Mechanical Characterization of Nickel Nanowires by using a Customized Atomic Microscope in Scanning Electron Microscope," 2011 IEEE 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2011, pp. 1999-2006.

Champaign, Robert F., and Ogden, Robert R., "Microscopy Study of Tin Whiskers," Journal of Failure Analysis and Prevention, vol. 10 no. 6, pp. 444-449, Dec. 2010.

Chandrasekaran, Hari, Sumanasekara, Gamini U., and Sunkara, Mahendra K., "Rationalization of Nanowire Synthesis Using Low-Melting Point Metals," Journal of Physical Chemistry B, vol. 110 no. 37, pp. 18351-18357, Sept. 21, 2006.

Chang, Mei, and De Jonghe, Lutgard C., "Whisker Growth in Reduction of Oxides," Metallurgical and Materials Transactions B, vol. 15 no. 4, pp. 685-694,Dec. 1984.

Chang, Yuneng, Chen, Yalian, Wu, Ruykuo, Chen, Kuanhon, and Lin, Johnyi, "Polycrystalline Copper Whiskers and Networks Observed in MOCVD."

Chason, Eric, Jadhav, Nitin, and Pei, Fei, "Effect of Layer Properties on Stress Evolution, Intermetallic Volume, and Density during Tin Whisker Formation," JOM, vol. 63 no. 10, pp. 62-68, Oct. 2011.

Chen, Dapeng, Qiao, Xueliang, and Chen, Jianguo, "Morphology-controlled synthesis of silver nanostructures via a solvothermal method," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.

Chen, X. L., Lan, Y. C., Li, J. Y., Cao, Y. G., and He, M., "Radial growth dynamics of nanowires," Journal of Crystal Growth, vol. 222 no. 3, pp. 586-590, Jan. 2001.

Chen, Yanbiao, Yang, Youwen, Chen, Xiangying, Liu, Fei, and Xie, Ting, "Orientation-controllable growth of Sb nanowire arrays by pulsed electrodeposition," Materials Chemistry and Physics, vol. 126 no. 1-2, pp. 386-390, Mar. 15, 2011.

Cheng, Jing, Vianco, Paul T., Subjeck, Joeseph, and Li, James C. M., "An assessment of Sn whiskers and depleted area formation in thin Sn films using quantitative image analysis," Journal of Materials Science, vol. 46 no. 1, pp. 263-274, Jan. 2011.

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Germanium

Iron

Lead Finish Material Candidates and Pros/Cons

Lead-Free Surface Finishes for Electronic Components: Tin Whisker Growth

Metal Whiskers from Sn-Ag-Cu Alloy Systems

NASA Goddard Space Flight Center Anecdote #1: 20 Years to Failure

NASA Goddard Space Flight Center Anecdote #2: Tin Whiskers on Waveguide

NASA Goddard Space Flight Center Anecdote #3: Field Failures Due to Tin Whiskers Breaking Loose from Matte Tin-Plated RF Enclosure Lids

NASA Goddard Space Flight Center Anecdote #4- Tin Whiskers on Shield of GPS Units

NASA Goddard Space Flight Center Anecdote #5: Field Failures Due to Tin Whiskers on Circuit Breaker Contacts

NASA Goddard Space Flight Center Basic Info/FAQ

NASA Goddard Space Flight Center Basic Info/FAQ

NASA Goddard Space Flight Center Experiment 1

NASA Goddard Space Flight Center Experiment 2

NASA Goddard Space Flight Center Experiment 2

NASA Goddard Space Flight Center Experiment 4

NASA Goddard Space Flight Center Experiment 5

NASA Goddard Space Flight Center Experiment 6: Simulation of Whisker Growth

NASA Goddard Space Flight Center GOLD WHISKERS: Introducing a New Member to the Family

NASA Goddard Space Flight Center GSFC Experiments

NASA Goddard Space Flight Center Literature References: Tin Whisker Literature References

NASA Goddard Space Flight Center Photo Gallery

NASA Goddard Space Flight Center Photo of the Month

NASA Goddard Space Flight Center Sn-Pb Whiskers

NASA Goddard Space Flight Center Specification Language Related to Pure Tin

NASA Goddard Space Flight Center Summary of Specification Language for Pure Tin

NASA Goddard Space Flight Center Whisker Failures

NASA Goddard Space Flight Center Zinc Whiskers on Raised Floor Tile Structures Photo Gallery

NASA Goddard Space Flight Center Zinc Whiskers on Zinc-Plated Steel Bus Rail

Pb-free (Lead Free) Frequently Asked Questions

Plating

Pure Tin Plating Prohibition

ROHS / Lead (Pb) Free Solutions

Silver

Solder

Testing for Tin Whisker Growth

The Trouble with Tin: Get the Lead Out!

The Trouble with Tin: Get the Lead Out!

Tin Whisker Mitigation - Adding Lead to Chip Size Components with Pure-Tin Terminals

Tin Whisker Summary

Tin Whiskers

Tin Whiskers "A New Problem"

Tin Whiskers on Card Guides

"Tin Whiskers with Special Morphology"

What's so special about Cadmium Plating?

Whisker (metallurgy)

Whiskers in germanium transistors etc

Zinc and Cadmium Whiskers

Zinc Whisker Abatement

Zinc Whisker Detail

Zinc whisker induced failures in electronic systems

Zinc "whiskers"

Zinc "whiskers", page 2

I would like to thank Jay Brusse for contributing to this bibliography.

Please send critiques, corrections, and/or additions to jrbarnes@iglou.com , or by snailmail to:
John Barnes
dBi Corporation
216 Hillsboro Ave
Lexington, KY 40511-2105

Before joining dBi, our staff was directly involved in putting over 115 major electronic products into mass production at Sycor, IBM, and Lexmark. Our staff has over 38 years experience in the computer and electronics industries, developing electronic products and electronic equipment that:

1. Work.
2. Are safe and reliable.
3. Can be manufactured, tested, repaired, and serviced economically.
4. May be sold and used worldwide.
5. Can be easily adapted/enhanced to meet new and changing requirements.

Our President, John R. Barnes, is a Professional Engineer (PE) licensed in the state of Kentucky, a NARTE-Certified Electromagnetic Compatibility Engineer (NCE), a NARTE-Certified Electromagnetic Compatibility Technician (NCT), a NARTE-Certified Electrostatic Discharge Control Engineer (ESDC Eng), a NARTE-Certified Electrostatic Discharge Control Technician (ESDC Tech), a NARTE-Certified Product Safety Engineer (PSE), a Senior Member of the IEEE (SM IEEE), and an Advanced-class amateur radio operator. He has written three books: Electronic System Design: Interference and Noise Control Techniques, which was published in English in 1987 and in Russian in 1990; and Robust Electronic Design Reference Book, Volumes I and II, which came out in 2004. John has also written articles on designing electronics for electrostatic discharge (ESD) immunity for Printed Circuit Design and Conformity magazines.

dBi Corporation can be contacted by:

• E-mail at jrbarnes@iglou.com
• Fax at (859)252-6128.
• Phone at (859)253-1178.
• Snail-mail at 216 Hillsboro Ave, Lexington, KY 40511-2105.