Robust Electronic Design, Inc.

• Designing the circuits to properly handle:
  • Normal operating conditions.
  • Start-up.
  • Termination/shut-down.
  • Unusual/abnormal operating conditions.
• Providing properly-timed input signals even under worst-case conditions.
• Providing "clean enough" input signals even under worst-case conditions (Signal Integrity, SI).
• Providing "clean enough" power even under worst-case conditions (Power Integrity, PI).

A lack of Power Integrity can cause an electronic system to:

• Randomly crash or malfunction in the lab, making hardware and software development/ testing/ qualification/ certification much more difficult and expensive, and stretching out the development process.
• Emit excessive Radiated and Conducted Emissions, making it illegal to sell the product--or even to use the product/ equipment if it interferes with other parties--unless we add expensive shielding and filtering.
• Be very sensitive to external electrical noise, making it illegal to sell the product in Europe unless we add expensive shielding and filtering.
• Randomly crash or malfunction in normal use or foreseeable misuse, frustrating users and operators, and perhaps causing:
  • Operating delays and increased operating costs.
  • Increased warranty and service costs.
  • Aborted missions.
  • Property damage.
  • Injury to people and animals.
  • Death.
  • Expensive lawsuits for the companies that manufacture, install, maintain, and use the product/ equipment.

My first book, Electronics System Design: Interference and Noise Control Techniques (Prentice-Hall, Englewood Cliffs, NJ, 1987) discusses Power Integrity under analog and digital circuit design in:

• Chapter 5, Designing Analog Circuits.
• Chapter 6, Designing Digital Circuits.

My second and third books, Robust Electronic Design Reference Book, Volumes I and II, were published by Kluwer Academic Publishers (now part of Springer) in Mar. 2004. They discuss Power Integrity in great detail in:

• Chapter 8, Capacitors.
• Chapter 10, EMC Ferrites.
• Chapter 20, Integrated Circuits.
• Chapter 24, Designing Power Supply Circuits.
• Chapter 28, Bypassing, Decoupling, and Power Distribution.
• Chapter 31, Designing Printed Circuit Boards.
• Chapter 32, Designing Cables and Backplanes.
• Chapter 35, Filtering.
• Chapter 40, Finding and Fixing Problems.
• Chapter 42, Lab Tests.
• Chapter 44, Approval Testing.
• Appendix G, Important Properties of Printed Circuit Boards, Hybrid Modules, Flat Cables, and Busbars.

BOOKS:

[2] Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques, IPC-D-317A. IPC, Northbrook, IL, 1995.

[3] Handbook of EC EMC Compliance. Boxborough, MA: Compliance Design, 1993.

[4] Handbook of EU EMC Compliance. Boxborough, MA: Compliance Design, 1995.

[5] Handbook of EU EMC Compliance. Boxborough, MA: Compliance Design, 1996.

[6] Practical Design Techniques for Power and Thermal Management . Norwood, MA: Analog Devices, 1998.

[7] Signal Integrity Issues in PCB Design. Bellevue, WA: UltraCAD Design, 2002.

[8] The Best of Analog Dialogue 1967 to 1991. Analog Devices, 1991.

[9] Unitrode Power Supply Design Seminar SEM-1100. Merrimack, NH: Unitrode, 1996.

[10] Unitrode Power Supply Design Seminar SEM-1200. Merrimack, NH: Unitrode, 1997.

[11] Archambeault, Bruce R., PCB Design for Real-World EMI Control . Kluwer Academic Publishers, Boston, 2002.

[12] Bakoglu, H. B., Circuits, Interconnections, and Packaging for VLSI. New York: Addison-Wesley, 1990.

[13] Barnes, John R., Electronics System Design: Interference and Noise Control Techniques. Prentice-Hall, Englewood Cliffs, NJ, 1987.

[14] Barnes, John R., Robust Electronic Design Reference Book, Volumes I and II. Kluwer Academic Publishers, Boston, 2004.

[15] Blankenhorn, James C., PCB Design of High-Speed Digital Circuits . Scotts Valley, CA: SMT Plus, 2002.

[16] Blood, Jr., William R., MECL System Design Handbook, 4th Edition . Motorola Semiconductor Products, 1983.

[17] Bogatin, Eric, Signal Integrity - Simplified. Upper Saddle River, NJ: Prentice-Hall, 2004.

[18] Brooks, Douglas, Signal Integrity Issues and Printed Circuit Board Design. Upper Saddle River, NJ: Prentice Hall PTR, 2003.

[19] Buchanan, James E., BiCMOS/CMOS Systems Design. McGraw-Hill, New York, 1991.

[20] Buchanan, James E., CMOS/TTL Digital Systems Design. McGraw-Hill, New York, 1990.

[21] Buchanan, James E., Signal and Power Integrity in Digital Systems: TTL, CMOS, and BiCMOS. McGraw-Hill, New York, 1996.

[22] Dally, William J., and Poulton, John W., Digital Systems Engineering, Cambridge University Press, Cambridge, UK, 1998.

[23] Deeley, Paul McKnight, Electrolytic Capacitors. Cornell-Dubilier Electric Corp, South Plainfield, NJ, 1938.

[24] Georgiev, Alexander M., The Electrolytic Capacitor. Murray Hill Books, New York, 1945.

[25] Ginsberg, Gerald L., A User's Guide to Selecting Electronic Components. New York: John Wiley & Sons, 1981.

[26] Goedbloed, Jasper, Electromagnetic Compatibility. Prentice-Hall, New York, 1990.

[27] Gore, Gregory V., The Engineer's Master Guide to EMI Control . West Conshohocken, PA: R & B Enterprises, 1986.

[28] Graf, Rudolf F., Electronic Databook, 3rd Edition. Blue Ridge Summit: TAB Books, 1983.

[29] Hall, Stephen H., Hall, Garrett W., and McCall, James A., High-Speed Digital System Design, John Wiley & Sons, New York, 2000.

[30] Harper, Charles A., High Performance Printed Circuit Boards . New York: McGraw-Hill, 2000.

[31] Hartal, Oren, Electromagnetic Compatibility by Design, 4th Edition. West Conshohocken, PA: R & B Enterprizes, 1996.

[32] Hartley, Rick, High Speed Design: A Practical Approach. IPC.

[33] Hayward, Wes, Campbell, Rick, and Larkin, Bob, Experimental Methods in RF Design. Newington, CT: ARRL, 2003.

[34] Johnson, Howard and Graham, Martin, High-Speed Digital Design. Prentice- Hall, Upper Saddle River, NJ, 1993.

[35] Keenan, R. Kenneth, Decoupling and Layout of Digital Printed Circuits. TKC, Pinellas Park, FL, 1985.

[36] Keenan, R. Kenneth, Digital Design for Interference Specifications. TKC, Pinellas Park, FL, 1983.

[37] Keenan, R. Kenneth, FCC/VDE Noise Specifications: Application of Ferrite Beads to Decoupling Printed-Circuit Boards from Backplanes. Pinellas Park, FL: The Keenan Corporation, 1984.

[38] Lenk, John D., Handbook of Simplified Solid-State Circuit Design . Englewood Cliffs, NJ: Prentice-Hall, 1971.

[39] Lenk, John D., Manual for Integrated Circuit Users. Reston, VA: Reston Publishing, 1973.

[40] Lund, Preben, Generation of Precision Artwork for Printed Circuit Boards. New York: John Wiley & Sons, 1978.

[41] Lund, Preben, Printed Circuit Board Precision Artwork Generation and Manufacturing Methods. Westlake Village, CA: Bishop Graphics, 1986.

[42] Mancini, Ron, Op Amps for Everyone, 2nd Edition. New York: Newnes, 2003.

[43] Marcoux, Phil P., Surface Mount Technology: Design for Manufacturability. Dearborn, MI: SME, 1989.

[44] Mardiguian, Michel, Controlling Radiated Emissions by Design 2nd ed., Kluwer, Boston, 2001.

[45] Mardiguian, Michel, Cookbook of EMI Fixes. Gainesville, VA: ICT, 1989.

[46] Mardiguian, Michel, Electromagnetic Control in Components and Devices. Gainesville, VA: Interference Control Technologies, 1988.

[47] Mardiguian, Michel, Interference Control in Computers and Microprocessor- Based Equipment. Don White Consultants, Gainesville, VA, 1984.

[48] Mills, Jeffrey P., Electromagnetic Interference Reduction in Electronic Systems. Englewood Cliffs, NJ: PTR Prentice Hall, 1993.

[49] Montrose, Mark I., EMC and the Printed Circuit Board. IEEE Press, New York, 1999.

[50] Montrose, Mark I., Printed Circuit Board Design Techniques for EMC Compliance. IEEE Press, New York, 1996.

[51] Morris, Robert L., and Miller, John R., Designing with TTL Integrated Circuits. New York: McGraw-Hill, 1971.

[52] Morrison, Ralph, Solving Interference Problems in Electronics . New York: John Wiley & Sons, 1995.

[53] Norris, Bryan, Digital Integrated Circuits and Operational-Amplifier and Optoelectronic Circuit Design. New York: McGraw-Hill, 1976.

[54] O'Hara, Martin, EMC at Component and PCB Level. Boston, MA: Newnes, 1998.

[55] Ott, Henry W., Noise Reduction Techniques in Electronic Systems, 2nd Edition. New York: John Wiley & Sons, 1988.

[56] Ott, Henry W., Noise Reduction Techniques in Electronic Systems. John Wiley & Sons, New York, 1976.

[57] Paul, Clayton R., Introduction to Electromagnetic Compatibility , John Wiley & Sons, New York, 1992.

[58] Poon, Ron K., Computer Circuits Electrical Design, Prentice Hall, Englewood Cliffs, NJ, 1995.

[59] Ritchey, Lee W., Right the First Time: A Practical Hand Book on High Speed PCB and System Design, Volume 1. Speeding Edge, 2003.

[59a] Ritchey, Lee W., Right the First Time: A Practical Handbook on High Speed PCB and System Design, Volume 2. Speeding Edge, 2006.

[60] Ritenour, Bill, and White, Donald, EMI Control in Computers & Microprocessor-Based Equipment. NTU: 1992.

[61] Scarlett, J. A., Transistor-Transistor Logic and Its Interconnections. New York: Van Nostrand Reinhold, 1972.

[62] Sheingold, Daniel H., Transducer Interfacing Handbook: A Guide to Analog Signal Conditioning. Norwood, MA: Analog Devices, 1981.

[63] Shoji, Masakazu, High-Speed Digital Circuits. Reading, MA: Addison-Wesley, 1996.

[64] Smith, Douglas C., High Frequency Measurements and Noise in Electronic Circuits. Van Nostrand Reinhold, New York, 1993.

[65] Stout, David F., and Kaufman, Milton, Handbook of Operational Amplifier Circuit Design. New York: McGraw-Hill, 1976.

[66] Tummala, Rao R., Fundamentals of Microsystems Packaging. New York: McGraw-Hill, 2001.

[67] Ulrich, Richard K., and Schaper, Leonard W., Integrated Passive Component Technology. Piscataway, NJ: IEEE Press, 2003.

[68] Violette, J. L. Norman, White, Donald R. J., and Violette, Michael F., Electromagnetic Compatibility Handbook. New York: Van Nostrand Reinhold, 1987.

[69] Violette, J. L. Norman, Noise Control & Design Considerations in High Performance Electronic Circuits & Systems. Falls Church, VA: Violette Engineering, 1993.

[70] White, Donald R. J., EMI Control in the Design of Printed Circuit Boards and Backplanes. Gainesville, VA: Don White Consultants, 1981.

[71] Williams, Tim, EMC for Product Designers 2nd ed., Newnes, Woburn, MA, 1996.

[72] Young, Brian, Digital Signal Integrity, Prentice Hall, Upper Saddle River, NJ, 2001.

PAPERS, APPLICATION NOTES, MAGAZINE ARTICLES, REPORTS, AND WEB PAGES:

[73] "74C Family Characteristics," Fairchild Semiconductor Application Note 90, Aug. 1973.

[74] "8 Hints for Successful Impedance Measurements," Hewlett-Packard Application Note 346-4.

[75] "8088 8-bit HMOS Microprocessor 8088/8088-2," Intel, Aug. 1990.

[76] "A High Frequency Broadband Filter," Microwave Journal, Sept. 15, 2003.

[77] "A Review of the Literature."

[78] "Above Board," UltraCAD.

[79] "Advances in Surface Mount Filtering Technology," Syfer.

[80] "AMD-K6(R) Processor EMI Design Considerations," AMD Application Note 22023, Mar. 1999.

[81] "AMD-K6(R) Processor Power Supply Design," AMD Application Note 21103, Feb. 1999.

[82] "Application Suggestions for X2Y Technology," X2Y.

[83] "AVX Dielectric Comparison Chart," AVX.

[84] "AVX's OxiCap(TM) Niobium Oxide Capacitors Deliver Cost Effective, Lead-Free Non-Burning High Capacitance Performance," AVX.

[85] "Buried Capacitance," Merix.

[86] "Buried Capacitance Design Guide," Zycon, 1995.

[87] "Buried Capacitance(TM) A Simple Solution," Zycon.

[88] "Bypass Capacitor Selection for High-Speed Designs," Micron Technical Note TN-00-06, Sept. 1999.

[89] "Capacitance Without Capacitors," Hadco, Nov. 23, 1998.

[90] "Capacitor ESR Measurement Techniques," American Technical Ceramics.

[91] "Careful Design Helps Exorcise Noise Demons From PC Audio," Aug. 21, 2000.

[92] "Ceramic Capacitors," Murata.

[93] "Circuit designing cautions (OS-CON)," Sanyo.

[94] "CMOS Power Consumption and Cpd Calculation," Texas Instruments Application Note SCAA035B, June 1997.

[95] "CMOS, the Ideal Logic Family," Fairchild Semiconductor Application Note 77, Jan. 1983.

[96] "Comparison Testing, A Single X2Y Components vs. Three Standard Bulk Capacitors (1) X and (2) Y's, Line to Line testing, Both DUT's Referenced to ground," X2Y.

[97] "Comparison Testing, A Single X2Y Component vs. Three Standard Capacitors (1) X and (2) Y's, Line to Ground and Line to Line Testing," X2Y.

[98] "Construction and Characteristics of OS-CON," Sanyo.

[99] "Crucial Precautions (OS-CON)," Sanyo.

[100] DESIGNERCOUNCIL archives. [101] "Design Considerations," Fairchild Semiconductor, Nov. 1999.

[102] "Design Considerations for Class-D Audio Power Amplifiers," Texas Instruments Application Report SLOA031, Aug. 1999.

[103] "Design Engineers Battle The Dark Side Of Electromagnetism," Dec. 18, 2000.

[104] "Design for EMI," Intel Application Note AP-589, Feb. 1999.

[105] "Designing Fast Response Synchronous Buck Regulators Using the TPS5210," Texas Instruments Application Report SLVA044, Mar. 1999.

[106] "Designing for EMI Compliance - Part 1 Design of the PC Board," 1985-86 Compliance Engineering, 1985, pp. 87-88, 97-110.

[107] "Designing the Input Filter for a Pentium II Processor Converter," Fairchild Application Bulletin AB-16.

[108] "Designing with TTL," Fairchild Semiconductor Application Note 363, June 1984.

[109] "Details of Output Capacitor Selection for Pentium II Process Converters using the RC5051," Fairchild Application Bulletin AB-14.

[110] "Do passive components degrade audio quality in your portable device?," Maxim Engineering Journal, vol. 48, pp. 16-19.

[111] "EEE Parts Derating," NASA Practice no. PD-ED-1201.

[112] "ELNA Chip Aluminum Electrolytic Capacitors Technical Data,"

[113] "Embedded IntelDX2(TM) Processor," Intel, Dec. 1997,

[114] "ESR Loss Factors," American Technical Ceramics.

[115] "FAST(R)/FASTr(TM) Design Considerations," Fairchild Semiconductor Application Note 661, Mar. 1990.

[116] "Film Capacitors Precautions and Guidelines," Nippon Chemi-con.

[117] "Flexible Motherboard Power Distribution and Control for the Pentium(R) III Xeon Processor," Intel Application Note AP-933, Jan. 2000.

[118] "Follow PC-Board Design Guidelines for Lowest CMOS EMI Radiation," Fairchild Semiconductor Application Note 389, Jan. 1985.

[119] "Frequency Characteristics of OS-CON," Sanyo.

[120] "General Routing Techniques with Emphasis on PI6C10X Clocks," Pericom Application Note 8.

[121] "Generating PSpice models for X2Y capacitors from S-parameters," Phycomp Application Note, Jan. 2003.

[121a] "Get the Most from X2Y Capacitors with Proper Attachment Techniques," X2Y Application Note 3008, V1, 2/23/06.

[122] "Guidelines for Printed Circuit Board Design," United Chemi-con.

[123] "HC-MOS Power Dissipation," Fairchild Semiconductor Application Note 303.

[124] "High-Speed-CMOS designs address noise and I/O levels," Fairchild Semiconductor Application Note 375, Oct, 1984.

[125] "High Speed Decoupling Strategy," Hadco, June 23, 1998.

[126] "IBM PowerPC 440GP Embedded Processor PowerPC 440GP System Design Considerations," IBM Application Note.

[127] "Implementation Guidelines for 3.3V Pentium(R) Processors with VRE Specifications for Desktop and Server Designs," Intel Application Note AP-522, June 1997.

[128] "Implementing the RC5040 and RC5042 DC-DC Converters on Pentium(R) Pro Motherboards," Fairchild Application Note 42.

[129] "Implementing the RC5050 and RC5051 DC-DC Converters on Pentium(R) Pro Motherboards," Fairchild Application Note 50.

[130] "Intel386(TM) DX Microprocessor 32-bit CHMOS Microprocessor with Integrated Memory Management," Intel, Dec. 1995.

[131] "Intel486(TM) Processor Family Decoupling Recommendations," Intel.

[132] "Layout and Termination Techniques for Cypress Clock Generators," Cypress.

[133] "Layout Guidelines for the TPA300x Series Parts," Texas Instruments Application Report SLOA103, July 2003.

[134] "Less Noise in High Frequency Circuits."

[135] "Line Driving and System Design," National Semiconductor Application Note 991.

[136] "Logic-System Design Techniques Reduce Switching-CMOS Power," Fairchild Semiconductor Application Note 376, Oct. 1984.

[137] "Low Inductance Chip Capacitors," AVX.

[137a] "Low Inductance Chip Capacitors," AVX.

[137b] "Low Inductance Chip Capacitors," AVX.

[138] "M80C286 High Performance CHMOS Microprocessor with Memory Management and Protection," Intel, Feb. 1990.

[139] "Maintaining Clean Power," UltraCad.

[140] "Microwave Datamate," IFR.

[141] "Mobile AMD-K6(R) Processor Power Supply Design," AMD Application Note 22495, May 1999.

[142] "Mounting precautions (OS-CON)," Sanyo.

[143] "Multilayer Ceramic Capacitors Precautions and Guidelines," Nippon Chemi-con.

[144] "Multilayer Ceramic EMI Filters," Syfer.

[145] "News: CMC Replacements for Tantalum Capacitors."

[146] "Novacap Technical Brochure."

[147] "Omni Review," Omni Graphics, 2000.

[148] "Optimize Power Distribution Analysis In High-Speed System Designs," Nov. 20, 2000.

[149] "Oscilloscope Probing of PC133/Rambus Circuits," Pericom Application Note 21.

[150] "Panasonic Specialty Polymer Aluminum Electrolytic Capacitors (SP CAP)."

[151] "PCB Design Guidelines for Reduced EMI," Texas Instruments SZZA009, Nov. 1999.

[152] "Pentium(R) II Processor at 350MHz, 400MHz, and 450MHz," Intel, Aug. 1998.

[153] "Pentium(R) III Processor for the PGA370 Socket at 500MHz to 866MHz," Intel, Mar. 2000.

[154] "Pentium(R) III Processor Power Distribution Guidelines," Intel Application Note, Apr. 1999.

[155] "Pentium(R) III Xeon(TM) Processor Power Distribution Guidelines," Intel Application Note AP-912, Mar. 1999.

[156] "Pentium(R) Pro Family Developer's Manual, Volume 1: Specifications," Intel, 1996.

[157] "Pentium(R) Pro Processor Power Distribution Guidelines," Intel Application Note AP-523, Nov. 1995.

[158] "Pentium Processor," Intel, June 1997.

[159] "Pentium Processor Flexible Motherboard Design Guidelines," Intel Application Note AP-579, June 1997.

[160] "Pentium Processor with MMX(TM) Technology," Intel, June 1997.

[161] "Pentium(R) Processor With Voltage Reduction Technology: Power Supply Design Considerations for Mobile Systems," Intel Application Note AP-519, June 1997.

[162] "Perfect Timing A Design Guide for Clock Generation and Distribution," Cypress Semiconductor, 2002.

[163] "Piezoelectric Effect in Ceramic Capacitors," American Technical Ceramics.

[164] "Planning for High Speed XC9500XL Designs," Xilinx Application Note XAPP115, Sept. 28, 1998.

[165] "Planning for High Speed XC9500XV Designs," Xilinx Application Note XAPP361, Aug. 8, 2001.

[166] "Power Dissipation in High-Performance ASICs."

[167] "Power Integrity and Ground Bounce Simulation of High Speed PCBs," Ansoft Presentation #11.

[168] "Power Intel's Pentium II Microprocessor using the SC1151CS and the MP60F VRM," Semtech Application Note AN97-1, Mar. 11, 1998.

[169] "Power Supplies for Pentium(TM), PowerPC(TM), and Beyond," Maxim, 2000.

[170] "PowerPC 405GP System Design Considerations," IBM PowerPC Application Note, Feb. 21, 2001.

[171] "PowerPC 750 Design Guidelines," IBM PowerPC Applications Note.

[172] "PowerPC Embedded Processors PowerPC 740/750: Power Notes," IBM Application Note.

[173] "PowerPC Embedded Processors PowerPC 750CXe Family: Power Notes," IBM Application Note.

[174] "Powering Portable CPU Cores," Maxim, 2000.

[175] "Precautions and Guidelines," Nippon Chemi-con.

[176] "Precautions and guidelines for users (OS-CON)," Nippon Chemi-con.

[177] "Precautions and guidelines for users (Tantalum)," Nippon Chemi-con.

[178] "Precautions and Guidelines to Users for Aluminum Electrolytic Capacitors -Index-," Chemi-con.

[179] "Precautions and Guidelines to Users for Multilayer Ceramic Capacitors," Nippon Chemi-con.

[180] "Precautions and Guidelines to Users for Tantalum Electroytic Capacitors," Nippon Chemi-con.

[181] "Precautions in Using Tantalum Capacitors."

[182] "Precautions when using OS-CONs in circuits," Sanyo.

[183] "Preferred Laminates and Prepreg - Materials Properties Comparison," Merix.

[184] "Printed-Circuit-Board Layout for Improved Electromagnetic Compatibility," Texas Instruments SDYA011, Oct. 1996.

[185] "Processor Hall of Fame."

[186] "Protection, Decoupling, and Filtering of Cypress CMOS Circuits," Cypress.

[187] "Reliability Issues."

[188] "Sanyo Frequency Characteristics of OS-CON."

[189] "Sanyo OS-CON ESR Matrix Table."

[190] "SC1154 Hysteretic Controller," Semtech Application Note AN99-6, Mar. 1, 2000.

[191] "Selecting RF Chip Capacitors for Wireless Applications," American Technical Ceramics.

[192] "Shunt Measurement, (1) X2Y vs. (2) Standard Capacitors," X2Y.

[193] "Shunt Measurement X2Y Standard Capacitors," X2Y, Sept. 27, 2003.

[194] "Slot 1 Processor Power Distribution Guidelines," Intel Application Note AP-587, May 1997.

[195] "Solutions to Current High-Speed Board Design," Pericom Application Note 22.

[196] "SP Capacitor Q & A," Panasonic.

[197] "SRAM System Design Guidelines," Cypress Semiconductor, Oct. 25, 2002.

[198] "System design and layout techniques for noise reduction in MCU-based systems," Microprocessors and Microsystems, vol. 20, pp. 303-309, 1996.

[199] "System Power Board Distribution Guidelines for PID9q-604e(TM) (Mach 5)," IBM Application Note AN-022, Sept. 1997.

[200] "Tantalum Capacitors With Solid Electrolyte (Chip Type)," Mectron.

[201] "Tantalum Solid Electrolytic Capacitors Precautions and Guidelines," Nippon Chemi-Con.

[202] "Technical Notes on Aluminum Electrolytic Capacitors," Nichicon Cat. 8101C, June 1999.

[203] "The Buried Capacitance(TM) Design Guide," Hadco 95-06-001, 1995.

[204] "The Bypass Capacitor in High-Speed Environments," Texas Instruments SCBA007A, Nov. 1996.

[205] "The Facts about the Input Impedance of Power and Ground Planes," Sigrity.

[206] "The Feedthrough Varistor a New Weapon Against EMI,"

[207] "Third Generation Power Conversion Solution for Pentium(R) II Motherboards," Fairchild Application Note 57.

[208] "Type ESRE Surface Mount Polymer Aluminum Electrolytic Capacitors."

[209] "Understanding Aluminum Electrolytic Capacitors," United Chemi-con,

[210] "Understanding Buck Power Stages in Switchmode Power Supplies," Texas Instruments Application Report SLVA057, Mar. 1999.

[211] "Unitrode Power Supply Design Seminar, SEM-1100," Unitrode, 1996.

[212] "Using Decoupling Capacitors," Cypress.

[213] "Vertical Orientation of ATC Chip Capacitors on Striplines," American Technical Ceramics.

[214] "Voltage Guidelines for Pentium Processors with MMX Technology," Intel Application Note AP-580, June 1997.

[215] "Voltage Regulator-Down (VRD) 10.0," Intel 252885-001, Apr. 2003.

[216] "VRM 8.1 DC-DC Converter Design Guidelines," Intel 243408-001, May 1997.

[217] "VRM 8.2 DC-DC Converter Design Guidelines," Intel 243773-002, Mar. 1999.

[218] "VRM 8.3 DC-DC Converter Design Guidelines," Intel 243870-004, Mar. 2000.

[219] "VRM 8.4 DC-DC Converter Design Guidelines," Intel 245335-001, Nov. 1999.

[220] "VRM 8.5 DC-DC converter Design Guidelines," Intel 249659-002, Mar. 2002.

[221] "VRM 9.0 DC-DC Converter Design Guidelines," Intel 249205-004, April 2002.

[222] "VRM 9.1 DC-DC Converter Design Guidelines," Intel 298646-001, January 2002.

[223] "X2Y Comparative Decoupling Performance in 4 Layer PCBs," X2Y.

[224] "X2Y Technology: Component Grounding," Application Note 7032001-1.

[225] "X2Y Technology Presentation," X2Y, Oct. 20, 2003.

[225a] Abothu, Isaac Robin, Raj, P. Markondeya, Hwang, Jin Hyun, Kumar, Manish, Iyer, Mahadevan, Yamamoto, Hiroshi, and Tummala, Rao, "Processing, Properties and Electrical Reliability of Embedded Ultra-Thin Film Ceramic Capacitors in Organic Packages," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1014-1018.

[225b] Ahmed, Faisal, and Safdar, Ishtiaq, "Designing for High Layer Count," Printed Circuit Design and Manufacture, vol. 24 no. 4, pp. 22-23, Apr. 2007.

[226] Alexander, John H., Jackson, Dawn A., and Bush, Eric L., "The Preparation and Properties of 4.7 uF 2220 Size 50 V Z5U Relaxor Multilayer Ceramic Capacitors," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-9, no. 4, pp. 464-468, Dec. 1986.

[227] Alexander, Mark, "Power Distribution System (PDS) Design: Using Bypass/Decoupling Capacitors," Xilinx Application Note XAPP623, Aug. 8, 2002.

[228] Alexander, Mark, "Power Distribution System (PDS) Design: Using Bypass/Decoupling Capacitors," Xilinx Application Note XAPP623 V2.0, Apr. 5, 2004.

[228a] Ali, Syed W., "10+ Gb/second Signal Considerations," Printed Circuit Design and Manufacture, vol. 24 no. 5, pp. 16-18, May 2007.

[229] Amorese. Gregory L., "Developing Sophisticated Models for Capacitors, Inductors and other Passive Components," Microwave Journal, vol. 46, no. 3, pp. 120-125, Mar. 2003.

[230] Amorese, Gregory L., "Reducing ESD Measurement Errors," Microwaves & RF, vol. 42, no. 4, pp. 75-80, Apr. 2003.

[231] Andresakis, John, Pramanik, Pranabes, Brandler, Daniel, and Nong, Dong, "Novel Substrate with Combined Embedded Capacitance and Resistance for Better Electrical Performance and Higher Integration," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1544-1547.

[232] Andresakis, John, Yamamoto, Takuya, Pramanik, Pranabes, and Buinno, Nick, "Performance of Polymeric Ultra-thin Substrates for use as Embedded Capacitors: Comparison of Unfilled and Filled Systems with Ferroelectric Particles," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S39-1-1-S39-1-8.

[233] Andresakis, John, Yamazaki, Kazuhiro, Kuwako, Fujio, and Fukawa, Yoshi, "Simulation Tools Speed the Design of Embedded Capacitance Layers," Printed Circuit Design and Manufacture, vol. 23 no. 12, pp. 24-29, Dec. 2006.

[234] Andresakis, John, Yamamoto, Takuya, Pramanik, Pranabes, Brandler, Daniel, and Nong, Dong, "Substrate with Combined Embedded Capacitance and Resistance for Better Electrical Performance and Higher Integration," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S22-02-1-S22-02-6.

[235] Ang, Simon S., and Brown, W. D., "Tantalum Oxide Dielectric for Embedded Capacitor Applications," Proceedings of the 6th International Conference on Properties and Applications of Dielectric Materials, Volume 2, Xi'an, China, June 21-26, 2000, pp. 841-844.

[236] Anthony, David J., "Alternative X2Y Component Attachment for Power Filtering," X2Y, Dec. 23, 2003.

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[547] Johnson, Howard, "Benefits of Resistive Probe," High-Speed Digital Design On-Line Newsletter, vol. 5, issue 4.

[548] Johnson, Howard, "Bypass Array Model," High-Speed Digital Design On-Line Newsletter, vol. 6, issue 2.

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[551] Johnson, Howard, "Bypass Capacitor Layout," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 3.

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[554] Johnson, Howard, "Capacitor Placement," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 1.

[555] Johnson, Howard, "Clean Power," EDN, vol. 45, no. 16, pp. 32, Aug. 3, 2000.

[556] Johnson, Howard, "Earth Ground," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 12.

[557] Johnson, Howard, "EMC/Signal Integrity for High-Speed Digital Circuits," Aug 2, 1999.

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[563] Johnson, Howard, "Healthy Power," EDN, vol. 45, no. 7, pp. 32, Mar. 30, 2000.

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