dBi Corporation

Please note: renumbered references on May 28, 2011, because added over 725 documents in the last 2 years (went from 1848 to 2579 items).

We can ensure that our electronic circuits will operate consistently and reliably by:

• Designing the circuits to properly handle:
  • Normal operating conditions.
  • Start-up.
  • Termination/shut-down.
  • Unusual/abnormal operating conditions.
• Providing properly-timed input signals even under worst-case conditions.
• Providing "clean enough" input signals even under worst-case conditions (Signal Integrity, SI).
• Providing "clean enough" power even under worst-case conditions (Power Integrity, PI).

A lack of Power Integrity can cause an electronic system to:

• Randomly crash or malfunction in the lab, making hardware and software development/ testing/ qualification/ certification much more difficult and expensive, and stretching out the development process.
• Emit excessive Radiated and Conducted Emissions, making it illegal to sell the product--or even to use the product/ equipment if it interferes with other parties--unless we add expensive shielding and filtering.
• Be very sensitive to external electrical noise, making it illegal to sell the product in Europe unless we add expensive shielding and filtering.
• Randomly crash or malfunction in normal use or foreseeable misuse, frustrating users and operators, and perhaps causing:
  • Operating delays and increased operating costs.
  • Increased warranty and service costs.
  • Aborted missions.
  • Property damage.
  • Injury to people and animals.
  • Death.
  • Expensive lawsuits for the companies that manufacture, install, maintain, and use the product/ equipment.

My first book, Electronics System Design: Interference and Noise Control Techniques (Prentice-Hall, Englewood Cliffs, NJ, 1987) discusses Power Integrity under analog and digital circuit design in:

• Chapter 5, Designing Analog Circuits.
• Chapter 6, Designing Digital Circuits.

My second and third books, Robust Electronic Design Reference Book, Volumes I and II, were published by Kluwer Academic Publishers (now part of Springer) in Mar. 2004. They discuss Power Integrity in great detail in:

• Chapter 8, Capacitors.
• Chapter 10, EMC Ferrites.
• Chapter 20, Integrated Circuits.
• Chapter 24, Designing Power Supply Circuits.
• Chapter 28, Bypassing, Decoupling, and Power Distribution.
• Chapter 31, Designing Printed Circuit Boards.
• Chapter 32, Designing Cables and Backplanes.
• Chapter 35, Filtering.
• Chapter 40, Finding and Fixing Problems.
• Chapter 42, Lab Tests.
• Chapter 44, Approval Testing.
• Appendix G, Important Properties of Printed Circuit Boards, Hybrid Modules, Flat Cables, and Busbars.

BOOKS:

[2] Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques, IPC-D-317A. IPC, Northbrook, IL, 1995.

[3] Handbook of EC EMC Compliance. Boxborough, MA: Compliance Design, 1993.

[4] Handbook of EU EMC Compliance. Boxborough, MA: Compliance Design, 1995.

[5] Handbook of EU EMC Compliance. Boxborough, MA: Compliance Design, 1996.

[6] Practical Design Techniques for Power and Thermal Management . Norwood, MA: Analog Devices, 1998.

[7] Signal Integrity Issues in PCB Design. Bellevue, WA: UltraCAD Design, 2002.

[8] The Best of Analog Dialogue 1967 to 1991. Analog Devices, 1991.

[9] Unitrode Power Supply Design Seminar SEM-1100. Merrimack, NH: Unitrode, 1996.

[10] Unitrode Power Supply Design Seminar SEM-1200. Merrimack, NH: Unitrode, 1997.

[11] Archambeault, Bruce R., PCB Design for Real-World EMI Control . Kluwer Academic Publishers, Boston, 2002.

[12] Bakoglu, H. B., Circuits, Interconnections, and Packaging for VLSI. New York: Addison-Wesley, 1990.

[13] Barnes, John R., Electronics System Design: Interference and Noise Control Techniques. Prentice-Hall, Englewood Cliffs, NJ, 1987.

[14] Barnes, John R., Robust Electronic Design Reference Book, Volumes I and II. Kluwer Academic Publishers, Boston, 2004.

[15] Blankenhorn, James C., PCB Design of High-Speed Digital Circuits . Scotts Valley, CA: SMT Plus, 2002.

[16] Blood, Jr., William R., MECL System Design Handbook, 4th Edition . Motorola Semiconductor Products, 1983.

[17] Bogatin, Eric, Signal Integrity - Simplified. Upper Saddle River, NJ: Prentice-Hall, 2004.

[117d] Bogatin, Eric, Signal and Power Integrity - Simplified (2nd Edition). Boston, MA: Prentice Hall, 2010. ISBN 978-0-13-234979-6. $109.00 list price.

[18] Brooks, Douglas, Signal Integrity Issues and Printed Circuit Board Design. Upper Saddle River, NJ: Prentice Hall PTR, 2003.

[19] Buchanan, James E., BiCMOS/CMOS Systems Design. McGraw-Hill, New York, 1991.

[20] Buchanan, James E., CMOS/TTL Digital Systems Design. McGraw-Hill, New York, 1990.

[21] Buchanan, James E., Signal and Power Integrity in Digital Systems: TTL, CMOS, and BiCMOS. McGraw-Hill, New York, 1996.

[22] Dally, William J., and Poulton, John W., Digital Systems Engineering, Cambridge University Press, Cambridge, UK, 1998.

[23] Deeley, Paul McKnight, Electrolytic Capacitors. Cornell-Dubilier Electric Corp, South Plainfield, NJ, 1938.

[24] Georgiev, Alexander M., The Electrolytic Capacitor. Murray Hill Books, New York, 1945.

[25] Ginsberg, Gerald L., A User's Guide to Selecting Electronic Components. New York: John Wiley & Sons, 1981.

[26] Goedbloed, Jasper, Electromagnetic Compatibility. Prentice-Hall, New York, 1990.

[27] Gore, Gregory V., The Engineer's Master Guide to EMI Control . West Conshohocken, PA: R & B Enterprises, 1986.

[28] Graf, Rudolf F., Electronic Databook, 3rd Edition. Blue Ridge Summit: TAB Books, 1983.

[29] Hall, Stephen H., Hall, Garrett W., and McCall, James A., High-Speed Digital System Design, John Wiley & Sons, New York, 2000.

[30] Harper, Charles A., High Performance Printed Circuit Boards . New York: McGraw-Hill, 2000.

[31] Hartal, Oren, Electromagnetic Compatibility by Design, 4th Edition. West Conshohocken, PA: R & B Enterprizes, 1996.

[32] Hartley, Rick, High Speed Design: A Practical Approach. IPC.

[33] Hayward, Wes, Campbell, Rick, and Larkin, Bob, Experimental Methods in RF Design. Newington, CT: ARRL, 2003.

[34] Johnson, Howard and Graham, Martin, High-Speed Digital Design. Prentice- Hall, Upper Saddle River, NJ, 1993.

[35] Keenan, R. Kenneth, Decoupling and Layout of Digital Printed Circuits. TKC, Pinellas Park, FL, 1985.

[36] Keenan, R. Kenneth, Digital Design for Interference Specifications. TKC, Pinellas Park, FL, 1983.

[37] Keenan, R. Kenneth, FCC/VDE Noise Specifications: Application of Ferrite Beads to Decoupling Printed-Circuit Boards from Backplanes. Pinellas Park, FL: The Keenan Corporation, 1984.

[38] Lenk, John D., Handbook of Simplified Solid-State Circuit Design . Englewood Cliffs, NJ: Prentice-Hall, 1971.

[39] Lenk, John D., Manual for Integrated Circuit Users. Reston, VA: Reston Publishing, 1973.

[40] Lund, Preben, Generation of Precision Artwork for Printed Circuit Boards. New York: John Wiley & Sons, 1978.

[41] Lund, Preben, Printed Circuit Board Precision Artwork Generation and Manufacturing Methods. Westlake Village, CA: Bishop Graphics, 1986.

[42] Mancini, Ron, Op Amps for Everyone, 2nd Edition. New York: Newnes, 2003.

[43] Marcoux, Phil P., Surface Mount Technology: Design for Manufacturability. Dearborn, MI: SME, 1989.

[44] Mardiguian, Michel, Controlling Radiated Emissions by Design 2nd ed., Kluwer, Boston, 2001.

[45] Mardiguian, Michel, Cookbook of EMI Fixes. Gainesville, VA: ICT, 1989.

[46] Mardiguian, Michel, Electromagnetic Control in Components and Devices. Gainesville, VA: Interference Control Technologies, 1988.

[47] Mardiguian, Michel, Interference Control in Computers and Microprocessor- Based Equipment. Don White Consultants, Gainesville, VA, 1984.

[47d] Mezhiba, Andrey V., and Friedman, Eby G., Power Distribution Networks in High Speed Integrated Circuits. Boston, MA: Kluwer Academic Publishers, 2004. ISBN: 1-4020-7534-0. $179.00 list price.

[48] Mills, Jeffrey P., Electromagnetic Interference Reduction in Electronic Systems. Englewood Cliffs, NJ: PTR Prentice Hall, 1993.

[49] Montrose, Mark I., EMC and the Printed Circuit Board. IEEE Press, New York, 1999.

[50] Montrose, Mark I., Printed Circuit Board Design Techniques for EMC Compliance. IEEE Press, New York, 1996.

[51] Morris, Robert L., and Miller, John R., Designing with TTL Integrated Circuits. New York: McGraw-Hill, 1971.

[52] Morrison, Ralph, Solving Interference Problems in Electronics . New York: John Wiley & Sons, 1995.

[53] Norris, Bryan, Digital Integrated Circuits and Operational-Amplifier and Optoelectronic Circuit Design. New York: McGraw-Hill, 1976.

[54] Novak, Istvan, and Miller, Jason R., Frequency-Domain Characterization of Power Distribution Networks. Boston, MA: Artech House, 2007.

[55] Novak, Istvan, Power Distribution Network Design Methodologies . Chicago, IL: International Engineering Consortium, 2008.

[56] O'Hara, Martin, EMC at Component and PCB Level. Boston, MA: Newnes, 1998.

[57] Ott, Henry W., Noise Reduction Techniques in Electronic Systems, 2nd Edition. New York: John Wiley & Sons, 1988.

[58] Ott, Henry W., Noise Reduction Techniques in Electronic Systems. John Wiley & Sons, New York, 1976.

[59] Paul, Clayton R., Introduction to Electromagnetic Compatibility , John Wiley & Sons, New York, 1992.

[60] Poon, Ron K., Computer Circuits Electrical Design, Prentice Hall, Englewood Cliffs, NJ, 1995.

[61] Ritchey, Lee W., Right the First Time: A Practical Hand Book on High Speed PCB and System Design, Volume 1. Speeding Edge, 2003.

[62] Ritchey, Lee W., Right the First Time: A Practical Handbook on High Speed PCB and System Design, Volume 2. Speeding Edge, 2006.

[63] Ritenour, Bill, and White, Donald, EMI Control in Computers & Microprocessor-Based Equipment. NTU: 1992.

[64] Scarlett, J. A., Transistor-Transistor Logic and Its Interconnections. New York: Van Nostrand Reinhold, 1972.

[65] Sheingold, Daniel H., Transducer Interfacing Handbook: A Guide to Analog Signal Conditioning. Norwood, MA: Analog Devices, 1981.

[66] Shoji, Masakazu, High-Speed Digital Circuits. Reading, MA: Addison-Wesley, 1996.

[67] Smith, Douglas C., High Frequency Measurements and Noise in Electronic Circuits. Van Nostrand Reinhold, New York, 1993.

[68] Stout, David F., and Kaufman, Milton, Handbook of Operational Amplifier Circuit Design. New York: McGraw-Hill, 1976.

[69] Tummala, Rao R., Fundamentals of Microsystems Packaging. New York: McGraw-Hill, 2001.

[70] Ulrich, Richard K., and Schaper, Leonard W., Integrated Passive Component Technology. Piscataway, NJ: IEEE Press, 2003.

[71] Violette, J. L. Norman, White, Donald R. J., and Violette, Michael F., Electromagnetic Compatibility Handbook. New York: Van Nostrand Reinhold, 1987.

[72] Violette, J. L. Norman, Noise Control & Design Considerations in High Performance Electronic Circuits & Systems. Falls Church, VA: Violette Engineering, 1993.

[73] White, Donald R. J., EMI Control in the Design of Printed Circuit Boards and Backplanes. Gainesville, VA: Don White Consultants, 1981.

[74] Williams, K. Barry A., Designing Power Distribution Systems for Electronic Circuits. Duxbury, MA: Aikman Engineering, 2005. ISBN 0-9760391-0-9.

[75] Williams, Tim, EMC for Product Designers 2nd ed., Newnes, Woburn, MA, 1996.

[76] Young, Brian, Digital Signal Integrity, Prentice Hall, Upper Saddle River, NJ, 2001.

THESES:

[77] Choi, Myoung Joon, Efficient Broadband Electromagnetic Modeling of the Power Distribution Network in High-Speed, Mixed-Signal Integrated Circuits. Ph. D. Thesis for University of Illinois at Urbana-Champaign, Urbana-Champaign, IL, 2004.

[78] Mandrekar, Rohan, Modeling and Co-simulation of Signal Distribution and Power Delivery in Packaged Digital Systems. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, May 2006.

[79] Muthana, Prathap K., Design of High Speed Packages and Boards Using Embedded Decoupling Capacitors, Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, 2007.

[80] Na, Nanju, Modeling and Simulation of Planes in Electronic Packages. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Jan. 2001.

[81] Selli, Giuseppe, BGA Footprints Modeling and Physics Based Via Models Validation for Power and signal Integrity Applications. Ph. D. Thesis for University of Missouri - Rolla, Rolla, MS, 2007.

[82] Wang, Wei, Parameter Extraction for Electronic Packaging and Decoupling Methodology for Power Delivery Systems. Ph. D. Thesis for University of California, Santa Cruz, CA, Sept. 2003.

PAPERS, APPLICATION NOTES, MAGAZINE ARTICLES, REPORTS, AND WEB PAGES:

[82d] "(2) Circuits - Only (1) X2Y."

[83] "74C Family Characteristics," Fairchild Semiconductor Application Note 90, Aug. 1973.

[84] "8 Hints for Successful Impedance Measurements," Hewlett-Packard Application Note 346-4.

[85] "8088 8-bit HMOS Microprocessor 8088/8088-2," Intel, Aug. 1990.

[86] "A High Frequency Broadband Filter," Microwave Journal, Sept. 15, 2003.

[87] "A Review of the Literature."

[87d] "A call to action: Establishing performance metrics for supercapacitors," American Ceramic Society Bulletin, vol. 91 no. 1, pp. 14, Jan./Feb. 2012.

[88] "Above Board," UltraCAD.

[89] "Advances in Surface Mount Filtering Technology," Syfer.

[89d] "Airbrush-Fabricated Carbon Nanotube Supercapacitor Electrodes," Defense Tech Briefs, vol. 5 no. 1, pp. 13-14, Feb. 2011.

[89h] "Alternative X2Y Component Attachment for Power Filtering," X2Y, Dec. 23, 2003.

[90] "AMD-K6(R) Processor EMI Design Considerations," AMD Application Note 22023, Mar. 1999.

[91] "AMD-K6(R) Processor Power Supply Design," AMD Application Note 21103, Feb. 1999.

[92] "Application Suggestions for X2Y Technology," X2Y.

[93] "AVX Dielectric Comparison Chart," AVX.

[94] "AVX's OxiCap(TM) Niobium Oxide Capacitors Deliver Cost Effective, Lead-Free Non-Burning High Capacitance Performance," AVX.

[95] "Best Board Design Practices for the Power Distribution Network (PDN)," Altera, 2006.

[96] "Buried Capacitance," Merix.

[97] "Buried Capacitance Design Guide," Zycon, 1995.

[98] "Buried Capacitance(TM) A Simple Solution," Zycon.

[99] "Bypass Capacitor Selection for High-Speed Designs," Micron Technical Note TN-00-06, Sept. 1999.

[100] "Capacitance Without Capacitors," Hadco, Nov. 23, 1998.

[101] "Capacitor ESR Measurement Techniques," American Technical Ceramics.

[102] "Careful Design Helps Exorcise Noise Demons From PC Audio," Aug. 21, 2000.

[103] "Ceramic Capacitors," Murata.

[104] "Circuit designing cautions (OS-CON)," Sanyo.

[105] "CMOS Power Consumption and Cpd Calculation," Texas Instruments Application Note SCAA035B, June 1997.

[106] "CMOS, the Ideal Logic Family," Fairchild Semiconductor Application Note 77, Jan. 1983.

[107] "Comparative Device-Only Measurements of X2Y, Arrays and Ordinary Capacitors," X2Y, Feb. 24, 2006.

[108] "Comparison Testing, A Single X2Y Components vs. Three Standard Bulk Capacitors (1) X and (2) Y's, Line to Line testing, Both DUT's Referenced to ground," X2Y.

[109] "Comparison Testing, A Single X2Y Component vs. Three Standard Capacitors (1) X and (2) Y's, Line to Ground and Line to Line Testing," X2Y.

[110] "Construction and Characteristics of OS-CON," Sanyo.

[111] "Crucial Precautions (OS-CON)," Sanyo.

[112] "Curved graphene sheets: Source of ultrahigh energy density supercapacitor?," American Ceramic Society Bulletin, vol. 90 no. 2, pp. 19, Mar. 2011.

[112d] "DC-to-DC Converters using X2Y Technology," X2Y, Dec. 3, 2003.

[113] "DC-To-DC Converters using X2Y Technology," X2Y Note# 2009, V3.0, Apr. 28, 2005.

[113d] "Decoupling Multiple Power Planes," X2Y, Dec. 23, 2003.

[114] DESIGNERCOUNCIL archives. [115] "Design Considerations," Fairchild Semiconductor, Nov. 1999.

[116] "Design Considerations for Class-D Audio Power Amplifiers," Texas Instruments Application Report SLOA031, Aug. 1999.

[117] "Design Engineers Battle The Dark Side Of Electromagnetism," Dec. 18, 2000.

[118] "Design for EMI," Intel Application Note AP-589, Feb. 1999.

[119] "Designing Fast Response Synchronous Buck Regulators Using the TPS5210," Texas Instruments Application Report SLVA044, Mar. 1999.

[120] "Designing for EMI Compliance - Part 1 Design of the PC Board," 1985-86 Compliance Engineering, 1985, pp. 87-88, 97-110.

[121] "Designing the Input Filter for a Pentium II Processor Converter," Fairchild Application Bulletin AB-16.

[122] "Designing with TTL," Fairchild Semiconductor Application Note 363, June 1984.

[123] "Details of Output Capacitor Selection for Pentium II Process Converters using the RC5051," Fairchild Application Bulletin AB-14.

[124] "Do passive components degrade audio quality in your portable device?," Maxim Engineering Journal, vol. 48, pp. 16-19.

[124d] "Does fast firing of multilayer ceramic capacitors help or hinder?," American Ceramic Society Bulletin, vol. 90 no. 9, pp. 19, Dec. 2011.

[125] "EEE Parts Derating," NASA Practice no. PD-ED-1201.

[125d] "Electrochemical Ultracapacitors Using Graphite Nanostacks," NASA Tech Briefs, vol. 36 no. 5, pp. 60, May 2012.

[126] "Electromagnetic Analysis of Decoupling Capacitor Mounting Structures with Sembeor," Simbeor Applications Note #2008_01, Mar. 2008.

[127] "ELNA Chip Aluminum Electrolytic Capacitors Technical Data,"

[128] "Embedded IntelDX2(TM) Processor," Intel, Dec. 1997,

[129] "EMC Improvement Guidelines," Atmel Application Note, Rev. 4279B-8051-08/03, Aug. 2003.

[130] "ESR Loss Factors," American Technical Ceramics.

[131] "FAST(R)/FASTr(TM) Design Considerations," Fairchild Semiconductor Application Note 661, Mar. 1990.

[131d] Anthony, David J., "Ferrite Bead Removal," X2Y, July 2, 2003.

[132] "Film Capacitors Precautions and Guidelines," Nippon Chemi-con.

[133] "Flexible Motherboard Power Distribution and Control for the Pentium(R) III Xeon Processor," Intel Application Note AP-933, Jan. 2000.

[134] "Follow PC-Board Design Guidelines for Lowest CMOS EMI Radiation," Fairchild Semiconductor Application Note 389, Jan. 1985.

[135] "Frequency Characteristics of OS-CON," Sanyo.

[136] "General Routing Techniques with Emphasis on PI6C10X Clocks," Pericom Application Note 8.

[136d] "General Testing Rules for X2Y Units."

[137] "Generating PSpice models for X2Y capacitors from S-parameters," Phycomp Application Note, Jan. 2003.

[138] "Get the Most from X2Y Capacitors with Proper Attachment Techniques," X2Y Application Note 3008, V1, 2/23/06.

[139] "Guidelines for Printed Circuit Board Design," United Chemi-con.

[140] "HC-MOS Power Dissipation," Fairchild Semiconductor Application Note 303.

[141] "High-Speed Board Design Advisor: Power Distribution Network," Altera Tecnical Brief TB-092-1.0, Ver. 1.0, Nov. 2007.

[142] "High-Speed-CMOS designs address noise and I/O levels," Fairchild Semiconductor Application Note 375, Oct, 1984.

[143] "High Speed Decoupling Strategy," Hadco, June 23, 1998.

[144] "IBM PowerPC 440GP Embedded Processor PowerPC 440GP System Design Considerations," IBM Application Note.

[144d] "IC Decoupling and EMI Suppression using X2Y Technology," X2Y, Dec. 12, 2003.

[145] "Implementation Guidelines for 3.3V Pentium(R) Processors with VRE Specifications for Desktop and Server Designs," Intel Application Note AP-522, June 1997.

[146] "Implementing the RC5040 and RC5042 DC-DC Converters on Pentium(R) Pro Motherboards," Fairchild Application Note 42.

[147] "Implementing the RC5050 and RC5051 DC-DC Converters on Pentium(R) Pro Motherboards," Fairchild Application Note 50.

[148] "Intel386(TM) DX Microprocessor 32-bit CHMOS Microprocessor with Integrated Memory Management," Intel, Dec. 1995.

[149] "Intel486(TM) Processor Family Decoupling Recommendations," Intel.

[149d] "Internal Model of X2Y," X2Y, Sept. 2, 2003.

[150] "Layout and Termination Techniques for Cypress Clock Generators," Cypress.

[151] "Layout Guidelines for the TPA300x Series Parts," Texas Instruments Application Report SLOA103, July 2003.

[152] "Less Noise in High Frequency Circuits."

[153] "Line Driving and System Design," National Semiconductor Application Note 991.

[154] "Logic-System Design Techniques Reduce Switching-CMOS Power," Fairchild Semiconductor Application Note 376, Oct. 1984.

[155] "Low Inductance Chip Capacitors," AVX.

[156] "Low Inductance Chip Capacitors," AVX.

[157] "Low Inductance Chip Capacitors," AVX.

[158] "M80C286 High Performance CHMOS Microprocessor with Memory Management and Protection," Intel, Feb. 1990.

[159] "Maintaining Clean Power," UltraCad.

[160] "Measurement and Comparative S21 Performance of Raw and Mounted Decoupling Capacitors," X2Y Note# 3006, V2, Apr. 24, 2007.

[160d] "Metal Disk Test Module for X2Y Capacitor Units."

[161] "Micro-supercapacitor has remarkable properties," Advanced Materials & Processes, vol. 168 no. 10, pp. 19, Oct. 2010.

[162] "Microwave Datamate," IFR.

[163] "Mobile AMD-K6(R) Processor Power Supply Design," AMD Application Note 22495, May 1999.

[164] "Mounting precautions (OS-CON)," Sanyo.

[165] "Multilayer Ceramic Capacitors Precautions and Guidelines," Nippon Chemi-con.

[166] "Multilayer Ceramic EMI Filters," Syfer.

[167] "New and Lower ESR Capabilities in Polymer Products," Arrow Asian Times, July 2003.

[167d] "New! X2Y Dual Line Chip."

[168] "News: CMC Replacements for Tantalum Capacitors."

[169] "Novacap Technical Brochure."

[170] "Novel Method toward Designing Supercapacitor Electrodes," Advanced Manufacturing Technology, vol. 31 no. 4, pp. 4, April 15, 2010.

[171] "Omni Review," Omni Graphics, 2000.

[172] "Optimize Power Distribution Analysis In High-Speed System Designs," Nov. 20, 2000.

[173] "Oscilloscope Probing of PC133/Rambus Circuits," Pericom Application Note 21.

[174] "Panasonic Specialty Polymer Aluminum Electrolytic Capacitors (SP CAP)."

[174d] "PCB Design for TDR Testing."

[175] "PCB Design Guidelines for Reduced EMI," Texas Instruments SZZA009, Nov. 1999.

[176] "Pentium(R) II Processor at 350MHz, 400MHz, and 450MHz," Intel, Aug. 1998.

[177] "Pentium(R) III Processor for the PGA370 Socket at 500MHz to 866MHz," Intel, Mar. 2000.

[178] "Pentium(R) III Processor Power Distribution Guidelines," Intel Application Note, Apr. 1999.

[179] "Pentium(R) III Xeon(TM) Processor Power Distribution Guidelines," Intel Application Note AP-912, Mar. 1999.

[180] "Pentium(R) Pro Family Developer's Manual, Volume 1: Specifications," Intel, 1996.

[181] "Pentium(R) Pro Processor Power Distribution Guidelines," Intel Application Note AP-523, Nov. 1995.

[182] "Pentium Processor," Intel, June 1997.

[183] "Pentium Processor Flexible Motherboard Design Guidelines," Intel Application Note AP-579, June 1997.

[184] "Pentium Processor with MMX(TM) Technology," Intel, June 1997.

[185] "Pentium(R) Processor With Voltage Reduction Technology: Power Supply Design Considerations for Mobile Systems," Intel Application Note AP-519, June 1997.

[186] "Perfect Timing A Design Guide for Clock Generation and Distribution," Cypress Semiconductor, 2002.

[187] "Piezoelectric Effect in Ceramic Capacitors," American Technical Ceramics.

[188] "Planning for High Speed XC9500XL Designs," Xilinx Application Note XAPP115, Sept. 28, 1998.

[189] "Planning for High Speed XC9500XV Designs," Xilinx Application Note XAPP361, Aug. 8, 2001.

[190] "Power Dissipation in High-Performance ASICs."

[191] "Power Integrity and Ground Bounce Simulation of High Speed PCBs," Ansoft Presentation #11.

[192] "Power Intel's Pentium II Microprocessor using the SC1151CS and the MP60F VRM," Semtech Application Note AN97-1, Mar. 11, 1998.

[193] "Power Supplies for Pentium(TM), PowerPC(TM), and Beyond," Maxim, 2000.

[194] "PowerPC 405GP System Design Considerations," IBM PowerPC Application Note, Feb. 21, 2001.

[195] "PowerPC 750 Design Guidelines," IBM PowerPC Applications Note.

[196] "PowerPC Embedded Processors PowerPC 740/750: Power Notes," IBM Application Note.

[197] "PowerPC Embedded Processors PowerPC 750CXe Family: Power Notes," IBM Application Note.

[198] "Powering Portable CPU Cores," Maxim, 2000.

[199] "Precautions and Guidelines," Nippon Chemi-con.

[200] "Precautions and guidelines for users (OS-CON)," Nippon Chemi-con.

[201] "Precautions and guidelines for users (Tantalum)," Nippon Chemi-con.

[202] "Precautions and Guidelines to Users for Aluminum Electrolytic Capacitors -Index-," Chemi-con.

[203] "Precautions and Guidelines to Users for Multilayer Ceramic Capacitors," Nippon Chemi-con.

[204] "Precautions and Guidelines to Users for Tantalum Electroytic Capacitors," Nippon Chemi-con.

[205] "Precautions in Using Tantalum Capacitors."

[206] "Precautions when using OS-CONs in circuits," Sanyo.

[207] "Preferred Laminates and Prepreg - Materials Properties Comparison," Merix.

[208] "Printed-Circuit-Board Layout for Improved Electromagnetic Compatibility," Texas Instruments SDYA011, Oct. 1996.

[209] "Processor Hall of Fame."

[210] "Protection, Decoupling, and Filtering of Cypress CMOS Circuits," Cypress.

[211] "Reliability Issues."

[211d] "Replacing Feedthrough Capacitors with X2Y Technology," X2Y, Jan. 5, 2004.

[211h] "RF Filtering for Audio Amplifier Circuits," X2Y, May 9. 2003.

[212] "Sanyo Frequency Characteristics of OS-CON."

[213] "Sanyo OS-CON ESR Matrix Table."

[214] "SC1154 Hysteretic Controller," Semtech Application Note AN99-6, Mar. 1, 2000.

[215] "Selecting RF Chip Capacitors for Wireless Applications," American Technical Ceramics.

[216] "Shunt Measurement, (1) X2Y vs. (2) Standard Capacitors," X2Y.

[217] "Shunt Measurement X2Y Standard Capacitors," X2Y, Sept. 27, 2003.

[218] "Slot 1 Processor Power Distribution Guidelines," Intel Application Note AP-587, May 1997.

[219] "Solutions to Current High-Speed Board Design," Pericom Application Note 22.

[220] "SP Capacitor Q & A," Panasonic.

[220d] "Squib Carrier Double Sided."

[220h] "Squib filter."

[221] "SRAM System Design Guidelines," Cypress Semiconductor, Oct. 25, 2002.

[222] "Supercapacitor development improves energy retention," Dataweek , pp. xx-xx, May 27, 2009.

[223] "Supercapacitor Electrolyte Solvents With Liquid Range Below -80 °C," NASA Tech Briefs, vol. 34 no. 1, pp. 44, Jan. 2010.

[223d] "Surface Count Ceramic Capacitors."

[224] "System design and layout techniques for noise reduction in MCU-based systems," Microprocessors and Microsystems, vol. 20, pp. 303-309, 1996.

[225] "System Power Board Distribution Guidelines for PID9q-604e(TM) (Mach 5)," IBM Application Note AN-022, Sept. 1997.

[226] "Tantalum Capacitors With Solid Electrolyte (Chip Type)," Mectron.

[227] "Tantalum Solid Electrolytic Capacitors Precautions and Guidelines," Nippon Chemi-Con.

[228] "Technical Notes on Aluminum Electrolytic Capacitors," Nichicon Cat. 8101C, June 1999.

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[1077] Hyun, Jin-Gul, Lee, Sangyong, and Paik, Kyung-Wook, "Fabrication and characterization of Epoxy/BaTiO3 composite capacitor films for high frequency behaviors," 9th International Conference on Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007, pp. xx-xx.

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[1080] Hyun, Kyung-Hoon, Lee, Sangkyu, Cho, Chae-Woong, Paik, Ungyu, Kim, Dae-Hwan, Na, Eun-Sang, and Park, Jea-Gun, "Improvement in the volume efficiency of multilayered ceramic capacitors (MLCCs)," Journal of Electroceramics, vol. 17 no. 2-4, pp. 351-354, Dec. 2006.

[1080d] Ianculescu, A., Mocanu, Z. V., Curecheriu, L. P., Mitoseriu, L., Padurariu, L., and Trusca, R., "Dielectric and tunability properties of La-doped BaTiO3 ceramics," Journal of Alloys and Compounds, vol. xxx no. xx, pp. xx-xx, xxxx.

[1080h] Ichiki, Masaaki, Iimura, Keita, Hosono, Toshifumi, Kuroki, Keisuke, Tomioka, Fumiaki, Suga, Tadatomo, Maeda, Ryutaro, and Itoh, Toshihiro, "Preparation of ferroelectric capacitor films onto the releasable substrate and its application to nano-transfer method," 2010 IEEE CPMT Symposium Japan, Tokyo, Japan, Aug. 24-26, 2010, pp. xx-xx.

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[1084] Ihlefeld, Jon, Laughlin, Brian, Hunt-Lowery, Alisa, Borland, William, Kingon, Angus, and Maria, Jon-Paul, "Copper Compatible Barium Titanate Thin Films for Embedded Passives," Journal of Electroceramics, vol. 14 no. 2, pp. 95-102, Mar. 2005.

[1085] Ikeda, Ken-ichi, Tsumagari, Ken-ichirou, Yoshida, Fuyuki, Nakashima, Hideharu, and Abe, Hiroshi, "Analysis of cube texture in high purity aluminum foils for electrolytic capacitor by EBSP method," Journal of Japan Institute of Light Metals , vol. 51 no. 2, pp. 119-124, Feb. 2001.

[1086] Imam, Afroz M., Divan, Deepak M., Harley, Ronald G., and Habetler, Thomas G., "Electrolytic Capacitor Failure Mechanism Due to Inrush Current," Conference Record of the 2007 IEEE Industry Applications Conference , New Orleans, LA, Sept. 23-27, 2007, pp. 730-736.

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[1089] Ingalls, Mark, and Kent, Gordon, "Measurement of the Characteristics of High-Q Ceramic Capacitors," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-12, no. 4, pp. 487-495, Dec. 1987.

[1090] Ingalls, Mark, and Kent, Gordon, "Monolithic Capacitors as Transmission Lines," IEEE Transactions on Microwave Theory and Techniques, vol. 35 no. 11, pp. 964-970, Nov. 1987.

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[1092] Ionescu, Ciprian, Golumbeanu, Virgil, and Davidescu, Mircea, "Influence of the Conductive Adhesives Joints to Decoupling Impedance," 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials, The High Tatras, Slovak Republic, May 8-11, 2003, pp. 255-259.

[1093] Iorga, Cosmin, "Compartmental Analysis of Dielectric Absorption in Capacitors," IEEE Transactions on Dielectrics and Electrical Insulation, vol. 7 no. 2, pp. 187-192, Feb. 2000.

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[1096] Ishimaru, Tomoki, Sekine, Tadatoshi, and Asai, Hideki, "Fast Simulation of Power Distribution Networks Based on Semi-Implicit Numerical Integration Method and RLCG-MNA Formulation," IEEE Electrical Design of Advanced Packaging & Systems Symposium, Hong Kong, China, Dec. 2-4, 2009, pp. xx-xx.

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[1097d] Ito, Atsushi, Yoshimura, Noboru, Ideguchi, Junichi, and Ogasawara, Tadashi, "Electrical Conduction of Multi-layer Ceramic Capacitor," Proceedings of the 3rd International Conference on Properties and Applications of Dielectric Materials, Volume 1, Tokyo, Japan, July 8-12, 1991, pp. 173-176.

[1098] Izadi-Najafabadi, Ali, Yasuda, Satoshi, Kobashi, Kazufumi, Yamada, Takeo, Futaba, Don N., Hatori, Hiroaki, Yumura, Motoo, Iijima, Sumio, and Hata, Kenji, "Extracting the Full Potential of Single-Walled Carbon Nanotubes as Durable Supercapacitor Electrodes Operable at 4 V with High Power and Energy Density," Advanced Materials, vol. 22 no. 35, pp. E235-E241, Sept. 15, 2010.

[1099] Jacobs, Franck, "PP for Film Capacitors: Origin, Manufacturing and Processing," CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006, pp. xx-xx.

[1100] Jain, Pushkar, and Rymaszewski, Eugene J., "Embedded Thin Film Capacitors - Theoretical Limits," IEEE Transactions on Advanced Packaging, vol. 25, no. 3, pp. 454-458, Aug. 2002.

[1101] Jain, T. A., Fung, K. Z., and Chan, Johnny, "Effect of the A/B ratio on the microstructures and electrical properties of (Ba0.95+/-xCa0.05)(Ti0.82Zr0.18)O3 for multilayer ceramic capacitors with nickel electrodes," Journal of Alloys and Compounds, vol. 468 no. 1-2, pp. 370-374, Jan. 22, 2009.

[1102] Jamadade, V. S., Fulari, V. J., and Lokhande, C. D., "Supercapacitive behavior of electrosynthesized marygold-like structured nickel doped iron hydroxide thin film," Journal of Alloys and Compounds , vol. 509 no. 21, pp. 6257-6261, May 26, 2011.

[1103] Jamison, Keith D., Wood, Roger D., Zollars, Byron G., and Kordesch, Martin E., "Use of Amorphous Oxides as High Temperature Dielectric Material in Wound Capacitors," CARTS USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.

[1104] Jampani, Prashanth, Manivannan, A., and Kumta, Prashant N., "Advancing the Supercapacitor Materials and Technology Frontier for Improving Power Quality," Electrochemical Society Interface, vol. 19 no. 3, pp. 57-62, Fall 2010.

[1105] Jang, Bo-Yun, Kim, Beom-Jong, Jeong, Young-Hun, Nahm, Sahn, Sun, Ho-Jung, and Lee, Hwack-Ju, "Structure and dielectric properties of BaTi4O9 thin films for RF-MIM capacitor applications," Journal of Electroceramics, vol. 17 no. 2-4, pp. 387-391, Dec. 2006.

[1106] Jang, Jaehoon, Nam, Junghyun, and Yoo, Jiyoon, "Cell Balancing Circuit Implementation with DC/DC Converters Using Super Capacitor Equivalent Circuit Parameters," IEEE Vehicle Power and Propulsion Conference, Arlington, TX, Sept. 9-12, 2007, pp. 646-653.

[1107] Jang, Jong H., Machida, Kenji, Kim, Yuri, and Naoi, Katsuhiko, "Electrophoretic deposition (EPD) of hydrous ruthenium oxides with PTFE and their supercapacitor performances," Electrochimica Acta, vol. 52 no. 4, pp. 1733-1741, Dec. 1, 2006.

[1108] Jang, Joo-Hee, Choi, Woo-Sung, Lee, Chang-Hyoung, Jeong, Geun-Hee, Kim, Nam-Jeong, Yu, Chang-Lim, Park, Chan, and Suh, Su-Jeong, "Fabrication and characterization of a thin film capacitor using Al anodizing and Ni electroless plating," Scripta Materialia, vol. 63 no. 3, pp. 269-272, Aug. 2010.

[1109] Jang, Kyung-Woon, and Paik, Kyung-Wook, "A Study on Epoxy/BaTiO3 Embedded Capacitor Pastes for Organic Substrates," Proceedings 56th Electronic Components & Technology Conference , San Diego, CA, May 30-June 2, 2006, pp. 1504-1509.

[1110] Jang, Kyung-Woon, and Paik, Kyung-Wook, "Screen Printable Epoxy/BaTiO3 Embedded Capacitor Pastes with High Dielectric Constant for Organic Substrate Applications," Journal of Applied Polymer Science, vol. 110 no. 2, pp. 798-807, Oct. 15, 2008.

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[1111] Janssen, L. P., "Reducing the Emission of Multi-Layer PCBs by Removing the Supply Plane," Electromagnetic Compatibility 1999, Zurich, Switzerland, Feb. 16-18, 1999, pp. 639-644.

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[1126] Johnson, Howard, "ADC Grounding," EDN, vol. 45, no. 25, pp. , Dec. 7, 2000.

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[1128] Johnson, Howard, "Benefits of Resistive Probe," High-Speed Digital Design On-Line Newsletter, vol. 5, issue 4.

[1129] Johnson, Howard, "Bypass Array Model," High-Speed Digital Design On-Line Newsletter, vol. 6, issue 2.

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[1133] Johnson, Howard, "Bypass Capacitor Sequencing," High-Speed Digital Design On-Line Newsletter, vol. 9 issue 7.

[1134] Johnson, Howard, "Bypass Multi-Valued Arrays," High-Speed Digital Design On-Line Newsletter, vol. 1, issue 17.

[1135] Johnson, Howard, "Capacitor Layout Matters," EDN, Sept. 5, 2002.

[1136] Johnson, Howard, "Capacitor Placement," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 1.

[1137] Johnson, Howard, "Clean Power," EDN, vol. 45, no. 16, pp. 32, Aug. 3, 2000.

[1138] Johnson, Howard, "Dielectric Loss Tangents," High-Speed Digital Design On-Line Newsletter, vol. 4 issue 5.

[1139] Johnson, Howard, "Earth Ground," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 12.

[1140] Johnson, Howard, "EMC/Signal Integrity for High-Speed Digital Circuits," Aug 2, 1999.

[1141] Johnson, Howard, "Equivalent Circuit Source Impedance," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 9.

[1142] Johnson, Howard, "ESR or regulator output capacitor," High-Speed Digital Design On-Line Newsletter, vol. 5, issue 3.

[1143] Johnson, Howard, "Front-connected power supply," High-Speed Digital Design On-Line Newsletter, vol. 4, issue 17.

[1144] Johnson, Howard, "Ground Currents," High-Speed Digital Design On-Line Newsletter, vol. 3, issue 7.

[1145] Johnson, Howard, "Ground/Power Planes," High-Speed Digital Design On-Line Newsletter, vol. 1, issue 8.

[1146] Johnson, Howard, "Healthy Power," EDN, vol. 45, no. 7, pp. 32, Mar. 30, 2000.

[1147] Johnson, Howard, "High-Speed Return Signals," High-Speed Digital Design On-Line Newsletter, vol. 1, issue 15.

[1148] Johnson, Howard, "Improving Bypass Capacitor Layout." Printed Circuit Design, vol. 14, no. 9, pp. 27-28, Sept. 1997.

[1149] Johnson, Howard, "Interplane Capacitance," High-Speed Digital Design On-Line Newsletter, vol. 3, issue 21.

[1150] Johnson, Howard, "Measuring Droop," EDN, vol. xx no. x, pp. xx-xx, Feb. 3, 2005.

[1151] Johnson, Howard, "Measuring Power and Ground," High-Speed Digital Design On-Line Newsletter, vol. 3, issue 13.

[1152] Johnson, Howard, "Measuring Power Ground Impedance," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 14.

[1153] Johnson, Howard, "Measuring Power Plane Resonance," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 27.

[1154] Johnson, Howard, "Moats and Floats," Electronic Design, vol. 45, no. 4, pp. 181, Feb. 17, 1997.

[1155] Johnson, Howard, "Multiple ADC Grounding," EDN, vol 46, no. 3, pp. 30, Feb. 1, 2001.

[1156] Johnson, Howard, "Mutual Understanding," EDN, vol. 43, no. 1, pp. 24, Jan. 1, 1998.

[1157] Johnson, Howard, "On Chip Bypassing with End Terminations," EDN, vol. xx no. x, pp. xx-xx, May 27, 2004.

[1158] Johnson, Howard, "Operating Above Resonance," Electronic Design, vol. 45, no. x, pp. xx-xx, Apr. 14, 1997.

[1159] Johnson, Howard, "Parasitic inductance of a bypass capacitor," EDN, vol. 45, no. 15, pp. 32, July 20, 2000.

[1160] Johnson, Howard, "Parasitic Inductance of Bypass Capacitor II," High-Speed Digital Design On-Line Newsletter, vol. 6, issue 9.

[1161] Johnson, Howard, "Picket Fences," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 16.

[1162] Johnson, Howard, "Power and Ground Source Impedance," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 4.

[1163] Johnson, Howard, "Power Bus Noise," High-Speed Digital Design On-Line Newsletter, vol. 1, issue 9.

[1164] Johnson, Howard, "Power Plane Resistance," EDN, July 11, 2002.

[1165] Johnson, Howard, "Power Plane Resonance," EDN, vol. 43, no. 18, pp. 22, Sept. 1, 1998.

[1166] Johnson, Howard, "Probes," High-Speed Digital Design On-Line Newsletter, vol. 1, issue 13.

[1167] Johnson, Howard, "Probing for Noise," EDN, vol. 42, no. 25, pp. 215, Dec. 4, 1997.

[1168] Johnson, Howard, "Probing High-Speed Digital Designs," Electronic Design, vol. 45, no. 6, pp. 155-162, Mar 12, 1997.

[1169] Johnson, Howard, "Quality Factor," EDN, vol. 50 no. 25, pp. 38, Dec. 5, 2005.

[1170] Johnson, Howard, "Radiated Digital Ground Noise," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 17.

[1171] Johnson, Howard, "Resistance," High-Speed Digital Design On-Line Newsletter, vol. 1, issue 11.

[1172] Johnson, Howard, "Segmenting the Vcc Plane," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 18.

[1173] Johnson, Howard, "Short-Term Impedance of Planes," High-Speed Digital Design On-Line Newsletter, vol. 6 issue 5.

[1174] Johnson, Howard, "Single Point Ground," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 26.

[1175] Johnson, Howard, "Steel-plated power planes," EDN, vol. 47, no. 6, pp. 26, Mar. 21, 2002.

[1176] Johnson, Howard, "TDR and Ice Cube Trays," High-Speed Digital Design On-Line Newsletter, vol. 3, issue 5.

[1177] Johnson, Howard, "Ten Layer Stack," High-Speed Digital Design On-Line Newsletter, vol. 2, issue 11.

[1178] Johnson, Howard, "The Way Home," EDN, vol. 45, no. 13, pp. 32, June 22, 2000.

[1179] Johnson, Howard, "Through-hole clearances," EDN, vol. 44, no. 14, pp. , July 8, 1999.

[1180] Johnson, Howard, "Trace Between Capacitors," High-Speed Digital Design On-Line Newsletter, vol. 3, issue 4.

[1181] Johnson, Howard, "Voltage-Regulator Droop," EDN, vol. xx no. x, pp. xx-xx, Sept. 14, 2006.

[1182] Johnson, Howard, "Voltage-Regulator Model," EDN, vol. xx no. x, pp. xx-xx, Aug. 17, 2006.

[1183] Johnson, Howard, "VRM Stability - Part I: Feedback," High-Speed Digital Design On-Line Newsletter, vol. 10 issue 3.

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[1184d] Joung, Mi-Ri, Kim, Jin-Seong, Song, Myung-Eun, Choi, Jae-Hong, Nahm, Sahn, Choi, Chang-Hak, and Sung, Tae-Hyun, "Synthesis of highly tetragonal BaTiO3 nanopowders by a two-step alkoxide-hydroxide route," Journal of Alloys and Compounds, vol. 509 no. 37, pp. 9089-9092, Sept. 15, 2011.

[1185] Jow, Jiin-Jiang, Lai, Huen-Hua, Chen, Ho-Rei, Wang, Cheng-Chin, Wu, Mao-Sung, and Ling, Tzong-Rong, "Effect of hydrothermal treatment on the performance of RuO2-Ta2O5/Ti electrodes for use in supercapacitors," Electrochimica Acta, vol. 55 no. 8, pp. 2793-2798, Mar. 1, 2010.

[1186] Jow, Uei-Ming, Wei, Chang-Lin, Lai, Ying-Jiunn, Chen, Chang-Sheng, and Shyu, Chin-Sun, "Embedded Passives On Multi-Layer Printed Wiring Board (PWB) for 5GHz Front-end Module," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1331-1337.

[1187] Jung, Sung Man, Bae, In Sung, Yoon, Jae Sik, Goto, Shoji, and Kim, Byung Il, "Evaluation of Electric Properties for Niobium Capacitors," Materials Transactions, vol. 48 no. 12, pp. 3197-3200, Dec. 2007.

[1188] Juodkazis, K., Juodkazyte, J., Sukiene, V., Griguceviciene, A., and Selskis, A., "On the charge storage mechanism at RuO2/0.5 M H2SO4 interface," Journal of Solid State Electrochemistry, vol. 12 no. 11, pp. 1399-1404, Nov. 2008.

[1189] Jurewicz, K., and Babel, K., "Efficient Capacitor Materials from Active Carbons Based on Coconut Shell/Melamine Precursors," Energy &, Fuels, vol. 24 no. 6, pp. 3429-3435, June 17, 2010.

[1190] Jwalapuram, Vishnu, "Power Distribution System Design for High Speed Boards," OnBoard Technology, vol. xx no. xx, pp. 58-60, June 2004.

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[1192] Kagata, , and Abe, Yutaka, "Suppression of Low-Frequency Dispersion in TiO2 Sintered Capacitor by Doping Ti Metal," CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 19-25.

[1193] Kahn, Louis, "Capacitors--1959," IRE Transactions on Component Parts, vol. 6 no. 3, pp. 150-174, Sept. 1959.

[1194] Kahng, Sungtek, "Characteristics of the Resonance and Impedance of Power-Bus Structure with the Embedded Metamaterial Substrate," Electrical Design of Advanced Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 16-19.

[1195] Kahng, Sungtek, and Choi, Jaehoon, "Correlated effects of decoupling capacitors and vias loaded in the PCB power-bus," IEEE Antennas and Propagation Society International Symposium 2006, Albuquerque, NM, July 9-14, 2006, pp. 77-80.

[1196] Kahng, Sungtek, "GA-Optimization for Finding Decoupling Capacitors to Damp the Rectangular Power-Bus Resonances," 18th International Zurich Symposium on Electromagnetic Compatibility, Munich, Germany, Sept. 24-28, 2007, pp. 103-106.

[1197] Kahng, Sungtek, "GA-Optimized Decoupling Capacitors Damping the Rectangular Power-Bus' Cavity-Mode Resonances," IEEE Microwave and Wireless Components Letters , vol. 16 no. 6, pp. 375-377, June 2006.

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[2532] Zhang, Shengwen, Peng, Chuang, Ng, Kok C., and Chen, George Z., "Nanocomposites of manganese oxides and carbon nanotubes for aqueous Supercapacitor stacks," Electrochimica Acta, vol. 55 no. 25, pp. 7447-7453, Oct. 30, 2010.

[2533] Zhang, Shihai, Chu, Baojin, Xhou, Xin, Neese, Bret, and Zhang, Qiming, "High Energy Density Polymer Dielectrics for Capacitor Applications," CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 141-150.

[2533d] Zhang, Shihai, Zou, Chen, Zhou, Xin, Anderson, Dean, Zellers, Brian, and Zhang, Qiming, "Polymer Film Capacitors with High Dielectric Constant, High Capacitance Density, and High Energy Density," 2010 IEEE International Power Modulator and High Voltage Conference, Atlanta, GA, May 23-27, 2010, pp. 221-224.

[2534] Zhang, Wanping, Zhang, Ling, Shayan, Amirali, Yu, Wenjian, Hu, Xiang, Zhu, Zhi, Engin, Ege, and Cheng, Chung-Kuan, "On-Chip Power Network Optimization with Decoupling Capacitors and Controlled-ESRs," 2010 15th Asia and South Pacific Design Automation Conference, Taipei, Taiwan, Jan. 18-21, 2010, pp. 119-124.

[2535] Zhang, Wenfeng, Huang, Zheng-Hong, Guo, Zhen, Li, Can, and Kang, Feiyu, "Porous carbons prepared from deoiled asphalt and their electrochemical properties for supercapacitors," Materials Letters, vol. 64 no. 17, pp. 1868-1870, Sept. 15, 2010.

[1535d] Zhang, Xiaohua, Ren, Wei, Shi, Peng, Khan, M. Saeed, Chen, Xiaofeng, Wu, Xiaoqing, and Yao, Xi, "Structural and dielectric properties of Bi2Zn2/3Nb4/3O7 thin films prepared by pulsed laser deposition at low temperature for embedded capacitor applications," Journal of Alloys and Compounds, vol. xxx no. xx, pp. xx-xx, xxxx.

[2536] Zhang, Xuejun, Li, Haiyan, and Tian, Yanhong, "Activated Carbon Fiber for Super-capacitor Electrode," Advanced Materials Research, vol. 97-101, pp. 510-513.

[2536d] Zhang, Yakun, Li, Jianling, Gao, Fei, and Wang, Xindong, "Electrodeposition of PANI/MnO2 composite on SnO2/Ti substrate for supercapacitor electrode," Advanced Materials Research, vol. 239-242, pp. 1372-1375, 2011.

[2537] Zhang, Yanping, Sun, Xiaowei, Pan, Likun, Li, Haibo, Sun, Zhuo, Sun, Changqing, and Tay, Beng Kang, "Carbon nanotube-zinc oxide electrode and gel polymer electrolyte for electrochemical supercapacitors," Journal of Alloys and Compounds , vol. 480 no. 2, pp. L17-L19, July 8, 2009.

[2538] Zhang, Yanping, Zhang, Zhejuan, Li, Haibo, Pan, Likun, Gao, Yang, Pang, Feiyan, Sun, Zhuo, Sun, Xiaowei, and Tay, Beng Kang, "Study of electrochemical supercapacitors utilizing carbon nanotubes electrodes and PVA-hybrid polyacid electrolytes," 2nd IEEE International Nanoelectronics Conference, Shanghai, China, Mar. 24-27, 2008, pp. 252-254.

[2539] Zhang, Yaojiang, De Paulis, Francesco, and Fan, Jun, "Modeling Multilayer Power Distribution Network by Systematically Incorporating Via and Cavity Models," Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, Singapore, May 19-23, 2008, pp. 335-338.

[2540] Zhang, Yining Kevin, Pan, Deyuan, Chen, Sujing, Lin, Junhong, Chen, Yuanqiang, Yu, Hui, Xiao, Zhangying, Chen, Xiong, Wu, Gengyun, Guo, Liang, and Chen, Youxiong, "Multilayer Polymer Aluminum Electrolytic Capacitors with Polypyrrole as Cathode Materials," CARTS USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.

[2541] Zhang, Yining Kevin, Lin, Junhong, and Chen, Yuanqiang, "Polymer Aluminum Electrolytic Capacitors with Chemically-Polymerized Polypyrrole (PPy) as Cathode Materials Part I. Effect of Monomer Concentration and Oxidant on Electrical Properties of the Capacitors," CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.

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[2543] Zhang, Zhi-an, Lai, Yan-qing, Li, Jie, and Liu, Ye-xiang, "Electrochemical behavior of wound supercapacitors with propylene carbonate and acetonitrile based nonaqueous electrolytes," Journal of Central South University of Technology, vol. 16 no. 2, pp. 247-252, Apr. 2009.

[2544] Zhao, Dan-Dan, Yang, Zhi, Kong, Eric Siu-Wai, Xu, Cai-Ling, and Zhang, Ya-Fei, "Carbon nanotube arrays supported manganese oxide and its application in electrochemical capacitors," Journal of Solid State Electrochemistry , vol. 15 no. 6, pp. 1235-1242, June 2011.

[2544d] Zhao, Hong, Xu, Mingzhong, Zhang, wenlong, and Wang, Xuan, "The Effect of Crystal Forms on Dielectric Properties of Polypropylene," 8th International Conference on Properties and Applications of Dielectric Materials, Bali, Indonesia, June 26-30, 2006, pp. 778-781.

[2544h] Zhao, Jiachang, Tang, Bohejin, Cao, Jian, Feng, Jicheng, Liu, Ping, Zhao, Jie, and Xu, Jingli, "Effect of Hydrothermal Temperature on the Structure and Electrochemical Performance of Manganese Compound/ Ordered Mesoporous Carbon Composites for Supercapacitors," Materials and Manufacturing Processes, vol. 27 no. 2, pp. 119-124, 2012.

[2545] Zhao, Jia-chang, Lai, Chun-yan, Dai, Yang, and Xie, Jing-ying, "Synthesis of mesoporous carbon as electrode material for supercapacitor by modified template method," Journal of Central South University of Technology, vol. 12 no. 6, pp. 647-652, Dec. 2005.

[2546] Zhao, Jianyin, and Liu, Fang, "Reliability assessment of the metallized film capacitors from degradation data," Microelectronics Reliability, vol. 47 no. 2-3, pp. 434-436, Feb.-Mar. 2007.

[2547] Zhao, Jin, and Mandhana, Om P., "A Fast Evaluation of Power Delivery System Input Impedance of Printed Circuit Boards with Decoupling Capacitors," IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, Oct. 25-27, 2004, pp. 111-114.

[2548] Zhao, Jin, and Mandhana, Om P., "A Fast Evaluation of Power Delivery System Input Impedance of Printed Circuit Boards with Decoupling Capacitors (Presentation)," IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, Oct. 25-27, 2004, pp. 111-114.

[2549] Zhao, Jin, Zhang, Jingping, and Fang, Jiayuan, "Effects of Power/Ground Via Distribution on the Power/Ground Performance of C4/BGA Packages."

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[2552] Zhao, Min, Panda, Rajendran V., Sapatnekar, Sachin S., Edwards, Tim, Chaudhry, Rajat, and Blaauw, David, "Hierarchical Analysis of Power Distribution Networks," Proceedings 2000 37th Design Automation Conference, Los Angeles, CA, June 5-9, 2000, pp. 150-155.

[2552d] Zhao, Ning, Wan, Lixi, and Yu, Shuhui, "Properties of Ferroelectric Thin Film Capacitor for Embedded Passive Applications," 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, Aug. 8-11, 2011, pp. 264-267.

[2553] Zhao, Xiaochen, Wang, Aiqin, Yan, Jingwang, Sun, Gongquan, Sun, Lixian, and Zhang, Tao, "Synthesis and Electrochemical Performance of Heteroatom-Incorporated Ordered Mesoporous Carbons," Chemistry of Materials, vol. 22 no. 19, pp. 5463-5473, Oct. 12, 2010.

[2554] Zhao, Xiao-Yan, Cao, Jing-Pei, Morishita, Kayoko, Ozaki, Jun-ichi, and Takarada, Takayuki, "Electric Double-Layer Capacitors from Activated Carbon Derived from Black Liquor," Energy &, Fuels, vol. 24 no. 3, pp. 1889-1893, Mar. 18, 2010.

[2554d] Zhao, Yanlei, Li, Haidong, Zhang, Housheng, and Liu, Xueting, "An Improved Supercapacitor Model and Its Parameter Identification for Wind Power Flow Optimization and Control System," Advanced Materials Research , vol. 121-122, pp. 916-921, 2010.

[2555] Zhao, Yaomin, Liu, Ling, Xu, Juan, Yang, Jie, Yan, Manming, and Jiang, Zhiyu, "High-performance supercapacitors of hydrous ruthenium oxide/mesoporous carbon composites," Journal of Solid State Electrochemistry, vol. 11 no. 2, pp. 283-290, Feb. 2007.

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[2558] Zheng, Liping, Wang, Ying, Wang, Xianyou, Wang, Xingyan, An, Hongfang, and Yi, Lanhuan, "The effects of surface modification on the supercapacitive behaviors of carbon derived from calcium carbide," Journal of Materials Science , vol. 45 no. 22, pp. 6030-6037, Nov. 2010.

[2559] Zheng, Liping, Wang, Xianyou, An, Hongfang, Wang, Xingyan, Yi, Lanhuan, and Bai, Li, "The preparation and performance of flocculent polyaniline/carbon nanotubes composite electrode material for supercapacitors," Journal of Solid State Electrochemistry, vol. 15 no. 4, pp. 675-681, Apr. 2011.

[2560] Zheng, Liqiang, Mathewson, Alan, O'Flynn, Brendan, Hayes, Michael, and O'Mathuna, Cian, "Design and Implementation of the Embedded Capacitance Layers for Decoupling of Wireless Sensor Nodes," 2010 12th Electronics Packaging Technology Conference, Singapore, Dec. 8-10, 2010, pp. 687-690.

[2560d] Zheng, Mingdong, Zhang, Xiaoyong, Li, Ruchun, Wu, Mingbo, Geng, Yejing, and He, Xiaojun, "Direct Preparation of Activated Carbon from Coal and its Electrochemical Properties for Electric Double Layer Capacitor," Advanced Materials Research, vol. 197-198, pp. 1253-1257, 2011.

[2561] Zheng, X. H., and Chen, X. M., "Temperature-Stable High-e Dielectrics Ceramics Based on (1 - x) Ba5NdTi3Ta7O30/xBi4Ti3O12," Journal of Electroceramics, vol. 10 no. 1, pp. 31-37, Mar. 2003.

[2562] Zheng, Yue, Cai, M. Q., and Woo, C. H., "Critical properties of symmetric nanoscale metal-ferroelectric-metal capacitors," Acta Materialia, vol. 58 no. 8, pp. 3050-3058, May 2010.

[2563] Zhitomirsky, I., Cheong, M., and Wei, J., "The Cathodic Electrodeposition of Manganese Oxide Films for Electrochemical Supercapacitors," JOM, vol. 59 no. 7, pp. 66-69, July 2007.

[2564] Zhiwen, Yin, Baomin, Xu, and Hong, Wang, "One-Step, Low-Temperature Sintering of SrTiO3 Based Grain Boundary Barrier Layer Capacitor Materials," Proceedings of the Eighth IEEE International Symposium on Applications of Ferroelectrics, Greenville, SC, Aug. 30-Sept. 2, 1992, pp. 472-475.

[2564d] Zhongyuan, Mei, and Qiaoqing, Lue, "The Research on the Space Factor of High Voltage Power Capacitors Impregnated All PP Film/Foil," Proceedings of the 3rd International Conference on Properties and Applications of Dielectric Materials, Volume 2, Tokyo, Japan, July 8-12, 1991, pp. 736-739.

[2565] Zhou, Chongfu, Kumar, Satish, Doyle, Condell D., and Tour, James M., "Functionalized Single Wall Carbon Nanotubes Treated with Pyrrole for Electrochemical Supercapacitor Membranes," Chemistry of Materials , vol. 17 no. 8, pp. 1997-2002, Apr. 19, 2005.

[2566] Zhou, Haihui, Chen, Hong, Luo, Shenglian, Lu, Gewu, Wei, Wanzhi, and Kuang, Yafei, "The effect of the polyaniline morphology on the performance of polyaniline supercapacitors," Journal of Solid State Electrochemistry, vol. 9 no. 8, pp. 574-580, Aug. 2005.

[2567] Zhou, Shao-yun, Li, Xin-hai, Wang, Zhi-xing, Guo, Hua-jun, and Peng, Wen-jie, "Comparison of capacitive behavior of activated carbons with different pore structures in aqueous and nonaqueous systems," Journal of Central South University of Technology, vol. 15 no. 5, pp. 674-678, Oct. 2008.

[2568] Zhou, Shao-yun, Li, Xin-hai, Wang, Zhi-xing, Guo, Hua-jun, and Peng, Wen-jie, "Effect of activated carbon and electrolyte on properties of supercapacitor," Transactions of Nonferrous Metals Society of China, vol. 17 no. 6, pp. 1328-1333, Dec. 2007.

[2569] Zhou, Tianxiang, Mo, Shanshan, Zhou, Shuangli, Zou, Wujun, Liu, Yingliang, and Yuan, Dingsheng, "Mn3O4/worm-like mesoporous carbon synthesized via a microwave method for supercapacitors," Journal of Materials Science, vol. xx no. x, pp. xx-xx, xxxx.

[2569a] Zhou, Tingdong, Friedrich, Joshua D., and Becker, Wiren D., "Deriving voltage tolerance specification for processor circuit design," 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, San Jose, CA, Oct. 23-26, 2011, pp. 17-20.

[2569b] Zhou, Xin, Chu, Baojin, Wang, Yong, and Zhang, Qiming, "Polyvinylidene Fluoride based polymeric dielectrics for high energy density capacitor application," IEEE 9th International Conference on the Properties and Applications of Dielectric Materials, Harbin, China, July 19-23, 2009, pp. 15-19.

[2569d] zhou, Xinhong, Li, Lanfeng, Dong, Shanmu, Chen, Xiao, Han, Pengxian, Xu, Hongxia, Yao, Jianhua, Shang, Chaoqun, Liu, Zhihong, and Cui, Guanglei, "A renewable bamboo carbon/polyaniline composite for a high-performance supercapacitor electrode material," Journal of Solid State Electrochemistry, vol. xx no. x, pp. xx-xx, xxxx.

[2570] Zhou, Y. K., He, B. L., Zhang, F. B., and Li, H. L., "Hydrous manganese oxide/carbon nanotube composite electrodes for electrochemical capacitors," Journal of Solid State Electrochemistry , vol. 8 no. 11, pp. 482-487, Oct. 2004.

[2571] Zhou, Yaping, Dhong, Sang H., Flachs, Brian, Harvey, Paul M., and Michael, Brad W., "A method to measure impedance of chip/package/board power supply system using pseudo-impulse current," 15th Topical Meeting on Electrical Performance of Electronic Packaging, Scottsdale, CA, Oct. 23-25, 2006, pp. 33-36.

[2572] Zhou, Yaping, Wenzel, Rob, and Herberg, Ben, "Modeling the Intrinsic Inductance of Embedded Capacitors," Digest of 11th IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, Oct. 21-23, 2002, pp. 167-170.

[2573] Zhou, Yaping, Dhong, Sang H., Nishino, Yoichi, Harvey, Paul M., Mandrekar, Rohan, Gervais, Gilles, and Criscolo, Nikki, "Power supply noise simulation considering dynamic effect of on-chip current," 15th Topical Meeting on Electrical Performance of Electronic Packaging , Scottsdale, CA, Oct. 23-25, 2006, pp. 87-90.

[2574] Zhou, Yi, Qin, Zong-Yi, Li, Li, Zhang, Yu, Wei, Yu-Ling, Wang, Ling-Feng, and Zhu, Mei-Fang, "Polyaniline/multi-walled carbon nanotube composites with core-shell structures as supercapacitor electrode materials," Electrochimica Acta , vol. 55 no. 12, pp. 3904-3908, Apr. 30, 2010.

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Our President, John R. Barnes, is a Professional Engineer (PE) licensed in the state of Kentucky, an iNARTE-Certified Electromagnetic Compatibility Engineer (NCE), an iNARTE-Certified Electromagnetic Compatibility Technician (NCT), an iNARTE-Certified Electrostatic Discharge Control Engineer (ESDC Eng), an iNARTE-Certified Electrostatic Discharge Control Technician (ESDC Tech), an iNARTE-Certified Product Safety Engineer (PSE), an iNARTE-Certified Master EMC Design Engineer, a Senior Member of the IEEE (SM IEEE), and an Advanced-class amateur radio operator. He has written three books: Electronic System Design: Interference and Noise Control Techniques, which was published in English in 1987 and in Russian in 1990; and Robust Electronic Design Reference Book, Volumes I and II, which came out in 2004. John has also written articles on designing electronics for electrostatic discharge (ESD) immunity for Printed Circuit Design and Conformity magazines.

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