We can ensure that our electronic circuits will operate consistently and reliably by:
A lack of Power Integrity can cause an electronic system to:
My first book, Electronics System Design: Interference and Noise Control Techniques (Prentice-Hall, Englewood Cliffs, NJ, 1987) discusses Power Integrity under analog and digital circuit design in:
My second and third books, Robust Electronic Design Reference Book, Volumes I and II, were published by Kluwer Academic Publishers (now part of Springer) in Mar. 2004. They discuss Power Integrity in great detail in:
[2] Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques, IPC-D-317A. IPC, Northbrook, IL, 1995.
[3] Handbook of EC EMC Compliance. Boxborough, MA: Compliance Design, 1993.
[4] Handbook of EU EMC Compliance. Boxborough, MA: Compliance Design, 1995.
[5] Handbook of EU EMC Compliance. Boxborough, MA: Compliance Design, 1996.
[6] Practical Design Techniques for Power and Thermal Management . Norwood, MA: Analog Devices, 1998.
[7] Signal Integrity Issues in PCB Design. Bellevue, WA: UltraCAD Design, 2002.
[8] The Best of Analog Dialogue 1967 to 1991. Analog Devices, 1991.
[9] Unitrode Power Supply Design Seminar SEM-1100. Merrimack, NH: Unitrode, 1996.
[10] Unitrode Power Supply Design Seminar SEM-1200. Merrimack, NH: Unitrode, 1997.
[11] Archambeault, Bruce R., PCB Design for Real-World EMI Control . Kluwer Academic Publishers, Boston, 2002.
[12] Bakoglu, H. B., Circuits, Interconnections, and Packaging for VLSI. New York: Addison-Wesley, 1990.
[13] Barnes, John R., Electronics System Design: Interference and Noise Control Techniques. Prentice-Hall, Englewood Cliffs, NJ, 1987.
[14] Barnes, John R., Robust Electronic Design Reference Book, Volumes I and II. Kluwer Academic Publishers, Boston, 2004.
[15] Blankenhorn, James C., PCB Design of High-Speed Digital Circuits . Scotts Valley, CA: SMT Plus, 2002.
[16] Blood, Jr., William R., MECL System Design Handbook, 4th Edition . Motorola Semiconductor Products, 1983.
[17] Bogatin, Eric, Signal Integrity - Simplified. Upper Saddle River, NJ: Prentice-Hall, 2004.
[18] Brooks, Douglas, Signal Integrity Issues and Printed Circuit Board Design. Upper Saddle River, NJ: Prentice Hall PTR, 2003.
[19] Buchanan, James E., BiCMOS/CMOS Systems Design. McGraw-Hill, New York, 1991.
[20] Buchanan, James E., CMOS/TTL Digital Systems Design. McGraw-Hill, New York, 1990.
[21] Buchanan, James E., Signal and Power Integrity in Digital Systems: TTL, CMOS, and BiCMOS. McGraw-Hill, New York, 1996.
[22] Dally, William J., and Poulton, John W., Digital Systems Engineering, Cambridge University Press, Cambridge, UK, 1998.
[23] Deeley, Paul McKnight, Electrolytic Capacitors. Cornell-Dubilier Electric Corp, South Plainfield, NJ, 1938.
[24] Georgiev, Alexander M., The Electrolytic Capacitor. Murray Hill Books, New York, 1945.
[25] Ginsberg, Gerald L., A User's Guide to Selecting Electronic Components. New York: John Wiley & Sons, 1981.
[26] Goedbloed, Jasper, Electromagnetic Compatibility. Prentice-Hall, New York, 1990.
[27] Gore, Gregory V., The Engineer's Master Guide to EMI Control . West Conshohocken, PA: R & B Enterprises, 1986.
[28] Graf, Rudolf F., Electronic Databook, 3rd Edition. Blue Ridge Summit: TAB Books, 1983.
[29] Hall, Stephen H., Hall, Garrett W., and McCall, James A., High-Speed Digital System Design, John Wiley & Sons, New York, 2000.
[30] Harper, Charles A., High Performance Printed Circuit Boards . New York: McGraw-Hill, 2000.
[31] Hartal, Oren, Electromagnetic Compatibility by Design, 4th Edition. West Conshohocken, PA: R & B Enterprizes, 1996.
[32] Hartley, Rick, High Speed Design: A Practical Approach. IPC.
[33] Hayward, Wes, Campbell, Rick, and Larkin, Bob, Experimental Methods in RF Design. Newington, CT: ARRL, 2003.
[34] Johnson, Howard and Graham, Martin, High-Speed Digital Design. Prentice- Hall, Upper Saddle River, NJ, 1993.
[35] Keenan, R. Kenneth, Decoupling and Layout of Digital Printed Circuits. TKC, Pinellas Park, FL, 1985.
[36] Keenan, R. Kenneth, Digital Design for Interference Specifications. TKC, Pinellas Park, FL, 1983.
[37] Keenan, R. Kenneth, FCC/VDE Noise Specifications: Application of Ferrite Beads to Decoupling Printed-Circuit Boards from Backplanes. Pinellas Park, FL: The Keenan Corporation, 1984.
[38] Lenk, John D., Handbook of Simplified Solid-State Circuit Design . Englewood Cliffs, NJ: Prentice-Hall, 1971.
[39] Lenk, John D., Manual for Integrated Circuit Users. Reston, VA: Reston Publishing, 1973.
[40] Lund, Preben, Generation of Precision Artwork for Printed Circuit Boards. New York: John Wiley & Sons, 1978.
[41] Lund, Preben, Printed Circuit Board Precision Artwork Generation and Manufacturing Methods. Westlake Village, CA: Bishop Graphics, 1986.
[42] Mancini, Ron, Op Amps for Everyone, 2nd Edition. New York: Newnes, 2003.
[43] Marcoux, Phil P., Surface Mount Technology: Design for Manufacturability. Dearborn, MI: SME, 1989.
[44] Mardiguian, Michel, Controlling Radiated Emissions by Design 2nd ed., Kluwer, Boston, 2001.
[45] Mardiguian, Michel, Cookbook of EMI Fixes. Gainesville, VA: ICT, 1989.
[46] Mardiguian, Michel, Electromagnetic Control in Components and Devices. Gainesville, VA: Interference Control Technologies, 1988.
[47] Mardiguian, Michel, Interference Control in Computers and Microprocessor- Based Equipment. Don White Consultants, Gainesville, VA, 1984.
[48] Mills, Jeffrey P., Electromagnetic Interference Reduction in Electronic Systems. Englewood Cliffs, NJ: PTR Prentice Hall, 1993.
[49] Montrose, Mark I., EMC and the Printed Circuit Board. IEEE Press, New York, 1999.
[50] Montrose, Mark I., Printed Circuit Board Design Techniques for EMC Compliance. IEEE Press, New York, 1996.
[51] Morris, Robert L., and Miller, John R., Designing with TTL Integrated Circuits. New York: McGraw-Hill, 1971.
[52] Morrison, Ralph, Solving Interference Problems in Electronics . New York: John Wiley & Sons, 1995.
[53] Norris, Bryan, Digital Integrated Circuits and Operational-Amplifier and Optoelectronic Circuit Design. New York: McGraw-Hill, 1976.
[54] Novak, Istvan, and Miller, Jason R., Frequency-Domain Characterization of Power Distribution Networks. Boston, MA: Artech House, 2007.
[55] Novak, Istvan, Power Distribution Network Design Methodologies . Chicago, IL: International Engineering Consortium, 2008.
[56] O'Hara, Martin, EMC at Component and PCB Level. Boston, MA: Newnes, 1998.
[57] Ott, Henry W., Noise Reduction Techniques in Electronic Systems, 2nd Edition. New York: John Wiley & Sons, 1988.
[58] Ott, Henry W., Noise Reduction Techniques in Electronic Systems. John Wiley & Sons, New York, 1976.
[59] Paul, Clayton R., Introduction to Electromagnetic Compatibility , John Wiley & Sons, New York, 1992.
[60] Poon, Ron K., Computer Circuits Electrical Design, Prentice Hall, Englewood Cliffs, NJ, 1995.
[61] Ritchey, Lee W., Right the First Time: A Practical Hand Book on High Speed PCB and System Design, Volume 1. Speeding Edge, 2003.
[62] Ritchey, Lee W., Right the First Time: A Practical Handbook on High Speed PCB and System Design, Volume 2. Speeding Edge, 2006.
[63] Ritenour, Bill, and White, Donald, EMI Control in Computers & Microprocessor-Based Equipment. NTU: 1992.
[64] Scarlett, J. A., Transistor-Transistor Logic and Its Interconnections. New York: Van Nostrand Reinhold, 1972.
[65] Sheingold, Daniel H., Transducer Interfacing Handbook: A Guide to Analog Signal Conditioning. Norwood, MA: Analog Devices, 1981.
[66] Shoji, Masakazu, High-Speed Digital Circuits. Reading, MA: Addison-Wesley, 1996.
[67] Smith, Douglas C., High Frequency Measurements and Noise in Electronic Circuits. Van Nostrand Reinhold, New York, 1993.
[68] Stout, David F., and Kaufman, Milton, Handbook of Operational Amplifier Circuit Design. New York: McGraw-Hill, 1976.
[69] Tummala, Rao R., Fundamentals of Microsystems Packaging. New York: McGraw-Hill, 2001.
[70] Ulrich, Richard K., and Schaper, Leonard W., Integrated Passive Component Technology. Piscataway, NJ: IEEE Press, 2003.
[71] Violette, J. L. Norman, White, Donald R. J., and Violette, Michael F., Electromagnetic Compatibility Handbook. New York: Van Nostrand Reinhold, 1987.
[72] Violette, J. L. Norman, Noise Control & Design Considerations in High Performance Electronic Circuits & Systems. Falls Church, VA: Violette Engineering, 1993.
[73] White, Donald R. J., EMI Control in the Design of Printed Circuit Boards and Backplanes. Gainesville, VA: Don White Consultants, 1981.
[74] Williams, Tim, EMC for Product Designers 2nd ed., Newnes, Woburn, MA, 1996.
[75] Young, Brian, Digital Signal Integrity, Prentice Hall, Upper Saddle River, NJ, 2001.
[76] Choi, Myoung Joon, Efficient Broadband Electromagnetic Modeling of the Power Distribution Network in High-Speed, Mixed-Signal Integrated Circuits. Ph. D. Thesis for University of Illinois at Urbana-Champaign, Urbana-Champaign, IL, 2004.
[76d] Mandrekar, Rohan, Modeling and Co-simulation of Signal Distribution and Power Delivery in Packaged Digital Systems. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, May 2006.
[76h] Muthana, Prathap K., Design of High Speed Packages and Boards Using Embedded Decoupling Capacitors, Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, 2007.
[76l] Na, Nanju, Modeling and Simulation of Planes in Electronic Packages. Ph. D. Thesis for Georgia Institute of Technology, Atlanta, GA, Jan. 2001.
[76p] Selli, Giuseppe, BGA Footprints Modeling and Physics Based Via Models Validation for Power and signal Integrity Applications. Ph. D. Thesis for University of Missouri - Rolla, Rolla, MS, 2007.
[77] Wang, Wei, Parameter Extraction for Electronic Packaging and Decoupling Methodology for Power Delivery Systems. Ph. D. Thesis for University of California, Santa Cruz, CA, Sept. 2003.
[78] "74C Family Characteristics," Fairchild Semiconductor Application Note 90, Aug. 1973.
[79] "8 Hints for Successful Impedance Measurements," Hewlett-Packard Application Note 346-4.
[80] "8088 8-bit HMOS Microprocessor 8088/8088-2," Intel, Aug. 1990.
[81] "A High Frequency Broadband Filter," Microwave Journal, Sept. 15, 2003.
[82] "A Review of the Literature."
[83] "Above Board," UltraCAD.
[84] "Advances in Surface Mount Filtering Technology," Syfer.
[85] "AMD-K6(R) Processor EMI Design Considerations," AMD Application Note 22023, Mar. 1999.
[86] "AMD-K6(R) Processor Power Supply Design," AMD Application Note 21103, Feb. 1999.
[87] "Application Suggestions for X2Y Technology," X2Y.
[88] "AVX Dielectric Comparison Chart," AVX.
[90] "Best Board Design Practices for the Power Distribution Network (PDN)," Altera, 2006.
[91] "Buried Capacitance," Merix.
[92] "Buried Capacitance Design Guide," Zycon, 1995.
[93] "Buried Capacitance(TM) A Simple Solution," Zycon.
[94] "Bypass Capacitor Selection for High-Speed Designs," Micron Technical Note TN-00-06, Sept. 1999.
[95] "Capacitance Without Capacitors," Hadco, Nov. 23, 1998.
[96] "Capacitor ESR Measurement Techniques," American Technical Ceramics.
[97] "Careful Design Helps Exorcise Noise Demons From PC Audio," Aug. 21, 2000.
[98] "Ceramic Capacitors," Murata.
[99] "Circuit designing cautions (OS-CON)," Sanyo.
[100] "CMOS Power Consumption and Cpd Calculation," Texas Instruments Application Note SCAA035B, June 1997.
[101] "CMOS, the Ideal Logic Family," Fairchild Semiconductor Application Note 77, Jan. 1983.
[102] "Comparative Device-Only Measurements of X2Y, Arrays and Ordinary Capacitors," X2Y, Feb. 24, 2006.
[105] "Construction and Characteristics of OS-CON," Sanyo.
[106] "Crucial Precautions (OS-CON)," Sanyo.
[107] "DC-To-DC Converters using X2Y Technology," X2Y Note# 2009, V3.0, Apr. 28, 2005.
[108] DESIGNERCOUNCIL archives. [109] "Design Considerations," Fairchild Semiconductor, Nov. 1999.
[110] "Design Considerations for Class-D Audio Power Amplifiers," Texas Instruments Application Report SLOA031, Aug. 1999.
[111] "Design Engineers Battle The Dark Side Of Electromagnetism," Dec. 18, 2000.
[112] "Design for EMI," Intel Application Note AP-589, Feb. 1999.
[113] "Designing Fast Response Synchronous Buck Regulators Using the TPS5210," Texas Instruments Application Report SLVA044, Mar. 1999.
[114] "Designing for EMI Compliance - Part 1 Design of the PC Board," 1985-86 Compliance Engineering, 1985, pp. 87-88, 97-110.
[115] "Designing the Input Filter for a Pentium II Processor Converter," Fairchild Application Bulletin AB-16.
[116] "Designing with TTL," Fairchild Semiconductor Application Note 363, June 1984.
[117] "Details of Output Capacitor Selection for Pentium II Process Converters using the RC5051," Fairchild Application Bulletin AB-14.
[118] "Do passive components degrade audio quality in your portable device?," Maxim Engineering Journal, vol. 48, pp. 16-19.
[119] "EEE Parts Derating," NASA Practice no. PD-ED-1201.
[120] "Electromagnetic Analysis of Decoupling Capacitor Mounting Structures with Sembeor," Simbeor Applications Note #2008_01, Mar. 2008.
[121] "ELNA Chip Aluminum Electrolytic Capacitors Technical Data,"
[122] "Embedded IntelDX2(TM) Processor," Intel, Dec. 1997,
[123] "EMC Improvement Guidelines," Atmel Application Note, Rev. 4279B-8051-08/03, Aug. 2003.
[124] "ESR Loss Factors," American Technical Ceramics.
[125] "FAST(R)/FASTr(TM) Design Considerations," Fairchild Semiconductor Application Note 661, Mar. 1990.
[126] "Film Capacitors Precautions and Guidelines," Nippon Chemi-con.
[127] "Flexible Motherboard Power Distribution and Control for the Pentium(R) III Xeon Processor," Intel Application Note AP-933, Jan. 2000.
[128] "Follow PC-Board Design Guidelines for Lowest CMOS EMI Radiation," Fairchild Semiconductor Application Note 389, Jan. 1985.
[129] "Frequency Characteristics of OS-CON," Sanyo.
[130] "General Routing Techniques with Emphasis on PI6C10X Clocks," Pericom Application Note 8.
[131] "Generating PSpice models for X2Y capacitors from S-parameters," Phycomp Application Note, Jan. 2003.
[132] "Get the Most from X2Y Capacitors with Proper Attachment Techniques," X2Y Application Note 3008, V1, 2/23/06.
[133] "Guidelines for Printed Circuit Board Design," United Chemi-con.
[134] "HC-MOS Power Dissipation," Fairchild Semiconductor Application Note 303.
[135] "High-Speed Board Design Advisor: Power Distribution Network," Altera Tecnical Brief TB-092-1.0, Ver. 1.0, Nov. 2007.
[136] "High-Speed-CMOS designs address noise and I/O levels," Fairchild Semiconductor Application Note 375, Oct, 1984.
[137] "High Speed Decoupling Strategy," Hadco, June 23, 1998.
[138] "IBM PowerPC 440GP Embedded Processor PowerPC 440GP System Design Considerations," IBM Application Note.
[139] "Implementation Guidelines for 3.3V Pentium(R) Processors with VRE Specifications for Desktop and Server Designs," Intel Application Note AP-522, June 1997.
[140] "Implementing the RC5040 and RC5042 DC-DC Converters on Pentium(R) Pro Motherboards," Fairchild Application Note 42.
[141] "Implementing the RC5050 and RC5051 DC-DC Converters on Pentium(R) Pro Motherboards," Fairchild Application Note 50.
[142] "Intel386(TM) DX Microprocessor 32-bit CHMOS Microprocessor with Integrated Memory Management," Intel, Dec. 1995.
[143] "Intel486(TM) Processor Family Decoupling Recommendations," Intel.
[144] "Layout and Termination Techniques for Cypress Clock Generators," Cypress.
[145] "Layout Guidelines for the TPA300x Series Parts," Texas Instruments Application Report SLOA103, July 2003.
[146] "Less Noise in High Frequency Circuits."
[147] "Line Driving and System Design," National Semiconductor Application Note 991.
[148] "Logic-System Design Techniques Reduce Switching-CMOS Power," Fairchild Semiconductor Application Note 376, Oct. 1984.
[149] "Low Inductance Chip Capacitors," AVX.
[150] "Low Inductance Chip Capacitors," AVX.
[151] "Low Inductance Chip Capacitors," AVX.
[152] "M80C286 High Performance CHMOS Microprocessor with Memory Management and Protection," Intel, Feb. 1990.
[153] "Maintaining Clean Power," UltraCad.
[154] "Measurement and Comparative S21 Performance of Raw and Mounted Decoupling Capacitors," X2Y Note# 3006, V2, Apr. 24, 2007.
[155] "Microwave Datamate," IFR.
[156] "Mobile AMD-K6(R) Processor Power Supply Design," AMD Application Note 22495, May 1999.
[157] "Mounting precautions (OS-CON)," Sanyo.
[158] "Multilayer Ceramic Capacitors Precautions and Guidelines," Nippon Chemi-con.
[159] "Multilayer Ceramic EMI Filters," Syfer.
[160] "New and Lower ESR Capabilities in Polymer Products," Arrow Asian Times, July 2003.
[161] "News: CMC Replacements for Tantalum Capacitors."
[162] "Novacap Technical Brochure."
[163] "Omni Review," Omni Graphics, 2000.
[164] "Optimize Power Distribution Analysis In High-Speed System Designs," Nov. 20, 2000.
[165] "Oscilloscope Probing of PC133/Rambus Circuits," Pericom Application Note 21.
[166] "Panasonic Specialty Polymer Aluminum Electrolytic Capacitors (SP CAP)."
[167] "PCB Design Guidelines for Reduced EMI," Texas Instruments SZZA009, Nov. 1999.
[168] "Pentium(R) II Processor at 350MHz, 400MHz, and 450MHz," Intel, Aug. 1998.
[169] "Pentium(R) III Processor for the PGA370 Socket at 500MHz to 866MHz," Intel, Mar. 2000.
[170] "Pentium(R) III Processor Power Distribution Guidelines," Intel Application Note, Apr. 1999.
[171] "Pentium(R) III Xeon(TM) Processor Power Distribution Guidelines," Intel Application Note AP-912, Mar. 1999.
[172] "Pentium(R) Pro Family Developer's Manual, Volume 1: Specifications," Intel, 1996.
[173] "Pentium(R) Pro Processor Power Distribution Guidelines," Intel Application Note AP-523, Nov. 1995.
[174] "Pentium Processor," Intel, June 1997.
[175] "Pentium Processor Flexible Motherboard Design Guidelines," Intel Application Note AP-579, June 1997.
[176] "Pentium Processor with MMX(TM) Technology," Intel, June 1997.
[177] "Pentium(R) Processor With Voltage Reduction Technology: Power Supply Design Considerations for Mobile Systems," Intel Application Note AP-519, June 1997.
[178] "Perfect Timing A Design Guide for Clock Generation and Distribution," Cypress Semiconductor, 2002.
[179] "Piezoelectric Effect in Ceramic Capacitors," American Technical Ceramics.
[180] "Planning for High Speed XC9500XL Designs," Xilinx Application Note XAPP115, Sept. 28, 1998.
[181] "Planning for High Speed XC9500XV Designs," Xilinx Application Note XAPP361, Aug. 8, 2001.
[182] "Power Dissipation in High-Performance ASICs."
[183] "Power Integrity and Ground Bounce Simulation of High Speed PCBs," Ansoft Presentation #11.
[184] "Power Intel's Pentium II Microprocessor using the SC1151CS and the MP60F VRM," Semtech Application Note AN97-1, Mar. 11, 1998.
[185] "Power Supplies for Pentium(TM), PowerPC(TM), and Beyond," Maxim, 2000.
[186] "PowerPC 405GP System Design Considerations," IBM PowerPC Application Note, Feb. 21, 2001.
[187] "PowerPC 750 Design Guidelines," IBM PowerPC Applications Note.
[188] "PowerPC Embedded Processors PowerPC 740/750: Power Notes," IBM Application Note.
[189] "PowerPC Embedded Processors PowerPC 750CXe Family: Power Notes," IBM Application Note.
[190] "Powering Portable CPU Cores," Maxim, 2000.
[191] "Precautions and Guidelines," Nippon Chemi-con.
[192] "Precautions and guidelines for users (OS-CON)," Nippon Chemi-con.
[193] "Precautions and guidelines for users (Tantalum)," Nippon Chemi-con.
[194] "Precautions and Guidelines to Users for Aluminum Electrolytic Capacitors -Index-," Chemi-con.
[195] "Precautions and Guidelines to Users for Multilayer Ceramic Capacitors," Nippon Chemi-con.
[196] "Precautions and Guidelines to Users for Tantalum Electroytic Capacitors," Nippon Chemi-con.
[197] "Precautions in Using Tantalum Capacitors."
[198] "Precautions when using OS-CONs in circuits," Sanyo.
[199] "Preferred Laminates and Prepreg - Materials Properties Comparison," Merix.
[200] "Printed-Circuit-Board Layout for Improved Electromagnetic Compatibility," Texas Instruments SDYA011, Oct. 1996.
[201] "Processor Hall of Fame."
[202] "Protection, Decoupling, and Filtering of Cypress CMOS Circuits," Cypress.
[203] "Reliability Issues."
[204] "Sanyo Frequency Characteristics of OS-CON."
[205] "Sanyo OS-CON ESR Matrix Table."
[206] "SC1154 Hysteretic Controller," Semtech Application Note AN99-6, Mar. 1, 2000.
[207] "Selecting RF Chip Capacitors for Wireless Applications," American Technical Ceramics.
[208] "Shunt Measurement, (1) X2Y vs. (2) Standard Capacitors," X2Y.
[209] "Shunt Measurement X2Y Standard Capacitors," X2Y, Sept. 27, 2003.
[210] "Slot 1 Processor Power Distribution Guidelines," Intel Application Note AP-587, May 1997.
[211] "Solutions to Current High-Speed Board Design," Pericom Application Note 22.
[212] "SP Capacitor Q & A," Panasonic.
[213] "SRAM System Design Guidelines," Cypress Semiconductor, Oct. 25, 2002.
[214] "System design and layout techniques for noise reduction in MCU-based systems," Microprocessors and Microsystems, vol. 20, pp. 303-309, 1996.
[215] "System Power Board Distribution Guidelines for PID9q-604e(TM) (Mach 5)," IBM Application Note AN-022, Sept. 1997.
[216] "Tantalum Capacitors With Solid Electrolyte (Chip Type)," Mectron.
[217] "Tantalum Solid Electrolytic Capacitors Precautions and Guidelines," Nippon Chemi-Con.
[218] "Technical Notes on Aluminum Electrolytic Capacitors," Nichicon Cat. 8101C, June 1999.
[219] "The Buried Capacitance(TM) Design Guide," Hadco 95-06-001, 1995.
[220] "The Bypass Capacitor in High-Speed Environments," Texas Instruments SCBA007A, Nov. 1996.
[221] "The Facts about the Input Impedance of Power and Ground Planes," Sigrity.
[222] "The Feedthrough Varistor a New Weapon Against EMI,"
[222d] "There Was Prior Art, ZBC Inventor Says," Printed Circuit Design and Manufacture, vol. 20 no. 11, pp. 10,47, Nov. 2003.
[223] "Third Generation Power Conversion Solution for Pentium(R) II Motherboards," Fairchild Application Note 57.
[224] "Type ESRE Surface Mount Polymer Aluminum Electrolytic Capacitors."
[225] "Ultra-Low Impedance Measurements Using 2-Port Measurements," Agilent Technologies Application Note.
[226] "Understanding Aluminum Electrolytic Capacitors," United Chemi-con,
[227] "Understanding Buck Power Stages in Switchmode Power Supplies," Texas Instruments Application Report SLVA057, Mar. 1999.
[228] "Understanding Capacitor Inductance and Measurement in Power Bypass Applications," X2Y Note# 3009, V1, Feb. 27, 2006.
[229] "Unitrode Power Supply Design Seminar, SEM-1100," Unitrode, 1996.
[230] "Using a Spatial View to Understand and Solve Common Power Bypass Problems," Teraspeed Consulting Group, 2008.
[231] "Using Decoupling Capacitors," Cypress.
[232] "Vertical Orientation of ATC Chip Capacitors on Striplines," American Technical Ceramics.
[233] "Voltage Guidelines for Pentium Processors with MMX Technology," Intel Application Note AP-580, June 1997.
[234] "Voltage Regulator-Down (VRD) 10.0," Intel 252885-001, Apr. 2003.
[235] "Voltage Regulator-Down (VRD) 11.0," Intel, Nov. 2006.
[236] "VRM 8.1 DC-DC Converter Design Guidelines," Intel 243408-001, May 1997.
[237] "VRM 8.2 DC-DC Converter Design Guidelines," Intel 243773-002, Mar. 1999.
[238] "VRM 8.3 DC-DC Converter Design Guidelines," Intel 243870-004, Mar. 2000.
[239] "VRM 8.4 DC-DC Converter Design Guidelines," Intel 245335-001, Nov. 1999.
[240] "VRM 8.5 DC-DC converter Design Guidelines," Intel 249659-002, Mar. 2002.
[241] "VRM 9.0 DC-DC Converter Design Guidelines," Intel 249205-004, April 2002.
[242] "VRM 9.1 DC-DC Converter Design Guidelines," Intel 298646-001, January 2002.
[243] "X2Y Capacitors in IC Back-Side Mounting Applications," X2Y Note# 3010, V1, Oct. 25, 2006.
[244] "X2Y Comparative Decoupling Performance in 4 Layer PCBs," X2Y.
[245] "X2Y Inductance Ratings," X2Y Note# 3013, V1, Sept. 9, 2008.
[246] "X2Y Live FPGA Power Bypass,", X2Y Attenuators, Jan. 25, 2006.
[247] "X2Y Technology: Component Grounding," Application Note 7032001-1.
[248] "X2Y Technology Presentation," X2Y, Oct. 20, 2003.
[249] Abothu, Isaac Robin, Raj, P. Markondeya, Balaraman, Devarajan, Govind, Vinu, Bhattacharya, Swapan, Sacks, Michael D., Swaminathan, M., Lance, Michael J., and Tummala, Rao, "Development of High-k Embedded capacitors on Printing Wiring Board Using Sol-Gel and Foil Transfer Processes," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 514-520.
[249d] Abothu, Isaac Robin, Raj, P. Markondeya, Balaraman, Devarajan, Sacks, Michael D., Bhattacharya, Swapan, and Tummala, Rao R., "Low-Cost Embedded Capacitor Technology With Hydrothermal and Sol-Gel Processes," 2004 9th International Symposium on Advanced Packaging Materials, Atlanta, GA, Mar. 24-26, 2004, pp. 78-83.
[250] Abothu, Isaac Robin, Raj, P. Markondeya, Hwang, Jin Hyun, Kumar, Manish, Iyer, Mahadevan, Yamamoto, Hiroshi, and Tummala, Rao, "Processing, Properties and Electrical Reliability of Embedded Ultra-Thin Film Ceramic Capacitors in Organic Packages," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1014-1018.
[251] Abothu, Isaac Robin, Lee, Baik-Woo, Raj, P. Markondeya, Engin, Ege, Muthana, Prathap, Yoon, Chong K., Swaminathan, Madhavan, and Tummala, Rao R., "Tailoring the Temperature Coefficient of Capacitance (TCC), Dielectric Loss and Capacitance Density with Ceramic-Polymer Nanocomposites for RF Applications," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1790-1794.
[252] Abou-Alfotouh, Ahmed, Orabi, Mohamed, and Ghahary, Ali, "PCB Layout VIAs Effect on Power Supply Performance," Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition, Austin, TX, Feb. 24-28, 2008, pp. 339-345.
[252d] Adams, Tom, "Preventing MLCC Failures," Circuits Assembly, vol. 20 no. 8, pp. 17-19, Aug. 2009.
[253] Adolt, A. R., and Melroy, D. O.. "Humidity Effects on Reverse Bias Testing of Ta Film Capacitors," 18th Annual Reliability Physics Symposium, Las vegas, NV, Apr. 8-10, 1980, pp. 39-43.
[253d] Aggarwal, Ankur O., Naeli, Kianoush, Raj, P. Makondeya, Ayazi, Farrokh, Bhattacharya, Swapan, and Tummala, Rao R., "MEMS Composite Structures for Tunable Capacitors and IC-package Nano Interconnects," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 835-842.
[254] Ahmad, Mohamad M., Yamada, Koji, Meuffels, Paul, and Waser, Rainer, "Aging-induced dielectric relaxation in barium titanate ceramics," Applied Physics Letters, vol. 90 no. 11, pp. 112902-1-112902-3, Mar. 12, 2007.
[255] Ahmed, Faisal, and Safdar, Ishtiaq, "Designing for High Layer Count," Printed Circuit Design and Manufacture, vol. 24 no. 4, pp. 22-23, Apr. 2007.
[256] Akiyoshi, Teppei, Wang, Guanghui, Hofmann, Heath, and Lanagan, Mike, "Ripple Current and Electrical Noise Characterization of DC BUS Capacitors for Future Power Electronics," CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 159-171.
[257] Alam, Mohammed A., Azarian, Michael H., Osterman, Michael, and Pecht, Michael, "Reliability of Embedded Planar Capacitors under Temperature and Voltage Stress," CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[258] Alba, Carlos, and Fernandez, Oscar, "New Micropower Film Capacitors for Industrial & Automotive Converters," 24th Annual Capacitor and Resistor Technology Symposium, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. 263-266.
[259] Alberta, E. F., Hackenberger, W. S., Bhalla, A. S., Randall, C. A., and Shrout, T. R., "Ceramic Capacitors for Extreme Environments," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 142-147.
[260] Alberta, E. F., Hackenberger, W. S., Stringer, C. J., Randall, C. A., Shrout, T. R., and Schwarze, G., "High Temperature Ceramic Capacitors," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[261] Alberto, Frank, McGregor, David, Balliette, Bill, Andresakis, John, Gretzinger, Cindy, Greenlee, Bob, Riley, Lance P., Patrick, Steve, Grebenkemper, John, and Novak, Istvan, "Thin and Very Thin Laminates for Power Distribution Applications: What Is New in 2004?," DesignCon 2004, Santa Clara, CA, Feb. 2-5, 2004, pp. xx-xx.
[261d] Albina, A., Taberna, P. L., Cambronne, J. P., Simon, P., Flahaut, E., and Lebey, T., "Impact of the surface roughness on the electrical capacitance," Microelectronics Journal, vol. 37 no. 8, pp, 752-758, Aug. 2006.
[262] Albina, A., Taberna, P. L., Cambronne, J. P., Simon, P., Flahaut, E., and Lebey, T., "Influence of Carbonaceous Electrodes on Dielectric Capacitor," Proceedings of CARTS-Europe 2005, Prague, Czech Republic, Oct. 17-20, 2005, pp. 9-16.
[263] Alexander, John H., Jackson, Dawn A., and Bush, Eric L., "The Preparation and Properties of 4.7 uF 2220 Size 50 V Z5U Relaxor Multilayer Ceramic Capacitors," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-9, no. 4, pp. 464-468, Dec. 1986.
[264] Alexander, Mark, "Power Distribution System (PDS) Design: Using Bypass/Decoupling Capacitors," Xilinx Application Note XAPP623, Aug. 8, 2002.
[265] Alexander, Mark, "Power Distribution System (PDS) Design: Using Bypass/Decoupling Capacitors," Xilinx Application Note XAPP623 V2.0, Apr. 5, 2004.
[266] Ali, Syed W., "10+ Gb/second Signal Considerations," Printed Circuit Design and Manufacture, vol. 24 no. 5, pp. 16-18, May 2007.
[267] Ali, Syed W., "Mixed Signal Design Considerations," Printed Circuit Design and Fab , vol 25 no. 10, pp. 29-31, Oct. 2008.
[268] Al-Omari, A. N., and Lear, K. L., "Dielectric Characteristics of Spin-coated Dielectric Films Using On-wafer Parallel-plate Capacitors at Microwave Frequencies," IEEE Transactions on Dielectrics and Electrical Insulation, vol. 12 no. 6, pp. 1151-1161, Dec. 2005.
[269] Amaral, Acacio M. R., and Cardoso, A. J. Marques, "An Experimental Technique for Estimating the ESR and Reactance Intrinsic Values of Aluminum Electrolytic Capacitors," Proceedings of the IEEE Instrumentation and Measurement Technology Conference>, Sorrento, Italy, Apr. 24-27, 2006, pp. 1820-1825.
[270] Amorese. Gregory L., "Developing Sophisticated Models for Capacitors, Inductors and other Passive Components," Microwave Journal, vol. 46, no. 3, pp. 120-125, Mar. 2003.
[271] Amorese, Gregory L., "Reducing ESD Measurement Errors," Microwaves & RF, vol. 42, no. 4, pp. 75-80, Apr. 2003.
[271d] An, Hongfang, Wang, Ying, Wang, Xianyou, Li, Na, and Zheng, Liping, "The preparation of PANI/CA composite electrode material for supercapacitors and its electrochemical performance," Journal of Solid State Electrochemistry, vol. xx no. xx, pp. xx-xx, xxxx.
[272] An, Kay Hyeok, Kim, Won Seok, Park, Young Soo, Choi, Young Chul, Lee, Seung Mi, Chung, Dong Chul, Bae, Dong Jae, Lim, Seong Chu, and Lee, Young Hee, "Supercapacitors Using Single-Walled Carbon Nanotube Electrodes," Advanced Materials, vol. 13 no. 7, pp. 497-500, Apr. 2001.
[272d] Anderton, J. M., and Warrens, S. G., "Capacitor Cracking due to Thermal Shock in Wave Solder Processing," Soldering & Surface Mount Technology, vol. 1 no. 3, pp. 54-55, 1989.
[273] Andreas, Heather A., and Conway, Brian E., "Examination of the double-layer capacitance of an high specific-area C-cloth electrode as titrated from acidic to alkaline pHs," Electrochimica Acta , vol. 51 no. 28, pp. 6510-6520, Sept. 15, 2006.
[274] Andreescu, Daniel, Goia, Corina, Goia, Dan V., Blakely, Keith A., Donn, Randy B., and Groat, Eric, "Novel Copper Powders and Flakes for Electronic Applications," CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 15-20.
[275] Andreescu, Daniel, Goia, Corina, Goia, Dan V., Blakely, Keith A., Donn, Randy B., and Groat, Eric, "Novel Copper Powders and Flakes for Electronic Applications," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 38-44.
[276] Andresakis, J., Yamamoto, T., Yamazaki, K., Kuwako, F., Fukawa, Y., and Bennik, Glenn, "Simulation of Resonance Reduction in PCBs Utilizing Embedded Capacitance," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[276d] Andresakis, John, Yamamoto, Takuya, and Biunno, Nick, "New non-reinforced substrates for use as embedded capacitors," Circuit World, vol. 30 no. 1, pp. 36-41, 2004.
[277] Andresakis, John, Pramanik, Pranabes, Brandler, Daniel, and Nong, Dong, "Novel Substrate with Combined Embedded Capacitance and Resistance for Better Electrical Performance and Higher Integration," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1544-1547.
[278] Andresakis, John, Yamamoto, Takuya, Pramanik, Pranabes, and Buinno, Nick, "Performance of Polymeric Ultra-thin Substrates for use as Embedded Capacitors: Comparison of Unfilled and Filled Systems with Ferroelectric Particles," Proceedings of the Technical Conference (CDROM) IPC/SMEMA Council APEX 2004 Conference, Anaheim, CA, Feb. 24-26, 2004, pp. S39-1-1-S39-1-8.
[279] Andresakis, John, Yamazaki, Kazuhiro, Kuwako, Fujio, and Fukawa, Yoshi, "Simulation Tools Speed the Design of Embedded Capacitance Layers," Printed Circuit Design and Manufacture, vol. 23 no. 12, pp. 24-29, Dec. 2006.
[280] Andresakis, John, Yamamoto, Takuya, Pramanik, Pranabes, Brandler, Daniel, and Nong, Dong, "Substrate with Combined Embedded Capacitance and Resistance for Better Electrical Performance and Higher Integration," IPC Printed Circuits Expo, APEX and the Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S22-02-1-S22-02-6.
[281] Andresakis, John, Yamamoto, Takuya, and Pramanik. Pranabes, "Substrate with Combined Embedded Capacitance and Resistance for Better Electrical Performance and Higher Integration," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[282] Andresakis, John, Smith, Norm, Knighten, Jim, Fan, Jun, Harvey, Mark, and Fukawa, Yoshi, "Use of Buried Capacitance Layers: Performance and Lessons from a Real World Example," 2008 SMTA International Conference Proceedings, Orlando, FL, Aug. 17-21, 2008, pp. 57-65.
[283] Ang, Simon S., and Brown, W. D., "Tantalum Oxide Dielectric for Embedded Capacitor Applications," Proceedings of the 6th International Conference on Properties and Applications of Dielectric Materials, Volume 2, Xi'an, China, June 21-26, 2000, pp. 841-844.
[284] Anolick, Eugene S., and Nelson, Glenn R., "Low Field Time Dependent Dielectric Integrity," 17th Annual Reliability Physics Symposium, San Francisco, CA, Apr. 24-26, 1979, pp. 8-12.
[284d] Antano-Lopez, Rene, Keddam, Michel, and Takenouti, Hisasi, "A new experimental approach to the time-constants of electrochemical impedance: frequency response of the double layer capacitance," Electrochimica Acta, vol. 46 no. 24-25, pp. 3611-3617, Aug. 15, 2001.
[285] Anthony, David J., "Alternative X2Y Component Attachment for Power Filtering," X2Y, Dec. 23, 2003.
[286] Anthony, David J., "DC-to-DC Converters using X2Y Technology," X2Y, Dec. 3, 2003.
[287] Anthony, David J., "Decoupling Multiple Power Planes," X2Y, Dec. 23, 2003.
[288] Anthony, David J., "Ferrite Bead Removal," X2Y, July 2, 2003.
[289] Anthony, David J., "IC Decoupling and EMI Suppression using X2Y Technology," X2Y, Dec. 15, 2003.
[290] Anthony, David J., "Internal Model of X2Y," X2Y, Sept. 2, 2003.
[291] Anthony, David J., "Replacing Feedthrough Capacitors with X2Y Technology," X2Y, Jan. 5, 2004.
[292] Anthony, David J., "RF Filtering for Audio Amplifier Circuits," X2Y, May 9. 2003.
[293] Anthony, David J., "X2Y Circuit 1 & Circuit 2 Configurations," X2Y, Nov. 25, 2003.
[294] Anthony, David J., "X2Y DC Power Filtering (Ceramic, Ferrite, MOV)," X2y, Aug. 03, 2003.
[295] Anthony, David J., "X2Y G1/G2 Attachment," X2Y, Oct. 27, 2003.
[296] Anthony, David J., "X2Y Solution for Decoupling Printed Circuit Boards," X2Y, Dec. 12, 2003.
[297] Anthony, Tony, and Musil, Ken, "New Capacitor Technology," Future Circuits International, no. 5, pp. 63-69, xxxx.
[298] Antonini, G., Orlandi, A., and Rizzi, R. M., "Different Strategies for Circuit Characterization of Power Delivery Networks," 2009 20th International Zurich Symposium on Electromagnetic Compatibility, Zurich, Switzerland, Jan. 12-16, 2009, pp. 341-344.
[299] Antoniolli, Ivan, and End, Fernando, "Aluminum Electrolytic Capacitors for Heavy Duty DC Applications," 24th Annual Capacitor and Resistor Technology Symposium, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. 197-203.
[300] Arakaki, Hitoshi, Iguchi, Daisuke, and Ueno, Osamu, "Simuration for Reduction Effect on Electromagnetic Noise Radiation Using Board-Edge Capacitors" 1999 International Symposium on Electromagnetic Compatibility, Tokyo, Japan, May 17-21, 1999, pp. 29-32.
[300d] Arbizzani, C., Mastragostino, M., and Meneghello, L., "Characterization by Impedance Spectroscopy of a Polymer-Based Supercapacitor," Electrochimica Acta, vol. 40 no. 13-14, pp. 2223-2228, Oct. 1995.
[301] Arbizzani. Catia, Mastragostino, Marina, Meneghello, Luca, and Paraventi, Ruggero, "Electronically Conducting Polymers and Activated Carbon: Electrode Materials in Supercapacitor Technology," Advanced Materials, vol. 8 no. 4, pp. 331-334, Apr. 1996.
[301d] Arbizzani, Catia, Mastragostino, Marina, and Meneghello, Luca, "Polymer-Based Redox Supercapacitors: A Comparative Study," Electrochimica Acta, vol. 41 no. 1, pp. 21-26, Jan. 1996.
[302] Archambeault, Bruce, and Ruehli, Albert E., "Analysis of Power/Ground- Plane EMI Decoupling Performance Using the Partial-Element Equivalent Circuit Technique," IEEE Transactions on Electromagnetic Compatibility, vol. 43, no. 4, pp. 437-445, Nov. 2001.
[303] Archambeault, Bruce, "Analyzing Power/Ground Plane Decoupling Performance Using the Partial Element Equivalent Circuit (PEEC) Simulation Technique," Conformity, vol. 7, no. 5, pp. 12-19, May 2002.
[304] Archambeault, Bruce, "Analyzing Power/Ground Plane Decoupling Performance Using the Partial Element Equivalent Circuit (PEEC) Simulation Technique," IEEE International Symposium on Electromagnetic Compatibility Symposium Record Volume Two, Washington, D.C., Aug. 21-25, 2000, pp. 779-784.
[304d] Archambeault, Bruce, "Decoupling Capacitor Connection Inductance," EMC, no. 221, pp. 71-72, Spring 2009.
[305] Archambeault, Bruce, "Design Tips: PCB Decoupling Capacitor Mounting Top - Bottom - Either? ," EMC, no. 211, pp. 85-86, Fall 2006.
[306] Archambeault, Bruce, "Designing with Decoupling Capacitors," Printed Circuit Design and Manufacture, vol. 24 no. 4, pp. 16-17, Apr. 2007.
[306d] Archambeault, Bruce, "Effective Decoupling Capacitors," Printed Circuit Design and Fab , vol. 26 no. 5, pp. xx-xx, May 2009.
[307] Archambeault, Bruce, and Ruehli, Albert, "Electrical Package Modeling Including Voltage and Ground Reference Planes Using the Partial Element Equivalent Circuit (PEEC) Method," Electromagnetic Compatibility 1999, Zurich, Switzerland, Feb. 16-18, 1999, pp. 233-238.
[308] Archambeault, Bruce, "Eliminating the MYTHS about printed circuit board power/ground plane decoupling," ITEM 2001, pp. 106-111, 2001.
[309] Archambeault, Bruce, Mao, J., Luan, S., Drewniak, J. L., and Van Doren, T. P., "Estimation of power/ground-reference plane decoupling noise in multi-layer PC boards," ITEM 2002, pp. 157-163, 2002.
[310] Archambeault, Bruce, "Main Causes of EMI in PCBs & Effective Power/ Ground Plane Decoupling for PCB."
[311] Archambeault, Bruce, Wetmore, Phil, Yuan, Xingchao, and Mathews, Ron, "Modeling the Effectiveness of Decoupling Capacitors for Multilayer PCBs," 1998 IEEE EMC Symposium Record Volume One, Denver, CO, Aug. 24-28, 1998, pp. 522-526.
[312] Archambeault, Bruce, Bogatin, Eric, Steinberger, Michael, Swaminathan, Madhavan, and Novak, Istvan, "Power Distribution Planes: To Split or Not to Split?," DesignCon 2009, Santa Clara, CA, Feb. 2-5, 2009, pp. xx-xx.
[313] Archambeault, Bruce, "Power Ground-Reference Plane Decoupling Analysis of Design Alternatives," 2001 IEEE EMC International Symposium Symposium Record - Volume 2, Montreal, Canada, Aug. 13-17, 2001, pp. 1217-1220.
[314] Archambeault, Bruce, and White, Doug, "Technical Report - Printed Circuit Board Decoupling Capacitor Performance for Optimum EMC Design,"Jan. 1999.
[315] Armstrong, Keith, "Design Techniques for EMC Part 5: PCB Design and Layout."
[316] Ashburn, Travis, and Skamser, Dan, "Highly Accelerated Testing of Capacitors for Medical Applications," 2008 Medical Electronics Symposium, Anaheim, CA, Jan. 29-31, 2008, pp. xx-xx.
[317] Ashmore, Clive, "The Next Leap of Faith?," Circuits Assembly, vol. 20 no. 2, pp. 15, Feb. 2009.
[318] Atanassova, E., Spassov, D., Paskaleva, A., Georgieva, M., and Koprinarova, J., "Electrical characteristics of Ti-doped Ta2O5 stacked capacitors," Thin Solid Films, vol. 516 no. 23, pp. 8684-8692, Oct. 1, 2008.
[319] Auernheimer, Joel, "New Methods for Power Distribution System Design and Analysis," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 550-555.
[320] Aygun, Kemal, and Hu, Grace, "Characterization of Halogen-Free Package Materials Using Cavity Resonators," 17th Topical Meeting on Electrical Performance of Electronic Packaging , San Jose, CA, Oct. 27-29, 2008, pp. 147-150.
[321] Azuma, Takahiro, "Progress Adapts 3-Terminal Capacitors for Use in IC Power Lines," AEI, pp. 54-56, July 2002.
[322] Baker, Bonnie C., "12-Bit Analog Layout Techniques."
[322d] Balaraman, D., Raj, P. M., Wan, L., Abothu, I. R., Bhattacharya, S., Dalmia, S., Lance, M. J., Swaminathan, M., Sacks, M. D., and Tummala, R. R., "BaTiO3 Films by Low-Temperature Hydrothermal Techniques for Next Generation Packaging Applications," Journal of Electroceramics, vol. 13 no. 1-3, pp. 95-100, July 2004.
[323]Balaraman, Devarajan, Raj, P. M., Abothu, Robin, Bhattacharya, S., Sacks, Michael, Lance, Michael,; Meyer, Harry, Swaminathan, Madhavan, and Tumrnala, Rao, "Exploring the Limits of Low Cost, Organics-Compatible High-k Ceramic Thin-Films for Embedded Decoupling Applications," 2005 Proceedings 55th Electronic Components & Technology Conference, Volume 2, Orlando, FL, May 31-June 3, 2005, pp. 1215-1221.
[323a] Balaraman, Devarajan, Raj, P. Markondeya, Tanikella, Ravi, Kohl, Paul, Bhattacharya, Swapan, and Tummala, Rao, "Low temperature (<100° C) Hydrothermal Synthesis of High K-low Loss BaTiO3 Films for Integral Capacitors," Proceedings of 4th Electronics Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp. 79-84.
[323d] Balaraman, Devarajan, Raj, P. Markondeya, Bhattacharya, Swapan, and Tummala, Rao R., "Novel Hydrothermal Processing (<100° C) of Ceramic-Polymer Composites for Integral Capacitor Applications," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 1699-1703.
[324] Balaraman, Devarajan, Choi, Jinwoo, Patel, Vijay, Raj, P. Markondeya, Abothu, Isaac Robin, Bhattacharya, Swapan, Wan, Lixi, Swaminathan, Madhavan, and Tummala, Rao, "Simultaneous Switching Noise Suppression Using Hydrothermal Barium Titanate Thin Film Capacitors," 54th Electronic Components & Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp. 282-288.
[325] Balaraman, Devarajan, Raj, P. Markondeya, Abothu, Isaac Robin, Bhattacharya, Swapan, Sacks, Michael D., Tummala, Rao, and Lance, Michael J., "Synthesis of Ceramic Thin Films for Organic Board Compatible Integral Capacitors - Processing and Characterization," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 200-205.
[326] Balducci, Andrea, Henderson, Wesley A., Mastragostino, Marina, Passerini, Stefano, Simon, Patrice, and Soavi, Francesca, "Cycling stability of a hybrid activated carbon//poly(3-methylthiophene) supercapacitor with N-butyl-N-methylpyrrolidinium bis(trifluoromethanesulfonyl)imide ionic liquid as electrolyte," Electrochimica Acta, vol. 50 no. 11, pp. 2233-2237, Apr. 1, 2005.
[327] Balliette, Bill, "Superior Decoupling for High Speed Digital Electronics with 3M(TM) Embedded Capacitor Material," 3M, Nov. 12, 2003.
[328] Bandyopadhyay, Jaya, Chahal, Premjeet, and Swaminathan, Madhavan, "Importance of Damping and Resonance in Thin-Film Integrated Decoupling Capacitor Design," Proceedings of the IEEE 6th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, CA, Oct. 27-28, 1997. pp. 31-34 [329] Bandyopadhyay, Jaya, "Power Distribution Modeling and Decoupling of Multilayer Printed Circuit Board," Proceedings of the 8th IEEE Topical Meeting on Electrical Performance of Electronic Packaging, San Diego, CA, Oct. 25-27, 1999, pp. 103-106.
[329d] Banford, H. M., Fouracre, R. A., Faucitano, A., Buttafava, A., and Martinotti, F., "The Influence of Chemical Structure on the Dielectric Behavior of Polypropylene," IEEE Transactions on Dielectrics and Electrical Insulation, vol. 3 no. 4, pp. 594-598, Aug. 1996.
[330] Banyai, Chris, and Gerke, Daryl, "EMI Design Techniques for Microcontrollers in Automotive Applications," Intel Application Note AP-711, Feb. 1996.
[331] Barkal, Susan, Prevallet, Mike, Prymak, John, and Staubli, Paul, "High Temperature Ceramic and Tantalum Capacitors," CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. xx-xx.
[332] Barnes, John R., "Designing Electronic Equipment for ESD Immunity," Printed Circuit Design, vol. 18, no. 7, pp. 18-26, July 2001.
[333] Barnes, John R., "Designing Electronic Systems for ESD Immunity," Conformity, vol. 8, no. 1, pp. 18-27, Feb. 2003.
[334] Barnes, John R., "Power Distribution on Printed Circuit Boards," Apr. 30, 2000 (unpublished).
[335] Bateman, Cyril, "Evaluate capacitors for SMPS designs," Electronics World, vol. 106 no. 1772, pp. 696-702, Sept. 2000.
[336] Bateman, Cyril, "Power dissipation in capacitors," Electronics World, vol. 101 no. xxxx, pp. 287-290, Apr. 1995.
[337] Bateman, Cyril, "Understanding capacitor," Electronics World, vol. 104 no. xxxx, pp. 594-599, Aug. 1998.
[338] Bateman, Cyril, "Understanding capacitors," Electronics World, vol. 103 no. xxxx, pp. 998-1003, Dec. 1997.
[339] Bateman, Cyril, "Understanding Capacitors," Electronics World, vol. 104 no. xxxx, pp. 324-326,328,330-333, Apr. 1998.
[340] Bateman, Cyril, "Understanding capacitors," Electronics World, vol. 104 no. xxxx, pp. 391-396, May 1998.
[341] Bateman, Cyril, "Understanding capacitors," Electronics World, vol. 114 no. xxxx, pp. 640-644, Aug. 1998.
[342] Bateman, Cyril, "Understanding capacitors Aluminium and tantalum options," Electronics World, vol. 104 no. xxxx, pp. 495-503, June 1998.
[343] Bateman, Cyril, "Understanding capacitors II," Electronics World, vol. 104 no. xxxx, pp. 126-132, Feb. 1998.
[344] Beal, Sam, "Evaluating HDI Technologies for High-Bandwidth Applications."
[345] Becker, W., McCredie, B., Wilkins, G., and Iqbal, A., "Power Distribution Modelling of High Performance First Level Computer Packages," IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, Oct. 20-22, 1993, pp. 202-205.
[346] Beker, Benjamin, and Wallace, Doug, "A Methodology for Optimizing the Selection of Decoupling Components for Power Delivery Systems of High-Performance ASICs," Digest of 11th IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, Oct. 21-23, 2002, pp. 195-198.
[347] Beker, Benjamin, Cokkinides, George, and Templeton, Allen, "Electrical Performance of Integrated Decoupling Capacitor Arrays," Proceedings of the 5th Topical Meeting on Electrical Performance of Electronic Packaging , Napa, CA, Oct. 28-30, 1996, pp. 83-85.
[348] Beker, Benjamin, Cokkinides, George, and Templeton, Allen, "EM Analysis of Low Inductance Decoupling Capacitors," IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, Oct. 20-22, 1993, pp. 82-84.
[349] Beker, Ben, Charbonneau, Rick, St. Cyr, Valerie, Greenlee, Bob, Grebenkemper, John, Gretton, Jason, Howard, James, Hsu, Kang, McGregor, David, Novak, Istvan, Peiffer, Joel S., and Sheffield, Robert, "Thin PCB Laminates for Power Distribution - How Thin is Thin Enough?," DesignCon 2002, High-Performance System Design Conference, San Jose, CA, January 28-31, 2002.
[350] Beker, Benjamin, Cokkinides, George, and Templeton, Allen, "Modeling and Design of Decoupling Capacitors for Applications in MCMs," Proceedings of the 1994 International Electronics Packaging Conference , Atlanta, GA, Sept. 25-28, 1994, pp. 38-44.
[351] Belanger, Daniel, Brousse, Thierry, and Long, Jeffrey W., "Manganese Oxides: Battery Materials Make the Leap to Electrochemical Capacitors," Electrochemical Society Interface, vol. 17 no. 1, pp. 49-52, Spring 2008.
[352] Bendaoud, Soufiane, "Put The Whammy On RF Noise, EMI Without Hurting Performance," June 9, 2003.
[352d] Bergenthal, Jim, and Prymak, John, "Electrostatic Discharge (ESD) Concerns for Ceramic Capacitors," 19th Annual Capacitor and Resistor Technology Symposium, New Orleans, LA, Mar. 1999, pp. xx-xx.
[353] Berghe, S. Van den, Olyslager, F., Zutter, D. De, Moerloose, J. De, and Temmerman, W., "Power Plane Resonances as a Source of Delta-I noise and the influence of Decoupling Capacitors," IEEE 1997 International Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 18-22, 1997, pp. 145-148.
[354] Beyene, Wendemagegnehu, Yuan, Chuck, Kim, Joong-Ho Kim, and Swaminathan, Madhavan, "Modeling and Analysis of Power Distribution Networks for Gigabit Applications," Proceedings of the Fourth International Symposium on Quality Electronic Design, location?, Mar. 24-26, 2003, pp. 235-240.
[355] Bharath, Krishna, Engin, Ege, and Swaminathan, Madhavan, "Automatic Package and Board Decoupling Capacitor Placement Using Genetic Algorithms and M-FDM," Design Automation Conference, Anaheim, CA, June 8-13, 2008, pp. 560-565.
[356] Bharath, Krishna, Engin, Ege, Swaminathan, Madhavan, Uriu, Kazuhide, and Yamada, Toru, "Computationally Efficient Power Integrity Simulation for System-on-Package Applications," 44th ACM/IEEE Design Automation Conference, San Diego, June 4-8, 2007, pp. 612-617.
[357] Bharath, Krishna, Engin, Ege, Swaminathan, Madhavan, Uriu, Kazuhide, and Yamada, Toru, "Efficient Modeling of Package Power Delivery Networks with Fringing Fields and Gap Coupling in Mixed Signal Systems," 15th Topical Meeting on Electrical Performance of Electronic Packaging, Scottsdale, CA, Oct. 23-25, 2006, pp. 59-62.
[358] Bharath, Krishna, Engin, Ege, Swaminathan, Madhavan, Uriu, Kazuhide, and Yamada, Toru, "Efficient Simulation of Power/Ground Planes for SiP Applications," 2007 Proceedings 57th Electronic Components & Technology Conference , Reno, NV, May 29-June 1, 2007, pp. 1199-1205.
[359] Bharath, Krishna, Sankaran, Nithya, Engin, A. Ege, and Swaminathan, Madhavan, "Multi-Layer Fringe-Field Augmentations for the Efficient Modeling of Package Power Planes," 17th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, CA, Oct. 27-29, 2008, pp. 331-334.
[360] Bharath, Krishna, Engin, Ege, Swaminathan, Madhavan, Uriu, Kazuhide, and Yamada, Toru, "Signal and Power Integrity Co-Simulation for Multi-layered System on Package Modules," IEEE International Symposium on Electromagnetic Compatibility, Honolulu, HI, July 8-13, 2007, pp. xx-xx.
[361] Bhardwaj, Nitin, "Decoupling Capacitance."
[361d] Bhattacharya, S. K., and Tummala, R. R., "Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors," Microelectronics Journal, vol. 32 no. 1, pp. 11-19, Jan. 2001.
[361h] Bhattacharya, S., Tummala, R. R., and Chahal, P., "Integration of Polymer/Ceramic Thin Film Capacitors on PWB," Proceedings 3rd International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Braselton, GA, Mar. 9-12, 1997, pp. 68-70.
[362] Bhattacharya, Swapan K., and Tummala, Rao R., "Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives," Journal of Electronic Packaging, vol. 124 no. 1, pp. 1-6, Mar. 2002.
[362d] Bhattacharya, Swapan K., and Tummala, Rao R., "Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates," Journal of Materials Science: Materials in Electronics, vol. 11 no. 3, pp. 253-268, Apr. 2000.
[362h] Bhattacharya, Swapan K., Raj, P. Markondeya, Balaraman, Devarajan, Windlass, Hitesh, and Tummala, Rao R., "Process development for PWB compatible embedded capacitors," Circuit World, vol. 30 no. 1, pp. 31-35, 2004.
[363] Biler, M., and Sita, Z., "Ta Capacitors with Conductive Polymer Stable in Humidity," Proceedings CARTS Asia 2005, Taipei, Taiwan, Oct. 11-13, 2005, pp. 123-128.
[364] Biler, M., and Sita, Z., "Ta Capacitors with Conductive Polymer Stable in Humidity," Proceedings of CARTS-Europe 2005, Prague, Czech Republic, Oct. 17-20, 2005, pp. 132-137.
[365] Biler, M., and Sita, Z., "Ta Capacitors with Conductive Polymer Stable in Humidity," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[366] Bin, Liu, Wei, Chen, Wenyu, Shang, Qingfeng, Liu, Lei, Chu, and Shoutian, Chen, "The Influence of the Partial Discharge on the Electrical Aging Property of High Voltage Ceramic Capacitor," Proceedings of 1998 International Symposium on Electrical Insulating Materials, Toyohashi, Japan, Sept. 27-30, 1998, pp. 763-765.
[367] Biunno, Nicholas, and Novak, Istvan, "Frequency Domain Analysis and Electrical Properties Test Method for PCB Dielectric Core Materials," DesignCon 2003 East, High-Performance System Design Conference, Boston, MA, June 23-25, 2003.
[368] Black, Jennifer, and Andreas, Heather A., "Effects of charge redistribution on self-discharge of electrochemical capacitors," Electrochimica Acta, vol. 54 no. 13, pp. 3568-3574, May 1, 2009.
[369] Blais, Peter, Long, Bill, Prymak, John, and Prevallet, Mike, "Facedown Terminations for Higher CV and Lower ESL," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[370] Blando, Gustavo, Miller, Jason R., Winterberg, Douglas, and Novak, Istvan, "Crosstalk In Via Pin-Fields, Including the Impact of Power Distribution Structures," DesignCon 2009, Santa Clara, CA, Feb. 2-5, 2009, pp. xx-xx.
[371] Bogatin, Eric, "Bouncing Out Ground Bounce," Printed Circuit Design & Manufacture, vol. 20, no. 8, pp. 22-27, Aug. 2003.
[372] Bogatin, Eric, "Debunking Myths About Power Distribution System Design," Printed Circuit Design.
[373] Bogatin, Eric, and Ferry, Chuck, "Efficiently Designing Power Distribution Networks (PDN)," Bogatin Enterprises.
[374] Bogatin, Eric, "Fact or Fiction?," Printed Circuit Design, vol. 18, no. 12, pp. 14-18, Dec. 2001.
[375] Bogatin, Eric, "Five Emerging Technologies that will Revolutionize High Speed Systems," High-Speed Communications Alliance, June 26, 2003.
[376] Bogatin, Eric, "Five Myths about the PDN," Bogatin Enterprises.
[377] Bogatin, Eric, "High Bandwidth Measurement Techniques for Low Inductance Structures," 2003.
[378] Bogatin, Eric, "IC Package Technology and Forecast."
[379] Bogatin, Eric, "Inductance Analysis of BGA and CSP Packages," May 6, 1999.
[380] Bogatin, Eric, "Looking Under the Sheets: Inductance," Printed Circuit Design and Manufacture, vol. 24 no. 11, pp. 48, Nov. 2007.
[381] Bogatin, Eric, and Ferry, Chuck, "Make simulation your friend," EDA Tech Forum, vol. 6 no. 2, pp. 8-11, Apr. 2009.
[382] Bogatin, Eric, "Materials Requirements for High Performance Digital Systems," Circuitree Magazine, Aug. 2003.
[383] Bogatin, Eric, "No Faith," Printed Circuit Design and Manufacture, vol. 23 no. 8, pp. 48, Aug. 2006.
[384] Bogatin, Eric, "PCB Directions," Printed Circuit Design & Manufacture, vol. 20, no. 10, pp. 36.
[385] Bogatin, Eric, "Rules of Thumb I Have Known and Loved," Oct. 31, 1999.
[386] Bogatin, Eric, "Rules of Thumb I Have Known and Loved," Printed Circuit Design & Manufacture, vol. 20, no. 9, pp. 33.
[387] Bogatin, Eric, "Signal Integrity Advantages of HDI Technology," Oct. 29, 1999.
[388] Bogatin, Eric, "Signal Integrity and HDI Substrates," June 1999.
[389] Bogatin, Eric, "Signal Integrity: Problems and Solutions," Mar. 1, 2000.
[390] Bogatin, Eric, "SPICEing Up Impedance Profiles," Printed Circuit Design and Manufacture, vol. 23 no. 9, pp. 48, Sept. 2006.
[391] Bogatin, Eric, and Grasso, Charles, "The Power of Planes," Printed Circuit Design, Feb. 2002.
[392] Bogatin, Eric, "What Really Is Inductance?," Oct. 30, 1999.
[393] Bogatin, Eric, "When it comes to power distribution network design, put your trust in analysis," Printed Circuit Design and Fab, vol. 23 no. 8, pp. xx-xx, Aug. 2006.
[393d] Boggs, S. A., "Semi-empirical High-field Conduction Model for Polyethylene and Implications thereof," IEEE Transactions on Dielectrics and Electrical Insulation , vol. 2 no. 1, pp. 97-106, Feb. 1995.
[393h] Bohinc, Klemen, Kralj-Iglic, Veronika, and Iglic, Ales, "Thickness of electrical double layer. Effect of ion size," Electrochimica Acta, vol. 46 no. 19, pp. 3033-3040, June 15, 2001.
[394] Bonomo, Walter, Hooper, Geoff, Richardson, David, Roberts, Dean, and van de Steeg, Theo, "Failure modes in capacitors," Electronic Products, vol. 50 no. 7, pp. 53-55, Dec. 2007.
[395] Borland, William, "Designing for Embedded Passives," Printed Circuit Design, vol. 18, no. 8, pp. 16-21, Aug. 2001.
[396] Bowers, John S., "Characterization of Reconstituted Mica Paper Capacitors used in High Voltage and High Temperature Power Electronics Applications," Proceedings of 1996 IEEE Applied Power Electronics Conference, Volume 2, San Jose, CA, Mar. 3-7, 1996, pp. 737-742.
[386d] Bray, K. R., Wu, R. L. C., Fries-Carr, S., and Weimer, J., "Aluminum oxynitride dielectrics for multilayer capacitors with higher energy density and wide temperature properties," Thin Solid Films, vol. 518 no. 1, pp. 366-371, Nov. 2, 2009.
[397] Bray, Kevin R., Wu, Richard L. C., Fries-Carr, Sandra, and Weimer, Joseph, "Aluminum Oxynitride Capacitors for Multilayer Devices with Higher Energy Density and Wide Temperature Properties," CARTS USA 2008 Proceedings , Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[398] Bray, Kevin R., Wu, Richard L. C., Weimer, Joseph, and Fries-Carr, Sandra, "Aluminum Oxynitride Dielectrics for High Power, Wide Temperature Capacitor Applications," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[399] Bray, Kevin R., Wu, Richard L. C., Fries-Carr, Sandra, and Weimer, Joseph, "Multilayer Aluminum Oxynitride Capacitors for Higher Energy Density, Wide Temperature Applications," CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 371-379.
[400] Brennan, Thomas F., "Ceramic Capacitor Insulation Resistance Failures Accelerated by Low Voltage," 16th Annual Reliability Physics Symposium, San Diego, CA, Apr. 18-20, 1978, pp. 68-74.
[401] Brenneman, Michael, "Integrating Packaging Effects in High-Speed IC Design,"
[402] Brevnov, Dmitri A., and Olson, Tim S., "Double-layer capacitors composed of interconnected silver particles and with a high-frequency response," Electrochimica Acta, vol. 51 no. 7, pp. 1172-1177, Jan. 5, 2006.
[403] Brim, Brad, "Cost-Optimized PCB Power Integrity Design," Printed Circuit Design and Manufacture, vol. 24 no. 3, pp. 22-23, 26-27, Mar. 2007.
[404] Brim, Brad, "PCB Signal Integrity, Power Integrity and EMC Challenges," Printed Circuit Design and Fab, vol. 25 no. 12, pp. 34-37, Dec. 2008.
[404d] Brim, Brad, "Power Integrity: Controlling the Noise," Printed Circuit Design and Fab, vol. 26 no. 9, pp. xx-xx, Sept. 2009.
[405] Brooks, Douglas, "Bypass Capacitors An Interview With Todd Hubing," Printed Circuit Design, vol. 15, no. 3, pp. 30-32, Mar. 1998.
[406] Brooks, Douglas G., "ESR and Bypass Capacitor Self-Resonant Behavior," Feb. 21, 2000.
[407] Brooks, Doug, "ESR and Bypass Capacitors," Printed Circuit Design, vol. 17, no. 6, pp. 30-32, June 2000.
[408] Brooks, Douglas, "Ground Bounce Part 2," UltraCAD Design.
[409] Brooks, Doug, "High Planes Splitter," Printed Circuit Design, vol. 17, no. 12, pp. 14-18, Dec. 2000.
[410] Brooks, Douglas, "Maintaining Clean Power II," Printed Circuit Design, vol. 14, no. 5, pp. 28-29, May 1997.
[411] Brooks, Douglas, "Maintaining clean power, part one," Printed Circuit Design, vol. 14, no. 4, pp. 30-33, Apr. 1997.
[412] Brooks, Doug, "Noise-Fighting Components," Printed Circuit Design, vol. 17, no. 3, pp. 30-35, Mar. 2000.
[413] Brooks, Doug, "Splitting Planes for Speed and Power," UltraCAD.
[414] Brooks, Doug, "This Month's Quiz," UltraCAD.
[414d] Brouji, H. El, Briat, O., Vinassa, J-M., Henry, H., and Woirgard, E., "Analysis of the dynamic behavior changes of supercapacitors during calendar life test under several voltages and temperatures conditions," Microelectronics Reliability, vol. 49 no. 9-11, pp., 1391-1397, Sept.-Nov. 2009.
[415] Brouji, H. El, Briat, O., Vinassa, J.-M., Bertrand, N., and Woirgard, E., "Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing tests," Microelectronics Reliability, vol. xx, no. x, pp. xx-xx, xxxx.
[416] Brown, R. W., "Empirically-derived capacitor characteristic formulas from distributed modelling," IET Circuits, Devices & Systems, vol. 1 no. 2, pp. 117-125, Apr. 2007.
[417] Brown, Robert W., "Distributed Circuit Modeling of Multilayer Capacitor Parameters Related to the Metal Film Layer," IEEE Transactions on Components and Packaging Technologies, vol. 30 no. 4, pp. 764-773, Dec. 2007.
[418] Brown, Robert W., "Equivalent Series and Parallel Equivalent Circuits for Metallized Film Capacitors," 2007 IEEE Region 10 Conference, Taipei, Taiwan, Oct. 30-Nov. 2, 2007, pp. xx-xx.
[419] Brown, Robert W., "Using Distributed Circuits to Model Power Capacitor Behavior," 2005 IEEE Region 10, Melbourne, Australia, Nov. 21-24, 2005, pp. xx-xx.
[420] Brown, Robert W., "Linking Corrosion and Catastrophic Failure in Low-Power Metallized Polypropylene Capacitors," IEEE Transactions on Device and Materials Reliability, vol. 6 no. 2, pp. 326-333, June 2006.
[421] Brown, Robert W., "Modeling of Capacitor Parameters Related to the Metal Film Layer With Partial Edge Disconnection," IEEE Transactions on Components and Packaging Technologies, vol. 30 no. 4, pp. 774-780, Dec. 2007.
[422] Brunette, Brian, and Reynolds, Chris, "Wet Tantalum Capacitors Meet DSCC 93026," Power Electronics Technology, vol. 35 no. 1, pp. 34-36, Jan. 2009.
[423] Brusse, Jay A., and Sampson, Michael J., "COTS Ceramic Chip Capacitors: An Evaluation of the Parts and Assurance Methodologies," 24th Annual Capacitor and Resistor Technology Symposium, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. 128-140.
[424] Bryant, James, "Lock Down That Noise - Don't Let It Escape," Design News, vol. 63 no. 12, pp. 19, Sept. 1, 2008.
[425] Bucker, Markus, "EMI Behavior of Copper Areas on Outer Layers of PCBs," IEEE International Symposium of Electromagnetic Compatibility, Washington, D.C., Aug. 21-25, 2000, pp. 477-482.
[426] Budnik, Mark, Raychowdhury, Arijit, Bansal, Aditya, and Roy, Kaushik, "A High Density, Carbon Nanotube Capacitor for Decoupling Applications," 2006 43rd ACM/IEEE Design Automation Conference, Anaheim, CA, July 24-28, 2006, pp. 935-938.
[427] Bultitude, J., Gormally, P., Rogers, J., and Jiang, J., "Arc-Over-Resistant Multilayer Ceramic Capacitors for High-Voltage Applications," CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006, pp. xx-xx.
[428] Bultitude, J., Gormally, P., Rogers, J., and Jiang, J., "Voltage Breakdown Mechanisms in High Voltage Rated, Surface Mount MLCCs," CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 329-335.
[429] Bultitude, J., Gormally, P., Rogers, J., and Jiang, J., "Voltage Breakdown Mechanisms in High Voltage Rated, Surface Mount MLCCs," CARTS Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[430] Burket, Chris, and Qiu, Weihong, "New NTC MLCC Capacitor for Improved Transient Performance in Multiphase Voltage Regulators," Twenty-Fourth Annual IEEE Applied Power Electronics Conference and Exposition, Washington, DC, Feb. 15-19, 2009, pp. 1446-1451.
[430d] Burn, Ian, "High Performance Capacitor Dielectrics from Chemically Prepared Powders," Proceedings of the Tenth IEEE International Symposium on Applications of Ferroelectrics, Volume 1, East Brunswick, NJ, Aug. 18-21, 1996, pp. 397-400.
[431] Burn, Ian, and Porter, William C., "MLCs with Copper Electrodes for High Frequency Applications," 1990 Proceedings 40th Electronic Components & Technology Conference, Las Vegas, NV, May 20-23, 1990, pp. 277-283.
[432] Burnham, J., Webster, S. L., Simmons, W. J., and Borough, J. W., "A Study of Dielectric Absorption in Capacitors by Thermally Stimulated Discharge (TSD) Tests," 14th Annual Reliability Physics Symposium , Las Vegas, NV, Apr. 20-22, 1976, pp. 147-156.
[433] Burnham, J., and Wong, E., "Failure Mechanism on Accelerated AC Test for High Voltage Capacitors," 12th Annual Reliability Physics Symposium, Las Vegas, NV, Apr. 2-4, 1974, pp. 223-233.
[434] Burough, J. W., Brammer, W. G., and Burnham, John, "Degradation of PVF2 Capacitors During Accelerated Tests," 16th Annual Reliability Physics Symposium, San Diego, CA, Apr. 18-20, 1978, pp. 219-223.
[435] Busson, Jean Paul, "Supply Voltage Drop on Fast Current Demand," Texas Instruments Application Brief SLVA076, Sept. 1999.
[435d] Cacciari, Mario, Mazzanti, Giovanni, and Montanari, Gian Carlo, "Weibull Statistics in Short-term Dielectric Breakdown of Thin Polyethylene Films," IEEE Transactions on Dielectrics and Electrical Insulation , vol. 1 no. 1, pp. 153-159, Feb. 1994.
[436] Cain, Jeffrey and Makl, Steve, "Capacitor Selection and EMI Filtering," ITEM 1997, pp. 142-148, 1997.
[437] Cain, Jeffrey, "Comparison of Multilayer Ceramic and Tantalum Capacitors."
[438] Cain, Jeff, "Interconnect Schemes for Low Inductance Ceramic Capacitors."
[439] Cain, Jeffrey, "Parasitic Inductance of Multilayer Ceramic Capacitors."
[440] Cain, Jeffrey, "The Effects of ESR and ESL in Digital Decoupling Applications."
[441] Caldwell, Barry, "Board decoupling using a standard methodology," EDN, vol. 50 no. 22, pp. 75-80, Oct. 27, 2005.
[442] Callewaert, Clyde M., Mantese, Joseph V., Micheli, Adolph L., Schubring, Norman, Messuri, Dominic A., Phillips, William T., and Musick, Steve A., "Distributed-Element Multipole EMI Filters: Material and Design Considerations," Compliance Engineering, vol. XVIII, no. 7, pp. ?, Sept./Oct. 2000.
[443] Campbell, C. K., van Wyk, J. D., Holm, M. F. K., Prinsloo, J. J. R., and Schoeman, J. J., "Steady-State and Transient C-V Response of a High-Voltage Nonlinear Barium Titanate Ceramic-Disc Power-Snubber Capacitor," 1992 Proceedings 42nd Electronic Components & Technology Conference , San Diego, CA, May 18-20, 1992, pp. 607-610.
[444] Camerlo, Sergio, Novak, Istvan, Kaw, Ravi, Waizman, Alex, Miller, J. P., Fan, Jun, and Drewniak, Jim, "Board and Package Level PDN Simulations," DesignCon 2004, Santa Clara, CA, Feb. 2-5, 2004, pp. xx-xx.
[445] Cantlebary, Jeff, "LICA (Low-Inductance Capacitor Array) Flip-Chip Application Notes," AVX.
[446] Capps, Charles P., "Give Your Digital System a Power Boost," Electronic Design, vol. 50, no. 24, pp. 69-73, Nov. 11, 2002.
[446d] Carey, W. J., Wiebe, A. J., Altgilbers, L. L., and Nunnally, W. C., "Pulse Discharge Characteristics of Surface Mount Capacitors," Conference Record of the 2006 Twenty-Seventh International Power Modulator Symposium, Arlington, VA, May 14-18, 2006, pp. 141-144.
[447] Carlberg, Bjorn, Norberg, Jonas, and Liu, Johan, "Electrospun Nano-Fibrous Polymer Films with Barium Titanate Nanoparticles for Embedded Capacitor Applications," 2007 Proceedings 57th Electronic Components & Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 1019-1026.
[447d] Carrier, Patrick, "Designing for Power Integrity," Printed Circuit Design and Fab , vol. 26 no. 9, pp. xx-xx, Sept. 2009.
[448] Carsten, Bruce, "Sniffer probe locates sources of EMI," EDN, June 4, 1998.
[449] Carter, Bruce, "High-Speed Amplifier PCB Layout Tips," Texas Instruments Application Brief SLOA102, Sept. 2002.
[450] Carter, Bruce, "How (Not) to Decouple High-Speed Operation Amplifiers," Texas Instruments Application Report SLOA069, Sept. 2001.
[451] Cases, M., de Araujo, D. N., Pham, N., Patel, P., and Archambeault, B., "Embedded Passives for Digital System Applications," Advancing Microelectronics, vol. 32 no. 4, pp. 6-9, July-Aug. 2005.
[452] Catrysse, J., "PCB-design and EMC-constraints," Electromagnetic Compatibility 1993, Zurich, Switzerland, Mar. 9-11, 1993, pp. 171-184.
[453] Cebeci, Fevzi C., Sezer, Esma, and Sarac, A. Sezai, "A Novel EDOT-Nonylbithiazole-EDOT based Comonomer as an Active Electrode Material for Supercapacitor Applications," Electrochimica Acta, vol. 54 no. 26, pp. 6354-6360, Nov. 1, 2009.
[454] Cesario, Sal, "Polycarbonate Capacitors Yesterday, Today and Tomorrow," CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 151-157.
[455] Chacko, Antony, Young, Jayson, and Hahn, Randy, "Small Case Size Polymer Now Comes in Ultra Low ESR," CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[456] Chahal, Premjeet, Tummala, Rao R., Allen, Mark G., and Swaminathan, Madhavan, "A Novel Integrated Decoupling Capacitor for MCM-L Technology," 1996 Proceedings 46th Electronic Components & Technology Conference, Orlando, FL, May 28-31, 1996, pp. 125-132.
[457] Chahal, Premjeet, Tummala, Rao R., Allen, Mark G., and Swaminathan, Madhavan, "A Novel Integrated Decoupling Capacitor for MCM-L Technology," IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B , vol. 21 no. 2, pp. 184-193, May 1998.
[458] Chahal, P., Haridass, A., Pham, A., Tummala, R. R., Allen, M. G., Swaminathan, M., and Laskar, J., "Integration of Thin Film Passive Circuits Using High/Low Dielectric Constant Materials," 1997 Proceedings 47th Electronic Components & Technology Conference, San Jose, CA, May 18-21, 1997, pp. 739-744.
[458d] Chai, Francis K., Brews, J. R., Schrimpf, R. D., and Birnie III, D. P., "Relating Local Electric Field in a Ferroelectric Capacitor to Externally Measurable Voltages," Proceedings of the Ninth IEEE International Symposium on Applications of Ferroelectrics, University Park, PA, Aug. 7-10, 1994, pp. 83-86.
[459] Chambers, Jeff, "EMI suppression filters and pulse waveforms," ITEM 2002, pp. 195-199, 2002.
[460] Chambers, Jeff, "Feedthrough Filter Problems."
[461] Chan, Edward, Prymak, John D., and Wang, Daniel, "Power-On Failures in Tantalum and Aluminum SMT Capacitors," 2002 EMAP Conference, Singapore, Nov. 2003, pp. xx-xx.
[461d] Chan, K. L., Mariatti, M., Lockman, Z., and Sim, L. C., "Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application," Journal of Materials Science: Materials in Electronics , vol. xx no. x, pp. xx-xx, xxxx.
[462] Chan, N. H., and Rawal, B. S., "Low-Voltage Performance of Multilayer Ceramic Capacitors," AVX.
[463] Chan, Y. C., Wang, Y., Gui, Z. L., and Li, L. T., "Thermal Effects on the Dielectric and Electrical Properties of Relaxor Ferroelectric Ceramic-Based MLCs," Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, Omiya, Japan, Dec. 4-6, 1995, pp. 328-333.
[463d] Chandrasekaran, R., Soneda, Y., Yamashita, J., Kodama, M., and Hatori, H., "Preparation and electrochemical performance of activated carbon thin films with polyethylene oxide-salt addition for electrochemical capacitor applications," Journal of Solid State Electrochemistry, vol. 12 no. 10, pp. 1349-1355, Oct. 2008.
[464] Chandy, Ajith, and Chen, Tom, "Performance Driven Decoupling Capacitor Allocation Considering Data and Clock Interactions," Proceedings of the Design, Automation and Test in Europe Conference and Exhibition, Volume 2, Messe Munich, Germany, Mar. 7-11, 2005, pp. 984-985.
[465] Chang, Jinho, Park, Mira, Ham, Dukho, Ogale, S. B., Mane, Rajaram S., and Han, Sung-Hwan, "Liquid-phase synthesized mesoporous electrochemical supercapacitors of nickel hydroxide," Electrochimica Acta, vol. 53 no. 15, pp. 5016-5021, June 1, 2008.
[466] Chang, Kuo-Hsin, and Hu, Chi-Chang, "Hydrothermal synthesis of binary Ru-Ti oxides with excellent performances for supercapacitors," Electrochimica Acta, vol. 52 no. 4, pp. 1749-1757, Dec. 1, 2006.
[467] Chang, Narhyuck, "High-Speed Board Design Techniques," Mar. 5, 1999.
[468] Chang, Tsun-Hiu, "Minimizing Switching Noise in a Power Distribution Network Using External Coupled Resistive Termination," IEEE Transactions on Advanced Packaging, vol. 28 no. 4, pp. 754-760, Nov. 2005.
[469] Chao, Fen, and Liang, Guozheng, "Effects of coupling agent on the preparation and dielectric properties of novel polymer-ceramic composites for embedded passive applications," Journal of Materials Science: Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.
[470] Charbonneau, Richard and Grasso, Charles, "Embedded Capacitance the Next Step in PWB Design," NCMS.
[471] Chase, Yun, "Introduction to Choosing MLC Capacitors for Bypass/Decoupling Applications."
[472] Chen, Chang-Sheng, Lin, Yo-Shen, Chen, Wei-Ting, Shyu, Chin-Sun, Lay, Shinn-Juh, and Lee, Min-Lin, "PCB Embedded Capacitor with Central Via Connection Structure for RF Application," Electrical Design of Advanced Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 77-80.
[473] Chen, Chi-Te, Zhao, Jin, and Chen, Qinglun, "A Simulation Study of Simultaneous Switching Noise," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. pages?.
[473b] Chen, Chong, Yu, Shuhui, Sun, Rong, Luo, Suibin, Weng, Lvqian, and Du, Ruxu, "Micro-structural and Interfacial Effects on the Dielectric Properties of High-k Aluminum/Epoxy Composites for Embedded Capacitors," International Conference on Electronic Packaging Technology & High Density Packaging , Beijing, China, Aug. 10-13, 2009, pp. 589-592.
[473d] Chen, Deng-Yuan, Azuma, Masamichi, McMillan, Larry D., and Paz de Araujo, Carlos A., "A Simple Unified Analytical Model for Ferroelectric Thin Film Capacitor and Its Applications for Nonvolatile Memory Operation," Proceedings of the Ninth IEEE International Symposium on Applications of Ferroelectrics, University Park, PA, Aug. 7-10, 1994, pp. 25-28.
[474] Chen, Edward, Lai, Ken, Prymak, John, and Prevallet, Mike, "Facedown Termination for Higher C/V - Lower ESL Conductive-Polymer SMT Capacitors," Proceedings CARTS Asia 2005, Taipei, Taiwan, Oct. 11-15, 2005, pp. xx-xx.
[475] Chen, Edward, Lai, Ken, Ashburn, Travis, Prymak, John, and Prevallet, Mike, "Introducing Flex "Fail-Open" Capabilities for MLC Chip Capacitors," Proceedings CARTS Asia 2005, Taipei, Taiwan, Oct. 11-13, 2005, pp. 63-71.
[476] Chen, Edward, Prevallet, Mike, and Prymak, John, "Ripple Current Confusion," KEMET.
[477] Chen, Hongwei, Yang, Chuanren, Fu, Chunlin, Shi, Jun, Zhang, Jihua, and Leng, Wenjian, "Microstructure and dielectric properties of BaZrxTi1-xO3 ceramics," Journal of Materials Science: Materials in Electronics, vol. 19 no. 4, pp. 379-382, Apr. 2008.
[478] Chen, Huabo, Fang, Jiayuan, and Shi, Weimin, "Effective Decoupling Radius of Decoupling Capacitor," Proceedings 10th Topical Meeting on Electrical Performance of Electronic Packaging, Cambridge, MA, Oct. 29-31, 2001, pp. 277-281.
[479] Chen, I-Fong, Hsue, Ching-Wen, Kuan, Ming-Chih, and Luo, Wen-Yuh, "Modeling the Imperfect Ground of Printed Circuit Boards Based on TEM Assumption," IEICE Transactions on Communications, vol. E83-B, no. 9, pp. 2124-2129, Sept. 2000.
[480] Chen, Jie, Huang, Kelong, and Liu, Suqin, "Hydrothermal preparation of octadecahedron Fe3O4 thin film for use in an electrochemical supercapacitor," Electrochimica Acta, vol. 55 no. 1, pp. 1-5, Dec. 15, 2009.
[481] Chen, Juan, Xu, Minjia, Hubing, Todd H., Drewniak, James L., Van Doren, Thomas P., and DuBroff, Richard E., "Experimental Evaluation of Power Bus Decoupling on a 4-Layer Printed Circuit Board," IEEE International Symposium on Electromagnetic Compatibility Symposium Record Volume One, Washington, D.C., Aug. 21-25, 2000, pp. 335-338.
[482] Chen, Juan, Hubing, Todd H., Van Doren, Thomas P., and DuBroff, Richard E., "Power Bus Isolation Using Power Islands in Printed Circuit Boards," IEEE Transactions on Electromagnetic Compatibility, vol. 44, no. 2, pp. 373-380, May 2002.
[483] Chen, K. Y., Brown, W. D., and Schaper, L. W., "Modeling and Simulation of Thin Film Decoupling Capacitors," Proceedings of the IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging , West Point, NY, Oct. 26-28, 1998, pp. 205-208.
[484] Chen, Ke, Nielsen, Matt, Soss, S., Rymaszewski, Eugene J., Lu, Toh-Ming, and Wan, C. T., "Study of Tantalum Oxide Thin Film Capacitors on Metallized Polymer Sheets for Advanced Packaging Applications, " IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B, vol. 20, no. 2, pp. 117-122, May 1997.
[485] Chen, Liying, Wu, Shunhua, Wang, Shuang, and Wang, Guoqing, "Microstructure and dielectric properties of BaTiO3-based X7R ceramics," Journal of Materials Science: Materials in Electronics, vol. 19 no. 4, pp. 327-331, Apr. 2008.
[486] Chen, Qiao-Ling, Xue, Kuan-Hong, Shen, Wei, Tao, Fei-Fei, Yin, Shou-Yin, and Xu, Wen, "Fabrication and electrochemical properties of carbon nanotube array electrode for supercapacitors," Electrochimica Acta, vol. 49 no. 24, pp. 4157-4161, Sept. 30, 2004.
[487] Chen, Yuzhe, Wu, Zhonghua, Liu, Yaowu, and Fang, Jiayuan, "Equivalent Circuit Models of Via Interactions in Electronic Packaging," IEEE International Symposium on EMC, Chicago, IL, Aug. 22-26, 1994, pp. 377-380.
[488] Chen, Yuzhe, Chen, Zhaoqing, and Fang, Jiayuan, "Optimum Placement of Decoupling Capacitors on Packages and Printed Circuit Boards Under the Guidance of Electromagnetic Field Simulations," 1996 Proceedings 46th Electronic Components & Technology Conference, Orlando, FL, May 28-31, 1996, pp. 756-760
[489] Chen, Zhao, Xinyou, Huang, Hao, Guan, and Chunhua, Gao, "Effect of Y2O3 and Dy2O3 on Dielectric Properties of Ba0.7 Sr0.3 TiO3 Series Capacitor Ceramics," Journal of Rare Earths, vol. 25 no. Supplement 2, pp. 197-200, June 2007.
[490] Chickamenahalli, S., Aygun, K., Hill, M. J., Radhakrishnan, K., Eilert, K., and Stanford, E., "Microprocessor Platform Impedance Characterization using VTT Tools," Twentieth Annual IEEE Applied Power Electronics Conference and Exposition, Volume 3, Austin, TX, Mar. 6-10, 2005, pp. 1466-1469.
[491] Chickamenahalli, Shamala A., Li, Yuan-Liang, and Figueroa, David G., "Study of Synchrnous DC/DC Converters in High-Current Processor Power Delivery Systems," Proceedings 2000 HD International Conference on High-Density Interconnect and Systems Packaging (Proceedings of SPIE - The International Society for Optical Engineering, Volume 4217), Denver, CO, Apr. 25-28, 2000, pp. 182-187.
[491d] Chinoy, Percy, and Langlois, Marc, "Thin-film embedded resistor and capacitor technologies," Circuit World , vol. 30 no. 1, pp. 16-19, 2004.
[492] Cho, Han Seo, Cho, Sukhyeon, Jo, Jihong, Seo, Haenam, Kim, Byongmoon, and Yoo, Jegwang, "Highly reliable processes for embedding discrete passive components into organic substrates," Microelectronics Reliability, vol. xx no. x, pp. xx-xx, xxxx.
[493] Cho, Sung-Dong, Jang, Kyung-Woon, Hyun, Jin-Gul, Lee, Sangyong, Paik, Kyung-Wook, Kim, Hyungsoo, and Kim, Joung-Ho, "Epoxy/BaTiO3 Composite Films and Pastes for High Dielectric Constant and Low-Tolerance Embedded Capacitors Fabrication in Organic Substrates," IEEE Transactions on Electronics Packaging Manufacturing, vol. 28 no. 4 pp. 297-303, Oct. 2005.
[494] Choi, J., Chun, S., Na, N., Swaminathan, M., and Smith, L., "A Methodology for the Placement and Optimization of Decoupling Capacitors for Gigahertz Systems," Thirteenth International Conference on VLSI Design, location?, date? 2000, pp. 156-161.
[495] Choi, Jinseong, Wan, Lixi, Swaminathan, Madhavan, Beker, Ben, and Master, Raj, "Modeling of Realistic On-Chip Power Grid using the FDTD Method," 2002 IEEE International Symposium on Electromagnetic Compatibility Symposium Record - Volume 1, Minneapolis, MN, Aug. 19-23, 2002, pp. 238-243.
[496] Choi, Jinwoo, Min, Sung-Hwan, Kim, Joong-Ho Kim, Swaminathan, Madhavan, Beyene, Wendemagegnehu, and Yuan, Xingchao Yuan, "Modeling and Analysis of Power Distribution Networks for Gigabit Applications," IEEE Transactions on Mobile Computing, vol. 2, no. 4, pp. 299-313, Oct.-Dec. 2003.
[497] Choi, Jinwoo, Kam, Dong Gun, Chung, Daehyun, Srinivasan, Krishna, Govind, Vinu, Kim, Joungho, and Swaminathan, Madhavan, "Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications," IEEE Transactions on Advanced Packaging, vol. 30 no. 2, pp. 180-190, May 2007.
[498] Choi, Myoung Joon, and Cangellaris, Andreas C., "A Quasi Three- Dimensional Distributed Model for Complex Power Distribution Networks," IEEE Transactions on Advanced Packaging, vol. 25, no. 1, pp. 28-34, Feb. 2002.
[499] Choi, Myoung Joon, Pandit, Vishram S., and Ryu, Woong Hwan, "Controllable Parameters Identification for High Speed Channel through Signal-Power Integrity Combined Analysis," 2008 Proceedings 58th Electronic Components &, Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 658-663.
[500] Chou, Tai-Yu, and Patil, Sada, "Modeling Power and Ground Planes and Simultaneous Switching Noise for Multilayer Packages," Proceedings of the 1994 International Electronics Packaging Conference, Atlanta, GA, Sept. 25-28, 1994, pp. 11-21.
[501] Chow, Robert, and Ellis, Alan D., "Fabrication and Characterization of Nanolayer Capacitors," CARTS USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[502] Christian, Kevin D., "Precision Laser Trimmable Passives," CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 189-192.
[503] Chuang, Hao-Hsiang, Wu, Shu-Jung, Hong, Ming-Zhang, Hsu, Darren, Huang, Raphael, Hsiao, Li Chang, and Wu, Tzong-Lin, "Power Integrity Chip-Package-PCB Co-Simulation for I/O Interface of DDR3 High-Speed Memory," Electrical Design of Advanced Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 31-34.
[504] Chun, Sungjun, Smith, Larry, Anderson, Ray, and Swaminathan, Madhavan, "Model to Hardware Correlation for Power Distribution Induced I/O Noise in a Functioning Computer System," 2002 Proceedings 52nd Electronic Components & Technology Conference, San Diego, CA, May 28-31, 2002, pp. 319-324.
[505] Chung, Chee-Yee, Shi, Weimin, and Waizman, Alex, "Achieving 3.2 Gb/s, 400 MTS AGTL+ IO through robust power delivery design with minimal package size," DesignCon 2002 - High Performance System Design Conference , Santa Clara, CA, Jan. 29-30, 2002.
[506] Chung, Chee-Yee, Waizman, Alex, "Optimum Signal Integrity Through Appropriate Analysis of Signal Return Path and Power Delivery," 2001 Proceedings 51st Electronic Components & Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 1402-1407.
[506d] Chung, Ilsub, Yoo, I. K., Lee, W., Chung, C. W., Lee, J. K., and Desu, Seshu B., "Electrode Stress Effects on Electrical Properties of PZT Thin Film Capacitors," Proceedings of the Ninth IEEE International Symposium on Applications of Ferroelectrics, University Park, PA, Aug. 7-10, 1994, pp. 527-530.
[506h] Chung, Ilsub, Kim, Chang Jung, Chung, Chee Won, and Yoo, In Kyeong, "Fabrication of Ferroelectric Capacitors Using RuO2/Pt Electrode," Proceedings of the Tenth IEEE International Symposium on Applications of Ferroelectrics, Volume 1, East Brunswick, NJ, Aug. 18-21, 1996, pp. 93-101.
[507] Cicerone, S., Orlandi, A., Archambeault, B., Connor, S., Fan, J., and Drewniak, J. L., "Cavities' Identification Algorithm for Power Integrity Analysis of Complex Boards," 2009 20th International Zurich Symposium on Electromagnetic Compatibility, Zurich, Switzerland, Jan. 12-16, 2009, pp. 253-256.
[508] Clark, Nancy H., Baca, Wes E., Dhooge, Nancy J., Evans, David, and Murphy, Tom, "Hybrid Capacitor Assembly Qualification," CARTS USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[508d] Clelland, I., Price, R., and Sarjeant, W. J., "Advances in Capacitor Technology for Modern Power Electronics," Conference Record of the 2000 Twenty-Fourth International Power Modulator Symposium, Norfolk, VA, June 26-29, 2000, pp. 145-148.
[509] Clelland, Ian W., and Price, Rick A., "Recent Advances in Capacitor Technology with Application to High Frequency Power Electronics and Voltage Conversion," Proceedings of the 14th Annual Applied Power Electronics Conference & Exposition, Mar. 1999.
[510] Clelland, Ian W., and Price, Rick A., "Recent Advances in Capacitor Technology with Application to High Frequency Power Electronics and Voltage Conversion," Fourteenth Annual Applied Power Electronics Conference and Exposition, Volume 2, Dallas, TX, Mar. 14-18, 1999, pp. 685-691.
[511] Clelland, Ian W., and Price, Rick A., "Requirement for Robust Capacitors in High Density Power Converters," Proceedings of the 16th Annual Applied Power Electronics Conference & Exposition, Mar. 2001.
[512] Clement, Warren J., "Flat-Pack Electrolytic Capacitors for Switched-Mode Power Supplies," 33rd Electronic Components Conference , Orlando, FL, May 16-18, 1983, pp. 105-110.
[513] Clifford, Tom, "Embedded Passives Predictability, As-Received and In-Service," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S27:01.
[514] Clifford, Tom, "Embedded Passives...Predictability, As-Received and In-Service," 2008 IPC Midwest Show Proceedings, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.
[515] Cocovich, Joe, "EMI/RFI Board Design," National Semiconductor Application Note 643, Dec. 1989.
[516] Coda, Nello, and Selvaggi, Jerry A., "Design Considerations for High Frequency Chip Capacitors," 26th Electronic Components Conference , San Francisco, CA, Apr. 26-28, 1976, pp. 227-232.
[517] Cokkinides, George, and Beker, Benjamin, "Modeling the Effects of Non-Linear Materials in De-Coupling Components of Digital Systems," Proceedings of the 8th IEEE Topical Meeting on Electrical Performance of Electronic Packaging, San Diego, CA, Oct. 25-27, 1999, pp. 99-102.
[518] Condon, Gil, "Solve Two-Sided Printed Circuit Board EMI/Noise Problems the Easy Way - at the Drawing Board," ITEM 1988 Update, pp. 32-36, 1988.
[519] Conway, Michael, "Improved Voltage and Temperature DC Bias Performance of BME X7R Dielectric," Proceedings of CARTS-Europe 2005, Prague, Czech Republic, Oct. 17-20, 2005, pp. 147-152.
[520] Cooper, Raymond J., "Electrode Development for Multilayer Capacitors," Kemet TechTopics , vol. 7 no. 2, pp. 1-2, June 1997.
[521] Costa, V., Preatoni, R., and Caniggia, S., "Investigation of EMI on Multilayer Printed Circuit Boards: Delta-I-noise and Power Supply Decoupling," IEEE 1996 International Symposium on Electromagnetic Compatibility, Santa Clara, CA, Aug. 19-23, 1996, pp.436-441.
[522] Coyle Jr., Roy Tom, "Novel Failure Mechanism Involving the Motion of Oxygen Vacancies in Chip Capacitors," Proceedings 2003 International Symposium on Microelectronics (Proceedings of SPIE - The International Society for Optical Engineering, Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 43-48.
[523] Cozzolino, M. J., "A Comparison of BME and Traditional Technology Ceramic Capacitors," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[524] Cozzolino, M. J., "Electrical Shorting In Multilayer Ceramic Capacitors," 24th Annual Capacitor and Resistor Technology Symposium, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. 57-68.
[525] Cui, Wei, Fan, Jun, Shi, Hao, and Drewniak, James L., "DC Power Bus Noise Isolation with Power Islands," 2001 IEEE EMC International Symposium Symposium Record - Volume 2, Montreal, Canada, Aug. 13-17, 2001, pp. 899-903.
[526] Cui, Wei, Fan, Jun, Ren, Yong, Shi, Hao, Drewniak, James L., and DuBroff, Richard E., "DC Power-Bus Noise Isolation With Power-Plane Segmentation," IEEE Transactions on Electromagnetic Compatibility, vol. 45, no. 2, pp. 436-443, May 2003.
[527] Cui, Wei, Ye, Xiaoning, Archambeault, Bruce, White, Doug, Li, Min, and Drewniak, James L., "EMI resulting from Signal Via Transitions through the DC Power Bus," IEEE International Symposium on Electromagnetic Compatibility Symposium Record Volume Two, Washington, D.C., Aug. 21-25, 2000, pp. 821-826.
[527d] Curecheriu, Lavinia Petronela, Mitoseriu, Liliana, and Ianculescu, Adelina, "Nonlinear dielectric properties of Ba1-xSrxTiO3 ceramics," Journal of Alloys and Compounds, vol. 482 no. 1-2, pp. 1-4, Aug. 12, 2009.
[528] Curtis, Jon D., "Designing for Compliance."
[529] Curtis, Jon, "Designing for Compliance 1999 Part 2: Rethinking the Role of Power and Return Planes," Conformity, pp. 4-9, May 1999.
[530] Curtis, Jon D., and Straus, Isidor, "Follow These 18 Rules for Better EMC Design," Professional Program Proceedings Electro 98, location?, June 9-11, 1998, pp. 83-95.
[531] Dahlen, P. E., Timpane, T., Becker, D. J., Liang, T. W., Martin, W. D., Rudrud, P., and Bartley, G. K., "Maintaining System Signal and Power Integrity Characteristics as Part of a Module Cost-Reduction Exercise," 2007 IEEE Electrical Performance of Electronic Packaging, Atlanta, GA, Oct. 29-31, 2007, pp. 83-86.
[532] Dai, Ling, Lin, Fuchang, Zhu, Zhifang, and Li, Jin, "Electrical Characteristics of High Energy Density Multilayer Ceramic Capacitor for Pulse Power Application," IEEE Transactions on Magnetics , vol. 41 no. 1 part 2, pp, 281-284, Jan. 2005.
[533] Daijavad, Shahrokh, and Heeb, Hansruedi, "On the Effectiveness of Decoupling Capacitors in Reducing EM Radiation from PCBs," 1993 International Symposium on Electromagnetic Compatibility, Dallas, TX, Aug. 9-13, 1993, pp. 330-332.
[533d] Daikhin, L. I., Kornyshev, A. A., and Urbakh, M., "Double layer capacitance on a rough metal surface: Surface roughness measured by "Debye ruler"," Electrochimica Acta, vol. 42 no. 19, pp. 2853-2860, 1997.
[534] Das, Rabindra N., Poliks, Mark D., Lauffer, John M., and Markovich, Voya R., "High Capacitance, Large Area, Thin Film, Nanocomposite Based Embedded Capacitors," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1510-1515.
[535] Das, Rabindra Nath, Egitto, Frank D., Lauffer, John M., and Markovich, Voya R., "Laser Micromachining of Barium Titanate (BaTiO3)-Epoxy Nanocomposite-Based Flexible/Rollable Capacitors: New Approach for Making Library of Capacitors," IEEE Transactions on Electronics Packaging Manufacturing, vol. 31 n. 2, pp. 97-103, Apr. 2008.
[536] Das, Rabindra N., Egitto, Frank D., Lauffer, John M., and Markovich, Voya R., "Laser Micromachining of Barium Titanate (BaTiO3)-Polymer Nanocomposite Based Flexible/Rollable Capacitors," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S22:04.
[537] Das, Rabindra N., Egitto, Frank D., Lauffer, John M., and Markovich, Voya R., "Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors," Printed Circuit Design and Manufacture, vol. 24 no. 7, pp. 32-37, July 2007.
[537d] Das, Rabindra N., Lauffer, John M., and Markovich, Voya R., "Polymer Nanocomposites for Electronic Packaging," Advancing Microelectronics, vol. 36 no. 3, pp. 26-31, May/June 2009.
[537d] Das, Rabindra N., Rosser, Steven G., Papathomas, Konstantinos I., Poliks, Mark D., Lauffer, John M., and Markovich, Voya R., "RCC Capacitive Layers for SBU Applications," Printed Circuit Design and Fab, vol. 26 no. 5, pp. xx-xx, May 2009.
[538] Das, Rabindra N., Rosser, Steven G., Papathomas, Konstantinos I., Poliks, Mark D., Lauffer, John M., and Markovich, Voya R., "Resin Coated Copper Capacitive (RC3) Nanocomposites for Multilayer Embedded Capacitors," 2008 Proceedings 58th Electronic Components &, Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 729-735.
[538b] Das, Rabindra N., Rosser, Steven G., Papathomas, Konstantinos I., Antesberger, Tim, and Markovich, Voya R., "Resin coated copper capacitive (RC3) nanocomposites for multilayer embedded capacitors: towards system in a package (SiP)," Circuit World, vol. 35 no. 4, pp. 31-39, 2009.
[538d] Das-Gupta, D. K., and Scarpa, P. C. N., "Polarization and Dielectric Behavior of ac-aged Polyethylene," IEEE Transactions on Dielectrics and Electrical Insulation, vol. 3 no. 3, pp. 366-374, June 1996.
[538h] Das-Gupta, Dilip K., "Conduction Mechanisms and High-field Effects in Synthetic Insulating Polymers," IEEE Transactions on Dielectrics and Electrical Insulation , vol. 4 no. 2, pp. 149-156, Apr. 1997.
[539] Dash, Glen, "Designing for Compliance - Part 1: Design of the PC Board," Compliance Engineering 1988, 1988, pp. 85-94.
[540] Dash, Glen, and Straus, Isidor, "Designing for Compliance - Part 1 Design of the PC Board," Compliance Engineering 1989 Reference Guide , 1989, pp. 96-103.
[541] Dash, Glen, and Straus, Isidor, "Designing for Compliance, Part 1: Design of the PC Board," Compliance Engineering 1990 CE Handbook, 1990, pp. 87-95.
[542] Davidson, Evan E., "Electrical Design of a High Speed Computer Packaging System," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-6, no. 3, pp. 272-282, Sep. 1983.
[543] Davidson, Lincoln, Fallah, Ahmad Mahin, Nelson, Robert, and Rogers, David A., "Evaluating and Choosing Decoupling Capacitors," 2001 IEEE EMC International Symposium Symposium Record - Volume 1, Montreal, Canada, Aug. 13-17, 2001, pp. 448-452.
[544] Davignon, John, and Greenlee, Bob, "A PWB Fabricator Perspective of Embedded Decoupling Capacitance Materials," CircuiTree, vol. 14 no. 3, pp. xx, Mar. 2001.
[545] Davis, Sam, "Select the Optimal Power Capacitors for the Load," Electronic Design, vol. 52, no. 8, Supplement (between pages 48 and 49), Apr. 12, 2004.
[546] Day, John, and Gupta, Sri, "A New Y5V 0603 0.1uF Ceramic Chip Capacitor," 1994 Proceedings 44th Electronic Components & Technology Conference, Washington, D.C., May 1-4, 1994, pp. 716-720.
[546d] Day, John E., Brown, Arthur E., and Nance, Joseph D., "High K Low Firing Temperature Capacitors Based on Lead Niobate," Proceedings of the Eighth IEEE International Symposium on Applications of Ferroelectrics, Greenville, SC, Aug. 30-Sept. 2, 1992, pp. 74-75.
[547] Dayton, G., Glabau, E., and Cobb, T., "Development and Properties of X8R Capacitors," Surface Mount International Conference & Exposition Proceedings of the Technical Program, Volume II, San Jose, CA, Aug. 31-Sep. 2, 1993, pp. 818-825.
[548] Dechakupt, T., Yang, G., Reaney, I. M., Randall, C. A., and Trolier-McKinstry, S., "Microstructure and Interfaces of Thin Film Capacitors on Base Metal Foils," Advanced Materials Research, vol. 55-57, pp. 917-920, 2008.
[549] Deeley, Paul McKnight, "Electrolytic Capacitors: Theory, Construction, Characteristics and Applications, 2nd ed."
[550] Delurio, Thomas, and Lee, Eddie, "Supercaps Lighten the Load in LED Flash Applications," Power Electronics Technology, vol. 35 no. 1, pp. 14-17, Jan. 2009.
[551] DeMatos, H. V., "Design of an Integral Fuse for a High Frequency Solid Tantalum Capacitor," 30th Electronic Components Conference, San Francisco, CA, Apr. 28-30, 1980, pp. 392-396.
[551d] Demcko, Ron, and Ward, Brian, "MLCC ESD characterization," CARTS 2007 Symposium Proceedings , Albuquerque, NM, Mar. 26-29, 2007, pp. 257-262.
[552] Deng, Yongwei, Qi, Zhonghua, Tan, Zhigang, Xiao, Congtu, and Cheng, He, "Shorting Failure In High Voltage Ceramic Capacitor With Floating Internal Electrode Structure," CARTS USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[553] Derksen, Rob, Bouma, Bart, Muccioli, Jim, and Anthony, Dave, "Reducing EMI/RFI Susceptibility," Oct. 1, 2003.
[554] Derksen, Rob, Bouma, Bart, Muccioli, Jim, and Anthony, Dave, "X2Y Capacitors Reduce EMI/RFI Susceptibility of Computer Equipment," EPN Online, Feb. 2004.
[555] Derksen, Rob, Bouma, Bart, Muccioli, Jim, and Anthony, Dave, "X2Y Integrated Passive Devices : A Breakthrough in High Speed Decoupling and Broadband Filtering," X2Y Attenuators.
[556] Devenish, Bill, and Palczweski, Andrew, "The Embedded Passives Journey," IPC Printed Circuits Expo, APEX and the Designers Summit Proceedings 2008 Technical Conference, Las Vegas, NV, Apr. 1-3, 2008, pp. S22:02.
[557] Devoe, Alan, Hofmaier, Reginald L., and Ngo, Linda, "New High Temperature Ceramic Capacitor," CARTS USA 2009 Proceedings , Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[558] Dias, D., Monteiro, R., Mota-Cactano, C., Pimentel, A., and Fortunato, E., "Study of MnO2 Coverage on Ta Capacitors with High CV Powders," CARTS Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[559] Diaz-Alvarez, Enrique, Krusius, J. Peter, and Kroeger, F., "Modeling and Simulation of Integrated Capacitors for High Frequency Chip Power Decoupling," IEEE Transactions on Components and Packaging Technologies , vol. 23, no. 4, pp. 611-619, Dec. 2000.
[560] Diaz-Alvarez, E., Krusius, J. P., and Kroeger, F., "Power Decoupling with Integral Capacitors and Area Array Connections," Proceedings of the IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging , West Point, NY, Oct. 26-28, 1998, pp. 209-212.
[561] Diblik, S., and Zednicek, T., "New Technologies on Tantalum and Niobium Oxide Capacitors for Space-Limited Designs," 1st Electronics Systemintegration Technology Conference, Volume 2, Dresden, Germany, Sept. 5-7, 2006, pp. 805-811.
[562] Dimos, Duane, Lockwood, Steven J., Schwartz, Robert W., and Rodgers, M. Steven, "Thin-Film Decoupling Capacitors for Multichip Modules," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A , vol. 18 no. 1, pp. 174-178, Mar. 1995.
[563] Dippel, Markus, "Microprocessors: Coping with Extreme Power Changes," Power Electronics Technology, vol. 29, no. 2, pp. 29-31, Feb. 2003.
[564] Dirjish, Mat, "Ultracapacitors Branch Out Into Wider Markets," Electronic Design , vol. 56 no. 24, pp. 35-38,40, Nov. 17, 2008.
[565] Dishongh, Terry, Searis, Damion, Roth, Weston C., and Peter, Erik, "A Method for Improving Component Decoupling Using Advanced Capacitor Under Ball Grid Array (ACUB)," Advances in Electronic Packaging 2003, Volume 1 , Maui, Hawaii, July 6-11, 2003, pp. 33-36.
[566] Djebara, L., and Nguyen, T. P., "Formation of the Dielectric in Tantalum Capacitors with Conducting Polymer," 24th Annual Capacitor and Resistor Technology Symposium, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. 219-222.
[567] Djebara, L., and Nguyen, T. P., "Some Investigations Concerning the Tantalum Oxide for Electrolytic Capacitors: Effect of Thermal Treatment," CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 121-125.
[568] Djordjevic, Antonije R. and Sarkar, Tapan Kumar, "An Investigation of Delta-I Noise on Integrated Circuits," IEEE Transactions on Electromagnetic Compatibility, vol. 35, no. 2, pp. 134-147, May 1993.
[569] Djordjevic, Antonije, and Maricevic, Zoran, "Internal EMC Problems Caused by Parasitic Resonances," IEEE International Symposium on Electromagnetic Compatibility Symposium Record Volume One, Washington, D.C., Aug. 21-25, 2000, pp. 329-334.
[570] Donahoe, Daniel N., Pecht, Michael, Lloyd, Isabel K., and Ganesan, Sanka, "Moisture induced degradation of multilayer ceramic capacitors," Microelectronics Reliability, vol. 46 no. 2-4, pp. 400-408, Feb.-Apr. 2006.
[570d] Donazzi, F., Luoni, G., and Laurent, C., "Weibull Statistics in Short-term Dielectric Breakdown of Thin Polyethylene Films [comment and reply]," IEEE Transactions on Dielectrics and Electrical Insulation, vol. 1 no. 1, pp. 163, Feb. 1994.
[571] Doraiswami, Ravi, "Shape Memory Capacitors for Next Generation Embedded Actives," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[572] Dostal, Frederik, "Emulated ripple makes step-down conversion easy," Electronic Products , vol. Power Supplement 2008, pp. 5-6, 2008.
[573] Downing, R., et al, "Decoupling Capacitor Effects on Switching Noise," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16, no. 5, Aug. 1993, pp. 484-489.
[574] Drabkin, Victor, Houghton, Chris, Kantorovich, Isaac, and Tsuk, Michael, "Aperiodic Resonant Excitation of Microprocessor Power Distribution Systems and the Reverse Pulse Technique," Digest of 11th IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, Oct. 21-23, 2002, pp. 175-178.
[575] Drewniak, James L., Archambeault, Bruce, Knighten, James, Selli, Giuseppe, Fan, Jun, Cocchini, Matteo, Connor, Samuel, and Xue, Liang, "Comparing Time-Domain and Frequency Domain Techniques for Investigation on Charge Delivery and Power-Bus Noise for High-Speed Printed Circuit Boards," DesignCon 2007, Santa Clara, CA, Jan. 29-Feb. 1, 2007, pp. xx-xx.
[576] Drewniak, J. L., Hubing, T. H., Van Doren, T. P., and Baudendistal, P., "Modeling Power Bus Decoupling on Multilayer Printed Circuit Boards," IEEE International Symposium on EMC, Chicago, IL, Aug. 22-26, 1994, pp. 456-461.
[577] Drobnik, Josef, Huang, Lilly, Jain, Praveen, and Steigerwald, Robert, "PC Platform Power Distribution System - Past Application, Today's Challenge and Future Direction" The 21st International Telecommunications Energy Conference INTELEC'99, Copenhagen, Denmark, June 6-9, 1999, pp. 2-1 (pages 1 to 6).
[577d] Dubal, D. P., Dhawale, D. S., Salunkhe, R. R., Pawar, S. M., Fulari, V. J., and Lokhande, C. D., "A novel chemical synthesis of interlocked cubes of hausmannite Mn3O4 thin films for supercapacitor application," Journal of Alloys and Compounds , vol. 484 no. 1-2, pp. 218-221, Sept. 18, 2009.
[578] Duffy, N. W., Baldsing, W., and Pandolfo, A. G., "The nickel-carbon asymmetric supercapacitor-Performance, energy density and electrode mass ratios," Electrochimica Acta, vol. 54 no. 2, pp. 535-539, Dec. 30, 2008.
[579] Duncan, Samuel H. and White, Robert V., "Designing 2.1V Futurebus+ termination system requires system-engineering approach," EDN, May 26. 1994.
[580] Eales, Ian, "Managing power-plane connections reduces noise, increases reliability," Personal Engineering, vol. 11, no. 9, pp. 69-72, Sept. 1994.
[581] Edlund, Greg, "Noise budgets help maintain signal integrity in low-voltage systems."
[582] Edson, Douglas, and Wadler, David, "A New Low ESR Fused Solid Tantalum Capacitor," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[583] Edson, Douglas, and Wadler, David, "A New Low ESR Fused Solid Tantalum Capacitor," CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006, pp. xx-xx.
[584] Edson, Douglas M., and Bates, James S., "Electrical Properties of a Novel High CV Wet Tantalum Capacitor System," CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[585] Eged, Bertalan, and Balogh, Laszlo, "Analytical Calculation Of the Impedance of Lossy Power/Ground Planes," Proceedings of the 18th IEEE Instrumentation and Measurement Technology Conference, Volume 2, Budapest, Hungary, May 21-23, 2001, pp. 989-993.
[586] Eged, Bertalan, and Gelencser, Istvan, "The effect of Discontinuities on Ground/Power Planes of High-Speed Printed Circuit Boards," International Wroclaw Symposium on Electromagnetic Compatibility, Part -1 , Wroclaw, Poland, June 27-30, 2000, pp. 64-69.
[587] Eidelman, Alex, "Addressing Tantalum Capacitor Technology Challenges," CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 393-402.
[588] Eliasson, Leif, "Aluminium Electrolytic Capacitors' Performance in Very High Ripple Current and Temperature Applications," CARTS Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[589] Eliasson, Leif, "Aluminium Electrolytic Capacitors' performance in Very High Ripple Current and Temperature Applications," CARTS USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[590] Eliasson, Leif, and Daly, Joseph, "Optimize Electrolytic Capacitor Selection," Power Electronics Technology, vol. 29, no. 2, pp. 34-35, Feb. 2003.
[591] Engel, Guenter F., Schlauer, Gerald, Wischnat, Volker, and Pechloff, Michael, "Effective Reduction of Leakage Failure Mode after Flex Cracking Events in X7R-type Multilayer Ceramic Capacitors (MLCCs) by using Internal Series Connection (MLSCs)," CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006, pp. xx-xx.
[592] Engin, A. Ege, Bharath, Krishna, and Swaminathan, Madhavan, "Analysis for Signal and Power Integrity Using the Multilayered Finite Difference Method," IEEE International Symposium on Circuits and Systems, New Orleans, LA, May 27-30, 2007, pp. 1493-1496.
[593] Engin, A. Ege, Bharath, Krishna, Swaminathan, Madhavan, Cases, Moises, Mutnury, Bhyrav, Pham, Nam, de Araujo, Daniel N., and Matoglu, Erdem, "Finite-Difference Modeling of Noise Coupling between Power/Ground Planes in Multilayered Packages and Boards," Proceedings 56th Electronic Components & Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1262-1267.
[593b] Ennis, J. B., MacDougall, F. W., Yang, X. H., Bushnell, A. H., Cooper, R. A., and Gilbert, J. E., "High-Specific-Power Capacitors," Proceedings of the 2008 IEEE International Power Modulators and High Voltage Conference, Las Vegas, NV, May 27-31, 2008, pp. 53-56.
[593d] Ennis, Joel, Yang, Xiao Hui, MacDougall, Fred, Seal, Ken, and Herbig, Juleigh, "High Energy Density Capacitor Characterization," Proceedings of the 26th International Power Modulator Symposium and 2004 High Voltage Workshop , San Francisco, CA, May 23-26, 2004, pp. 68-71.
[594] Ernst, Larry, "Continuous Forms Printer EMC Compliance," Feb 1994.
[595] Esteban, Freddy, and Vazquez, Isabel, "Film Capacitors for DC-Link Application in Industrial Converters," CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006, pp. xx-xx.
[596] Evans, David, "Determining Ripple Current Capability in Tantalum Hybrid Capacitors," CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 361-370.
[597] Evans, David A., "Tantalum Hybrid Button Cell Capacitor," 24th Annual Capacitor and Resistor Technology Symposium, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. 182-186.
[597d] Evans, Joe T., and Bullington, Jeff A., "A Ferroelectric Capacitor Simulation Model," IEEE 7th International Symposium on Applications of Ferroelectrics, June 6-8, 1990, pp. 692-697.
[598] Evans, Rich and Tsuk, Michael, "Modeling and Measurement of a High-Performance Computer Power Distribution System," IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B, vol. 17, no. 4, pp. 467-471, Nov. 1994.
[599] Everett, Michael A., "Overview: Ultracapacitors and Ultracapacitor Applications," CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[600] Fairchild, K., Morcan, G., Lenihan, T., Brown, W., Schaper, L., Ang, S., Sommers, W., Parkerson, J., and Glover, M., "Reliability of Flexible Thin-Film Embedded Resistors and electrical Characterization of Thin-Film Embedded Capacitors and Inductors" 1997 Proceedings 47th Electronic Components & Technology Conference, San Jose, CA, May 18-21, 1997, pp. 730-738.
[601] Fallah, Ahmad Mahin, Davidson, Lincoln, Banerjee, Debashis, Nelson, Robert M., and Rogers, David A., "An Inexpensive and Simple Method for Characterizing Passive Components," 2001 IEEE EMC International Symposium Symposium Record - Volume 2, Montreal, Canada, Aug. 13-17, 2001, pp. 1141-1145.
[602] Fallah, Ahmad M., and Nelson, Robert M., "Analytical and Experimental Analysis of Decoupling Capacitor Interactions with Plane and Interconnect Inductance- A Placement Topology," 2002 IEEE International Symposium on Electromagnetic Compatibility Symposium Record - Volume 2, Minneapolis, MN, Aug. 19-23, 2002, pp. 871-876.
[603] Faltus, R., Flegr, Z., Sponar, R., Jane, M., and Zednicek, T., "DC/DC Converter Output Capacitor Benchmark," CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[604] Faltus, R., Zednicek, T., Smith, Ian, Zajacek, J., and Sikula, J., "Tantalum Capacitor Benchmark in Portable Audio Applications," CARTS Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[605] Faltus, R., Zednicek, T., Smith, Ian, Zajacek, J., and Sikula, J., "Tantalum Capacitor Benchmark in Portable Audio Applications," CARTS USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[605d] Faltus, Radovan, "Exploring Output Capacitor Impact on DC-DC Converter Performance," Power Electronics Technology, vol. 35 no. 8, pp. 26-31, Aug. 2009.
[605h] Faltus, Radovan, Zednicek, Tomas, and Kalous, M., "The importance of high-temperature capacitors," Electronic Products , vol 52 no. 6, pp. 19-20, Nov. 2009.
[606] Fan, Jun, Drewniak, James L., Knighten, James L., Smith, Norman W., and Orlandi, Antonio, "Calculation of Self and Mutual Inductances Associated with Vias in a DC Power Bus Structure from a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation," Electromagnetic Compatibility 2001, Zurich, Switzerland, Feb. 20-22, 2001, pp. 521-526.
[607] Fan, Jun, Drewniak, James L., Shi, Hao, and Knighten, James L., "DC Power-Bus Modeling and Design With a Mixed-Potential Integral-Equation Formulation and Circuit Extraction." IEEE Transactions on Electromagnetic Compatibility, vol. 43, no. 4, pp. 426-436, Nov. 2001.
[608] Fan, Jun, Shi, Hao, Knighten, James L., and Drewniak, James L, "DC Power Bus Modeling in High-Speed Digital Designs Including Conductor and Dielectric Losses," Asia-Pacific Conference on Environmental Electromagnetics, Shanghai, China, May 3-7, 2000, pp. 126-131.
[609] Fan, Jun, Drewniak, James L., and Knighten, James L., "DC Power Bus Modeling Using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation and an Iterative Equation Solver," Proceedings of the IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging, Scottsdale, AZ, Oct. 23-25, 2000, pp. 143-146.
[610] Fan, Jun, Cui, Wei, Drewniak, James L., Van Doren, Thomas P., and Knighten, James L., "Estimating the Noise Mitigation Effect of Local Decoupling in Printed Circuit Boards," IEEE Transactions on Advanced Packaging, vol. 25, no. 2, pp. 154-165, May 2002.
[611] Fan, Jun, Knighten, James L., Smith, Norman W., and Neely, Jason, "Evaluation of SMT Decoupling Design in a Functioning High Speed PCB," 2001 IEEE EMC International Symposium Symposium Record - Volume 2, Montreal, Canada, Aug. 13-17, 2001, pp. 1097-1101.
[612] Fan, Jun, Smith, Norm, Knighten, Jim, Andresakis, John, Fukawa, Yoshi, and Harvey, Mark, "Implementation of Buried Capacitance in High-Speed Designs," Printed Circuit Design and Fab, vol. 25 no. 3, pp. 30-35, Mar. 2008.
[613] Fan, Jun, Shaofeng, Luan, and Drewniak, James L., "Including SMT ferrite beads in DC power bus and high-speed I/O line modeling," 2001 IEEE EMC International Symposium Symposium Record - Volume 1, Montreal, Canada, Aug. 13-17, 2001, pp. 336-339.
[614] Fan, Jun, Shi, Hao, Orlandi, Antonio, Knighten, James L., Drewniak, James L., "Modeling DC Power-Bus Structures with Vertical Discontinuities Using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation," IEEE Transactions on Advanced Packaging, vol. 24, no. 2, pp. 143-157, May 2001.
[615] Fan, Jun, and Shi, Hao, "Power Bus Modeling Using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation."
[616] Fan, Jun, Knighten, James L., Orlandi, Antonio, Smith, Norman W., and Drewniak, James L., "Quantifying Decoupling Capacitor Location," IEEE International Symposium on Electromagnetic Compatibility Symposium Record Volume Two, Washington, D.C., Aug. 21-25, 2000, pp. 761-766.
[617] Fan, Jun, Drewniak, James L., Knighten, James L., Smith, Norman W., Orlandi, Antonio, Van Doren, Thomas P., Hubing, Todd H., and DuBroff, Richard E., "Quantifying SMT Decoupling Capacitor Placement in DC Power-Bus Design for Multilayer PCBs," IEEE Transactions on Electromagnetic Compatibility, vol. 43, no. 4, pp. 588-599, Nov. 2001.
[618] Fan, Jun, Ren, Yong, Chen, Juan, Hockanson, David M., Shi, Hao, Drewniak, James L., Hubing, Todd H., Van Doren, Thomas P., and DuBroff, Richard E., "RF Isolation Using Power Islands in DC Power Bus Design," 1999 IEEE EMC Symposium, Seattle, WA, Aug. 2-6, 1999, pp. 838-843.
[619] Fan, Jun, Smith, Norm, Knighten, Jim, Andresakis, John, Fukawa, Yoshi, and Harvey, Mark, "Utilization of Buried Capacitance: A Case Study," DesignCon 2008 , Santa Clara, CA, Feb. 4-7, 2008, pp. xx-xx.
[620] Fang, Jiayuan, and Zhao, Jin, "Low-Impedance Power Delivery over Broad Frequencies," Printed Circuit Design & Manufacture, vol. 20, no. 9, pp. 18-22, Sept. 2003.
[621] Fang, Jiayuan, Liu, Yaowu, Chen, Yuzhe, Wu, Zhonghua, and Agrawal, Amit, "Modeling of Power/Ground Plane Noise in High Speed Digital Electronics Packaging," IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, Oct. 20-22, 1993, pp. 206-208.
[622] Fang, Jiayuan, Herrell, Dennis, Zhao, Jin, Zhang, Jingping, and Chen, Raymond, "Modeling of the Electrical Performance of the Power and Ground Supply for a PC Microprocessor on a Card," Proceedings of the IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging , West Point, NY, Oct. 26-28, 1998, pp. 116-119.
[622d] Fang, Te-Hua, and Chang, Win-Jin, "Nanoindentation characteristics on polycarbonate polymer film," Microelectronics Journal, vol. 35 no. 7, pp. 595-599, July 2004.
[623] Farag, A. S., Wang, C., Cheng, T. C., Zheng, G., Du, Y., Hu, L., Palk, B., and Moon, M., "Failure Analysis of Composite Dielectric of Power Capacitors in Distribution Systems," IEEE Transactions on Dielectrics and Electrical Insulation , vol. 5 no. 4, pp. 583-588, Aug. 1998.
[624] Farrell, Brendan, Andreescu, Daniel, and Goia, Dan V., "Alloy and Core-Shell Silver/Palladium Platelets for Ultra-Low Fire MLCC's," CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 1-11.
[625] Farrell, Brendan, Rowland, Sarah, Goia, Dan V., and Groat, Eric, "Highly Dispersed Silver Nanoplatelets as Precursors for Ultra-Thin Conductive Layers," 2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[626] Farrell, Brendan P., Andreescu, Daniel, Eastman, Christopher M., and Goia, Dan V., "Novel Ag and AgPd Nanoparticles for MLCC's with Ultrathin Electrodes: A Case for the Revival of PM MLC Technology," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 275-282.
[626d] Farsi, Hossein, and Gobal, Fereydoon, "Theoretical analysis of the performance of a model supercapacitor consisting of metal oxide nano-particles," Journal of Solid State Electrochemistry , vol. 11 no. 8, pp. 1085-1092, Aug. 2007.
[626h] Feng, Y. J., Xu, Z., and Wei, X. Y., "Dielectric performances of antiferroelectric ceramics and application to capacitors," 17th IEEE International Symposium on the Applications of Ferroelectrics, Volume 2, Santa Fe, NM, Feb, 23-28, 2008, pp. xx-xx.
[627] Fernandez, Oscar, and Esteban, Freddy, "MKP Capacitors for DC-Link application in modern converters," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 283-287.
[628] Figueroa, David G., and Li, Y. L., "A Techniques for the Characterization of Multi-Terminal Capacitors for High Frequency Applications," 2000 Proceedings 50th Electronic Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp. 445-448.
[629] Fiore, Richard, "ESR Losses in Ceramic Capacitors," Microwave Product Digest, Sept. 1999.
[630] Fiore, Richard, "Practical Capacitor Tolerance Selection for Coupling, DC Blocking and Bypass Applications," Microwave Product Digest, Sept. 2001.
[631] Fiore, Richard, "RF Ceramic Chip Capacitors in High RF Power Applications," Microwave Journal, vol. 43, no. 4, pp. 96-109, Apr. 2000.
[632] Firek, Chester, and Kent, Bob, "Filtering and fast transient response," Electronic Products, vol. Power Supplement 2008, pp. 19-21, 2008.
[633] Fischer, Thomas, Kneuer, Christian, Albach, Manfred, and Schubert, Goeran, "Mutual Inductance of Capacitor Low-Pass Filters," 2009 20th International Zurich Symposium on Electromagnetic Compatibility, Zurich, Switzerland, Jan. 12-16, 2009, pp. 381-384.
[634] Fisher, J. S., "Failure Characteristics of Thin Film Capacitors," 10th Annual Reliability Physics Symposium, Las Vegas, NV, Apr. 5-7, 1972, pp. 183-187.
[635] Fisher, John, and Camerlo, Sergio, "The Role of Capacitors in High-Speed Systems Design," DesignCon99 High-Performance System Design Conference, Santa Clara, CA, Feb. 1-4, 1999, pp. 137-155.
[636] Fisher, John M., and Camerlo, Sergio D., "The Role of Capacitors in High-Speed Systems Design," DesignCon99 High-Performance System Design Conference Proceedings Addendum, Santa Clara, CA, Feb. 1-4, 1999, pp. 59-93.
[636d] Fizesan, Raul T., Pitica, Dan, and Man, Lucian, "Power Integrity Analysis and Bypass Capacitor Selection Using FDM on a Printed Circuit Board," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.
[637] Flegr, Z., Faltus, R., Zednicek, T., Smith, Ian, Zajacek, J., and Sikula, J., "Tantalum Capacitor Benchmark in Portable Audio Applications," CARTS Asia 2007 Proceedings, Taipei, Taiwan, Oct. 9-13, 2007, pp. xx-xx.
[638] Flores, Pablo A. Ruiz, Aguirre, Miguel E. Esquivel, Perez, Juan C., and Torres, Juan J., "Removal of Contaminants into Formation Tank with Ion Exchange Resins," CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 27-37.
[639] Franklin, R. W., "A Survey of Internal Fuses for Solid Tantalum Capacitors," 1988 Proceedings 38th Electronics Components Conference , Los Angeles, CA, May 9-11, 1988, pp. 109-113.
[640] Franklin, R. W., "An Exploration of Leakage Current," AVX.
[641] Franklin, R. W., "Analysis of Solid Tantalum Capacitor Leakage Current," AVX.
[642] Franklin, R. W., "Equivalent Series Resistance of Tantalum Capacitors."
[643] Franklin, R. W., "Ripple Rating of Tantalum Chip Capacitors."
[644] Freeman, Yuri, Lessner, Philip, and Scruggs, Craig, "Create Stable, Reliable, And Efficient Tantalum Capacitors," Electronic Design, vol. 56 no. 17, pp. 58,60-61, Aug. 28, 2008.
[645] Freeman, Yuri Pozdeev, "Effects of Thermal Oxide of Ta on Anodic Oxide of Ta," CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006, pp. xx-xx.
[646] Freeman, Yuri, Harrell, William R., Luzinov, Igor, Holman, Brian, and Lessner, Philip, "Electrical Characterization of Polymer Tantalum Capacitors with Poly (3,4-ethylenedioxythiophene) Cathode," CARTS USA 2009 Proceedings , Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[647] Freeman, Yuri Pozdeev, "How Far We Can Go with Hi CV Ta Capacitors," CARTS-Europe 2004 , Nice, France, Oct. 18-21, 2004, pp. 173-177.
[648] Freeman, Yuri Pozdeev, "Progress in High CV Ta Capacitors," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 232-238.
[649] Freeman, Yuri, Hahn, Randy, Lessner, Philip, and Prymak, John, "Reliability and Critical Applications of Tantalum Capacitors," CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 111-121.
[650] Freeman, Yuri, Hahn, Randy, Lessner, Philip, and Prymak, John, "Reliability and Critical Applications of Tantalum Capacitors," CARTS Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. 193-104.
[651] Freeman, Yuri, and Lessner, Philip, "Stable, Reliable, and Efficient Tantalum Capacitors," CARTS USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[652] Frost, Andy and Tsai, Jason, "Are you measuring your circuit or your scope probe?"
[652d] Fu, Shen-Li, and Chen, Gung-Fu, "Low Temperature Firing Pb(Fe2/3W1/3)x(Fe1/2Nb1/2)yTi2O3-Based Thick Film Capacitor Materials," Proceedings of the 1985 International Symposium on Microelectronics, Anaheim, CA, Nov. 11-14, 1985, pp. 48-51.
[653] Fuertes, A. B., Lota, G., Centeno, T. A., and Frackowiak, E., "Templated mesoporous carbons for supercapacitor application," Electrochimica Acta, vol. 50 no. 14, pp. 2799-2805, May 5, 2005.
[654] Fujio, Shihei, Sakurai, Alkihisa, and Kabayama, Hideki, "Analysis on the Power/Ground Plane Resonance Damping and Radiated Field Reduction with the RC Termination," 2001 IEEE EMC International Symposium Symposium Record - Volume 1, Montreal, Canada, Aug. 13-17, 2001, pp. 686-690.
[655] Fujio, Shohei, Kabayama, Hideki, and Sakurai, Akihisa, "Modeling and Analysis on Pass-through Current Decoupling Method for Multi-layer Printed Circuit Board," 1999 International Symposium on Electromagnetic Compatibility, Tokyo, Japan, May 17-21, 1999, pp. 365-368.
[655d] Fukuda, Yukio, Numata, Ken, Aoki, Kalsuhiro, and Nishimura, Akitoshi, "A Model for Describing Current-Voltage Characteristics of SrTiO3 Capacitors Under Low Electric Fields," Proceedings of the Ninth IEEE International Symposium on Applications of Ferroelectrics, University Park, PA, Aug. 7-10, 1994, pp. 79-82.
[656] Fukumoto, Yukihiro, Nakamura, Satoshi, Wada, Osami, and Koga, Ryuji, "A Design Method of Decoupling Circuits for a Digital PCB to Reduce High Frequency Current on Power and Ground Planes," 1999 International Symposium on Electromagnetic Compatibility, Tokyo, Japan, May 17-21, 1999, pp. 9-12.
[657] Fukumoto, Yukihiro, Matsuishi, Takuya, Kinoshita, Tomohiro, Wada, Osama, Toyota, Yoshitaka, and Koga, Ryuji, "Power Current Model of LSI and Parameter Identification for EMI Simulation of Digital PCBs," 2001 IEEE EMC International Symposium Symposium Record - Volume 2, Montreal, Canada, Aug. 13-17, 2001, pp. 1185-1190.
[658] Fukumoto, Yukihiro, Takahata, Yasuo, Wada, Osami, Toyota, Yoshitaka, Miyashita, Takuya, and Koga, Ryuji, "Power Current Model of LSI/IC Containing Equivalent Internal Impedance for EMI Analysis of Digital Circuits," IEICE Transactions on Communications, vol. E84-B, no. 11, pp. 3041-3049, Nov. 2001.
[659] Fukutani, Iwao, and Takagi, Daisuke, "Three-Terminal Capacitors Tackle Electromagnetic Noise, Absorb Surges," JEE, vol. 31, no. 328, pp. 28-31, Apr. 1994.
[660] Funer, Rolf, "Embedding Resistors and Capacitors," Printed Circuit Design, vol. 19, no. 12, pp. 8-11, Dec. 2002.
[660d] Gadoum, A., Gosse, B., and Gosse, J.-P., "Accelerated ac Degradation of Impregnated PP Films," IEEE Transactions on Dielectrics and Electrical Insulation, vol. 2 no. 6, pp. 1075-1082, Dec. 1995.
[661] Galvagni, John, "Low Inductance Capacitors for Digital Circuits."
[662] Galvagni, John, Randall, Sara, Roughan, Paul, and Templeton, Allen, "So Many Electrons, So Little Time...," 1994 Proceedings 44th Electronic Components & Technology Conference, Washington, D.C., May 1-4, 1994, pp. 234-238.
[663] Galvagni, John, Randali, Sara, and Roughan, Paul, "The Need for Low Inductance Capacitors."
[663d] Gao, Bo, Yuan, Chang-zhou, Su, Lin-hao, Chen, Li, and Zhang, Xiao-gang, "Nickel oxide coated on ultrasonically pretreated carbon nanotubes for supercapacitor," Journal of Solid State Electrochemistry, vol. 13 no. 8, pp. 1251-1257, Aug. 2009.
[664] Gao, Wei, Wan, Lixi, and Li, Jun, "A Lowpass Filter with An Embedded Capacitor for Wideband Noise Suppression in Multi-GHz PCBs," International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 28-31, 2008, pp. xx-xx.
[665] Garben, Bernd, Frech, Roland, Supper, Jochen, and McAllister, Michael F., "Frequency Dependencies of Power Noise," IEEE Transactions on Advanced Packaging, vol. 25, no. 2, pp. 166-173, May 2002.
[666] Garben, Bernd, McAllister, Michael F., and Becker, Wiren D., "Mid-Frequency Delta-I Noise Analysis of Complex Computer System Boards with Multiprocessor Modules and Verification by Measurements," IEEE Transactions on Advanced Packaging, vol. 24, no. 3, pp. 294-303, Aug. 2001.
[667] Garben, Bernd, and McAllister, Michael F., "Novel Methodology for Mid-Frequency Delta-I Noise Analysis of Complex Computer System Boards and Verification by Measurements," Proceedings of the IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging, Scottsdale, AZ, Oct. 23-25, 2000, pp. 69-72.
[668] Garben, Bernd, Katopis, George A., and Becker, Wiren D., "Package and Chip Design Optimization for Mid-Frequency Power Distribution Decoupling," Digest of 11th IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, Oct. 21-23, 2002.
[669] Garben, Bernd, Frech, Roland, and Supper, Jochen, "Simulations of Frequency Dependencies of Delta-I Noise," Proceedings 10th Topical Meeting on Electrical Performance of Electronic Packaging, Cambridge, MA, Oct. 29-31, 2001, pp. 199-202.
[670] Garcia-Araez, Nuria, Climent, Victor, Herrero, Enrique, Feliu, Juan M., and Lipkowski, Jacek, "Thermodynamic approach to the double layer capacity of a Pt(111) electrode in perchloric acid solutions," Electrochimica Acta, vol. 51 no. 18, pp. 3787-3793, May 5, 2006.
[671] Gawel, Richard, "Proper Design Techniques Solve High-Speed Op-Amp Stability Problems," Jan. 21, 2002.
[671d] Gebbia, Mark, Simma, Semion, and Alon, Ely, "Supercapacitors evolve to meet market needs," Electronic Products , vol 52 no. 7, pp. 19-20,22,24, Dec. 2009.
[672] Gentchev, A., Zansky, Z., and Collanton, P., "Pentium II power supplies: too young to smoke."
[673] Georgieva, Natalia, Chen, Zhizhang, and Oberhammer, Wolfgang, "On Resonant Effects in Multilayer RF/Microwave Printed Circuit Board Applications," IEEE Transactions on Advanced Packaging, vol. 22, no. 2, pp. 200-206, May 1999.
[674] Gerfer, Alexander, "SMD ferrites and filter connectors - EMI problem solvers," ITEM 2001, pp. 144-151, 2001.
[675] Gerke, Daryl, and Kimmel, Bill, "The Designer's Guide to Electromagnetic Compatibility," EDN, vol. 39, no. 2, pp. S3-S114, Jan. 20, 1994.
[676] Getz, Robin, and Moeckel, Bob, "Understanding and Eliminating EMI in Microcontroller Applications," National Seminconductor Application Note 1050, Aug. 1996.
[676d] Giants, T. W., "Crystallinity and Dielectric Properties of PEEK, Poly(ether ether ketone)," IEEE Transactions on Dielectrics and Electrical Insulation, vol. 1 no. 6, pp. 991-999, Dec. 1994.
[677] Gill, John, "Surge in Solid Tantalum Capacitors."
[678] Glazebrook, Jason, and Anderson, Ron, "Benefits of Using Custom Components in Respect to Film Capacitors and Assemblies," Proceedings of the 25th Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 78-83.
[679] Glover, Michael D., and Schaper, Leonard W., "A Functional Module Comparison of the Interconnected Mesh Power System (IMPS) with a Standard Four-layer MCM Topology," Proceedings 1996 IEEE Multi-Chip Module Conference, Santa Cruz, Feb. 6-7, 1996, pp. 143-146.
[680] Goia, Dan V., Halaciuga, Ionel, and LaPlante, Sylas, "Novel Precipitation Method for Producing Dispersed Crystalline Copper Powders for Electronic Applications," CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[681] Goldberger, Haim, and Troianello, Tony, "Power Handling Capacity of New Silicon-based RF Capacitors, Test to Destruction Data," CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 49-54.
[682] Goldblatt, Kim, "Powering Xilinx Spartan-II FPGas," Xilinx Application Note XAPP189, July 20, 2001.
[682d] Gondro, Elmar, Kuhn, Christian, Schuler, Franz, and Kowarik, Oskar, "Physics Based Fatigue Compact Model for Ferroelectric Capacitors," Proceedings of the 2000 12th IEEE International Symposium on Applications of Ferroelectrics, Volume 2, Honolulu, HI, July 21-Aug. 2, 2000, pp. 615-618.
[683] Gonzalez, G. M., Linares Y. M, R., Rosa, J. de la, and Fonseca, W. H., "Ground Plane Impedance Analysis of Printed Circuit Boards," 1999 IEEE EMC Symposium, Seattle, WA, Aug. 2-6, 1999, pp. 712-715.
[684] Goodenough, Frank, "Power-Supply Rails Plummet and Proliferate," Electronic Design, vol. 43, no. 15, pp. 51-55, July 24, 1995.
[685] Goodfellow, Steve and Weiss, Don, "Designing Power Systems Around Processor Specifications," Electronic Design, vol. 45, no. 2, pp. 53-60, Jan. 20, 1997.
[686] Gormally, Patrick, Bultitude, John, and Akbas, Mehmet, "Application Specific Ceramic MLCC Capacitors for Power Supplies," 24th Annual Capacitor and Resistor Technology Symposium, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. 73-77.
[687] Gormally, Pat, "Choosing the Best Capacitor for Wireless Devices and Charger Control Circuits," Wireless Design & Development, vol. 17 no. 5, pp. 12,14, May 2009.
[688] Gormally, Patrick, Edelman, Alex, and Vaisman, Pavel, "Considerations for Using Tantalum Capacitors in Portable Battery Operated Medical Devices," 2007 Medical Electronics Symposium, Minneapolis, MN, May 1-3, 2007, pp. xx-xx.
[689] Gormally, Patrick M., "Selecting Tantalum Capacitors for Low Profile, Small Form Factor Applications," 24th Annual Capacitor and Resistor Technology Symposium, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. 210-216.
[689d] Grama, Alin, Petreus, Dorin, Borza, Paul, and Grama, Lacrimioara, "Experimental Determination of Equivalent Series Resistance of a Supercapacitor," 32nd International Spring Seminar on Electronics Technology, Brno, Czech Republic, May 13-17, 2009, pp. xx-xx.
[690] Grasso, Charles, and Greb, Vincent W., "A Better Model for Decoupling Clock Circuits," Compliance Engineering 2000 Annual Reference Guide, vol. XVII, no. 3, pp. 130-136, 2000.
[691] Grasso, Charles, "Power Bus Ripple & Radiated Emissions Evaluation," NMCS, Feb. 2000.
[692] Greason, W. D., and Critchley, John, "Shelf-Life Evaluation of Aluminum Electrolytic Capacitors," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-9, no. 3, pp. 293-299, Sept. 1986.
[693] Greb, Vincent W., "Don't let rules of thumb set decoupling-capacitor values," EDN, Sept. 1, 1995.
[694] Grebenkemper, John, "The Effects of Thin Laminates on Signal Integrity," PC Fab, vol. 25, no. 11, pp. 38-41, Nov. 2002.
[695] Grebenkemper, John, "Thin PCB Laminates," Printed Circuit Design, vol. 19, no. 3, pp. 21-26, Mar. 2002.
[696] Greim, Michael C., "High-end digital system give a thumbs down to rules of thumb," EDN, vol. 45, no. 12, pp. 101-110, June 5, 2000.
[696b] Grodzka, Emilia, Winkler, Krzysztof, Esteban, Beatriz Meana, and Kvarnstrom,
Carita,
"Capacitance properties of electrochemically deposited polyazulene films,"
Electrochimica Acta<.CITE>, vol. 55 no. 3, pp. 970-978, Jan. 1, 2010.
[696d] Gu, Hal-Bon, Kim, Jong-Uk, Song, Hee-Woong, Park, Gye-Choon, and Park,
Bok-Kee,
"Electrochemical properties of carbon composite electrode with polymer
electrolyte for electric double-layer capacitor," Electrochimica Acta
, vol. 45 no. 8-9, pp. 1533-1536, Jan. 3, 2000.
[697] Gu, Shengxing,
"Capacitor Selection in Aviation Equipment," CARTS USA 2008
Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[697d] Gu, X., Shui, Q., Jiang, C., Sun, Y., and Gundersen, M. A.,
"High Energy Density Ceramic Film Capacitors for Compact Pulsed Power,"
Proceedings of the 26th International Power Modulator Symposium and 2004 High
Voltage Workshop, San Francisco, CA, May 23-26, 2004, pp. 79-81.
[697h] Gui, Zhilun, Cai, Hong, and Li, Longtu,
"Composite MLCCs with X7R Characteristics," Proceedings of the 2000 12th
IEEE International Symposium on Applications of Ferroelectrics, Volume 2
, Honolulu, HI, July 21-Aug. 2, 2000, pp. 821-824.
[698] Guillemet, Ph., Pascot, C., and Scudeller, Y.,
"Compact Thermal Modeling of Electric Double-Layer-Capacitors,"
Proceedings of the 12th International Workshop on THERMal INvestigations of
ICs and Systems, Nice, Cote d'Azur, France, Sept. 24-26, 2006, pp.
118-122.
[699] Guillemet, Ph., Pascot, C., and Scudeller, Y.,
"Electro-thermal analysis of Electric Double-Layer-Capacitors,"
Proceedings of the 12th International Workshop on THERMal INvestigations of
ICs and Systems, Nice, Cote d'Azur, France, Sept. 24-26, 2006, pp.
224-228.
[700] Guo, Chunlei, and Hubing, Todd H.,
"Circuit Models for Power Bus Structures on Printed Circuit Boards Using a
Hybrid FEM-SPICE Method," IEEE Transactions on Advanced Packaging
, vol. 29 no. 3, pp. 441-447, Aug. 2006.
[701] Gupta, Puneet, and Kahng, Andrew B.,
"Efficient Design and Analysis of Robust Power Distribution Meshes,"
19th International Conference on VLSI Design, Hyderabad, India, Jan.
3-7, 2006, pp. xx-xx.
[791d]
Gupta, S. P., Koripella, C. R., and Mann, L. A.,
"Low Fire Z5U Ceramic Dielectric for Surface Mount MLC," Proceedings of
the Eighth IEEE International Symposium on Applications of Ferroelectrics
, Greenville, SC, Aug. 30-Sept. 2, 1992, pp. 206-208.
[702] Gupta, Vinay, and Miura, Norio,
"Polyaniline/single-wall carbon nanotube (PANI/SWCNT) composites for high
performance supercapacitors," Electrochimica Acta, vol. 52 no. 4,
pp. 1721-1726, Dec. 1, 2006.
[703] Haas, Helmut, Schnitter, Christoph, Sato, Nobuyuki, Karabulut, Hikmet,
Fujimori, Yohsuke, and Thomas, Oliver,
"Challenge: Highest Capacitance Tantalum Powders," CARTS USA 2009
Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[704] Haas, Helmut,
"Magnesium Vapour Reduced Tantalum Powders with Very High Capacitances,"
CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 5-8.
[705] Hackenberger, Wesley, Kwon, Seongtae, and Alberta, Edward,
"Advanced Multilayer Capacitors Using High Energy Density Antiferroelectric
Ceramics," CARTS USA 2008 Proceedings, Newport Beach, CA,
Mar. 17-20, 2008, pp. xx-xx.
[706] Hackenberger, Wesley, Alberta, Ed, Rehrig, Paul W., Jeong, Daeyong, and Zhang,
Qiming,
"High Dielectric Constant Terpolymers for Energy Storage Capacitors,"
Proceedings of the 25th Symposium for Passive Components, Palm
Springs, CA, Mar. 21-24, 2005, pp. 239-243.
[707] Hahn, Andy,
"High-Speed Operational Amplifier Layout Made Easy," Texas Instruments
Application Brief SLOA046, June. 2000.
[708] Hahn, M., Kotz, R., Gallay, R., and Siggel, A.,
"Pressure evolution in propylene carbonate based electrochemical double layer
capacitors," Electrochimica Acta, vol. 52 no. 4, pp. 1709-1712,
Dec. 1, 2006.
[709] Hahn, Randy, Piller, Jim, and Lessner, Philip,
"Improved SMT Performance of Tantalum Conductive Polymer Capacitors with Very
Low ESR," Proceedings of CARTS-Europe 2005, Prague, Czech
Republic, Oct. 17-20, 2005, pp. 161-170.
[710] Hahn, Randy, Piller, Jim, and Lessner, Philip,
"Improved SMT Performance of Tantalum Conductive Polymer Capacitors with Very
Low ESR," 2006 CARTS Conference Proceedings, Orlando, FL,
Apr. 3-6, 2006, pp. xx-xx.
[711] Hahn, Randy, and Paulsen, Jonathan,
"Low Impedance Ta Capacitors to Serve the Needs of the Electronics Industry,"
CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept.
25-28, 2006, pp. xx-xx.
[712] Hahn, Randy, and Paulsen, Jonathan,
"Low Impedance Ta Capacitors to Serve the Needs of the Electronics Industry,"
CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar.
26-29, 2007, pp. 349-360.
[713] Hahn, Randy, and Pritchard, Kim,
"Strategies for Manufacturing Ultra Low ESR Ta Capacitors,"
CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 166-171.
[714] Hahn, Randy, and Pritchard, Kim,
"Strategies for Manufacturing Ultra Low ESR Ta Capacitors,"
Proceedings of the 25th Symposium for Passive Components, Palm Springs,
CA, Mar. 21-24, 2005, pp. 225-231.
[715] Hahn, Randy, Randall, Mike, and Paulsen, Jonathan,
"The Battle for Maximum Volumetric Efficiency - Part I: When Technologies
Compete, Customers Win," CARTS Europe 2007, Barcelona, Spain,
Oct. 29-Nov. 1, 2007, pp. 63-73.
[716] Hahn, Randy, Randall, Mike, and Paulsen, Jonathan,
"The Battle for Maximum Volumetric Efficiency - When Technologies Compete,
Customers Win," CARTS USA 2008 Proceedings, Newport Beach,
CA, Mar. 17-20, 2008, pp. xx-xx.
[717] Hakoda, Takeshi, Sakusabe, Takashi, Takahashi, Takehiro, and Schibuya, Noboru,
"Study on Noise Reduction Effect Using the Decoupling Capacitor with Resistor
on Power Distribution Line," Asia-Pacific Symposium on Electromagnetic
Compatibility and 19th International Zurich Symposium on Electromagnetic
Compatibility, Singapore, May 19-23, 2008, pp. 863-866.
[717d] Hall, Chad,
"Pairing ultracapacitors and batteries aids reliability," Electronic
Products, vol 52 no. 6, pp. 49-50, Nov. 2009.
[718] Haller, Robert J.,
"The nuts and bolts of signal-integrity analysis."
[719] Hammal, R., Rain, P., Gosse, J.P., and Hantouche, C.,
"Study and Characterization of PD in Impregnated Polypropylene Capacitors,"
IEEE Transactions on Dielectrics and Electrical Insulation, vol.
7 no. 3, pp. 446-457, June 2000.
[720] Hampe, Matthias, and Dickmann, Stefan,
"Double and Single Summation Expression for the Impedance of Populated PCB
Power-Bus Structures Including Asymmetrically Connected Components," EMC
Zurich in Singapore 2006, Singapore, Feb. 27-Mar. 3, 2006, pp.
375-378.
[721] Hampe, Matthias, and Dickmann, Stefan,
"Generation of Common-Mode Currents on PCB Power-Bus Structures," EMC
Zurich in Singapore 2006, Singapore, Feb. 27-Mar. 3, 2006, pp.
320-323.
[722] Hampe, Matthias, and Dickmann, Stefan,
"Improved Impedance Calculation of Populated PCB Power-Bus Structures,"
EMC Zurich in Singapore 2006, Singapore, Feb. 27-Mar. 3, 2006,
pp. 85-88.
[723] Hampe, Matthias, Palanisamy, Vijay Anand, and Dickmann, Stefan,
"Single Summation Expression for the Impedance of Rectangular PCB Power-Bus
Structures Loaded With Multiple Lumped Elements," IEEE Transactions on
Electromagnetic Compatibility, vol. 49 no. 1, pp. 58-67, Feb. 2007.
[724] Hampe, Matthias, and Diskmann, Stefan,
"The Impact of Decoupling Capacitors on the Impedance of Rectangular PCB
Power-Bus Structures," 16th International Zurich Symposium on
Electromagnetic Compatibility, Zurich, Switzerland, Feb. 13-18, 2005,
pp. 251-256.
[725] Hanrahan, Robert M.,
"Designers Must Take Care When Powering High-Speed CMOS," Electronic
Design, vol. 51, no. 17, pp. 53, Aug. 4, 2003.
[725d] Hao, Yan-Jing, Wang, Yan-Ying, Lai, Qiong-Yu, Zhao, Yan, Chen, Lian-Mei, and Ji,
Xiao-Yang,
"Study of capacitive properties for LT-Li4Mn5O12 in hybrid supercapacitor,"
Journal of Solid State Electrochemistry, vol. 13 no. 6, pp.
905-912, June 2009.
[726] Hara, Tsutomu, Kasai, Mariko, Yokota, Hitoshi, and Nakamura, Atsushi,
"Analysis of Radiation Noise Caused by Power Distribution on Multilayer
Printed Circuit Board," 1999 International Symposium on Electromagnetic
Compatibility, Tokyo, Japan, May 17-21, 1999, pp. 5-8.
[727] Harada, K., Kanai, H., Yamashita, Y., Mukaeda, S., and Hasegawa, K.,
"Y7R-Designated 6.8 uF Multilayer Ceramic Capacitors in EIA1206 size,"
Proceedings of 1995 Japan International Electronic Manufacturing Technology
Symposium, Omiya, Japan, Dec. 4-6, 1995, pp. 323-327.
[728] Harada, Takashi, Sasaki, Hideki, and Kami, Yoshio,
"Controlling Power- Distribution-Plane Resonance in Multilayer Printed Circuit
Boards," IEICE Transactions on Communications, vol. E83-B,
no. 3, pp. 577-585, Mar. 2000.
[729] Harada, T., Sasaki, H., and Kami, Y.,
"Investigation on Power Distribution Plane Resonance in Multilayer Printed
Circuit Boards Using a Transmission-Line Model" 1999 International
Symposium on Electromagnetic Compatibility, Tokyo, Japan, May 17-21,
1999, pp. 21-24.
[730] Harada, Takashi, Sasaki, Hideki, and Kami, Yoshio,
"Investigation on Radiated Emission Characteristics of Multilayer Printed
Circuit Boards," IEICE Transactions on Communications, vol.
E80-B, no. 11, pp. 1645-1651, Nov. 1997.
[731] Harada, Takashi, Ogawa, Masashi, Kusumoto, Manabu, and Wabuka, Hiroshi,
"Power Integrity Estimation by Use of LSI Power-pin Model Applying
Chip-Package-Board Co-design," Electrical Design of Advanced Packaging
and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 5-8.
[732] Harada, Takashi, Sasaki, Hideki, and Kami, Yoshio,
"Radiated Emission Arising from Power Distribution in Multilayer Printed
Circuit Boards," IEEE 1997 International Symposium on Electromagnetic
Compatibility, Austin, TX, Aug. 18-22, 1997, pp. 518-522.
[732d] Harris, Kevin, McDuff, Glen, and Burkes, T. R.,
"Evaluation of Electrolytic Capacitors for High Peak Current Pulse Duty,"
IEEE Conference Record of the 1990 Nineteenth Power Modulator Symposium
, San Diego, CA, June 26-28, 1990, pp. 548-559.
[733] Harris, Scott,
"Turn up the heat on stacked capacitors," Electronics Weekly,
June 4, 2008.
[733d] Hase, T., Noguchi, T., Takemura, K., and Miyasaka, Y.,
"Fatigue Characteristics of PZT Capacitors with Ir/IrOx Electrodes,"
Proceedings of the Eleventh IEEE International Symposium on Applications of
Ferroelectrics, Montreux, Switzerland, Aug. 24-27, 1998, pp. 7-10.
[734] Haseloff, Eilhard,
"Electromagnetic Emission From Logic Circuits," Texas Instruments
Application Report SZZA007, Nov. 1999.
[735] Hashemi, Hassan, Sandborn, Peter A., Disko, David, and Evans, Rich,
"The Close Attached Capacitor: A Solution to Switching Noise Problems,"
1992 Proceedings 42nd Electronic Components & Technology Conference
, San Diego, CA, May 18-20, 1992, pp. 573-582.
[736] Hashemi, Seyed Hassan, Sandborn, Peter A., Disko, David, and Evans,
Richard,
"The Close Attached Capacitor: A Solution to Switching Noise Problems,"
IEEE Transactions on Components, Hybrids, and Manufacturing
Technology, vol. 15, no. 6, pp. 1056-1063, Dec. 1992.
[737] Haussmann, Gary, Matthews, Marty, and Gisin, Franz,
"Impact on Radiated Emissions of Printed Circuit Board Stitching," 1999
IEEE EMC Symposium, Seattle, WA, Aug. 2-6, 1999, pp. 793-796.
[738] He, Jiangqi, Zhong, Dong, Ji, Steven Yun, Ji, Gang, and Li, Yuan-Liang,
"Study of Package EMI Reduction for GHz Microprocessors," Digest of
11th IEEE Topical Meeting on Electrical Performance of Electronic
Packaging, Monterey, CA, Oct. 21-23, 2002.
[739] Heinrich, Gerd, and Dickmann, Stefan,
"Interactions between Vias and the PCB Power-Bus," 2009 20th
International Zurich Symposium on Electromagnetic Compatibility,
Zurich, Switzerland, Jan. 12-16, 2009, pp. 257-260.
[740] Held, Joachim, and Wolf, Thomas,
"Optimized Decoupling Concepts for Digital VLSI Circuits," 2001 IEEE EMC
International Symposium Symposium Record - Volume 2, Montreal, Canada,
Aug. 13-17, 2001, pp. 904-909.
[741] Helmold, Norman,
"Infrared Flash Thermographic Location of a Short in a Solid Tantalum
Capacitor," CARTS 2007 Symposium Proceedings, Albuquerque,
NM, Mar. 26-29, 2007, pp. 307.
[742] Helms, Bruce,
"Multilayer Ceramic Chip Capacitors: An Alternative to Tantalums,"
Surface Mount Technology, vol. 5, no. 5, pp. 38-41, May 1991.
[743] Hendrix, Bryan C., and Stauf, Gregory T.,
"Low Temperature Process for High Density Thin Film Integrated Capacitors,"
Proceedings 2000 HD International Conference on High-Density
Interconnect and Systems Packaging (Proceedings of SPIE - The International
Society for Optical Engineering, Volume 4217), Denver, CO, Apr. 25-28,
2000, pp. 342-345.
[744] Henke, Reinhold and Ohnstad, Daniel,
"EMC-Controlled Board Design," Printed Circuit Design, vol. 8,
no. 7, pp. 28-37, July 1991.
[745] Hennings, Detlev, Klee, Mareike, and Waser, Rainer,
"Advanced Dielectrics: Bulk Ceramics anf Thin Films," Advanced Materials
, vol. 3 no. 7-8, pp. 334-340, July/Aug. 1991.
[745d] Hennings, Detlev F. K.,
"Multilayer Ceramic Capacitors with Base Metal Electrodes," Proceedings
of the 2000 12th IEEE International Symposium on Applications of
Ferroelectrics, Volume 1, Honolulu, HI, July 21-Aug. 2, 2000, pp.
135-138.
[746] Herrell, Dennis, and Beker, Benjamin,
"EMI and Power Delivery Design in PC Systems", Proceedings of the IEEE
6th Topical Meeting on Electrical Performance of Electronic Packaging,
San Jose, CA, Oct. 27-28, 1997. pp. 23-26.
[747] Herrell, Dennis J. and Beker, Benjamin,
"Modeling of Power Distribution Systems for High-Performance Microprocessors,"
IEEE Transactions on Advanced Packaging, vol. 22, no. 3, pp.
240-248, Aug. 1999.
[748] Herrell, Dennis, and Beker, Benjamin,
"Modeling of Power Distribution Systems in PCs," Proceedings of the IEEE
7th Topical Meeting on Electrical Performance of Electronic Packaging ,
West Point, NY, Oct. 26-28, 1998, pp. 159-162.
[749] Herrell, Dennis,
"Power to the package," IEEE Spectrum, vol. 36, no. 7, pp.
46-53, July 1999.
[750] Hersey, Ralph,
"FWD>DES- bulk decoupling ca," TechNet archives #004555, 2 Aug 1996.
[751] Heyen, Johann, and Jacob, Arne F.,
"Multilayer Capacitors with Reduced Parasitics," 2005 European Microwave
Conference, Volume 2, Paris, France, Oct. 4-6, 2005, pp. 1343-1346.
[752] Hilburn, Rocky, Hasegawa, Craig, and Wang, Jiangtao,
"Business Case for Multiple Sheet Resistivities for Thin Film Embedded
Resistor Packaging Applications," IPC Printed Circuits Expo, APEX and
the Designers Summit Proceedings 2008 Technical Conference, Las Vegas,
NV, Apr. 1-3, 2008, pp. S22:01.
[753] Hill, Lee,
"Embedded Capacitance," Printed Circuit Design, vol. 17, no. 6,
pp. 38-39, June 2000.
[754] Hillman, Craig,
"Common mistakes in electronic design," EDN, vol. xx no. x, pp.
xx-xx, Dec. 14, 2007.
[755] Hillman, Craig, and Helmold, Norman,
"Identification of Missing or Insufficient Electrolyte Constituents in Failed
Aluminum Electrolytic Capacitors," 24th Annual Capacitor and
Resistor Technology Symposium, San Antonio, TX, Mar. 29-Apr. 1, 2004,
pp. 122-127.
[756] Hillman, Craig,
"Uprating of Ceramic Capacitors," Circuitnet.
[757] Hino, Takanori, Nishida, Minoru, and Araki, Takao,
"Dielectric Properties of Multilayer BaTiO3-SrTiO3 Thin Film by Pulsed
Laser Deposition," Quarterly Journal of the Japan Welding Society/
Yosetsu Gakkai Ronbunshu, vol. 24 no. 3, pp. 259-264, 2006.
[758] Hipler, Frank, and Auer, Gerhard,
"A New Ultrafine Titanium Oxide Raw Material for the Manufacturing of
Fine-Particulate Barium Titanate Dielectrics," CARTS Europe 2007
, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[759] Hitchcock, Rarren, and Hofmann, Neal,
"Buried Treasure - Capacitance and Resistance," 1997 Electronic
Interconnect Conference, 1997.
[759d] Ho, J., Jow, T. R., and Boggs, S. A.,
"Implications of Advanced Capacitor Dielectrics for Performance of Metallized
Film Capacitor Windings," Proceedings of the 2008 IEEE International
Power Modulators and High Voltage Conference, Las Vegas, NV, May 27-31,
2008, pp. 556-559.
[760] Ho, Janet, Jow, T. Richard, and Boggs, Steven A.,
"Implications of Advanced Capacitor Dielectrics for Performance of Metallized
Film Capacitor Windings," IEEE Transactions on Dielectrics and
Electrical Insulation, vol. 15 no. 6, pp. 1754-1760, Dec. 2008.
[761] Hobbs, Joseph M., Dalmia, Sidharth, Sundaram, Venky, Wan, Lixi, Kim, Woopoung,
White, George E., Swaminathan Madhavan, and Tummala, Rao R.,
"Development and Characterization of Embedded Thin-Film Capacitors for Mixed
Signal Applications on Fully Organic System-on-package Technology,"
Proceedings of Radio and Wireless Conference, San Diego, CA, Aug.
2002, pp. 201-204.
[762] Hoffmann, Christian, Dudesek, Pavol, Moser, Johann, and Reichmann, Klaus,
"Ceramic System with High Dielectric Constant for C0G Capacitors,"
CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006,
pp. xx-xx.
[762d] Hogiri, Masayuki, and Kagata, Hiroshi,
"The Influence of BaTiO3 Tetragonality by Solid State Synthesis on MLCC's
Dielectric Characteristics," Key Engineering Materials, vol.
421-422, pp. 293-296, 2010.
[763] Holden, Happy,
"A Design Technology Innovation- The Power Mesh Architecture for PCBs,"
The Board Authority, pp. 2-6, December 2000.
[763d] Holden, Happy,
"Embedded Passive Design," Printed Circuit Design and Fab,
vol. 26 no. 7, pp. 48,36, July 2009.
[764] Horacek, I., Zednicek, T., Zednicek, S., Karnik, T., Petrzilek, J., Jacisko,
P., Gregorova, P., and Pinwill, I.,
"High CV Tantalum Capacitors - Challenges and Limitations," CARTS
USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp.
xx-xx.
[765] Horacek, I., Marek, L., Tomasko, J., Zednicek, T., and Zednicek, S.,
"Lowest ESR at High Voltage - Multianode Tantalum Capacitors," 24th
Annual Capacitor and Resistor Technology Symposium, San Antonio, TX,
Mar. 29-Apr. 1, 2004, pp. 275-278.
[766] Horacek, I., Marek, L., Tomasko, J., Zednicek, T., and Zednicek, S.,
"Lowest ESR at High Voltage - Multianode Tantalum Capacitors,"
CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 141-144.
[767] Horacek, I., Marek, L., Tomasko, J., Zednicek, T., and Zednicek, S.,
"Lowest ESR at High Voltage - Multianode Tantalum Capacitors,"
Advancing Microelectronics, vol. 33 no. 4, pp. 26-28, July/Aug.
2006.
[768] Hossick-Schott, Joachim,
"A Carbon Cathode in a High-Voltage Defibrillator Capacitor," 2006
CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[769] Hossick-Schott, Joachim,
"A Charge-based Model for the Time Progression of Field Crystallization in
Tantalum Pentoxide," CARTS USA 2009 Proceedings,
Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[770] Hossick-Schott, Joachim, and Viste, Mark. E.,
"A Charge-Transfer Reaction at the Electrified Tantalum-Pentoxide-Electrolyte
Interface," CARTS-Europe 2006 Proceedings, Bad Homburg,
Germany, Sept. 25-28, 2006, pp. xx-xx.
[771] Hossick-Schott, Joachim, and Viste, Mark E.,
"Electrochemical Reactions on Graphite Cathodes in High-Voltage Capacitors,"
CARTS USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20,
2008, pp. xx-xx.
[772] Hossick-Schott, Joachim,
"Prospects for the ultimate energy density of oxide-based capacitor anodes,"
CARTS Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007,
pp. xx-xx.
[772d] Howard, James,
"An Open Architecture Approach to BURIED PASSIVE Components," Printed
Circuit Design and Manufacture, vol. 20 no. 12, pp. 40-41, Dec. 2003.
[773] Howard, James R.,
"Buried Capacitance Technology," Surface Mount International Conference
& Exposition Proceedings of the Technical Program, Volume I, San
Jose, CA, Sept. 1-3, 1992, pp. 547-555.
[774] Howard, James,
"Buried Capacitance Technology Achieves Distributed Decoupling Capacitance,"
IPC Printed Circuits Expo Meeting Proceedings , Boston, MA, Apr.
24-27, 1994, pp. P7-2-1 to P7-2-9.
[775] Hsiang, Hsing-I., Hsi, Chi-Shiung, Huang, Chun-Chi, and Fu, Shen-Li,
"Low temperature sintering and dielectric properties of BaTiO3 with glass
addition," Materials Chemistry and Physics, vol. 113 no. 2-3, pp.
658-663, Feb. 15, 2009.
[775d] Hsieh, Tung-Feng, Chuang, Chia-Chih, Liu, Ming-Yang, Chou, Yu-Chuan, and Shu,
Chi-Min,
"A New Way to Manufacture a Carbon Nanotubes Supercapacitor," Advanced
Materials Research, vol. 79-82, pp. 47-50, 2009.
[776] Hsu, Hsing-Chou, and Lin, Jack,
"Analysis of Entire Power Distribution System of Chip, Package and Board for
High Speed IO Design," 17th Topical Meeting on Electrical Performance of
Electronic Packaging, San Jose, CA, Oct. 27-29, 2008, pp. 99-102.
[776d] Hsu, Jimmy, Lin, Jack, Lin, Chin-Sung, and Wu, Kevin,
"Interference Investigation of Entire Power Distribution System from Chip,
Package to Board for High Speed IO Design," 59th Electronic Components
& Technology Conference, San Diego, CA, May 26-29, 2009, pp.
1926-1930.
[777] Hu, Chi-Chang, Liu, Ming-Jue, and Chang, Kuo-Hsin,
"Anodic deposition of hydrous ruthenium oxide for supercapaciors: Effects of
the AcO- concentration, plating temperature, and oxide loading,"
Electrochimica Acta, vol. 53 no. 6, pp. 2679-2687, Feb. 15, 2008.
[778] Hu, Chi-Chang, and Chen, Wei-Chun,
"Effects of substrates on the capacitive performance of RuOx.nH2O and
activated carbon-RuOx electrodes for supercapacitors," Electrochimica
Acta, vol. 49 no. 21, pp. 3469-3477, Sept. 1, 2004.
[779] Hu, Chi-Chang, Chang, Kuo-Hsin, and Wang, Chen-Ching,
"Two-step hydrothermal synthesis of Ru-Sn oxide composites for electrochemical
supercapacitors," Electrochimica Acta, vol. 52 no. 13, pp.
4411-4418, Mar. 20, 2007.
[780] Hu, H., Hubing, T., Van Doren, T.,
"Estimation of Printed Circuit Board Power Bus Noise at Resonance Using a
Simple Transmission Line Model," 2001 IEEE EMC International Symposium
Symposium Record - Volume 2, Montreal, Canada, Aug. 13-17, 2001, pp.
896-898.
[781] Hu, Mason, and Howard, James,
"Distributed and Discrete Capacitors EMI Performance Comparison,"
Proceedings of the Technical Program NEPCON West '95, Volume 2,
Anaheim, CA, Feb. 28-Mar. 2, 1995, pp. 756-765.
[782] Hu, Mason, and Howard, James,
"EMI Performance Comparison of Distributed and Discrete Capacitors,"
Compliance Engineering, vol. XII, no. 3, pp. 57-62, Mar./Apr.
1995.
[783] Hu, Mason, and Howard, James,
"Distributed and Discrete Capacitors EMI Performance Comparison,"
Proceedings of the Technical Program NEPCON West '95, Volume 2,
Anaheim, CA, Feb. 26-Mar. 2, 1995, pp. 756-765.
[784] Hu, Zhong-Ai, Xie, Yu-Long, Wang, Yao-Xian, Mo, Li-Ping, Yang, Yu-Ying, and
Zhang, Zi-Yu,
"Polyaniline/SnO2 nanocomposite for supercapacitor applications,"
Materials Chemistry and Physics, vol. 114 no. 2-3, pp. 990-995, Apr.
15, 2009.
[784d] Huang, C., Bless, P., and Stein, S. J.,
"High Reliability Thick Film Capacitor Dielectrics," Proceedings of the
1984 International Symposium on Microelectronics, Dallas, TX, Sept.
17-19, 1984, pp. 433-440.
[785] Huang, Gang, Naeemi, Azad, Zhou, Tingdong, O'Connor, Dan, Muszynski, Andrew,
Singh, Bhup, Becker, Dale, Venuto, James, and Meindl, James D.,
"Compact Physical Models for Chip and Package Power and Ground Distribution
Networks for Gigascale Integration (GSI)," 2008 Proceedings 58th
Electronic Components &, Technology Conference, Lake Buena Vista,
FL, May 27-30, 2008, pp. 646-651.
[786] Huang, Hong,
"Coordination of Design Issues in The Intermediate Bus Architecture,"
Twentieth Annual IEEE Applied Power Electronics Conference and Exposition,
Volume 1, Austin, TX, Mar. 6-10, 2005, pp. 169-175.
[787] Huang, Li-Ming, Wen, Ten-Chin, and Gopalan, A.,
"Electrochemical and spectroelectrochemical monitoring of supercapacitance
and electrochromic properties of hydrous ruthenium oxide embedded
poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonic acid) composite,"
Electrochimica Acta, vol. 51 no. 17, pp. 3469-3476, Apr. 25,
2006.
[788] Huang, Lilly, Weiss, Don, and Rausch, Martin,
"Effects of On-Package Decoupling on Microprocessor Power Delivery Design,"
Proceedings of the 5th Topical Meeting on Electrical Performance of
Electronic Packaging , Napa, CA, Oct. 28-30, 1996, pp. 86-89.
[789] Huang, Qinghua, Wang, Xianyou, and Li, Jun,
"Characterization and performance of hydrous manganese oxide prepared by
electrochemical method and its application for supercapacitors,"
Electrochimica Acta, vol. 52 no. 4, pp. 1758-1762, Dec. 1, 2006.
[790] Huber, Andreas, Wendel, Jan, and Reiss, Karl,
"A FDTD Method for Fast Simulation of Decoupling Capacitors on Multilayer
Multichip Modules," 1999 International Symposium on Electromagnetic
Compatibility, Tokyo, Japan, May 17-21, 1999, pp. 228-231.
[791] Hubing, T., Van Doren, T., Sha, F., Drewniak, J., and Wilhelm, M.,
"An Experimental Investigation of 4-Layer Printed Circuit Board
Decoupling," IEEE 1995 International Symposium on Electromagnetic
Compatibility, Atlanta, GA, Aug. 14-18, 1995, pp. 308-312.
[792] Hubing, Todd H.,
"Decoupling Capacitance, Theory and Applications," NCMS Embedded
Capacitance Conference, Feb. 28-29, 2000.
[793] Hubing, Todd, and Van Doren, Tom,
"Designing for EMC: The Top 4 Guidelines," Printed Circuit Design &
Manufacture, vol. 20, no. 6, pp. 22-27, 47, June 2003.
[794] Hubing, Todd H., Van Doren, Thomas P., and Drewniak, James L.,
"Identifying and Quantifying Printed Circuit Board Inductance," IEEE
International Symposium on EMC, Chicago, IL, Aug. 22-26, 1994, pp.
205-208.
[795] Hubing, Todd H., Drewniak, James L., Van Doren, Thomas P., and
Hockanson, David M.,
"Power Bus Decoupling on Multilayer Printed Circuit Boards," IEEE
Transactions on Electromagnetic Compatibility, vol. 37, no. 2, pp.
155-166, May 1995.
[796] Hubing, T., Chen, J., Drewniak, J., Van Doren, T., Ren, Y., Fan, J.,
and DuBroff, R.,
"Power Bus Noise Reduction Using Power Islands in Printed Circuit Board
Designs," 1999 International Symposium on Electromagnetic
Compatibility, Tokyo, Japan, May 17-21, 1999, pp. 1-4.
[797] Hubing, Todd, Chen, Juan, Drewniak, James, Van Doren, Tom, Ren, Yong,
Fan, Jun, and DuBroff, Richard,
"Power Bus Noise Reduction Using Power Islands in Printed Circuit Board
Designs," Nov. 11, 1999.
[798] Hubing, Todd, Xu, M., Chen, J., Van Doren, T., Drewniak, J., and
DuBroff, R.,
"Preliminary Embedded Capacitance Measurement Results," Oct. 23, 1999.
[799] Hubing, Todd,
"PWB Power Bus Structures: Theory and Design," Nov. 11, 1999.
[800] Hudis, Martin,
"Large Aluminum Electrolytic Capacitor Constructed With an Electrochemical
Cathode," Fourteenth Annual Applied Power Electronics Conference and
Exposition, Volume 2, Dallas, TX, Mar. 14-18, 1999, pp. 699-706.
[801] Huenert, Rudolf,
"Copper Powders for Capacitors," Proceedings CARTS Asia 2005,
Taipei, Taiwan, Oct. 11-13, 2005, pp. 11-19.
[801d] Huh, Min, Cho, Kyeong Ho, Nam, Hyo-Duk, and Lee, Hee Young,
"Degradation Behavior of Ca-Doped Barium Titanate Ceramic Capacitors,"
Proceedings of the Ninth IEEE International Symposium on Applications of
Ferroelectrics, University Park, PA, Aug. 7-10, 1994, pp. 572-576.
[802] Humenik, J. N., Oberschmidt, J. M., Wu, L. L., and Paull, S. G.,
"Low-inductance decoupling capacitor for the thermal conduction modules of the
IBM Enterprise System/9000 processors," IBM Journal of Research and
Development, vol. 36, no. 5, pp. 935-942, Sept. 1992.
[803] Hunter, Craig,
"Packaging Passives," SMT Web Exclusive Article.
[804] Hurst, Larry, and Comaschi, Alberto,
"Power Bypass Decoupling of SHARC Processors," Analog Devices
Engineer-to-Engineer Note EE-253, Rev. 1, Dec. 5, 2006.
[804d] Hwang, Jin-Hyun, Raj, P. Markondeya, Abothu, Isaac Robin, Yoon, Chong, Iyer,
Mahadevan, Jung, Hyung-Mi, Hong, Jong-Kuk, and Tummala, Rao,
"Temperature dependence of the dielectric properties of polymer composite
based RF capacitors," Microelectronic Engineering, vol. 85 no. 3,
pp. 553-558, Mar. 2008.
[805] Hwang, Seunghyun E., Swaminathan, Madhavan, and Venkatakrishnan,
Venkatesan,
"Extraction of Material Properties for Low-K and Low-Loss Dielectrics Using
Cavity Resonator and Efficient Finite Difference Solver up to 40GHz,"
Electrical Design of Advanced Packaging and Systems Symposium, Seoul,
Korea, Dec. 10-12, 2008, pp. 53-56.
[806] Hynynen, Lauri, Tarvainen, Timo, Rouvala, Markku, and Renko, Antti,
"On the Effect of Mobile Device Shape Characteristics to Interconnection Noise
Coupling to an RF Chip Antenna," 15th Topical Meeting on Electrical
Performance of Electronic Packaging, Scottsdale, CA, Oct. 23-25, 2006,
pp. 127-130.
[807] Hyslop, M. S., Gilderdale, A. N., Hernandez, J. M., Larson, R. W.,
and Watson, W. A.,
"High Performance Decoupling Capacitor for Installation Under the Dual-In-Line
IC Package," 1987 Proceedings 37th Electronic Components &
Technology Conference, Boston, MA, May 11-13, 1987, pp. 449-455.
[808] Hyun, Jin-Gul, Cho, Sung-Dong, and Paik, Kyung-Wook,
"A Study on the Temperature Dependence of Epoxy/BaTiO3 Composite Embedded
Capacitor Films," Journal of Electronic Materials, vol. 34 no.
9, pp. 1264-1269, Sept. 2005.
[809] Hyun, Jin-Gul, and Paik, Kyung-Wook,
"Characteristics of Fine Patterned Epoxy/BaTiO3 Composite Embedded Capacitor
Films (ECFs) for Organic Substrates," 2007 Proceedings 57th Electronic
Components & Technology Conference, Reno, NV, May 29-June 1, 2007,
pp. 1027-1032.
[810] Hyun, Jin-Gul, Lee, Sangyong, and Paik, Kyung-Wook,
"Fabrication and characterization of Epoxy/BaTiO3 composite capacitor films
for high frequency behaviors," 9th International Conference on
Electronic Materials and Packaging, Daejon, Korea, Nov. 19-22, 2007,
pp. xx-xx.
[811] Hyun, Jin-Gul, Paik, Kyung-Wook, and Pak, Jun So,
"Fabrication and Characterization of Epoxy/BaTiO3 Composite Embedded Capacitor
for High Frequency Behaviors," International Conference on Electronic
Materials and Packaging, Taipei, Taiwan, Oct. 22-24, 2008, pp. 124-128.
[812] Hyun, Jin-Gul, Lee, Sangyong, Cho, Sung-Dong, and Paik, Kyung-Wook,
"Frequency and Temperature Dependence of Dielectric Constant of Epoxy/BaTiO3
Composite Embedded Capacitor Films (ECFs) for Organic Substrate," 2005
Proceedings 55th Electronic Components & Technology Conference, Volume 1
, Orlando, FL, May 31-June 3, 2005, pp. 1241-1247.
[812d] Ieda, M., Nagao, M., and Hikita, M.,
"High-field Conduction and Breakdown in Insulating Polymers. Present Situation
and Future Prospects," IEEE Transactions on Dielectrics and Electrical
Insulation, vol. 1 no. 5, pp. 934-945, Oct. 1994.
[813] Iguchi, Daisuke, Arakaki, Hitoshi, and Ueno, Osamu,
"Reduction of Electromagnetic Radiation from Power and Ground Layers Using
Capacitors," 1999 International Symposium on Electromagnetic
Compatibility, Tokyo, Japan, May 17-21, 1999, pp. 25-28.
[814] Ikeda, Ken-ichi, Tsumagari, Ken-ichirou, Yoshida, Fuyuki, Nakashima, Hideharu,
and Abe, Hiroshi,
"Analysis of cube texture in high purity aluminum foils for electrolytic
capacitor by EBSP method," Journal of Japan Institute of Light Metals
, vol. 51 no. 2, pp. 119-124, Feb. 2001.
[815] Imanaka, Yoshihiko, Shioga, Takeshi, and Baniecki, John D.,
"Decoupling Capacitor with Low Inductance for High-Frequency Digital
Applications," Fujitsu Scientific & Technical Journal,
vol. 38 no. 1, pp. 22-30, June 2002.
[816] Ingalls, Mark, and Kent, Gordon,
"Measurement of the Characteristics of High-Q Ceramic Capacitors," 1987
Proceedings 37th Electronic Components & Technology Conference,
Boston, MA, May 11-13, 1987, pp. 135-144.
[817] Ingalls, Mark, and Kent, Gordon,
"Measurement of the Characteristics of High-Q Ceramic Capacitors," IEEE
Transactions on Components, Hybrids, and Manufacturing Technology, vol.
CHMT-12, no. 4, pp. 487-495, Dec. 1987.
[817d] Ingram, Malcolm D., Pappin, Amanda J., Delalande, Francois, Poupard,
Dominique, and Terzulli, Gilles,
"Development of electrochemical capacitors incorporating processable polymer
gel electrolytes," Electrochimica Acta, vol. 43 no. 10-11, pp.
1601-1605, 1998.
[818] Ionescu, Ciprian, Golumbeanu, Virgil, and Davidescu, Mircea,
"Influence of the Conductive Adhesives Joints to Decoupling Impedance,"
26th International Spring Seminar on Electronics Technology: Integrated
Management of Electronic Materials, The High Tatras, Slovak Republic,
May 8-11, 2003, pp. 255-259.
[819] Iorga, Cosmin,
"Compartmental Analysis of Dielectric Absorption in Capacitors," IEEE
Transactions on Dielectrics and Electrical Insulation, vol. 7 no. 2,
pp. 187-192, Feb. 2000.
[820] Irino, Hitoshi, Wabuka, Hiroshi, Tamaki, Naoya, Masuda, Norio, and
Tohya, Hirokazu,
"SPICE Simulation of Power Supply Current from LSI on PCB with a Behavioral
Model," 1999 International Symposium on Electromagnetic
Compatibility, Tokyo, Japan, May 17-21, 1999, pp. 224-227.
[820d] Ishikawa, Masashi, Ihara, Mitsuo, Morita, Masayuki, and Matsuda, Yoshiharu,
"Electric Double Layer Capacitors with New Gel Electrolytes,"
Electrochimica Acta, vol. 40 no. 13-14, pp. 2217-2222, Oct. 1995.
[821] Israelsohn, Joshua,
"Know your ceramic capacitor, part one," EDN, vol. 53 no. 18,
pp. 24, Sept. 18. 2008.
[822] Jacobs, Franck,
"PP for Film Capacitors: Origin, Manufacturing and Processing,"
CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006,
pp. xx-xx.
[823] Jain, Pushkar, and Rymaszewski, Eugene J.,
"Embedded Thin Film Capacitors - Theoretical Limits," IEEE Transactions
on Advanced Packaging, vol. 25, no. 3, pp. 454-458, Aug. 2002.
[824] Jain, T. A., Fung, K. Z., and Chan, Johnny,
"Effect of the A/B ratio on the microstructures and electrical properties of
(Ba0.95+/-xCa0.05)(Ti0.82Zr0.18)O3 for multilayer ceramic capacitors with
nickel electrodes," Journal of Alloys and Compounds, vol. 468 no.
1-2, pp. 370-374, Jan. 22, 2009.
[825] Jamison, Keith D., Wood, Roger D., Zollars, Byron G., and Kordesch, Martin E.,
"Use of Amorphous Oxides as High Temperature Dielectric Material in Wound
Capacitors," CARTS USA 2008 Proceedings, Newport Beach, CA,
Mar. 17-20, 2008, pp. xx-xx.
[826] Jang, Jong H., Machida, Kenji, Kim, Yuri, and Naoi, Katsuhiko,
"Electrophoretic deposition (EPD) of hydrous ruthenium oxides with PTFE and
their supercapacitor performances," Electrochimica Acta, vol. 52
no. 4, pp. 1733-1741, Dec. 1, 2006.
[827] Jang, Kyung-Woon, and Paik, Kyung-Wook,
"A Study on Epoxy/BaTiO3 Embedded Capacitor Pastes for Organic Substrates,"
Proceedings 56th Electronic Components & Technology Conference
, San Diego, CA, May 30-June 2, 2006, pp. 1504-1509.
[827d] Jang, Kyung-Woon, and Paik, Kyung-Wook,
"Screen Printable Epoxy/BaTiO3 Embedded Capacitor Pastes with High Dielectric
Constant for Organic Substrate Applications," Journal of Applied Polymer
Science, vol. 110 no. 2, pp. 798-807, Oct. 15, 2008.
[828] Janssen, L. P.,
"Reducing the Emission of Multi-Layer PCBs by Removing the Supply Plane,"
Electromagnetic Compatibility 1999, Zurich, Switzerland, Feb.
16-18, 1999, pp. 639-644.
[829] Javor, K.,
"Investigation Into the Effects of Microsecond Power Line Transients on
Line-Connected Capacitors," NASA/CR-2000-209906, NASA Marshall Space
Flight Center, AL 35812, Feb. 2000.
[830] Jayanthi, S., and Kutty, T. R. N.,
"Dielectric properties of 3d transition metal substituted BaTiO3 ceramics
containing the hexagonal phase formation," Journal of Materials Science:
Materials in Electronics, vol. xx no. xx, pp. xx-xx, xxxx.
[831] Jaynes, Tim,
"Jitter, Power Integrity, and Proper PDS Design for FPGA Systems," Xilinx
WP201, Oct. 6, 2003.
[832] Jeong, Jaill, Lee, Eun Jung, and Han, Young Ho,
"Electrical Properties of BaTiO3 Co-Doped with Rare Earth and Mn,"
Proceedings of the 25th Symposium for Passive Components, Palm Springs,
CA, Mar. 21-24, 2005, pp. 24-29.
[833] Ji, Gang, Arabi, Tawfik, Taylor, Greg, Beiley, Mark,
"A Design Methodology for the I/O Power Supply of Next Generation
Packaging," Digest of 11th IEEE Topical Meeting on Electrical
Performance of Electronic Packaging, Monterey, CA, Oct. 21-23, 2002,
pp. 253-256.
[834] Ji, Gang, Arabi, Tawfik, and Taylor, Greg,
"Design and Validation of a Power Supply Noise Reduction Technique,"
Proceedings of the 12th Topical Meeting on Electrical Performance of
Electronic Packaging, Princeton, NJ, Oct. 27-29, 2003, pp. 137-140.
[835] Ji, Gang, Arabi, Tawfik R., and Taylor, Greg,
"Design and Validation of a Power Supply Noise Reduction Technique,"
IEEE Transactions on Advanced Packaging, vol. 28 no. 3, pp. 445-448,
Aug. 2005.
[835d] Jiang, Junhua, and Kucernak, Anthony,
"Electrochemical supercapacitor material based on manganese oxide: preparation
and characterization," Electrochimica Acta, vol. 47 no. 15, pp.
2381-2386, June 5, 2002.
[835h] Jiang, Rongrong, Huang, Tao, Tang, Yang, Liu, Jiali, Xue, Leigang, Zhuang,
Jihua, and Yu, Aishui,
"Factors influencing MnO2/multi-walled carbon nanotubes composite's
electrochemical performance as supercapacitor electrode," Electrochimica
Acta, vol. 54 no. 27, pp. 7173-7179, Nov. 30, 2009.
[836] Jiao, Dan, Kim, Joong-Ho, and He, Jiangqi,
"Efficient Full-Wave Characterization of Discrete High-Density Multiterminal
Decoupling Capacitors for High-Speed Digital Systems," IEEE Transactions
on Advanced Packaging, vol. 31 no. 1, pp. 154-162, Feb. 2008.
[837] Jisha, M. R., Hwang, Yun Ju, Shin, Jae Sun, Nahm, Kee Suk, Kumar, T. Prem,
Karthikeyan, K., Dhanikaivelu, N., Kalpana, D., Renganathan, N. G., and
Stephan, A. Manuel,
"Electrochemical characterization of supercapacitors based on carbons derived
from coffee shells," Materials Chemistry and Physics, vol. 115
no. 1, pp. 33-39, May 15, 2009.
[838] Johnson, Daniel, and Sturmer, John,
"I, Robot - A Method for Flexible, Consistent Manufacturing of Capacitors,"
CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar.
26-29, 2007, pp. 105-109.
[838d] Johnson, Gerald H.,
"Challenges of High Supply Currents During VLSI Test," International
Test Conference, Atlantic City, NJ, Oct. 3-5, 2000, pp. 1013-1020.
[839] Johnson, Howard,
"ADC Grounding," EDN, vol. 45, no. 25, pp. , Dec. 7,
2000.
[840] Johnson, Howard,
"Another Version of a Coax Probe," High-Speed Digital Design On-Line
Newsletter, vol. 1, issue 18.
[841] Johnson, Howard,
"Benefits of Resistive Probe," High-Speed Digital Design On-Line
Newsletter, vol. 5, issue 4.
[842] Johnson, Howard,
"Bypass Array Model," High-Speed Digital Design On-Line
Newsletter, vol. 6, issue 2.
[843] Johnson, Howard,
"Bypass Arrays," High-Speed Digital Design On-Line
Newsletter, vol. 1, issue 6.
[844] Johnson, Howard,
"Bypass Capacitor Layout," Printed Circuit Design, vol. 14,
no. 8, pp. , Aug. 1997.
[845] Johnson, Howard,
"Bypass Capacitor Layout," High-Speed Digital Design On-Line
Newsletter, vol. 2, issue 3.
[846] Johnson, Howard,
"Bypass Capacitor Sequencing," High-Speed Digital Design On-Line
Newsletter, vol. 9 issue 7.
[847] Johnson, Howard,
"Bypass Multi-Valued Arrays," High-Speed Digital Design On-Line
Newsletter, vol. 1, issue 17.
[848] Johnson, Howard,
"Capacitor Layout Matters," EDN, Sept. 5, 2002.
[849] Johnson, Howard,
"Capacitor Placement," High-Speed Digital Design On-Line
Newsletter, vol. 2, issue 1.
[850] Johnson, Howard,
"Clean Power," EDN, vol. 45, no. 16, pp. 32, Aug. 3,
2000.
[851] Johnson, Howard,
"Dielectric Loss Tangents," High-Speed Digital Design On-Line
Newsletter, vol. 4 issue 5.
[852] Johnson, Howard,
"Earth Ground," High-Speed Digital Design On-Line Newsletter,
vol. 2, issue 12.
[853] Johnson, Howard,
"EMC/Signal Integrity for High-Speed Digital Circuits," Aug 2, 1999.
[854] Johnson, Howard,
"Equivalent Circuit Source Impedance," High-Speed Digital Design
On-Line Newsletter, vol. 2, issue 9.
[855] Johnson, Howard,
"ESR or regulator output capacitor," High-Speed Digital Design
On-Line Newsletter, vol. 5, issue 3.
[856] Johnson, Howard,
"Front-connected power supply," High-Speed Digital Design On-Line
Newsletter, vol. 4, issue 17.
[857] Johnson, Howard,
"Ground Currents," High-Speed Digital Design On-Line
Newsletter, vol. 3, issue 7.
[858] Johnson, Howard,
"Ground/Power Planes," High-Speed Digital Design On-Line
Newsletter, vol. 1, issue 8.
[859] Johnson, Howard,
"Healthy Power," EDN, vol. 45, no. 7, pp. 32, Mar. 30,
2000.
[860] Johnson, Howard,
"High-Speed Return Signals," High-Speed Digital Design On-Line
Newsletter, vol. 1, issue 15.
[861] Johnson, Howard,
"Improving Bypass Capacitor Layout." Printed Circuit Design, vol.
14, no. 9, pp. 27-28, Sept. 1997.
[862] Johnson, Howard,
"Interplane Capacitance," High-Speed Digital Design On-Line
Newsletter, vol. 3, issue 21.
[863] Johnson, Howard,
"Measuring Droop," EDN, vol. xx no. x, pp. xx-xx, Feb. 3,
2005.
[864] Johnson, Howard,
"Measuring Power and Ground," High-Speed Digital Design On-Line
Newsletter, vol. 3, issue 13.
[865] Johnson, Howard,
"Measuring Power Ground Impedance," High-Speed Digital Design
On-Line Newsletter, vol. 2, issue 14.
[866] Johnson, Howard,
"Measuring Power Plane Resonance," High-Speed Digital Design On-Line
Newsletter, vol. 2, issue 27.
[867] Johnson, Howard,
"Moats and Floats," Electronic Design, vol. 45, no. 4, pp.
181, Feb. 17, 1997.
[868] Johnson, Howard,
"Multiple ADC Grounding," EDN, vol 46, no. 3, pp. 30, Feb.
1, 2001.
[869] Johnson, Howard,
"Mutual Understanding," EDN, vol. 43, no. 1, pp. 24, Jan.
1, 1998.
[870] Johnson, Howard,
"On Chip Bypassing with End Terminations," EDN, vol. xx no.
x, pp. xx-xx, May 27, 2004.
[871] Johnson, Howard,
"Operating Above Resonance," Electronic Design, vol. 45, no.
x, pp. xx-xx, Apr. 14, 1997.
[872] Johnson, Howard,
"Parasitic inductance of a bypass capacitor," EDN, vol. 45,
no. 15, pp. 32, July 20, 2000.
[873] Johnson, Howard,
"Parasitic Inductance of Bypass Capacitor II," High-Speed Digital
Design On-Line Newsletter, vol. 6, issue 9.
[874] Johnson, Howard,
"Picket Fences," High-Speed Digital Design On-Line
Newsletter, vol. 2, issue 16.
[875] Johnson, Howard,
"Power and Ground Source Impedance," High-Speed Digital Design
On-Line Newsletter, vol. 2, issue 4.
[876] Johnson, Howard,
"Power Bus Noise," High-Speed Digital Design On-Line
Newsletter, vol. 1, issue 9.
[877] Johnson, Howard,
"Power Plane Resistance," EDN, July 11, 2002.
[878] Johnson, Howard,
"Power Plane Resonance," EDN, vol. 43, no. 18, pp. 22,
Sept. 1, 1998.
[879] Johnson, Howard,
"Probes," High-Speed Digital Design On-Line Newsletter, vol.
1, issue 13.
[880] Johnson, Howard,
"Probing for Noise," EDN, vol. 42, no. 25, pp. 215, Dec.
4, 1997.
[881] Johnson, Howard,
"Probing High-Speed Digital Designs," Electronic Design, vol.
45, no. 6, pp. 155-162, Mar 12, 1997.
[882] Johnson, Howard,
"Quality Factor," EDN, vol. 50 no. 25, pp. 38, Dec. 5,
2005.
[883] Johnson, Howard,
"Radiated Digital Ground Noise," High-Speed Digital Design On-Line
Newsletter, vol. 2, issue 17.
[884] Johnson, Howard,
"Resistance," High-Speed Digital Design On-Line Newsletter,
vol. 1, issue 11.
[885] Johnson, Howard,
"Segmenting the Vcc Plane," High-Speed Digital Design On-Line
Newsletter, vol. 2, issue 18.
[886] Johnson, Howard,
"Short-Term Impedance of Planes," High-Speed Digital Design On-Line
Newsletter, vol. 6 issue 5.
[887] Johnson, Howard,
"Single Point Ground," High-Speed Digital Design On-Line
Newsletter, vol. 2, issue 26.
[888] Johnson, Howard,
"Steel-plated power planes," EDN, vol. 47, no. 6, pp. 26,
Mar. 21, 2002.
[889] Johnson, Howard,
"TDR and Ice Cube Trays," High-Speed Digital Design On-Line
Newsletter, vol. 3, issue 5.
[890] Johnson, Howard,
"Ten Layer Stack," High-Speed Digital Design On-Line
Newsletter, vol. 2, issue 11.
[891] Johnson, Howard,
"The Way Home," EDN, vol. 45, no. 13, pp. 32, June 22,
2000.
[892] Johnson, Howard,
"Through-hole clearances," EDN, vol. 44, no. 14, pp. ,
July 8, 1999.
[893] Johnson, Howard,
"Trace Between Capacitors," High-Speed Digital Design On-Line
Newsletter, vol. 3, issue 4.
[894] Johnson, Howard,
"Voltage-Regulator Droop," EDN, vol. xx no. x, pp. xx-xx,
Sept. 14, 2006.
[895] Johnson, Howard,
"Voltage-Regulator Model," EDN, vol. xx no. x, pp. xx-xx,
Aug. 17, 2006.
[896] Johnson, Howard,
"VRM Stability - Part I: Feedback," High-Speed Digital Design
On-Line Newsletter, vol. 10 issue 3.
[897] Johnston, Joseph E.,
"The Role of Integrated Circuits Decoupling in Electromagnetic Compatibility,"
EMC Technology and Interference Control News, vol. 2, no. 4,
pp. 19-25, Oct-Dec. 1983.
[898] Jow, Uei-Ming, Wei, Chang-Lin, Lai, Ying-Jiunn, Chen, Chang-Sheng, and Shyu,
Chin-Sun,
"Embedded Passives On Multi-Layer Printed Wiring Board (PWB) for 5GHz
Front-end Module," Proceedings 56th Electronic Components &
Technology Conference, San Diego, CA, May 30-June 2, 2006, pp.
1331-1337.
[899] Jung, Sung Man, Bae, In Sung, Yoon, Jae Sik, Goto, Shoji, and Kim,
Byung Il,
"Evaluation of Electric Properties for Niobium Capacitors," Materials
Transactions, vol. 48 no. 12, pp. 3197-3200, Dec. 2007.
[899d] Juodkazis, K., Juodkazyte, J., Sukiene, V., Griguceviciene, A., and Selskis,
A.,
"On the charge storage mechanism at RuO2/0.5 M H2SO4 interface," Journal
of Solid State Electrochemistry, vol. 12 no. 11, pp. 1399-1404, Nov.
2008.
[900] Jwalapuram, Vishnu,
"Power Distribution System Design for High Speed Boards," OnBoard
Technology, vol. xx no. xx, pp. 58-60, June 2004.
[901] Kagata, Makoto, and Abe, Yutaka,
"Dielectric Properties of Sintered TiO2 and TiO2-WO3 Mixtures," 2006
CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[902] Kagata, , and Abe, Yutaka,
"Suppression of Low-Frequency Dispersion in TiO2 Sintered Capacitor by Doping
Ti Metal," CARTS 2007 Symposium Proceedings, Albuquerque, NM,
Mar. 26-29, 2007, pp. 19-25.
[903] Kahng, Sungtek,
"Characteristics of the Resonance and Impedance of Power-Bus Structure with
the Embedded Metamaterial Substrate," Electrical Design of Advanced
Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp.
16-19.
[904] Kahng, Sungtek, and Choi, Jaehoon,
"Correlated effects of decoupling capacitors and vias loaded in the PCB
power-bus," IEEE Antennas and Propagation Society International
Symposium 2006, Albuquerque, NM, July 9-14, 2006, pp. 77-80.
[905] Kahng, Sungtek,
"GA-Optimization for Finding Decoupling Capacitors to Damp the Rectangular
Power-Bus Resonances," 18th International Zurich Symposium on
Electromagnetic Compatibility, Munich, Germany, Sept. 24-28, 2007, pp.
103-106.
[906] Kahng, Sungtek,
"GA-Optimized Decoupling Capacitors Damping the Rectangular Power-Bus'
Cavity-Mode Resonances," IEEE Microwave and Wireless Components Letters
, vol. 16 no. 6, pp. 375-377, June 2006.
[907] Kamehara, N., Baniecki, J. D., Shioga, T., Kurihara, K., and Mizukoshi, M.,
"Low Inductance Thin Film Capacitors for Decoupling Applications," 17th
International Zurich Symposium on Electromagnetic Compatibility,
Singapore, Feb. 27-Mar. 3, 2006, pp. 565-567.
[908] Kang, Hee-do, Kim, Hyun, and Yook, Jong-Gwan,
"Analysis of Signal Integrity/Power Integrity in Multilayer Printed Circuit
Board and Two Improving Methods," Electrical Design of Advanced
Packaging and Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp.
210-213.
[909] Kantorovich, Isaac, and Houghton, Chris,
"Effectiveness of On-Die Decoupling Capacitance in Improving Chip
Performance," 17th Topical Meeting on Electrical Performance of
Electronic Packaging, San Jose, CA, Oct. 27-29, 2008, pp. 165-168.
[910] Kantorovich, Isaac, and Houghton, Chris,
"Maximum Tolerable Power Supply Noise for Data-Clock Synchronization,"
15th Topical Meeting on Electrical Performance of Electronic Packaging,
Scottsdale, CA, Oct. 23-25, 2006, pp. 167-170.
[911] Kantorovich, Isaac, Houghton, Chris, Root, Stephen, and St Laurent,
Jim,
"Measurement of Low Impedance on Chip Power Supply Loop," IEEE
Transactions on Advanced Packaging, vol. 27 no. 1, pp. 10-14, Feb.
2004.
[911d] Karady, George G., Roy, Rupesh,R., and Domitz, Stan,
"Effect of Temperature on the Partial Discharge Initiation Voltage of
Capacitors," IEEE Transactions on Dielectrics and Electrical Insulation
, vol. 2 no. 3, pp. 499-502, June 1995.
[911h] Kastening, B., Hahn, M., Rabanus, B., Heins, M., and zum Felde, U.,
"Electronic properties and double layer of activated carbon,"
Electrochimica Acta, vol. 42 no. 18, pp. 2789-2799, 1997.
[912] Kastening, Bertel, and Heins, Matthias,
"Properties of electrolytes in the micropores of activated carbon,"
Electrochimica Acta, vol. 50 no. 12, pp. 2487-2498, Apr. 15, 2005.
[913] Kastner, Ruth, Moshi, Eli, and Mahler, Bruce P.,
"Embedded Passives, Go for it!," IPC Printed Circuits Expo, APEX and the
Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S22-04-1-S22-04-6.
[914] Katopis, G. A., Becker, W. D., Mazzawy, T. R., Smith, H. H.,
Vakirtzis, C. K., Kuppinger, S. A., Singh, B., Lin, P. C., Bartells, J.,
Kihlmire, G. V., Venkatachalam, P. N., Stoller, H. I., and Frankel, J. L.,
"MCM technology and design for the S/390 G5 system," IBM Journal of
Research and Development, vol. 43, no. 5/6.
[915] Kaw, Ravi, Novak, Istvan, and Swaminathan, Madhavan,
"Towards Developing a Standard for Data Input/Output Format for PDN Modeling
& Simulation Tools," 2005 International Symposium on
Electromagnetic Compatibility, VOlume 2, Chicago, IL, Aug. 8-12, 2005,
pp. 644-649.
[916] Kawai, Masahiko, Yamada, Kazuhiro, Umezaki, Tomonori, Konishi, Akira,
Watanabe, Hideo, and Miura, Yasuhiro,
"Microstructure of surface area and etching behavior of high-purity aluminum
foils for electrolytic capacitors," Journal of Japan Institute of Light
Metals, vol. 54 no. 6, pp. 211-217, June 2004.
[917] Kazama, Satoshi, Shinohara, Shinichi, Sato, Risaburo, and Shimizu,
Masayuki,
"Estimation of Countermeasure Effect by a Bypass Condenser at a Source
Terminal of a CMOS IC," IEEE International Symposium on Electromagnetic
Compatibility Symposium Record Volume One, Washington, D.C., Aug.
21-25, 2000, pp. 353-356.
[918] Keimasi, Mohammadreza, Azarian, Michael H., and Pecht, Michael G.,
"Flex Cracking of Multilayer Ceramic Capacitors Assembled With Pb-Free and
Tin-Lead Solders," IEEE Transactions on Device and Materials Reliability
, vol. 8 no. 1, pp. 182-192, Mar. 2008.
[919] Keimasi, Mohammadreza, Azarian, Michael H., and Pecht, Michael,
"Isothermal aging effects on flex cracking of multilayer ceramic capacitors
with standard and flexible terminations," Microelectronics Reliability
, vol. 47 no. 12, pp. 2215-2225, Dec. 2007.
[920] Kerrigan, Ralph M., and Kropiewnicki, Bob,
"Film Capacitor Thermal Strategies Increase Power Density," CARTS
USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[921] Kerrigan, Ralph M.,
"High Crystalline Segmented Polypropylene Capacitors Offer Increased Energy
Density," Proceedings of the 25th Symposium for Passive Components
, Palm Springs, CA, Mar. 21-24, 2005, pp. 84-88.
[922] Kerrigan, Ralph M.,
"Metallized Polypropylene Film Energy Storage Capacitors For Low Pulse Duty,"
CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar.
26-29, 2007, pp. 97-104.
[922d] Khachen, W., and Laghari, J. R.,
"Determination of Aging-model Constants under High Frequency and High Electric
Fields," IEEE Transactions on Dielectrics and Electrical Insulation
, vol. 1 no. 6, pp. 1034-1038, Dec. 1994.
[923] Khanin, S. D.,
"Electrical Conduction and Breakdown in Amorphous Tantalum and Niobium Oxide
Films," International Symposium on Electrical Insulating Materials
, Tokyo, Japan, Sept. 17-20, 1995, pp. 97-100.
[924] Kierzek, K., Frackowiak, E., Lota, G., Gryglewicz, G., and Machnikowski, J.,
"Electrochemical capacitors based on highly porous carbons prepared by KOH
activation," Electrochimica Acta, vol. 49 no. 4, pp. 515-523,
Feb. 15, 2004.
[925] Kierzek, K., Frackowiak, E., Lota, G., Gryglewicz, G., and Machnikowski, J.,
"Erratum to "Electrochemical capacitors based on highly porous carbons
prepared by KOH activation"," Electrochimica Acta, vol. 49 no. 7,
pp. 1169-1170, Mar. 15, 2004.
[926] Kim, C. H., Park, M. J., Jeon, B. J., Gu, H. H., Lee, K. H., Uhm, J. W., Kwon,
Y. G., Kim, Y. T., and Hur, K. H.,
"Effects of Copper Powder Shape on Sintering Behavior of Termination in MLCC,"
CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr.
2, 2009, pp. xx-xx.
[927] Kim, Chan, Park, Sang-Hee, Lee, Wan-Jin, and Yang, Kap-Seung,
"Characteristics of supercapaitor electrodes of PBI-based carbon nanofiber web
prepared by electrospinning," Electrochimica Acta, vol. 50 no.
2-3, pp. 877-881, Nov. 30, 2004.
[928] Kim, Chan, Choi, Yeong-Og, Lee, Wan-Jin, and Yang, Kap-Seung,
"Supercapacitor performances of activated carbon fiber webs prepared by
electrospinning of PMDA-ODA poly(amic acid) solutions," Electrochimica
Acta, vol. 50 no. 2-3, pp. 883-887, Nov. 30, 2004.
[929] Kim, H. K., and Shi, F. G.,
"Thickness Dependent Dielectric Strength of a Low-permittivity Dielectric
Film," IEEE Transactions on Dielectrics and Electrical Insulation
, vol. 8 no. 2, pp. 248-252, Apr. 2001.
[930] Kim, Hyungsoo, Sun, Byung Kook, and Kim, Joungho,
"Suppression of GHz Range Power/Ground Inductive Impedance and Simultaneous
Switching Noise Using Embedded Film Capacitors in Multilayer Packages and
PCBs," IEEE Microwave and Wireless Components Letters, vol. 14,
no. 2, pp. 71-73, Feb. 2004.
[931] Kim, Insung, Song, Jaesung, and Min, Bokki,
"Preparation and Characteristics of Integrated Capacitor for RF devices,"
CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28,
2006, pp. xx-xx.
[932] Kim, Jaemin, Jeong, Youchul, Kim, Jingook, Lee, Junho, Ryu, Chunghyun, Shim,
Jongjoo, Shin, Minchul, and Kim, Joungho,
"Modeling and Measurement of Interlevel Electromagnetic Coupling and Fringing
Effect in a Hierarchical Power Distribution Network Using Segmentation Method
With Resonant Cavity Model," IEEE Transactions on Advanced Packaging
, vol. 31 no. 3, pp. 544-557, Aug. 2008.
[933] Kim, Jaemin, Shim, Jongjoo, Pak, Jun So, and Kim, Joungho,
"Modeling of Chip-Package-PCB Hierarchical Power Distribution Network based on
Segmentation Method," Electrical Design of Advanced Packaging and
Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 85-88.
[933d] Kim, Jingook, Kim, Jaemin, Ren, Liehui, Fan, Jun, Kim, Joungho, and Drewniak,
James L.,
"Extraction of Equivalent Inductance in Package-PCB Hierarchical Power
Distribution Network," IEEE 18th Conference on Electrical Performance of
Electronic Packaging and Systems, Portland, OR, Oct. 19-21, 2009, pp.
109-112.
[934] Kim, Jong-Huy, Lee, Yong-Sung, Sharma, Ashok K., and Liu, Chen G.,
"Polypyrrole/carbon composite electrode for high-power electrochemical
capacitors," Electrochimica Acta, vol. 52 no. 4, pp. 1727-1732,
Dec. 1, 2006.
[935] Kim, Jonghoon, Kim, Hyungsoo, Ryu, Woonghwan, Kim, Joungho, Yun,
Young-hwan, Kim, Soo-hyung, Ham, Seog-heon, An, Hyeong-keon, and Lee,
Yonh-hee,
"Effects of On-chip and Off-chip Decoupling Capacitors on Electromagnetic
Radiated Emission,' 1998 Proceedings 48th Electronic Components &
Technology Conference, Seattle, WA, May 25-28, 1998, pp. 610-614.
[936] Kim, Jonghoon, Choi, Baekkyu, Kim, Hyungsoo, Ryu, Woonghwan, Yun,
Young-hwan, Ham, Seog-heon, Kim, Soo-Hyung, Lee, Yong-hee, and Kim, Joungho,
"Separated Role of On-chip and On-PCB Decoupling Capacitors for Reduction of
Radiated Emission on Printed Circuit Board," 2001 IEEE EMC International
Symposium Symposium Record - Volume 1, Montreal, Canada, Aug. 13-17,
2001, pp. 531-536.
[937] Kim, Joong-Ho, and Swaminathan, Madhavan,
"Analysis of Multi-Layered Irregular Power Distribution Planes with Vias Using
Transmission Matrix Method," Proceedings 10th Topical Meeting on
Electrical Performance of Electronic Packaging, Cambridge, MA, Oct.
29-31, 2001, pp. 207-210.
[938] Kim, Joong-Ho, Jiao, Dan, He, Jiangqi, Radhakrishnan, Kaladhar, and
Dai, Changhong,
"Characterization of Discrete Decoupling Capacitors for High-Speed Digital
Systems," 54th Electronic Components & Technology Conference, Volume
1, Las Vegas, NV, June 1-4, 2004, pp. 259-265.
[938d] Kim, Joong-Ho, Matoglu, Erdem, Choi, Jinwoo, and Swaminathan, Madhavan,
"Modeling of Multi-Layered Power Distribution Planes Including Via Effects
Using Transmission Matrix Method," Proceedings of ASP-DAC/VLSI Design
2002. 7th Asia and South Pacific Design Automation Conference and 15th
International Conference on VLSI Design, Bangalore, India, Jan. 7-11,
2002, pp. 59-64.
[939] Kim, Joong-Ho, and Swaminathan, Madhavan,
"Modeling of Multilayered Power Distribution Planes Using Transmission Matrix
Method," IEEE Transactions on Advanced Packaging, vol. 25, no.
2, pp. 189-199, May 2002.
[940] Kim, Joong-Ho, Swaminathan, Madhavan, and Suh, Youngsuk Suh,
"Modeling of Power Distribution Networks for Mixed Signal Applications,"
2001 IEEE EMC International Symposium Symposium Record - Volume
2, Montreal, Canada, Aug. 13-17, 2001, pp. 1117-1122.
[941] Kim, Sang-Jin, Kim, Ki-Joon, Seong, Nak-Jin, Wang, Jong-Bae, Park, Hyun-Jun,
and Kim, Myong-Yong,
"The Degradation of Barium Titanate (BaTiO3) Films under High Electric
Fields," Proceedings of 1998 International Symposium on Electrical
Insulating Materials, Toyohashi, Japan, Sept. 27-30, 1998, pp. 147-150.
[942] Kim, Taeeui, Kim, KyungO, Kim, Hongwon, Jung, Taesung, and Yi, Sung,
"Tolerance Analysis for Embedded passive in Organic Substrate,"
International Conference on Electronic Materials and Packaging, Taipei,
Taiwan, Oct. 22-24, 2008, pp. 317-320.
[942d] Kim, Y. D., Landin, S. M., Cornejo, I. A., and Haun, M. J.,
"Low-Firing Pb(Mg1/3Nb2/3)O3-PbTiO3-Pb5Ge2SiO11 Compositions for Thick Film
Capacitor Applications," Proceedings of the Ninth IEEE International
Symposium on Applications of Ferroelectrics, University Park, PA, Aug.
7-10, 1994, pp. 585-588.
[943] Kim, Yong-Ju, Yoon, Han-Sub, Lee, Seongsoo, Moon, Gyu, Kim, Joungho,
and Wee, Jae-Kyung,
"An Efficient Path-Based Equivalent Circuit Model for Design, Synthesis, and
Optimization of Power Distribution Networks in Multilayer Printed Circuit
Boards," IEEE Transactions on Advanced Packaging, vol. 27, no.
1, pp. 97-106, Feb. 2004.
[944] Kim, Yong-Ju, Kang, Jong-Ho, KunWoo-Park, Wee, Joe-Kyung, and Hong,
Ki-Ho,
"Synthesis Method for Design of Power Distribution Network in High-Speed
Digital Systems," Proceedings of the 12th Topical Meeting on Electrical
Performance of Electronic Packaging, Princeton, NJ, Oct. 27-29, 2003,
pp. 133-136.
[945] Kinlen, Patrick J., Ulyanova, Yevgenia V., and Rawlings, Gary D.,
"Conductive and Electroactive Polyanilines with Unique Tunable Work
Functions," CARTS 2007 Symposium Proceedings, Albuquerque,
NM, Mar. 26-29, 2007, pp. 13-18.
[946] Kiriyama, Susumu,
"Monolithic Ceramic Capacitors Help Reduce Noise in Personal Computers,"
AEI, pp. 46-49, Mar. 2003.
[947] Kisza, Adolf,
"The capacitance of the diffuse layer of electric double layer of electrodes
in molten salts," Electrochimica Acta, vol. 51 no. 11, pp.
2315-2321, Feb. 15, 2006.
[948] Kitchen, W., Koenitzer, J., Krause, S., Mann, L., Yuan, S., Izumi, T., and
Noguchi, Y.,
"Tantalum Flakes - Powders For High Reliability Electrolytic Capacitor
Applications," 2006 CARTS Conference Proceedings, Orlando,
FL, Apr. 3-6, 2006, pp. xx-xx.
[948d] Kneer, E. A., Birnie III, D. P., Teowee, G., and Podlesny, J. C.,
"Effects of Sol-Gel PZT Film Thickness and Electrode Structure on the
Electrical Behavior of Pt/PZT/Pt Capacitors," Proceedings of the Ninth
IEEE International Symposium on Applications of Ferroelectrics,
University Park, PA, Aug. 7-10, 1994, pp. 446-449.
[949] Knighten, James L., Archambeault, Bruce, Fan, Jun, Selli, Giuseppe, Conner,
Samuel, and Drewniak, James L.,
"PDN Design Strategies: I. Ceramic SMT Decoupling Capacitors - What Values
Should I Choose?," EMC, no. 207, pp. 46-53, Fall 2005.
[950] Knighten, James L., Archambeault, Bruce, Fan, Jun, Selli, Giuseppe, Xue,
Liang, Conner, Samuel, and Drewniak, James L.,
"PDN Design Strategies: II. Ceramic SMT Decoupling Capacitors - Does Location
Matter?," EMC, no. 208, pp. 56-67, Winter 2006.
[951] Knighten, James L., Archambeault, Bruce, Fan, Jun, Selli, Giuseppe, Xue,
Liang, Conner, Samuel, and Drewniak, James L.,
"PDN Design Strategies: III. Planes and Materials - Are They Important Factors
in Power Bus Design?," EMC, no. 210, pp. 58-69. Summer 2006.
[952] Knighten, James L., Archambeault, Bruce, Fan, Jun, Selli, Giuseppe, Rajagopal,
Abhilash, Connor, Samuel, and Drewniak, James L.,
"PDN Design Strategies: IV. Sources of PDN Noise," EMC, no.
212, pp. 54-64, Winter 2007.
[953] Koduri, Ramam, and Orellana, Jose Rodrigo Anfossi,
"Dielectric and piezoelectric characterization of PSZT-BT ceramics for
capacitor applications," Journal of Materials Science: Materials in
Electronics, vol. 19 no. 4, pp. 373-378, Apr. 2008.
[954] Koebrugge, Gerald, Albertsen, Knuth, Coppens, Wiljan, and Derks, Wilma,
"BME-X8R For Automotive and High Voltage Applications," CARTS-Europe
2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006, pp. xx-xx.
[955] Kolkowski, James J.,
"Aluminum Electrolytic Capacitors for High Frequency Applications," 26th
Electronic Components Conference, San Francisco, CA, Apr. 26-28, 1976,
pp. 336-343.
[956] Kollia, Varvara, and Cangellaris, Andreas C.,
"A Methodology for Incorporating Metallization Loss in the Electromagnetic
Modeling of the Power Distribution Network," 17th Topical Meeting on
Electrical Performance of Electronic Packaging, San Jose, CA, Oct.
27-29, 2008, pp. 343-346.
[957] Kollia, Varvara, and Cangellaris, Andreas C.,
"A Modular Segmentation Approach for Comprehensive Electromagnetic Modeling of
The Power Distribution Network," 2008 Proceedings 58th Electronic
Components &, Technology Conference, Lake Buena Vista, FL,
May 27-30, 2008, pp. 638-645.
[958] Kollia, Varvara, and Cangellaris, Andreas C.,
"Extended Segmentation Procedure for Electromagnetic Modeling of the Power
Distribution Network," 2007 IEEE Electrical Performance of Electronic
Packaging, Atlanta, GA, Oct. 29-31, 2007, pp. 65-68.
[959] Kong, Lingwen, Yang, Zhiqin, Liu, Jianhui, and Lu, Minfei,
"Application of Embedded Components in Package Substrate," International
Conference on Electronic Packaging Technology & High Density Packaging
, Shanghai, China, July 28-31, 2008, pp. xx-xx.
[960] Kong, M. G., and Lee, Y. P.,
"Electrically Induced Heat Dissipation in Metallized Film Capacitors,"
IEEE Transactions on Dielectrics and Electrical Insulation, vol. 11 no.
6, pp. 1007-1013, Dec. 2004.
[960d] Kong, Zhonghua, Lin, Fuchang, Jang, Yadong, Dai, Ling, and Li, Hua,
"Study of Temperature Rise of Metallized Capacitors Applied in Repetitive
Pulse," IEEE Transactions on Dielectrics and Electrical Insulation
, vol. 16 no. 4, pp. 1100-1105, Aug. 2009.
[961] Konushi, S., Nagakari, S., Takafuji, J., Fukumaru, F., and Nambu,
S.,
"Low Impedance Thin Film Decoupling Capacitor for High Speed Digital
Circuits," Proceedings 2001 International Symposium on Microelectronics
(Proceedings of SPIE - The International Society for Optical Engineering,
Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 703-708.
[961d] Koo, June-Mo, Kini, TaeHo, and Kim, Jiyoung,
"Hydrogne Induced Degradation Phenomena of PZT Ferroelectric Capacitors,"
Proceedings of the 2000 12th IEEE International Symposium on
Applications of Ferroelectrics, Volume 2, Honolulu, HI, July 21-Aug. 2,
2000, pp. 591-594.
[962] Koohian ,Mehrzad,
"DDR Memories Place Tough Demands On Voltage Regulators," Apr. 28, 2003.
[963] Korony, George, Ritter, Andrew, Gonzalez-Titman, Carlos, Hock,
Joseph, Galvagni, John, and Heistand II, Robert,
"Controlling Capacitor Parasitics for High Frequency Decoupling,"
Proceedings 2001 International Symposium on Microelectronics
(Proceedings of SPIE - The International Society for Optical Engineering,
Volume 4587), Baltimore, MD, Oct. 9-11, 2001, pp. 605-609.
[963d] Kotz, R., and Carlen, M.,
"Principles and applications of electrochemical capacitors,"
Electrochimica Acta, vol. 45 no. 15-16, pp. 2483-2498, May 3, 2000.
[964] Kowalski, Marc E., and Codd, Patrick,
"Co-Simulation of IC, Package and PCB Power Delivery Networks in Ultra-Low
Voltage Power Rail Designs," 2007 Proceedings 57th Electronic Components
& Technology Conference, Reno, NV, May 29-June 1, 2007, pp.
798-803.
[965] Kozyrev, A., Ivanov, A., Samoilova, T., Soldatenkov, O., Zelner, M.,
Koutsaroff, I. P., Bernacki, T. A., and Cervin-Lawry, A.,
"Nonlinear Response of BaxSr1-xTiO3 Planar and Parallel-Plate Capacitors to
Microwave Power: Comparative Study of Power Handling Capability," 2005
European Microwave Conference, Volume 2, Paris, France, Oct. 4-6,
2005, pp. 1415-1418.
[965d] Krysa, Josef, and Mraz, Rudolf,
"Experimental Investigation of the Double Layer Capacity, X-ray Diffraction
and the Relative Surface Content of TiH2 During Pretreatment of Titanium Used
for the Preparation of Dimensionally Stable Anodes with RuO2 and/or IrO2
Coating," Electrochimica Acta, vol. 40 no. 12, pp. 1997-2003,
Sept. 1995.
[966] KuanXin, He, Xiaogang, Zhang, and Juan, Li,
"Preparation and electrochemical capacitance of Me double hydroxides (Me=Co
and Ni)/TiO2 nanotube composites electrode," Electrochimica Acta,
vol. 51 no. 7, pp. 1289-1292, Jan. 5, 2006.
[967] Kuenen, Jeroen C., and Meijer, Gerard C. M.,
"The Dielectric Relaxation in Capacitors and Dielectric Material and its
effect on VCOs," 1994 IEEE Instrumentation and Measurement Technology
Conference, Volume 2, Hamamatsu, Japan, May 10-12, 1994, pp. 443-446.
[968] Kulkarni, Sarvesh H., and Sylvester, Dennis,
"Power Distribution Techniques for Dual VDD Circuits," Asia and South
Pacific Conference on Design Automation, Yokohama, Japan, Jan. 24-27,
2006, pp. 838-843.
[969] Kultsar, Emery,
"Predicting EMI from DC Buses in Digital Equipment," ITEM 1994,
pp. 81-82 & 283-287, 1994.
[970] Kume, I., Inoue, N., Toda, T., Furumiya, M., Takeuchi, T., Ito, F., Iwaki, T.,
Shida, S., and Hayashi, Y.,
"Low-Temperature Plasma-Oxidation Process for Reliable Tantalum-Oxide (TaO)
Decoupling Capacitors," Proceedings of the IEEE 2008 International
Interconnect Technology Conference, Burlingame, CA, June 1-4, 2008, pp.
225-227.
[971] Kundu, Arun Chandra, Megahed, Mohamed, and Schmidt, Dominik,
"Comparison and Analysis of Integrated Passive Device Technologies for
Wireless Radio Frequency Module," 2008 Proceedings 58th Electronic
Components &, Technology Conference, Lake Buena Vista, FL, May
27-30, 2008, pp. 683-687.
[972] Kunieda, Yoshihiko, Kuroyanagi, Atsushi, Inoue, Tetsuo, Kanematsu, Hideyuki,
Inagaki, Jyunichi, and Oki, Takeo,
"Characteristics of Pore and Capacitance of Porous Tantalum Compact Sintered
in Capsule-Free Hot Isostatic Pressing or Vacuum," Journal of the Japan
Institute of Metals, vol. 59 no. 12, pp. 1286-1291, 1995.
[972d] Kuntman, A., Yilmaz, T., Gungor, A., and Baysal, B. M.,
"A New Polyimide Film for VLSI and its Electrical Characterization" IEEE
Transactions on Dielectrics and Electrical Insulation, vol. 5 no. 2,
pp. 296-300, Apr. 1998.
[973] Kwak, Hocheol, Ke, Haixin, Lee, Byoung Hwa, and Hubing, Todd,
"Plate Orientation Effect on the Inductance of Multi-Layer Ceramic
Capacitors," 2007 IEEE Electrical Performance of Electronic Packaging
, Atlanta, GA, Oct. 29-31, 2007, pp. 95-98.
[974] Kwon, Jong Hwa, Sim, Dong Uk, Kwak, Sang Il, Yun, Jae Hoon, Yook, Jong
Gwan,
"Partial EBG Placement on PDN to Effectively Suppress Simultaneous Switching
Noise," Electrical Design of Advanced Packaging and Systems Symposium
, Seoul, Korea, Dec. 10-12, 2008, pp. 89-92.
[975] Laddha, Vishal, and Swaminathan, Madhavan,
"Correlation of PDN Impedance with Jitter and Voltage Margin for High Speed
Channels," 17th Topical Meeting on Electrical Performance of
Electronic Packaging, San Jose, CA, Oct. 27-29, 2008, pp. 73-76.
[976] Laheaar, Ann, Kurig, Heisi, Janes, Alar, and Lust, Enn,
"LiPF6 based ethylene carbonate - dimethyl carbonate electrolyte for high
power density electrical double layer capacitor," Electrochimica Acta
, vol. 54 no. 19, pp. 4587-4594, July 30, 2009.
[977] Lai, Ken, Prymak, John, Blais, Peter, and Long, Bill,
"Flex Capabilities Improved with Modified MLC Chip Capacitors,"
CARTS Asia 2006, Taipei, Taiwan, Oct. 9-11, 2006, pp. xx-xx.
[978] Lai, Ken, Chen, Edward, Prymak, John, and Prevallet, Mike,
"Impact of Lead Free Solders on MLC Flex Capabilities," Proceedings
CARTS Asia 2005, Taipei, Taiwan, Oct. 11-15, 2005, pp. 171-178.
[979] Lai, Ken, Prymak, John, Blais, Peter, Long, Bill, and Staubli, Paul,
"Increased Ripple Current Capability through Facedown Terminations,"
CARTS Asia 2007 Proceedings, Taipei, Taiwan, Oct. 9-13, 2007, pp.
xx-xx.
[980] Lai, Ken, Chen, E., Blais, P., Lessner, P., Long, B., Mayer, A., and Prymak,
J.,
"Step Surge Stress Test (SSST) Defines Dielectric Capability," CARTS
Asia 2007 Proceedings, Taipei, Taiwan, Oct. 9-13, 2007, pp. xx-xx.
[981] Lai, Ming-lu, Kiang, Jean-Fu, and Jeng, Shyh-Kang,
"Multi-Layers PCB Power Plane Resonance Analysis Using Method of Lines,"
Electromagnetic Compatibility 2001, Zurich, Switzerland, Feb.
20-22, 2001, pp. 265-268.
[982] Lam, Cheung-Wei,
"Signal Integrity Design versus Radiated Emission Control," Nov. 2002.
[982d] Lambert, William J., Hill, Michael J., and Ayyanar, Rajapandian,
"Estimation of Microprocessor Instantaneous Load Current," IEEE
Transactions on Advanced Packaging, vol. 32 no. 4, pp. 831-840, Nov.
2009.
[983] Landers, Leslie, and Virutchapunt, Tanit,
"The DC Design Squeeze," Printed Circuit Design and Fab, vol.
26 no. 2, pp. 34-37, Feb. 2009.
[983d] Lang, Jun-Wei, Kong, Ling-Bin, Wu, Wei-Jin, Liu, Min, Luo, Yong-Chun, and Kang,
Long,
"A facile approach to the preparation of loose-packed Ni(OH)2 nanoflake
materials for electrochemical capacitors," Journal of Solid State
Electrochemistry, vol. 13 no. 2, pp. 333-340, Feb. 2009.
[984] Langston, Kent F., and Keller, Joe,
"Cracked Multilayer Chip Capacitors - How to Avoid Them," Proceedings of
the Technical Program NEPCON West 2000, Volume 2, Anaheim, CA, Feb.
29-Mar. 2, 2000, pp. 785-800.
[985] Laps, Mark, Grace, Roy, Sloka, Bill, Prymak, John, Xu, Xilin, Pinceloup,
Pascal, Gurav, Abhojit, Randall, Michael, Lessner, Philip, and Tajuddin, Aziz,
"Capacitors for Reduced Microphonics and Sound Emission," CARTS 2007
Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 207-215.
[986] Lau, W. S., Tan, T. S., Babu, Premila, and Sandler, Nathan P.,
"Mechanism of leakage current reduction of tantalum oxide capacitors by
titanium doping," Applied Physics Letters, vol. 90 no. 11, pp.
112903-1-112903-3, Mar. 12, 2007.
[986d] Lee, Baik-Woo, Abothu, Isaac Robin, Raj, P. Markondeya, Yoon, Chong K., and
Tummala, Rao R.,
"Tailoring of temperature coefficient of capacitance (TCC) in nanocomposite
capacitors," Scripta Materialia, vol. 54 no. 7, pp. 1231-1234,
Apr. 2006.
[987] Lee, Gyoung-Ja, and Pyun, Su-Il,
"Effect of microcrystallite structures on electrochemical characteristics of
mesoporous carbon electrodes for electric double-layer capacitors,"
Electrochimica Acta, vol. 51 no. 15, pp. 3029-3038, Apr. 1, 2006.
[988] Lee, H. F., Chan, C. Y., and Tang, C. S.,
"Embedding capacitors and resistors into printed circuit boards using a
sequential lamination technique," Journal of Materials Processing
Technology, vol. 207 no. 1-3, pp. 72-88, Oct. 16, 2008.
[989] Lee, Heesok, Hong, Yeong-Seok, Kam, Dong Gun, and Kim, Joungho,
"Analysis of Power Delivery Network Constructed by Irregular-Shaped
Power/Ground Plane Including Densely Populated Via-Hole," IEEE
Transactions on Advanced Packaging, vol. 28 no. 2, pp. 168-173, May
2005.
[990] Lee, Jae-Young, Lee, Jong-Heun, and Hong, Seong-Hyeon, Lee, Yong Kyun, and
Choi, Jae-Young,
"Coating BaTiO3 Nanolayers on Spherical Ni Powders for Multilayer Ceramic
Capacitors," Advanced Materials, vol. 15 no. 19, pp. 1655-1658,
Oct. 2003.
[991] Lee, Junho, Lu, Albert Chee W., Fan, Wei, Wai, Lai L., and Kim,
Joungho,
"Effects of Decoupling Capacitor on Signal Integrity in Applications with
Reference Plane Change," 2003 Proceedings 53rd Electronic Components
& Technology Conference, New Orleans, LA, May 27-30, 2003, pp.
1283-1288.
[992] Lee, Junho, Lee, Hyungdong, Park, Kunwoo, Chung, Byongtae, Kim, Jaemin, and
Kim, Joungho,
"Impact of Partial EBG PDN on PI, SI and Lumped Model-Based Correlation,"
Asia-Pacific Symposium on Electromagnetic Compatibility and 19th
International Zurich Symposium on Electromagnetic Compatibility,
Singapore, May 19-23, 2008, pp. 168-171.
[993] Lee, Junwoo, Rotaru, Mihai Dragos, Iyer, Mahadevan K., Kim,
Hyungsoo, and Kim, Joungho,
"Analysis and Suppression of SSN Noise Coupling Between Power/Ground Plane
Cavities Through Cutouts in Multilayer Packages and PCBs," IEEE
Transactions on Advanced Packaging, vol. 28 no. 2, pp. 298-309, May
2005.
[994] Lee, K. J., Bhattacharya, Swapan, Varadarajan, Mahesh, Wan, Lixi, Abothu,
Isaac Robin, Sundaram, Venky, Muthana, Prathap, Balaraman, Devarajan, Raj, P.
M., Swaminathan, Madhavan, Sitaraman, Suresh, and Tummala, Rao,
"Design, Fabrication, and Reliability Assessment of Embedded Resistors and
Capacitors on Multilayered Organic Substrates," 2005 IEEE/CPMT 10th
International Symposium on Advanced Packaging Materials, Irvine, CA,
Mar. 16-18, 2005, pp. 249-254.
[995] Lee, Ken, and Barber, Alan,
"Modeling and Analysis of Multichip Module Power Supply Planes," Hewlett
Packard HPL-94-32, Mar. 1994.
[996] Lee, Keunmyung, and Barber, Alan,
"Modeling and Analysis of Multichip Module Power Supply Planes," IEEE
Transactions on Components, Packaging, and Manufacturing Technology - Part
B, vol. 18, no. 4, pp. 628-639, Nov. 1995.
[997] Lee, Kuang-Tsin, Lee, Jyh-Fu, and Wu, Nae-Lih,
"Electrochemical characterizations on MnO2 supercapacitors with potassium
polyacrylate and potassium polyacrylate-co-polyacrylamide gel polymer
electrolytes," Electrochimica Acta, vol. 54 no. 26, pp.
6148-6153, Nov. 1, 2009.
[998] Lee, Sangyong, Hyun, Jin-Gul, Kim, Hyungsoo, and Paik, Kyung-Wook,
"A Study on Dielectric Constants of Epoxy/SrTiO3 Composite for Embedded
Capacitor Films (ECFs)," IEEE Transactions on Advanced Packaging,
vol. 30 no. 3, pp. 428-433, Aug. 2007.
[999] Lee, Sangyong, Hyun, Jin-Gul, Pak, Jim So, Lee, Heejae, Jeon, Hyun Sin, and
Paik, Kyung-Wook,
"Fabrication and Characterization of Embedded Capacitors in Printed Circuit
Boards using B-stage Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs),"
2008 Proceedings 58th Electronic Components &, Technology Conference
, Lake Buena Vista, FL, May 27-30, 2008, pp. 742-746.
[1000] Lee, Sangyong, Hyun, Jin-Gul, Park, Hyunjeong, Kim, Joungho, and Paik,
Kyung-Wook,
"Frequency Behavior of Embedded Epoxy/SrTiO3 Composite Capacitor Materials,"
2005 Proceedings 55th Electronic Components & Technology Conference,
Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 1222-1227.
[1001] Lee, Sangyong, Hyun, Jin-Gul, Chung, Chang Kyu, and Paik, Kyung-Wook,
"Multi-Functional Epoxy/SrTiO3 Ceramic Powder Embedded Capacitor Films(ECFs)
for Organic Substrates," 8th Electronics Packaging Technology Conference
, Singapore, Dec. 6-8, 2006, pp. 549-552.
[1001d] Lee, Sangyong, Jang, Jong Min, Lee, Woong Sun, and Paik, Kyung-Wook,
"Reliability Enhancement of Embedded Capacitors in Printed Circuit Boards
using B-stage Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs),"
59th Electronic Components & Technology Conference, San Diego, CA,
May 26-29, 2009, pp. 771-776.
[1002] Lee, Seung-Bok, and Sinn, Dong-Sook,
"Effect of Redox Reaction of Ni Inner Electrode on the Sintering Behavior of
MLCC chip," CARTS-Europe 2004, Nice, France, Oct. 18-21,
2004, pp. 188-194.
[1003] Lee, Y. P., and Kong, M. G.,
"Numerically Established Correlation in Electrical Responses of Polymer Film
Capacitors to ac and Pulsed Voltages," IEEE Transactions on Dielectrics
and Electrical Insulation, vol. 8 no. 6, pp. 880-888, Dec. 2001.
[1004] Lee, Y. P., and Kong, M. G.,
"Surface Field Dynamics in dc Film Capacitors under an Impulse Voltage
Perturbation," IEEE Transactions on Dielectrics and Electrical
Insulation, vol. 8 no. 2, pp. 293-298, Apr. 2001.
[1005] Lee, Ying-Chieh,
"Investigation of thin film end-termination on multilayer ceramic capacitors,"
Materials Chemistry and Physics, vol. 110 no. 1, pp. 100-105,
July 15, 2008.
[1006] Leferink, Frank B. J., and Doorn, Marcell J. C. M. van,
"Inductance of Printed Circuit Board Ground Planes," 1993 International
Symposium on Electromagnetic Compatibility, Dallas, TX, Aug. 9-13,
1993, pp. 327-329.
[1007] Leitner, K. W., Gollas, B., Winter, M., and Besenhard, J. O.,
"Combination of redox capacity and double layer capacitance in composite
electrodes through immobilization of an organic redox couple on carbon black,"
Electrochimica Acta, vol. 50 no. 1, pp. 199-204, Nov. 15, 2004.
[1008] Lenihan, T., Schaper, L., Shi, Y., Morcan, G., and Parkerson, J.,
"Embedded Thin Film Resistors, Capacitors and Inductors in Flexible Polyimide
Films" 1996 Proceedings 46th Electronic Components & Technology
Conference, Orlando, FL, May 28-31, 1996, pp. 119-124.
[1009] Lenkisch, Andreas,
"Power Distribution and Decoupling of Backplanes in VMEbus Systems,"
Trenew Electronic GmbH.
[1010] Lenkisch, Andreas,
"Power supply and decoupling on cPCI backplanes," Trenew Electronic GmbH.
[1011] Lenkisch, Andreas,
"Revolutionary Backplane Technology for Filtering and Bypassing the Supply
Voltage, Part 1: Theoretical Considerations," Trenew Electronic GmbH.
[1012] Lenkisch, Andreas,
"Revolutionary Backplane Technology for Filtering and Bypassing the Supply
Voltage, Part 2: Realization and Results," Trenew Electronic GmbH.
[1013] Lenkisch, Andreas,
"The Backplane as EMC Filter," Trenew Electronic GmbH.
[1014] Leone, Marco, Bruns, Heinz-D., and Leugner, D.,
"Numerical Simulation of Power-Bus Structures on Printed Circuit Boards,"
16th International Zurich Symposium on Electromagnetic Compatibility
, Zurich, Switzerland, Feb. 13-18, 2005, pp. 435-438.
[1015] Leone, Marco,
"The Radiation of a Rectangular Power-Bus Structure at Multiple Cavity-Mode
Resonances,"
[1016] Lerner, Moisey,
"Which Non-Sinusoidal Voltage May Shorten the Life of a Capacitor," 27th
Electronic Components Conference, Arlington, VA, May 16-18, 1977, pp.
468-474.
[1017] Lesea, Austin, and Alexander, Mark,
"Powering Xilinx FPGAs," Xilinx Application Note XAPP158, Aug. 5, 2002.
[1018] Lessner, Phillip, Hahn, Randy, and Pritchard, Kim,
"Strategies for Manufacturing Ultra Low ESR Ta Capacitors,"
Proceedings CARTS Asia 2005, Taipei, Taiwan, Oct. 11-13, 2005, pp.
116-122.
[1019] Levant, Jean-Luc, Ramdani, Mohamed, Perdriau, Richard, and Drissi, M'hamed,
"EMC Assessment at Chip and PCB Level: Use of the ICEM Model for Jitter
Analysis in an Integrated PLL," IEEE Transactions on Electromagnetic
Compatibility, vol. 49 no. 1, pp. 182-191, Feb. 2007.
[1020] Levy, Markus,
"Processors measure up to the power challenge."
[1020d] Lewandowski, A., Zajder, M., Frackowiak, E., and Beguin, F.,
"Supercapacitor based on activated carbon and polyethylene oxide-KOH-H2O
polymer electrolyte," Electrochimica Acta, vol. 46 no. 18, pp.
2777-2780, May 21, 2001.
[1021] Li, Chun-Hao, and Tsai, Ming-Jong,
"3D laser trimming technology for regulating embedded thick-film carbon
resistors on a random access memory module," Journal of Materials
Processing Technology, vol. 209 no. 4, pp. 2057-2067, Feb. 19, 2009.
[1021d] Li, Jian, Liu, En-hui, Li, Wen, Meng, Xiang-yun, and Tan, Song-ting,
"Nickel/carbon nanofibers composite electrodes as supercapacitors prepared by
electrospinning," Journal of Alloys and Compounds, vol. 478 no.
1-2, pp. 371-374, June 10, 2009.
[1022] Li, Jiao, Songping, Wu, Xiaohong, Ding, and Jing, Ni,
"ZnTiO3-based ceramics sintered at low temperature with boron addition for
multilayer ceramic capacitor applications," Journal of Materials
Science: Materials in Electronics, vol. 20 no. 12, pp. 1186-1192, Dec.
2009.
[1023] Li, Jun, Wan, Lixi, Gao, Wei, and Liao, Cheng,
"Improvement of Power Integrity with novel Segmented Power Bus Structures in
RF/digital SOP," International Conference on Electronic Packaging
Technology & High Density Packaging, Shanghai, China, July 28-31,
2008, pp. xx-xx.
[1023d] Li, Jun, Wang, Xianyou, Wang, Ying, Huang, Qinghua, Dai, Chunling, Gamboa,
Sergio, and Sebastian, P. J.,
"Structure and electrochemical properties of carbon aerogels synthesized at
ambient temperatures as supercapacitors," Journal of Non-Crystalline
Solids, vol. 354 no. 1, pp. 19-24, Jan. 1, 2008.
[1024] Li, Li, Takahashi, Akio, Hao, Jianjun Hao, Kikuchi, Ryohei, Hayakawa, Teruaki,
Tsurumi, Taka-Aki, and Kakimoto, Masa-Aki,
"Novel Polymer-Ceramic Nanocomposite Based on New Concepts for Embedded
Capacitor Application (I)," IEEE Transactions on Components and
Packaging Technologies, vol. 28 no. 4, pp. 754-759, Dec. 2005.
[1024d] Li, Ling-xia, Han, Ye-mei, Zhang, Ping, Ming, Cui, and Wei, Xue,
"Synthesis and characterization of BaTiO3-based X9R ceramics," Journal
of Materials Science, vol. 44 no. 20, pp. 5563-5568, Oct. 2009.
[1025] Li, Lixia, Song, Huaihe, and Chen, Xiaohong,
"Pore characteristics and electrochemical performance of ordered mesoporous
carbons for electric double-layer capacitors," Electrochimica Acta
, vol. 51 no. 26, pp. 5715-5720, Aug. 15, 2006.
[1025b] Li, Longtu, Chen, Renzheng, Wang, Xiaohui, and Gui, Zhilun,
"Study on Structure and Properties of X7R Ceramics based on BaTiO 3 with High
Dielectric Constants," Proceedings of the 2000 12th IEEE International
Symposium on Applications of Ferroelectrics, Volume 2, Honolulu, HI,
July 21-Aug. 2, 2000, pp. 825-828.
[1025d] Li, Wei, Xu, Zhijun, Chu, Ruiqing, Fu, Peng, and Hao, Jigong,
"Structure and electrical properties of BaTiO3 prepared by sol-gel process,"
Journal of Alloys and Compounds, vol. 482 no. 1-2, pp. 137-140,
Aug. 12, 2009.
[1026] Li, Y. L., Figueroa, David G., Rodriguez, J. P., Huang, Lilly, Liao,
J. C., Taniguchi, Masaaki, Canner, Jim, and Kondo, Takanori,
"A New Technique for High Frequency Characterization of Capacitors,"
1998 Proceedings 48th Electronic Components & Technology
Conference, Seattle, WA, May 25-28, 1998, pp. 1384-1390.
[1026d] Li, Yang, Xie, Huaqing, and Tu, Jiangping,
"Nanostructured SnS/carbon composite for supercapacitor," Materials
Letters, vol. 63 no. 21, pp. 1785-1787, Aug. 31, 2009.
[1027] Li, Yuan-Liang, Elzinga, Mark, and Yahyaei-moayyed, Farzaneh,
"Distributed Models for Multi-Terminal Capacitors - Using 2D Lossy
Transmission-Line Approach," 2001 Proceedings 51st Electronic
Components & Technology Conference, Orlando, FL, May 29-June 1,
2001.
[1028] Li, Y.L., Figueroa, David G., Chickamenahalli, Shamala A., Chung, Chee
Yee, Yew, Teong Guan, Cornelius, Michael D., and Do, Huong T.,
"Enhancing Power Distribution System through 3D Integrated Models, Optimized
Designs, and Switching VRM Model" 2000 Proceedings 50th Electronic
Components & Technology Conference, Las Vegas, NV, May 21-24, 2000, pp.
272-277.
[1029] Li, Yuan-Liang, Figueroa, David G., Yew, Teong Guan, and Chung, Chee
Lee,
"Validation of Integrated Capacitor-Via-Planes Model," Proceedings of
the 8th IEEE Topical Meeting on Electrical Performance of Electronic
Packaging, San Diego, CA, Oct. 25-27, 1999, pp. 121-124.
[1030] Liang, Haichao, Chen, Fang, Li, Rengui, Wang, Lu, and Deng, Zhenghua,
"Electrochemical study of activated carbon-semiconducting oxide composites as
electrode materials of double-layer capacitors," Electrochimica Acta
, vol. 49 no. 21, pp. 3463-3467, Sept. 1, 2004.
[1031] Liang, Kui, Chen, Ai, He, Li, and Wang, Wei,
"Nickel Oxide as an Electrode Material for Supercapacitors," Journal of
Materials Science and Technology, vol. 18 no. 4, pp. 383-384, July
2002.
[1031d] Liang, Yan-Yu, Bao, Shu-Juan, and Li, Hu-Lin,
"Nanocrystalline nickel cobalt hydroxides/ultrastable Y zeolite composite for
electrochemical capacitors," Journal of Solid State Electrochemistry
, vol. 11 no. 5, pp. 571-576, May 2007.
[1032] Lin, Ding-Bing, Wu, Chun-Te, and Hung, Guo-Chiang,
"The Isolation Island and the Displacement of Decoupling Capacitors for Power
Integrity Issues," 2005 IEEE/ACES International Conference on Wireless
Communications and Applied Computational Electromagnetics, Honolulu,
Hawaii, Apr. 3-7, 2005, pp. 1060-1064.
[1033] Lin, Kuo-Min, Chang, Kuo-Hsin, Hu, Chi-Chang, and Li, Yuan-Yao,
"Mesoporous RuO2 for the next generation supercapacitors with an ultrahigh
power density," Electrochimica Acta, vol. 54 no. 19, pp.
4574-4581, July 30, 2009.
[1034] Lin, Shen, and Chang, Norman,
"Challenges in Power-Ground Integrity," IEEE/ACM International
Conference on Computer Aided Design, location?, date? 2001, pp.
651-654.
[1035] Lin, Yu-Hsiang, Chou, Jonathan, Lu, Yi-Chang, Wu, Tzong-Lin, and Chen,
Hsin-Shu,
"Chip-Package-Board Co-design - a DDR3 System Design Example from Circuit
Designers' Perspective," Electrical Design of Advanced Packaging and
Systems Symposium, Seoul, Korea, Dec. 10-12, 2008, pp. 27-30.
[1036] Ling, H. C., and Chang, D. D.,
"In-Situ Observation of Electrode Melting in Multilayer Ceramic Capacitors,"
1988 Proceedings 38th Electronic Components Conference, Los
Angeles, CA, May 9-11, 1988, pp. 87-94.
[1037] Ling, Hung C., and Chang, David D.,
"Surge Test Characteristics of High K Multilayer Ceramic Capacitors,"
IEEE Transactions on Components, Packaging, and Manufacturing
Technology, vol. 14, no. 3, pp. 633-636, Sept. 1991.
[1038] Liu, David, Leidecker, Henning W., Perry, Thomas J., and Felt, Frederick S.,
"Accelerating Factors in Life Testing of High-Voltage Multi-Layer Ceramic
Capacitors," Proceedings of the 25th Symposium for Passive
Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 151-156.
[1039] Liu, En-Xiao, Wei, Xingchang, Oo, Zaw Zaw, and Li, Er-Ping,
"An Efficient Method for Power integrity and EMI Analysis of Irregular-Shaped
Power/Ground Planes in Packages," 2007 IEEE Electrical Performance of
Electronic Packaging, Atlanta, GA, Oct. 29-31, 2007, pp. 263-266.
[1040] Liu, En-Xiao, Wei, Xingchang, Oo, Zaw Zaw, and Li, Er-Ping,
"An Efficient Method for Power Integrity and EMI Analysis of Advanced
Packages," 2008 Proceedings 58th Electronic Components &, Technology
Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 652-657.
[1041] Liu, Enxiao, Oo, Zaw Zaw, and Li, ErPing,
"Analysis of Rectangular Power-Ground Plane Pairs for Noise Suppression,"
1st Electronics Systemintegration Technology Conference, Volume 1
, Dresden, Germany, Sept. 5-7, 2006, pp. 241-246.
[1042] Liu, Hongtao, He, Ping, Li, Zhiying, Liu, Yang, and Li, Jinghong,
"A novel nickel-based mixed rare-earth oxide/activated carbon supercapacitor
using room temperature ionic liquid electrolyte," Electrochimica Acta
, vol. 51 no. 10, pp. 1925-1931, Feb. 1, 2006.
[1042d] Liu, Ling, Zhao, Yaomin, Zhou, Qin, Xu, Hong, Zhao, Chongjun, and Jiang,
Zhiyu,
"Nano-polypyrrole supercapacitor arrays prepared by layer-by-layer assembling
method in anodic aluminum oxide templates," Journal of Solid State
Electrochemistry, vol. 11 no. 1, pp. 32-37, Jan. 2007.
[1042h] Liu, Tongchang, Pell, W. G., and Conway, B. E.,
"Self-discharge and potential recovery phenomena at thermally and
electrochemically prepared RuO2 supercapacitor electrodes,"
Electrochimica Acta, vol. 42 no. 23-24, pp. 3541-3552, 1997.
[1043] Liu, Xian-Ming, Zhang, Yi-He, Zhang, Xiao-Gang, and Fu, Shao-Yun,
"Studies on Me/Al-layered double hydroxides (Me = Ni and Co) as electrode
materials for electrochemical capacitors," Electrochimica Acta,
vol. 49 no. 19, pp. 3137-3141, Aug. 15, 2004.
[1043d] Liu, Xiaorong, and Pickup, Peter G.,
"Ru oxide/carbon fabric composites for supercapacitors," Journal of
Solid State Electrochemistry, vol. xx no. xx, pp. xx-xx, xxxx.
[1043h] Liu, Xiaorong, Huber, Trisha A., Kopac, Michael C., and Pickup, Peter G.,
"Ru oxide/carbon nanotube composites for supercapacitors prepared by
spontaneous reduction of Ru(VI) and Ru(VII)," Electrochimica Act
a, vol. 54 no. 27, pp. 7141-7147, Nov. 30, 2009.
[1044] Liu, Yi-Feng, Wang, Brian, Xu, Mingming, Liu, Xiaoping, Chen, Jie Zhu, and
Desmith, Michael,
"Correlation of On-Die Capacitance for Power Delivery Network," 17th
Topical Meeting on Electrical Performance of Electronic Packaging, San
Jose, CA, Oct. 27-29, 2008, pp. 123-126.
[1045] Liu, Zhi Hong, See, Kye Yak, Li, Er Ping, and Chua, Eng Kee,
"An Efficient Approach for the Power/Ground Plane Equivalent Circuit
Extraction," EMC Zurich in Singapore 2006, Singapore, Feb.
27-Mar. 3, 2006, pp. 379-382.
[1046] Loaiza-Montiel, Rosie,
"Layout techniques boost dynamic range for high-speed ICs,"
EDN, June 23, 1994.
[1047] Loescher, D. H., and Sidnell, N. A.,
"Film Capacitors with Low Internal Impedance," 26th Electronic
Components Conference, San Francisco, CA, Apr. 26-28, 1976, pp.
222-225.
[1048] Loh, Eugene,
"A Model for Low-Voltage Instability in Ceramic Capacitors," 20th Annual
Reliability Physics Symposium, San Diego, CA, Mar. 30-Apr. 1, 1982, pp.
144-151.
[1049] Loh, Eugene,
"Physical Interpretation of the Tantalum Chip Capacitor Life-Test Results,"
IEEE Transactions on Components, Hybrids, and Manufacturing
Technology, vol. CHMT-3, no. 4, pp. 647-654, Dec. 1980.
[1050] Long, Bill, Prevallet, Mike, and Prymak, John,
"Effects of Lead-Free Solder on Flex Performance," Proceedings of
the 25th Symposium for Passive Components, Palm Springs, CA, Mar.
21-24, 2005, pp. xx-xx.
[1051] Long, Bill, Prevallet, Mike, and Prymak, John D.,
"KEMET Spice - An Update," 24th Annual Capacitor and Resistor
Technology Symposium, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. xx-xx.
[1052] Long, Bill, Prevallet, Mike, and Prymak, John D.,
"Reliability Effects with Proofing of Tantalum Capacitors,"
Proceedings of the 25th Symposium for Passive Components, Palm Springs,
CA, Mar. 21-24, 2005, pp. 167-172.
[1053] Long, Jeffrey W.,
"Electrochemical Capacitors: emPOWERING the 21st Century,"
Electrochemical Society Interface, vol. 17 no. 1, pp. 33, Spring 2008.
[1054] LoVetri, J., Tapohos, T., and Seregelyi, J.,
"Investigation of the Substrate's Effect on the Transient Coupling to Printed
Circuit Boards," Electromagnetic Compatibility 2001, Zurich,
Switzerland, Feb. 20-22, 2001, pp. 669-672.
[1055] Low, S. M., Phoon, M., and Suffian, Johan A.,
"An Experimental Result on the Effect of Bypass Capacitance in Load Board for
Semiconductor's Speed Testing," 2008 10th Electronics Packaging
Technology Conference, Singapore, Dec. 9-12, 2008, pp. 1196-1201.
[1056] Low, Y. L., Schaper, L. W., Ang, S., and Oldham, D.,
"The Interconnected Mesh Power System (IMPS) MCM Topology," Proceedings
of IEEE 3rd Topical Meeting on Electrical Performance of Electronic Packaging
, Monterey, CA, Nov. 2-4, 1994, pp. 231-234.
[1057] Low, Y. L., Schaper, L. W., Ang, S., and Ahmad, M,,
"Theory and Experimental Confirmation of the Interconnected Mesh Power System
(IMPS) MCM Topology," Proceedings of the 1994 International Electronics
Packaging Conference, Atlanta, GA, Sept. 25-28, 1994, pp. 462-469.
[1058] Low, Y. L., Schaper, L. W., Ang, S., and Ahmad, M.,
"Theory and Experimental Confirmation of the Interconnected Mesh Power System
(IMPS) MCM Topology," The International Journal of Microcircuits and
Electronic Packaging, vol. 18 no. 2, pp. 146-153, Second Quarter
1995.
[1059] Low, Yee L., Schaper, Len W., and Ang, Simon S.,
"A Low-Cost MCM Design Topology-the Interconnected Mesh Power System (IMPS),"
Proceedings 1995 Multi-Chip Module Conference, Jan. 31-Feb. 2,
1995, pp. 200-205.
[1060] Low, Yee L., Schaper, Leonard W., and Ang, Simon S.,
"Modeling and Experimental Verification of the Interconnected Mesh Power
System (IMPS) MCM Topology," IEEE Transactions on Components, Packaging,
and Manufacturing Technology - Part B, vol. 20, no. 1, pp. 42-49,
Feb. 1997.
[1061] Low, Yee L., and Frye, Robert C.,
"Signal Integrity and Power Distribution Systems Analyses for a 4x4 ATM Switch
MCM," Proceedings of the 1997 International Conference on Multichip
Modules, Denver, CO, Apr. 2-4, 1997, pp. 278-283.
[1062] Low, Yee L., Schaper, Leonard W., and Ang, Simon S.,
"The Power Distribution System of the Interconnected Mesh Power System (IMPS)
MCM Topology," The International Journal of Microcircuits and Electronic
Packaging, vol. 18 no. 4, pp. 363-367, Fourth Quarter 1995.
[1063] Loyka, Sergey L.,
"A Simple Formula for the Ground Resistance Calculation," IEEE
Transactions on Electromagnetic Compatibility, vol. 41, no. 2, pp.
152-154, May 1999.
[1063d] Lu, Jian-Fang, Wang, Ling, Lai, Qiong-Yu, Chu, Hong-Yan, and Zhao, Yan,
"Study of capacitive properties in supercapacitor for copolymer of aniline
with m-phenylenediamine," Journal of Solid State Electrochemistry
, vol. 13 no. 12, pp. 1803-1810, Dec. 2009.
[1064] Lu, Jiongxin, Moon, Kyoung-Sik, and Wong, C. P.,
"Development of Novel Silver Nanoparticles/Polymer Composites as High K
Polymer Matrix by In-Situ Photochemical Method," Proceedings 56th
Electronic Components & Technology Conference, San Diego, CA, May
30-June 2, 2006, pp. 1841-1846.
[1064d] Lu, Jiongxin, Moon, Kyoung-Sik, Xu, Jianwen, and Wong, C. P.,
"Dielectric Loss Control of High-K Polymer Composites by Coulomb Blockade
Effects of Metal Nanoparticles for Embedded Capacitor Applications,"
IEEE/CPMT International Symposium on Advanced Packaging Materials: Processes,
Properties and Interfaces, Irvine, CA, Mar. 16-18, 2005, pp. 237-242.
[1065] Lu, Jiongxin, and Wong, C. P.,
"Dielectric Performance Enhancement of Nanoparticle-Based Materials for
Embedded Passive Applications," 2008 Proceedings 58th Electronic
Components &, Technology Conference, Lake Buena Vista, FL, May
27-30, 2008, pp. 736-741.
[1066] Lu, Jiongxin, Moon, Kyoung-Sik, and Wong, C. P.,
"In-situ Photochemical Synthesis of Novel Silver Nanoparticles/Polymer
Composites as High K Polymer Matrix for Embedded Passives Applications,"
2006 11th International Symposium on Advanced Packaging Materials:
Processes, Properties and Interface, Atlanta, GA, Mar. 15-17, 2006,
pp. 85-87.
[1067] Lu, Jiongxin, Moon, Kyoung-Sik, Kim, Byung-Kook, and Wong, C. P.,
"Novel All Organic High Dielectric Constant Polyaniline/epoxy Composites for
Embedded Capacitor Applications," 2006 11th International Symposium on
Advanced Packaging Materials: Processes, Properties and Interface,
Atlanta, GA, Mar. 15-17, 2006, pp. 88-92.
[1068] Lu, Jiongxin, and Wong, C. P.,
"Recent Advances in High-k Nanocomposite Materials for Embedded Capacitor
Applications," IEEE Transactions on Dielectrics and Electrical
Insulation, vol. 15 no. 5, pp. 1322-1328, Oct. 2008.
[1069] Lu. Jiongxin, Moon, Kyoung-Sik, Xu, Jianwen, and Wong, C. P.,
"Synthesis and dielectric properties of novel high-K polymer composites
containing in-situ formed silver nanoparticles for embedded capacitor
applications," Journal of Materials Chemistry, vol. 16 no.
16, pp. 1543-1548, 2006.
[1070] Luo, Jia-Yan, Liu, Jin-Long, He, Ping, and Xia, Yong-Yao,
"A novel LiTi2(PO4)3/MnO2 hybrid supercapacitor in lithium sulfate aqueous
electrolyte," Electrochimica Acta, vol. 53 no. 28, pp. 8128-8133,
Nov. 30, 2008.
[1070b] Luo, Suibin, Sun, Rong, Zhang, Jingwei, Yu, Shuhui, Du, Ruxu, and Zhang,
Zhijun,
"Synthesis and Characterization of Nano BaTiO3/Epoxy Composites for Embedded
Capacitors," International Conference on Electronic Packaging Technology
& High Density Packaging, Beijing, China, Aug. 10-13, 2009, pp.
856-859.
[1070d] Ma, Beihai, Kwon, Do-Kyun, Narayanan, Manoj, and Balachandran, U.,
"Dielectric properties and energy storage capability of antiferroelectric
Pb0.92La0.08Zr0.95Ti0.05O3 film-on-foil capacitors," Journal of
Materials Research, vol. 24 no. 9, pp. 2993-2996, Sept. 2009.
[1070f] Ma, Beihai, Narayanan, Manoj, Tong, Sheng, and Balachandran, U.,
"Fabrication and characterization of ferroelectric PLZT film capacitors on
metallic substrates," Journal of Materials Science, vol. 45 no.
1, pp. 151-157, Jan. 2010.
[1070h] MacDougall, Fred, Jow, Richard, Ennis, Joel, Yen, S. P. S., Yang, X. H. Chip,
and Ho, Janet,
"Pulsed Power Capacitors," Proceedings of the 2008 IEEE International
Power Modulators and High Voltage Conference, Las Vegas, NV, May 27-31,
2008, pp. 167-169.
[1071] Macomber, Laird L, and Parler Jr., Sam G.,
"Bullet Proof Your DC Link Aluminum Electrolytic Capacitor Banks,"
CARTS Asia 2007 Proceedings, Taipei, Taiwan, Oct. 9-13, 2007, pp.
xx-xx.
[1072] Macomber, Laird L.,
"Performance Comparison of Aluminum Electrolytic and Wet Tantalum Capacitors
at Cold Temperatures and High Frequencies," Proceedings CARTS Asia
2005, Taipei, Taiwan, Oct. 11-13, 2005, pp. 102-113.
[1073] Madou, An, and Martens, Luc,
"Electrical Behavior of Decoupling Capacitors Embedded in Multilayer PCBs,"
Proceedings of the 8th IEEE Topical Meeting on Electrical Performance of
Electronic Packaging, San Diego, CA, Oct. 25-27, 1999, pp. 107-110.
[1074] Madou, An, and Martens, Lue,
"Electrical Behavior of Decoupling Capacitors Embedded in Multilayer PCBs,"
IEEE Transactions on Electromagnetic Compatibility, vol. 43, no.
4, pp. 549-556, Nov. 2001.
[1075] Madou, An, and Martens, Luc,
"Electrical Performance of Buried Capacitors in Multi-layered PCBs,"
Proceedings of the 8th IEEE Topical Meeting on Electrical Performance of
Electronic Packaging, San Diego, CA, Oct. 25-27, 1999, pp. 107-110.
[1076] Mahajan, Ravi, Nair, Raj, Wakharkar, Vijay, Swan, Johanna, Tang, John,
and Vandentop, Gilroy,
"Emerging Directions for Packaging Technologies," Intel Technology
Journal, vol. 6, issue 2, pp. 62-75, May 16, 2002.
[1077] Mahanfar, Alireza, Fallah, Ahmad Mahin, and Nelson, Robert M.,
"On Characterizing the Impedance of Power/Ground Planes- Including the Effect
of Anti-Pads," 2003 IEEE Symposium on Electromagnetic Compatibility
Symposium Record, Volume 2 , Boston, MA, Aug. 18-22, 2003, pp.
869-874.
[1077d] Maher, Galeb H., and Hofmaier, Reginald L.,
"A New PLZT Dielectric for Use in Characteristic X7R Multilayer Ceramic
Capacitors," Proceedings of the 1984 International Symposium on
Microelectronics, Dallas, TX, Sept. 17-19, 1984, pp. 462-467.
[1078] Maher, Galeb H., Wilson, James M., and Maher, Samir G.,
"Dielectric Properties of a Newly Developed Very Low Fired COG Dielectric for
High Q and High Voltage Applications," Proceedings of the 25th
Symposium for Passive Components, Palm Springs, CA, Mar. 21-24, 2005,
pp. 261-265.
[1079] Maher, Galeb H., Wilson, James M., and Maher, Samir G.,
"Effect of Dielectric Thickness on the dc and ac Dielectric Breakdown Field
for Low Fired COG and X7R Capacitors," Proceedings CARTS Asia 2005
, Taipei, Taiwan, Oct. 11-13, 2005, pp. 95-101.
[1080] Maher, Galeb H., Wilson, James M., and Maher, Samir G.,
"Effect of Dielectric Thickness on the dc and ac Dielectric Breakdown Field
for Low Fired COG and X7R Capacitors," 2006 CARTS Conference
Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[1081] Maher, Galeb H.,
"High Volumetric Capacitance Low Fired X7R MLC Capacitor," 1993
Proceedings 43rd Electronic Components & Technology Conference,
Orlando, FL, June 1-4, 1993, pp. 280-284.
[1082] Maher, John P., Jacobsen, Robert T., and Lafferty, Raymond E.,
"High Frequency Measurement of Q-Factors of Ceramic Chip Capacitors,"
28th Electronic Components Conference, Anaheim, CA, Apr. 24-26,
1978, pp. 190-198.
[1083] Mahler, Bruce P.,
"Planar Resistor Technology in High Density MLB Applications," Printed
Circuit Fabrication, vol. 8 no. 6, pp. 154,156,162,164,167, June 1985.
[1083d] Malak, A., Fic, K., Lota, G., Vix-Guterl, C., and Frackowiak, E.,
"Hybrid materials for supercapacitor application," Journal of Solid
State Electrochemistry, vol. xx no. xx, pp. xx-xx, xxxx.
[1084] Maliniak, David,
"Don't Be A Separatist-Think "System"," Electronic Design,
vol.55 no. 3, pp. 51-52, 54, 56, Feb. 1, 2007.
[1085] Mancini, Ron,
"Decoupling capacitors: use them or fail," EDN, Sept. 12, 1997.
[1086] Mamiktala, Sanjaya,
"SIMPLE SWITCHER(R) PCB Layout Guidelines," National Semiconductor
Application Note 1229, July 2002.
[1086d] Mammeri, M., Laurent, C., and Nedjar, M.,
"Dynamics of Voltage Polarity Reversal as the Controlling Factor in
Space-charge Induced Breakdown of Insulating Polymers," IEEE
Transactions on Dielectrics and Electrical Insulation, vol. 4 no. 1,
pp. 44-51, Feb. 1997.
[1087] Mandakis, Basile James,
"The Solid Tantalum Capacitor - A "Solid" Contributor to Reliability,"
11th Annual Reliability Physics Symposium, Las Vegas, NV, Apr. 3-5,
1973, pp. 45-53.
[1088] Mandhana, Om P.,
"Analysis and Design of Critically Damped Power Distribution Network for High
Performance Microprocessor Systems," Digest of 11th IEEE Topical
Meeting on Electrical Performance of Electronic Packaging, Monterey,
CA, Oct. 21-23, 2002, pp. 183-186.
[1089] Mandhana, Om P., and Zhao, Jin,
"Comparative Study on Effectiveness of On-Chip, On-Package and PCB Decoupling
for Core Noise Reduction by Using Broadband Power Delivery Network Models,"
2005 Proceedings 55th Electronic Components & Technology Conference,
Volume 1, Orlando, FL, May 31-June 3, 2005, pp. 732-739.
[1090] Mandhana, Om P.,
"Design Oriented Analysis of Package Power Distribution System Considering
Target Impedance for High Performance Microprocessors," Proceedings 10th
Topical Meeting on Electrical Performance of Electronic Packaging,
Cambridge, MA, Oct. 29-31, 2001, pp. 273-276.
[1091] Mandhana, Om P.,
"Effect of Resonant Free Power Delivery Network Design on VRM Performance,"
Twentieth Annual IEEE Applied Power Electronics Conference and
Exposition, Volume 1, Austin, TX, Mar. 6-10, 2005, pp. 183-190.
[1092] Mandhana, Om P.,
"Methodology for On-Package Decoupling Capacitor Selection with Considerations
of Coupled Core and IO Power Delivery Network and Simultaneous Switching Noise
Effects," IEEE 14th Topical Meeting on Electrical Performance of
Electronic Packaging, Austin, TX, Oct. 24-26, 2005, pp. 175-178.
[1093] Mandhana, Om P.,
"Modeling, Analysis and Design of Resonant Free Power Distribution Network for
Modern Microprocessor Systems," IEEE Transactions on Advanced
Packaging, vol. 27, no. 1, pp. 107-120, Feb. 2004.
[1094] Mandhana, Om P.,
"Optimizing the Output Impedance of a Power Delivery Network for
Microprocessor Systems," 54th Electronic Components & Technology
Conference, Volume 2, Las Vegas, NV, June 1-4, 2004, pp. 1975-1982.
[1095] Mandhana, Om P., Zhao, Jin,
"Power Delivery System Performance Optimization of a Printed Circuit Board
with Multiple Microprocessors," 54th Electronic Components &
Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp.
581-588.
[1096] Mandhana, Om P., and Zhao, Jin,
"Power Delivery System Performance Optimization of a Printed Circuit Board
with Multiple Microprocessors (Presentation)," 54th Electronic
Components & Technology Conference, Volume 1, Las Vegas, NV, June
1-4, 2004, pp. 581-588.
[1097] Mandhana, Om P., Sanchez, Hector, Seigel, Joshua, and Burnette, Jonathan,
"Study of Simultaneous Switching Noise Reduction for Microprocessor Packages
by Application of High-K MIM Decoupling Capacitors," DesignCon 2007
, Santa Clara, CA, Jan. 29-Feb. 1, 2007, pp. xx-xx.
[1098] Maniwa, R. T.,
"Global Distribution: Clocks and Power," Integrated System
Design, vol. 7, issue 74, pp. 17-28, Aug. 1995.
[1099] Mannath, Deepa,
"Advanced Decoupling in High Performance IC Packaging," 54th Electronic
Components & Technology Conference, Volume 1, Las Vegas, NV, June
1-4, 2004, pp. 266-270.
[1100] Mao, Jingkun, Archambeault, Bruce, Drewniak, James L., and Van Doren,
Thomas P.,
"Estimating DC Power Bus Noise," 2002 IEEE International Symposium on
Electromagnetic Compatibility Symposium Record - Volume 2, Minneapolis,
MN, Aug. 19-23, 2002, pp. 1032-1036.
[1101] Mao, Jingkun, Wang, Chen, Selli, Giuseppe, Archambeault, Bruce, and
Drewniak, James L.,
"Memory DIMM DC Power Distribution Analysis and Design," 2003 IEEE
Symposium on Electromagnetic Compatibility Symposium Record, Volume 2 ,
Boston, MA, Aug. 18-22, 2003, pp. 597-602.
[1102] Margerison, Ian,
"Production of Tantalum powders using the Cambridge FFC Reduction Method,"
CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2,
2009, pp. xx-xx.
[1103] Markowski, Peter, and Quinn, Conor,
"Bypass Capacitors for Point-of- Load Architecture."
[1104] Mars, Pierre,
"Pump Up the Volume!," EDN Power Technology, Part Four, vol. 52
no. 1, pp. 13-14, Oct. 2007.
[1105] Mars, Pierre,
"Supercapacitors for mobile-phone power," Electronic
Products, vol. 50 no. 7, pp. 48, 50, Dec. 2007.
[1106] Mars, Pierre,
"Supercapacitors for SSD backup power," Electronic Products, vol.
51 no. 10, pp. 40-41, Mar. 2009.
[1107] Marshall, Jim, and Prymak, John,
"Surge Step Stress Testing (SSST) of Tantalum Capacitors," CARTS
2001 Proceedings, St. Petersburg, FL, Mar. 26-30, 2001, pp. xx-xx.
[1108] Martin, Arch,
"Decoupling: Basics."
[1109] Martin, Arch G., and Parkinson, Ward,
"Functional Testing of Decoupling Capacitors for Dynamic RAMs."
[1110] Martin, Arch G.,
"Improved Noise Suppression Via Multilayer Ceramic Capacitors (MLCs) in
Power-Entry Decoupling."
[1111] Maslyakova, A., and Zhuravleva, N.,
"Characteristic Properties of Cellulose Materials Modified by Chitosan,"
CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2,
2009, pp. xx-xx.
[1112] Mattingly, David,
"Increasing Reliability of SMD Tantalum Capacitors in Low Impedance
Applications."
[1113] Maxwell, John,
"Arc Season and Board Design Observations," 2006 CARTS Conference
Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[1114] Maxwell, John, and Lemus, Enrique,
"Impact of Pad Design and Spacing on AC Breakdown Performance,"
CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007,
pp. 263-268.
[1115] Maxwell, John,
"Very High Frequency Switch Mode Power Supply Output Filter Capacitor
Considerations and Mounting Limitations."
[1116] Mazzanti, G., Montanari, G. C., and Dissado, L. A.,
"A Space-charge Life Model for ac Electrical Aging of Polymers," IEEE
Transactions on Dielectrics and Electrical Insulation, vol. 6 no. 6,
pp. 864-875, Dec. 1999.
[1117] McCune, Earl,
"Ground-current control enhances dynamic range in high-speed circuits,"
EDN, Jan. 19, 1995.
[1117d] McDonald, D. J., Dollinger, R., and Sarjeant, W. J.,
"A Method of Characterizing High Energy Density Capacitors for Power
Conditioning Systems," IEEE Conference Record of the 1988 Eighteenth
Power Modulator Symposium, Hilton Head, SC, June 20-22, 1988, pp. 345-348.
[1118] McKinzie III, William E.,
"A Hybrid Electromagnetic Bandgap (EBG) Power Plane with Discrete Inductors
for Broadband Noise Suppression," 2007 IEEE Electrical Performance of
Electronic Packaging, Atlanta, GA, Oct. 29-31, 2007, pp. 91-94.
[1119] McMorrow, Scott, Neves, Al, Dagostino, Tom, Vicich, Brian, and Weir, Steve,
"PCB Design Methods for Optimum FPGA SerDes Jitter Performance,"
DesignCon 2007, Santa Clara, CA, Jan. 29-Feb. 1, 2007, pp. xx-xx.
[1120] McMorrow, Scott,
"Power Integrity Engineering: DC Power Integrity," Samtec, July 2008.
[1121] Meadors, Rick, and Hill, Lee,
"Steward EMI Presentation," Steward.
[1122] Megherhi, Mohammed, Symes, Walter, Chu, Mike, Romer, Elise, and Coppens,
Wiljan,
"COG Base Metal Electrode Dielectric Composition for Thin Layer MLCC,"
CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 21-24.
[1123] Merker, Udo, Lovenich, Wilfried, and Wussow, Klaus,
"Conducting Polymer Dispersions for High-Capacitance Tantalum Capacitors,"
CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28,
2006, pp. xx-xx.
[1124] Merker, Udo, Wussow, Klaus, and Lovenich, Wilfried,
"New Conducting Polymer Dispersions for Solid Electrolyte Capacitors,"
Proceedings of CARTS-Europe 2005, Prague, Czech Republic, Oct.
17-20, 2005, pp. 30-35.
[1125] Merker, Udo, Lovenich, Wilfried, and Wussow, Klaus,
"Tuning Conducting Polymer Dispersions for High-CV Tantalum Capacitors,"
CARTS Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp.
xx-xx.
[1126] Miller, Jason R., Novak, Istvan, and Delap, Jim,
"Characterizing and Modeling the Impact of Power/Ground Via Arrays on Power
Plane Impedance," DesignCon 2005, Santa Clara, CA, Jan.
31-Feb. 3, 2005, pp. xx-xx.
[1127] Miller, Jason R., Blando, Gustavo J., Dame, Roger, Williams, K. Barry A., and
Novak, Istvan,
"Examining the Impact of Split Planes on Signal and Power Integrity,"
DesignCon 2009, Santa Clara, CA, Feb. 2-5, 2009, pp. xx-xx.
[1128] Miller, Jason R., Blando, Gustavo, Williams, K. Barry A., and Novak, Istvan,
"Impact of PCB Laminate Parameters on Suppressing Modal Resonances,"
DesignCon 2008, Santa Clara, CA, Feb. 4-7, 2008, pp. xx-xx.
[1129] Miller, Jason, and Novak, Istvan,
"Modeling of Plane Discontinuities for Power Distributions Networks,"
Progress in Electromagnetics Research Symposium 2002, Cambridge,
MA, July 1-5, 2002, pp. xx-xx.
[1130] Miller, Jason R., and Novak, Istvan,
"Modeling the Impact of Power/Ground Via Arrays on Power Delivery,"
IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging
, Portland, OR, Oct. 25-27, 2004, pp. 119 - 122.
[1131] Miller, Jason R.,
"The Impact of Split Power Planes on Package Performance," 2001
Proceedings 51st Electronic Components & Technology Conference,
Orlando, FL, May 29-June 1, 2001, pp. ?.
[1132] Miller, John R.,
"Electrochemical Capacitor Technology Basics for the Traditional Component
Engineer," CARTS USA 2009 Proceedings, Jacksonville, FL, Mar.
30-Apr. 2, 2009, pp. xx-xx.
[1133] Miller, John R.,
"Electrochemical capacitor thermal management issues at high-rate cycling,"
Electrochimica Acta, vol. 52 no. 4, pp. 1703-1708, Dec. 1, 2006.
[1134] Miller, John R., and Burke, Andrew F.,
"Electrochemical Capacitors: Challenges and Opportunities for Real-World
Applications," Electrochemical Society Interface, vol. 17 no. 1,
pp. 53-57, Spring 2008.
[1135] Millman, W., and Zednicek, T.,
"Niobium Oxide Capacitors Brings High Performance to a Wide Range of
Electronic Applications," CARTS Europe 2007, Barcelona,
Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[1136] Millman, W., and Huntington, D.,
"Tantalum Capacitors Bring Micro-Miniaturisation to Electronic Devices,"
CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29,
2007, pp. 245-255.
[1137] Millman, W., and Huntington, D.,
"Tantalum Capacitors Bring Micro-Miniaturisation to Electronic Devices,"
CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28,
2006, pp. xx-xx.
[1138] Millman, W., and Huntington, D.,
"Tantalum Capacitors Bring Micro-Miniaturisation to Electronic Devices,"
CARTS Asia 2006, Taipei, Taiwan, Oct. 9-11, 2006, pp. xx-xx.
[1139] Min, Sung-Hwan, Seo, Chung-Seok, Yepes, Ana M., Ward, Chris, Dalmia, Sidharth,
White, George, and Swaminathan, Madhavan,
"RF Design Methodology for Design-Cycle-Time Reduction using Parameterization
of Embedded Passives on Multilayer Organic Substrates," 2008 IEEE
MTT-S International Microwave Symposium Digest, Atlanta, GA, June
15-20, 2008, pp. 1397-1400.
[1140] Mingli, Huang, Shun, Zhang, and Yuandao, Ju,
"The Study of High Density PCB Reliability," IPC Printed Circuits Expo,
APEX and the Designers Summit Proceedings 2008 Technical Conference,
Las Vegas, NV, Apr. 1-3, 2008, pp. S22:03.
[1140d] Mis, Edward, Dziedzic, Andrzej, and Nitsch, Karol,
"Electrical properties and electrical equivalent models of thick-film and LTCC
microcapacitors," Microelectronics International, vol. 26 no. 2,
pp. 45-50, 2009.
[1140h] Misman, O., Bhattacharya, S. K., Erbil, A., and Tummala, R. R.,
"PWB compatible high value integral capacitors by MOCVD," Journal of
Materials Science: Materials in Electronics, vol. 11 no. 9, pp.
657-660, Dec. 2000.
[1141] Missozhnikov, Lev V., and Sharipov, Ernst I.,
"Ti - Vacuum Deposition onto Al Substrate to Produce Cathode Foil for Oxide
Electrolytic Capacitors," CARTS Europe 2007, Barcelona,
Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[1142] Miyairi, K., and Morimitsu, N.,
"Interpretation of Short-Circuit Discharge Current in Film Capacitors Based on
an Equivalent Circuit," IEEE Transactions on Dielectrics and Electrical
Insulation, vol. 8 no. 6, pp. 874-879, Dec. 2001.
[1143] Moghaddam, S. A., Masoumi, N., and Lucas, C.,
"A Stochastic Power-Supply Noise Reduction Technique Using Max-Flow Algorithm
and Decoupling Capacitance," Proceedings Fifth International Workshop on
System-on-Chip for Real-Time Applications, Banff, Alberta, Canada, July
20-24, 2005, pp. 265-269.
[1144] Mogilevsky, Boris and Shirn, George A.,
"Surge Current Failure in Solid Electrolyte Tantalum Capacitors," 36th
Electronic Components Conference, Seattle, WA, May 5-7, 1986, pp.
663-667.
[1145] Mogilevsky, Boris and Shirn, George A.,
"Surge Current Failure in Solid Electrolyte Tantalum Capacitors," IEEE
Transactions on Components, Hybrids, and Manufacturing Technology, vol.
CHMT-9, no. 4, pp. 475-479, Dec. 1986.
[1146] Moll, Francesc, and Fang, Jiayuan,
"Extraction of Equivalent Circuit Models of Package Power Supply Distribution
Systems from Full Wave EM Field Simulations."
[1147] Mondal, Mosin, Connor, Samuel, Archambeault, Bruce, and Jandhyala, Vikram,
"Including the Impact of Connecting Vias in the Performance Metric Evaluation
for Board-Level Optimization of Decoupling Capacitors," 17th Topical
Meeting on Electrical Performance of Electronic Packaging, San Jose,
CA, Oct. 27-29, 2008, pp. 177-180.
[1148] Montanari, Davide, Saarinen, Kimmo, Scagliarini, Fabio, Zeidler, Dietmar,
Niskala, Matti, and Nender, Claes,
"Film Capacitors for Automotive and Industrial Applications," CARTS
Europe 2008, Helsinki, Finland, Oct. 20-23, 2008, pp. xx-xx.
[1149] Montanari, Davide, Saarinen, Kimmo, Scagliarini, Fabio, Zeidler, Dietmar,
Niskala, Matti, and Nender, Claes,
"Film Capacitors for Automotive and Industrial Applications," CARTS
USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp.
xx-xx.
[1150] Montanari, G. C., and Fabiani, D.,
"Searching for the Factors which Affect Self-healing Capacitor Degradation Under
Non-sinusoidal Voltage," IEEE Transactions on Dielectrics and Electrical
Insulation, vol. 6 no. 3, pp. 319-325, June 1999.
[1151] Montanari, G. C., and Fabiani, D.,
"The Effect of Non-sinusoidal Voltage on Intrinsic Aging of Cable and
Capacitor Insulating Materials," IEEE Transactions on Dielectrics and
Electrical Insulation, vol. 6 no. 6, pp. 798-802, Dec. 1999.
[1152] Montrose, Mark I.,
"Analysis on Loop Area Trace Radiated Emissions from Decoupling Capacitor
Placement on Printed Circuit Boards," 1999 IEEE International Symposium
on Electromagnetic Compatibility Symposium Record Volume One, Seattle,
WA, Aug. 2-6, 1999, pp. 423-428.
[1153] Montrose, Mark I.,
"Decoupling capacitors as a cause of radiated EMI: an analysis of capacitor
placement, Part 1. The Frequency Domain," ITEM 2000, pp.
47-48 & 62-68, 2000.
[1154] Montrose, Mark I.,
"Decoupling capacitors as a cause of radiated EMI: an analysis of capacitor
placement, Part 2. The Time Domain," ITEM Update 2000, pp.
69-77.
[1155] Montrose, Mark,
"Defining Proper Usage of Capacitors on a Printed Circuit Board."
[1156] Montrose, Mark,
"Overlooked Characteristics of Capacitors."
[1157] Montrose, Mark,
"Printed Circuit Board Design Techniques for EMC Compliance," EMC
'99, Portland, OR, Apr. 12, 1999.
[1158] Montrose, Mark I.,
"Printed Circuit Board Suppression Concepts for EMC Compliance,"
ITEM 1998, pp. 96-102 & 190-196, 1998.
[1159] Moore, Bruce D.,
"Circuit trade-offs minimize noise in battery-input power supplies,"
EDN, Jan. 18, 1996.
[1160] Moore, John, Zediak, Eric, Coker, Chris, and Gurav, Abhijit,
"Challenges Involving Deposition of Counter-Electrode Systems in High Charge
(> 100k CV/g) Ta Powders," TIC Conference, Philadelphia, PA,
2004, pp. xx-xx.
[1161] Moore, John,
"Nb Capacitors compared to Ta Capacitors as a less costly alternative."
Kemet TechTopics, vol. 11 no. 1, pp. 1-2, Sept. 2001.
[1162] Moore, John, and Prymak, John,
"Tantalum Capacitors - Challenges and Developments," TIC Conference
, Lisbon, Portugal, 2003, pp. xx-xx.
[1163] Moore, John,
"Ultra-Low ESR Tantalum Chip Capacitor," Kemet TechTopics,
vol. 7 no. 3, pp. 1-2, Sept. 1997.
[1164] Morcan, Gabriel, Ang, Simon S., Lenihan, Timothy, Schaper, Leonard W.,
and Brown, William D.,
"Characterization of Thin Film Tantalum Oxide Capacitors on Polyimide
Substrates, " IEEE Transactions on Advanced Packaging, vol. 22,
no. 3, pp. 499-509, Aug. 1999.
[1164d] Morita, Koichiro, Mizuno, Youichi, and Kishi, Hiroshi,
"Reliability design of Multilayer Ceramic Capacitor against thinning of
dielectric layers," Sixteenth IEEE International Symposium on
Applications of Ferroelectrics, Nara, Japan, May 27-31, 2007, pp.
549-552.
[1165] Morrison, David G.,
"Automotive Designs Accelerate Demand For Passive Components,"
Electronic Design, vol. xx no. x, pp. xx-xx. Jan. 22, 2001.
[1166] Morrison, David G.,
"Capacitive Technology Filters And Decouples With Fewer Parts," Feb. 7,
2000.
[1167] Mosley, Larry E.,
"Capacitor Impedance Needs For Future Microprocessors," 2006 CARTS
Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[1168] Mosley, Larry E., and Schrader, Jason S.,
"Hysteresis Measurements of Multi-Layer Ceramic Capacitors Using a
Sawyer-Tower Circuit," CARTS 2007 Symposium Proceedings,
Albuquerque, NM, Mar. 26-29, 2007, pp. 309-319.
[1169] Mosley, Larry E.,
"Power Delivery Challenges for Multi-Core Microprocessors," CARTS
USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[1170] Moure, Alberto, Pelaez, David, and Arribere, Maria,
"Design of Power Electronic Capacitors in IGBT Inverters Applications,"
CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28,
2006, pp. xx-xx.
[1171] Mourra, Olivier, Collins, Paul, Hopkins, John, and Tonicello, Ferdinando,
"Investigation on Tantalum Capacitors in Parallel Configuration,"
Proceedings of CARTS-Europe 2005, Prague, Czech Republic, Oct. 17-20,
2005, pp. 111-117.
[1172] Mu, Zhen,
"Discussing Impedance Distribution with Multiple Stimulating Sources in Power
Distribution System Design and Simulation," 17th Topical Meeting on
Electrical Performance of Electronic Packaging, San Jose, CA, Oct.
27-29, 2008, pp. 103-106.
[1173] Mu, Zhen, and Dudek, Heiko,
"How to Choose & Place Decoupling Capacitors to Reduce the Cost of the
Electronic Products," Cadence Design Systems, 2002.
[1173d] Mu, Zhen,
"Simulation and Modeling of Power and Ground Planes in High Speed Printed
Circuit Boards," 2001 IEEE International Symposium on Circuits and
Systems, Volume 5, Sydney, Australia, May 6-9, 2001, pp. 459-462.
[1174] Muccioli. James P., Anthony, Anthony A., and Anthony, David,
"A broadband filter proves itself in multiple dielectrics," ITEM Update
2001, pp. 82-93, 2001.
[1175] Muccioli, James, Anthony, Anthony A., and Anthony, David,
"A microwave test fixture for measuring four-terminal passive components from
DC to 10GHz," Interference Technology Annual Guide 2003, pp.
160-173, 2003.
[1176] Muccioli, James, Sanders, Dale, and Bouma, Bart,
"A SPICE model for a capacitive circuit from kHz-GHz," Interference
Technology EMC Test & Design Guide 2003, pp. 40-46, 2003.
[1177] Muccioli, James P., and Sanders, Dale L.,
"Decoupling Capacitors, A Designer's Roadmap to Optimal Decoupling Networks
for Integrated Circuits," Freescale Technology Forum,
Orlando, FL, 2005.
[1178] Muccioli, James P., and Anthony, Anthony A.,
"Dynamic Testing of a Dual Line Filter For Common and Differential Mode
Attenuation using a Spectrum Analyzer," ITEM 2000, pp. 102-110,
2000.
[1179] Muccioli, James, and Sanders, Dale,
"High Speed Decoupling Strategies with fewer Capacitors," X2Y Attenuators.
[1180] Muccioli, James P., and Sanders, Dale L.,
"Integrating the Right Decoupling Capacitor: Busting the 9 Greatest Capacitor
Myths," X2Y, July 19, 2005.
[1181] Mucciolo, James, Anthony, David J., and Anthony, Anthony A.,
"RF Filtering for Audio Amplifier Circuits," Passive
Component, March 1, 2003.
[1182] Mukund, P. R., and Nayak, Ghanshyam,
"Power Integrity in High Speed Electronics."
[1183] Munikoti, Ramachandra, and Dhar, Pulak,
"Low-Voltage Failures in Multilayer Ceramic Capacitors: A New Accelerated
Stress Test," 1988 Proceedings 38th Electronic Components
Conference, Los Angeles, CA, May 9-11, 1988, pp. 355-361.
[1184] Murayama, Yuji, Ishijima, Masami, and Takada, Daisuke,
"Development of a Low-ESR Functional Polymer Tantalum Capacitor, the
"NeoCapacitor"," NEC Technical Journal, vol. 2 no. 4, pp.
61-65, Dec. 2007.
[1185] Murphy, A. T., and Young, F. J.,
"High-Frequency Design and Performance of Tubular Capacitors," 1992
Proceedings 42nd Electronic Components & Technology Conference, San
Diego, CA, May 18-20, 1992, pp. 591-600.
[1186] Murphy, Arthur T., and Young, Frederick J.,
"High Frequency Design and Performance of Tubular Capacitors," IEEE
Transactions on Components, Hybrids, and Manufacturing Technology, vol.
16, no. 2, pp. 228-237, Mar. 1993.
[1187] Murphy, A. T., and Young, F. J.,
"High Frequency Performance of Capacitors," 1991 Proceedings 41st
Electronic Components Conference , Atlanta, GA, May 11-16, 1991, pp.
335-344.
[1188] Murphy, Arthur T., and Young, Frederick J.,
"High Frequency Performance of Multilayer Capacitors," IEEE Transactions
on Microwave Theory and Techniques, vol. 43, no. 9, pp. 2007-2015,
Sept. 1995.
[1189] Murphy, A. T., and Young, F. J.,
"Power and Ground Plane Inductance," 1990 Proceedings 40th Electronic
Components Conference, Las Vegas, NV, May 20-23, 1990, pp. 152-156.
[1190] Mustafa, Kai,
"Design and Layout Guidelines for the CDCVF2505 Clock Driver," Texas
Instruments Application Note SCAA045, Nov. 2000.
[1191] Mustafa, Kai,
"Filtering Techniques: Isolating Analog and Digital Power Supplies in TI's
PLL-Based CDC Devices," Texas Instruments Application Report SCAA048, Oct.
2001.
[1192] Muthana, Prathap, Matoglu, Erdem, Pham, Nam, de Araujo, Daniel N., Mutnury,
Bhyrav, Cases, Moises, and Swaminathan, Madhavan,
"Analysis of Embedded Package Capacitors for High Performance Components,"
15th Topical Meeting on Electrical Performance of Electronic Packaging
, Scottsdale, CA, Oct. 23-25, 2006, pp. 55-58.
[1193] Muthana, Prathap, Swaminathan, Madhavan, Tummala, Rao, Raj, P. Markondeya,
Engin, Ege, Wan, Lixi, Balaraman, Devarajan, and Bhattacharya, Swapan,
"Design, Modeling and Characterization of Embedded Capacitor Networks for
Mid-frequency Decoupling in Semiconductor Systems," 2005
International Symposium on Electromagnetic Compatibility, Volume 2,
Chicago, IL, Aug. 8-12, 2005, pp. 638-643.
[1194] Muthana, Prathap, Engin, Ege, Raj, P. M., Swaminathan, Madhavan, Tummala, Rao,
Sundaram, Venkatesh, Amey, Daniel, Dietz, Karl, Banerji, Sounak, and Cases,
Moises,
"Design, Modeling and Characterization of Embedded Capacitors for Decoupling
Applications."
[1195] Muthana, Prathap, Srinivasan, Krishna, Engin, Ege, Swaminathan, Madhavan,
Tummala, Rao, Amey, Daniel, Dietz, Karl, and Banerji, Sounak,
"I/O Decoupling in High Speed Packages Using Embedded Planar Capacitors,"
2007 Proceedings 57th Electronic Components & Technology Conference
, Reno, NV, May 29-June 1, 2007, pp. 299-304.
[1196] Muthana, Prathap, Srinivasan, Krishna, Engin, Arif Ege, Swaminathan, Madhavan,
Tummala, Rao, Sundaram, Venkatesh, Wiedenman, Boyd, Amey, Daniel I., Dietz,
Karl H., and Banerji, Sounak,
"Improvements in Noise Suppression for I/O Circuits Using Embedded Planar
Capacitors," IEEE Transactions on Advanced Packaging, vol. 31 no.
2, pp. 234-245, May 2008.
[1197] Muthana, Prathap. Swaminathan, Madhavan, Engin, Ege, Raj, P. Markondeya, and
Tummala, Rao,
"Mid Frequency Decoupling Using Embedded Decoupling Capacitors," IEEE
14th Topical Meeting on Electrical Performance of Electronic Packaging,
Austin, TX, Oct. 24-26, 2005, pp. 271-274.
[1198] Na, Nanju, Swaminathan, Madhavan, Libous, James, and O'Connor, Daniel,
"Modeling and Simulation of Core Switching Noise on a Package and Board,"
2001 Proceedings 51st Electronic Components & Technology
Conference, Orlando, FL, May 29-June 1, 2001, pp. 1095-1101.
[1199] Na, Nanju, Choi, Jinseong, Chun, Sungjun, Swaminathan, Madhavan, and
Srinivasan, Jegannathan,
"Modeling and Transient Simulation of Planes in Electronic Packages,"
IEEE Transactions on Advanced Packaging, vol. 23, no. 3, pp.
340-352, Aug. 2000.
[1200] Nachtrab, William T., Wong, Terence, Wong, James, and Tripp, Terrance,
"Development of Tantalum Fibers for Solid Electrolytic Capacitors,"
2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp.
xx-xx.
[1201] Nachtrab, William T., Wong, Terence, Wong, James, and Tripp, Terrance,
"The Effect of Fiber Thickness and Thickness Uniformity on CV/g Behavior of Ta
Ribbon Type Fibers," CARTS 2007 Symposium Proceedings,
Albuquerque, NM, Mar. 26-29, 2007, pp. 77-87.
[1202] Nagarajan, N., Humadi, H., and Zhitomirsky, I.,
"Cathodic electrodeposition of MnOx films for electrochemical
supercapacitors," Electrochimica Acta, vol. 51 no. 15, pp.
3039-3045, Apr. 1, 2006.
[1202d] Nakano, Makito, Saito, Akira, and Wada, Nobuyuki,
"E-J Characteristics in Multilayer Ceramic Capacitors with the Thin Dielectric
Layers," Key Engineering Materials, vol. 421-422, pp. 277-280,
2010.
[1203] Nakase, Koichiro, Ohshima, Daisuke, and Inoue, Hirobumi,
"Electrical Characterization of Thin-Film Embedded Passives," 55th
Electronic Components & Technology Conference, Orlando, FL, May 31-June
3, 2005, pp. xx-xx.
[1204] Nanbu, Noritoshi, Ebina, Takahito, Uno, Hiroyuki, Ishizawa, Saki, and Sasaki,
Yukio,
"Physical and electrochemical properties of quaternary ammonium
bis(oxalato)borates and their application to electric double-layer
capacitors," Electrochimica Acta, vol. 52 no. 4, pp. 1763-1770,
Dec. 1, 2006.
[1205] Naoi, Katsuhiko, and Morita, Masayuki,
"Advanced Polymers as Active Materials and Electrolytes for ECs and Hybrid
Capacitor Systems," Electrochemical Society Interface, vol. 17
no. 1, pp. 44-48, Spring 2008.
[1206] Naoi, Katsuhiko, and Simon, Patrice,
"New Materials and New Configurations for Advanced Electrochemical
Capacitors," Electrochemical Society Interface, vol. 17 no. 1,
pp. 34-37, Spring 2008.
[1207] Nassif, Sani R., and Kozhaya, Joseph N.,
"Fast Power Grid Simulation," Proceedings 2000 37th Design Automation
Conference, Los Angeles, CA, June 5-9, 2000, pp. 156-161.
[1208] Ndip, Ivan, Ohnimus, Florian, Guttowski, Stephan, and Reichl, Herbert,
"Minimizing Electromagnetic Interference in Power-Ground Cavities,"
Electrical Design of Advanced Packaging and Systems Symposium, Seoul,
Korea, Dec. 10-12, 2008, pp. 128-131.
[1209] Nelms, David, Ulrich, Richard, Schaper, Leonard, and Reeder, Sadie,
"Anodization for Forming Thin Film Embedded Capacitors in MCM-D and MCM-L
Substrates," 1998 Proceedings 48th Electronic Components &
Technology Conference, Seattle, WA, May 25-28, 1998, pp. 247-251.
[1210] Nelms, R. M., Cahela, D. R., Newsom, R. L., and Tatarchuk, B. J.,
"A Comparison of Two Equivalent Circuits for Double-Layer Capacitors,"
Fourteenth Annual Applied Power Electronics Conference and Exposition, Volume
2, Dallas, TX, Mar. 14-18, 1999, pp. 692-698.
[1211] Nelson, Robert, and Davidson, Lincoln,
"Electrical Noise Generated from the Microphonic Effect in Capacitors,"
2002 IEEE International Symposium on Electromagnetic Compatibility
Symposium Record - Volume 2, Minneapolis, MN, Aug. 19-23, 2002, pp.
855-860.
[1211d] Nemamcha, M., Gosse, J. P., and Gosse, B.,
"Effect of Partial Discharges on Impregnated Polypropylene Films," IEEE
Transactions on Dielectrics and Electrical Insulation, vol. 1 no. 4,
pp. 578-584, Aug. 1994.
[1212] Neves, P., Pedroso, J., and Mota-Caetano, C.,
"ESR Stabilization of Ta Capacitors for Automotive Applications in Severe
Environmental Conditions," CARTS Europe 2007, Barcelona,
Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[1213] Ng, Emily,
"Using aerogel supercapacitors as energy storage in DSL modems,",
Elektron, vol. xx no. xx, pp. 48-49, Mar. 2005.
[1214] Nguyen, Don J., Harris, Shaun L., and Novak, Istvan,
"Emerging Challenges of DC-DC Converters," DesignCon 2007,
Santa Clara, CA, Jan. 29-Feb. 1, 2007, pp. xx-xx.
[1215] Nguyen-Quang, N., Gilbert, A., Foster, M. P., and Stone, D. A.,
"Characteristics of high-voltage capacitors when operating in high
temperature environments," 2nd Electronics Systemintegration Technology
Conference, Greenwich, London, UK, Sept. 1-4, 2008, pp. 423-426.
[1216] Nickel, Josh G., Rosenberger, Joseph F., Crane Jr., Stanford W., Horvath,
Zsolt, Jeon, James, Codd, Patrick T., and Cangellaris, Andreas C.,
"A Novel Decoupling Capacitance Platform for Substrates, Sockets, and
Interposers," 2004 6th International Conference on Electronic Packaging
Technology, Singapore, Dec. 8-10, 2004, pp. 231-234.
[1217] Nielsen. J. A., Chien, C. P., and Shi, F.,
"Embedded Tantalum Pentoxide Thin Film Capacitors for Use in Power Electronic
Applications," Proceedings 2000 HD International Conference on
High-Density Interconnect and Systems Packaging (Proceedings of SPIE - The
International Society for Optical Engineering, Volume 4217), Denver,
CO, Apr. 25-28, 2000, pp. 346-350.
[1217b] Nishio, Kazuyuki, Fukushima, Tatsuro, and Masuda, Hideki,
"Formation of Highly Ordered Tunnel Pits by Electrochemical Etching of Al Foil
Using Masking Film," Journal of the Surface Finishing Society of Japan
, vol. 59 no. x, pp. 448-451, 2008.
[1217d] Nohr, Wolf-Dieter, Hanke, Gerhard, and Weber, Dieter-Jiirgen,
"Advanced Chip-in-Board Thinfilm Hybrid Technology with Integrated Polyimid
Film Capacitors for Ultra High-Speed and Millimeterwave Applications,"
1998 IEEE Radio and Wireless Conference, Colorado Springs, CO, Aug.
9-12, 1998, pp. 113-116.
[1218] Noji, Takashi, Kawasaki, Kenichi, Sano, Harunobu, Inoue, Noriyuki, and
Malhotra, Karun,
"Development of Multilayer Ceramic Capacitors with Low Microphonics,"
2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006,
pp. xx-xx.
[1218d] Nomura, Takeshi, Miura, Junko, Arashi, Tomohiro, Nakano, Yukie, and Sato,
Akira,
"Multilayer Ceramic Capacitors- Recent Trends," Proceedings of the Tenth
IEEE International Symposium on Applications of Ferroelectrics, Volume 1
, East Brunswick, NJ, Aug. 18-21, 1996, pp. 135-141.
[1218h] Norga, G. J., Wouters, D. J., Bartic, A., Fe, Laura, and Maes, H. E.,
"Effect of Crystallisation on Fatigue in Sol-Gel PZT Ferroelectric Capacitors
with Reactively Sputtered RuO2 Electrode Layers," Proceedings of the
Eleventh IEEE International Symposium on Applications of Ferroelectrics
, Montreux, Switzerland, Aug. 24-27, 1998, pp. 3-6.
[1219] Novak, Istvan,
"A Black-Box Frequency Dependent Model of Capacitors for Frequency Domain
Simulations," DesignCon East 2005, Worchester, MA, Sept.
19-22, 2005, pp. xx-xx.
[1220] Novak, Istvan,
"Accuracy Considerations of Power-Ground Plane Models," Proceedings
of the 8th IEEE Topical Meeting on Electrical Performance of Electronic
Packaging, San Diego, CA, Oct. 25-27, 1999, pp. 153-156.
[1221] Novak, Istvan,
"Comparison of Power Distribution Network Design Methods: Bypass Capacitor
Selection Based on Time Domain and Frequency Domain Performances,"
DesignCon 2006, Santa Clara, CA, Feb. 6-9, 2006, pp. xx-xx.
[1222] Novak, Istvan, Smith, Larry, Roy, Tanmoy, and Anderson, Raymond,
"Correction to "Lossy Power Distribution Networks with Thin Dielectric Layers
and/or Thin Conductive Layers"," IEEE Transactions on Advanced
Packaging, vol. 24, no. 2, pp. 224, May 2001.
[1223] Novak, Istvan, Smith, Larry, Roy, Tanmoy, and Anderson, Raymond,
"Correction to "Lossy Power Distribution Networks with Thin Dielectric Layers
and/or Thin Conductive Layers"," IEEE Transactions on Advanced
Packaging, vol. 24, no. 3, pp. 411, Aug. 2001.
[1224] Novak, Istvan, Noujeim, Leesa M., St. Cyr, Valerie, Biunno, Nicholas,
Patel, Atul, Korony, George, and Ritter, Andrew,
"Distributed Matched Bypassing for Board-Level Power Distribution
Networks," IEEE Transactions on Advanced Packaging, vol. 25,
no. 2, pp. 230-243, May 2002.
[1225] Novak, Istvan, Miller, Jason R.,
"Frequency-Dependent Characterization of Bulk and Ceramic Bypass
Capacitors," Proceedings of the 12th Topical Meeting on Electrical
Performance of Electronic Packaging, Princeton, NJ, Oct. 27-29, 2003,
pp. 101-104.
[1226] Novak, Istvan,
"Frequency-Domain Power-Distribution Measurements - An Overview,"
DesignCon 2003 East, High-Performance System Design Conference,
Boston, MA, June 23-25, 2003.
[1227] Novak, Istvan,
"Frequency-Domain Power-Distribution Measurements-- An Overview,"
DesignCon East 2003, Boston, MA, June 2003.
[1228] Novak, Istvan, Blando, Gustavo, and Miller, Jason R.,
"History of Controlled-ESR Capacitors at SUN," DesignCon 2007
, Santa Clara, CA, Jan. 29-Feb. 1, 2007, pp. xx-xx.
[1229] Novak, Istvan,
"Impedance and EMC Characterization Data of Embedded Capacitance
Materials," Apex2001, San Diego, CA, Jan. 16-18, 2001.
[1230] Novak, Istvan, Yang, Zhiping, Wojewoda, Leigh, Smith, Larry, Ishida, Hideki,
and Shimizu, Masayuki,
"Inductance of Bypass Capacitors: How to Define, How to Measure, How to
Simulate," DesignCon 2005, Santa Clara, CA, Jan. 31-Feb. 3,
2005, pp. xx-xx.
[1231] Novak, Istvan,
"Lossy Power Distribution Networks with Thin Dielectric Layers and/or Thin
Conductive Layers" IEEE Transactions on Advanced Packaging, vol.
23, no. 3, pp. 353-360, Aug. 2000.
[1232] Novak, Istvan, Smith, Larry, and Roy, Tanmoy,
"Low Impedance Power Planes with Self Damping," Proceedings of the
IEEE 9th Topical Meeting on Electrical Performance of Electronic
Packaging, Scottsdale, AZ, Oct. 23-25, 2000, pp. 123-126.
[1233] Novak, Istvan,
"Measuring MilliOhms and PicoHenries in Power-Distribution Networks,"
DesignCon 2000, High-Performance System Design Conference, Santa
Clara, CA, Feb. 1-4, 2000.
[1234] Novak, Istvan, Pannala, Sreemala, and Miller, Jason. R.,
"Overview of Some Options to Create Low-Q Controlled-ESR Bypass Capacitors,"
IEEE 13th Topical Meeting on Electrical Performance of Electronic
Packaging, Portland, OR, Oct. 25-27, 2004, pp. xx-xx.
[1235] Novak, Istvan,
"Powering Digital Boards," Feb. 9, 1999.
[1236] Novak, Istvan,
"Probes and Setup for Measuring Power-Plane Impedance with Vector Network
Analyzer," 1999 High-Performance System Design Conference,
Santa Clara, CA, Feb. 1-4, 1999.
[1237] Novak, Istvan,
"Probes and Setup for Measuring Power-Plane Impedances with Vector Network
Analyzer," DesignCon99 High-Performance System Design Conference
, Santa Clara, CA, Feb. 1-4, 1999, pp. 201-215.
[1238] Novak, Istvan,
"Probes and Setup for Measuring Power-Plane Impedances with Vector Network
Analyzer," DesignCon99 High-Performance System Design Conference,
Santa Clara, CA, Feb. 1-4, 1999, pp. 201-215.
[1239] Novak, Istvan,
"Reducing EMI Noise by Suppressing Power-Distribution Resonances," Sun
Microsystems.
[1240] Novak, Istvan,
"Reducing Simultaneous Switching Noise and EMI on Ground/Power Planes by
Dissipative Edge Termination," Proceedings of the IEEE 7th Topical
Meeting on Electrical Performance of Electronic Packaging , West Point,
NY, Oct. 26-28, 1998, pp. 181-184.
[1241] Novak, Istvan,
"Reducing Simultaneous Switching Noise and EMI on Ground/Power Planes by
Dissipative Edge Termination," IEEE Transactions on Advanced
Packaging, vol. 22, no. 3, pp. 274-283, Aug. 1999.
[1242] Novak, Istvan, Miller, Jason R., Blomberg, Eric,
"Simulating Complex Power-Ground Plane Shapes with Variable-Size Cell SPICE
Grids," Digest of 11th IEEE Topical Meeting on Electrical
Performance of Electronic Packaging, Monterey, CA, Oct. 21-23, 2002,
pp. 265-268.
[1243] Novak, Istvan, Blando, Gustavo, and Miller, Jason R.,
"Slow-Wave Causal Model for Multi Layer Ceramic Capacitors,"
DesignCon 2006, Santa Clara, CA, Feb. 6-9, 2006, pp. xx-xx.
[1244] Novak, Istvan,
"SUN's Experience with Thin and Ultra Thin Laminates for Power Distribution
Applications," DesignCon 2006, Santa Clara, CA, Feb. 6-9,
2006, pp. xx-xx.
[1245] Novak, Istvan,
"Tolerance Calculations in Power Distribution Networks," Xcell
Journal, pp. ?, Summer 2004.
[1245d] Nowak, C., Stopher, J., Zirnheld, J., and Dollinger, R.,
"Microdischarge Detection In High Frequency Capacitors," Conference
Record of the 1994 Twenty-First International Power Modulator Symposium
, Costa Mesa, CA, June 27-30, 1994, pp. 252-255.
[1246] Nuebel, Joe, Roy, Tammoy, and Das, Sudip,
"An Investigation on Power Plane Decoupling for High Speed Multiprocessor
Boards," 1999 IEEE International Symposium on Electromagnetic
Compatibility Symposium Record Volume One, Seattle, WA, Aug. 2-6,
1999, pp. 355-360.
[1247] O'Sullivan, Cornelius B., Smith, Larry D., and Forehand, Douglas W.,
"Developing a Decoupling Methodology with SPICE for Multilayer Printed Circuit
Boards," 1998 IEEE EMC Symposium Record Volume Two, Denver, CO,
Aug. 24-28, 1998, pp. 652-655.
[1248] O'Sullivan, Cornelius, and Lee, Norman,
"Ground Starvation Effects on Multi-layer PCBs," IEEE International
Symposium on Electromagnetic Compatibility Symposium Record Volume One,
Washington, D.C., Aug. 21-25, 2000, pp. 113-116.
[1249] O'Sullivan, Cornelius B., and Musladin, Martin,
"Investigation of the effectiveness of DC power bus interplane capacitance in
reducing radiated EMI from multi-layer PCBs," IEEE 1997 International
Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 18-22,
1997, pp. 293-297.
[1250] Oberschmidt, James M., and Humenik, James N.,
"A Low Inductance Capacitor Technology," 1990 Proceedings 40th
Electronic Components Conference, Las Vegas, NV, May 20-23, 1990, pp.
284-288.
[1251] Obreja, Vasile V. N.,
"Advance in the Assembling and Packaging of Supercapacitor Modules for Higher
Performance," 2nd Electronics Systemintegration Technology Conference
, Greenwich, London, UK, Sept. 1-4, 2008, pp. 771-774.
[1252] Obrzut, J., and Nozaki, R.,
"Broadband Characterization of Dielectric Films for Power-Ground Decoupling,"
Proceedings of the 18th IEEE Instrumentation and Measurement Technology
Conference, Volume 2, Budapest, Hungary, May 21-23, 2001, pp.
1000-1004.
[1253] Obuszewski, Mark,
"Progress in Miniaturization of Tantalum Capacitors," SMT, vol.
12, no. 3, pp. 62-64, Mar. 1998.
[1254] Ogasahara, Yasuhiro, Hashimoto, Masanori, and Onoye, Takao,
"Dynamic Supply Noise Measurement with All Digital Gated Oscillator for
Evaluating Decoupling Capacitance Effect," Proceedings of the IEEE 2007
Custom Integrated Circuits Conference, San Jose, CA, Sept. 16-19, 2007,
pp. 783-786.
[1255] Oggini, Stefano, and Ravanelli, Roberto .,
"High Frequency Application," Wireless Design, pp. 43-46, Oct.
2000.
[1256] Ogihara, Nobuhiro, Igarashi, Yoshiyuki, Kamakura, Ayumu, Naoi, Katsuhiko,
Kusachi, Yuki, and Utsugi, Koji,
"Disordered carbon negative electrode for electrochemical capacitors and
high-rate batteries," Electrochimica Acta, vol. 52 no. 4, pp.
1713-1720, Dec. 1, 2006.
[1257] Okajima, Keiichi, Ohta, Keigo, and Sudoh, Masao,
"Capacitance behavior of activated carbon fibers with oxygen-plasma
treatment," Electrochimica Acta, vol. 50 no. 11, pp. 2227-2231,
Apr. 1, 2005.
[1258] Okajima, Keiichi, Ikeda, Atsushi, Kamoshita, Kazunori, and Sudoh, Masao,
"High rate performance of highly dispersed C60 on activated carbon capacitor,"
Electrochimica Acta, vol. 51 no. 5, pp. 972-977, Nov. 10, 2005.
[1258d] Okamatsu, Toshihiro, Nishimura, Hitoshi, Inoue, Noriyuki, Sano, Harunobu, and
Takagi, Hiroshi,
"The effect of rare earth (Ln = Gd, Dy, Y and Yb) doping on the microstructure
and reliability in BaTiO3-based monolithic ceramic capacitors (MLCs),"
Key Engineering Materials, vol. 421-422, pp. 301-304, 2010.
[1259] Okamoto, Akira,
"Unique Distributed Constant Circuit Filter Solves Many EMI Problems,"
JEE, vol. 29, no. 31, pp. 48-54, Nov. 1992.
[1260] Olalla, David, and Esteban, Freddy,
"Empowering the EMI Filtering Industry- Development of a Capacitor series up
to 45æF with X2 safety classification for high density filters,"
CARTS Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[1261] Olbrich, Peter,
"Advanced Coating Technology for Film Capacitor Applications,"
CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 217-224.
[1262] Olbrich, Peter,
"Advanced Coating Technology for Film Capacitor Applications,"
Proceedings of the 25th Symposium for Passive Components, Palm Springs,
CA, Mar. 21-24, 2005, pp. 249-260.
[1263] Olbrich, Peter,
"Innovative Solutions in Film Capacitor Vacuum Coating for advanced automotive
Applications," CARTS Asia 2006, Taipei, Taiwan, Oct. 9-11,
2006, pp. xx-xx.
[1264] Olivares-Marin, M., Fernandez, J. A., Lazaro, M. J., Fernandez-Gonzalez, C.,
Macias-Garcia, A., Gomez-Serrano, V., Stoeckli, F., and Centeno, T. A.,
"Cherry stones as precursor of activated carbons for supercapacitors,"
Materials Chemistry and Physics, vol. 114 no. 1, pp. 323-327, Mar. 15,
2009.
[1265] Olney, Andrew, Gifford, Brad, Guravage, John, and Righter, Alan,
"Real-world printed circuit board ESD failures," Microelectronics
Reliability, vol. 45 no. 2, pp. 287-295, Feb. 2005.
[1266] Olson, Leonard T., and Sloma, Richard R.,
"3D Software Analysis of Power Distribution Systems and Hardware Correlation,"
Proceedings of the 1983 International Microelectronics Symposium,
Philadelphia, PA, Oct. 31-Nov. 2, 1983, pp. 630-636.
[1267] Oouchi, Jiro, Igarashi, Chikara, and Itoh, Kenichi,
"Study of Noise Reduction by 3 Multiple Decouping Capacitors with Series
Resistors," 1999 International Symposium on Electromagnetic
Compatibility, Tokyo, Japan, May 17-21, 1999, pp. 232-235.
[1268] Oppeneer, Martien, Sumant, Prasad, and Cangellaris, Andreas C.,
"Robust Iterative Finite Element Solver for Multi-terminal Power Distribution
Network Resistance Extraction," 17th Topical Meeting on Electrical
Performance of Electronic Packaging, San Jose, CA, Oct. 27-29, 2008,
pp. 181-184.
[1269] Orhanovic, Neven, Divekar, Dileep, and Matsui, Norio,
"Structure Decomposition for Hybrid Analysis of Multilayer Interconnect
Systems."
[1270] Osawa, N., and Fukuoka, K.,
"Pit nucleation behavior of aluminium foil for electrolytic capacitors during
early stage of DC etching," Corrosion Science, vol. 42 no. 3, pp.
585-597, Mar. 1, 2000.
[1271] Ott, Henry W.,
"The Ten Most Common EMC Problems and Their Solutions," 2000 IEEE
International Symposium on Electromagnetic Compatibility Workshops and
Tutorials, Washington, D.C., Aug. 21-25, 2000, pp. 1-7.
[1272] Ou, Bin-Lung, Chen, Hsueh-Chi, and Shen, Chin-Hui,
"An Evaluation of the Capacitance of Aluminum Electrolytic Capacitor Foils
A.C. Etched in Hydrochloric Acid Electrolytes," Journal of the Chinese
Institute of Engineers, vol. 27 no. 2, pp. 293-298 Mar. 2004.
[1273] Ousten, Yves, Levrier, Bruno, Duchamp, Genevieve, and Kertesz, Philippe,
"Embedded Passive Components to Increase the Reliability of High Frequency
Electronic Circuits," CARTS-Europe 2006 Proceedings, Bad
Homburg, Germany, Sept. 25-28, 2006, pp. xx-xx.
[1274] Ousten, Yves, Levrier, Bruno, and Verdier, Frederic,
"Reliability Analysis of Ceramic Capacitors Under 200°C,"
CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 40-44.
[1275] Paik, Kyung-Wook, Hyun, Jin-Gul, Lee, Sangyong, and Jang, Kyung-Woon,
"Epoxy/BaTiO3 (SrTiO3) Composite Films and Pastes for High Dielectric Constant
and Low Tolerance Embedded Capacitors in Organic Substrates," 2006 Pan
Pacific Symposium Conference Proceedings, Hawaii, Jan. 17-19, 2006.
pp. xx-xx.
[1276] Paik, Kyung-Wook, Hyun, Jin-Gul, Lee, Sangyong, and Jang, Kyung-Woon,
"Epoxy/BaTiO3 (SrTiO3) Composite Films and Pastes For High Dielectric Constant
and Low Tolerance Embedded Capacitors in Organic Substrates," 1st
Electronics Systemintegration Technology Conference, Volume 2, Dresden,
Germany, Sept. 5-7, 2006, pp. 794-801.
[1277] Pakula, T.,
"Dielectric Relaxation Modeling in Complex Polymer Systems," IEEE
Transactions on Dielectrics and Electrical Insulation, vol. 8 no. 6,
pp. 936-941, Dec. 2001.
[1278] Pannala, Sreemala, Bandyopadhyay, Jaya, and Swaminathan, Madhavan,
"Contribution of Resonance to Ground Bounce in Lossy Thin Film Planes,"
IEEE Transactions on Advanced Packaging, vol. 22, no. 3, pp.
249-258, Aug. 1999.
[1279] Park, Hyun, and McBrayer, Doug,
"Base Metal Electrode (BME) Multilayer Ceramic Capacitors (MLCCs),"
Kemet TechTopics, vol. 7 no. 4, pp. 1-2, Nov. 1997.
[1280] Park, Hyunjeong, Kim, Hyungsoo, Kam, Dong Gun, and Kim, Joungho,
"Co-Modeling and Co-Simulation of Package and On-Chip Decoupling Capacitor for
Resonant Free Power/Ground Network Design," 2005 Proceedings 55th
Electronic Components & Technology Conference, Volume 1, Orlando,
FL, May 31-June 3, 2005, pp. 727-731.
[1281] Park, Jongbae, Lu, Albart Chee W., Fan, Wei, Wai, Lai L., Chua, Kai M., Shim,
Yujeong, and Kim, Joungho,
"The Scalable Modeling of Multi-layer Embedded Capacitor based on LTCC
Substrate," Proceedings 56th Electronic Components & Technology
Conference, San Diego, CA, May 30-June 2, 2006, pp. 1286-1289.
[1282] Park, Seong-Geun, Kim, JiSeong, Yook, Jong-Gwan, and Park, Han-Kyu,
"Multilayer Power Delivery Network Design for High-speed Microprocessor
System," 2003 Proceedings 53rd Electronic Components & Technology
Conference, New Orleans, LA, May 27-30, 2003, pp. 1613-1618.
[1283] Park, Sung-Cheol, and Park, Young-Bae,
"Effect of Ar+ Radiofrequency Plasma Treatment Conditions on the Interfacial
Adhesion Energy Between Atomic-Layer-Deposited Al2O3 and Cu Thin Films in
Embedded Capacitors," Journal of Electronic Materials, vol. 37
no. 10, pp. 1565-1573, Oct. 2008.
[1284] Park, Yun-Hwi, Oh, Kwangje, Kim, Ikseop, Chu, Hosung, Sung, Jehong, Yun,
Seokchul, and Kim, Jinwaun,
"Suppression of SSN by Embedded Decoupling Capacitor in LTCC Package,"
Journal of Microelectronics and Electronic Packaging, Vol. 4 no. 2,
pp. 57-63, Second Quarter 2007.
[1285] Parker, J. Lee,
"An Analytical Analysis of the Discharge of a Buried Sheet Capacitor Using a
LCR Analogy," IPC Printed Circuits Expo, APEX and the Designer Summit
, Anaheim, CA, Feb. 8-10, 2006, pp. S22-03-1-S22-03-8.
[1286] Parker, J. Lee,
"An Analytical Approach for the Design of Buried Capacitance PCBs," 2009
IPC Printed Circuits Expo, APEX & the Designers Summit Proceedings,
Las Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.
[1287] Parker, J. Lee,
"Buried CAPACITOR ANALYSIS," Printed Circuit Design and Manufacture
, vol. 23 no. 6, pp. 38-40, June 2006.
[1287d] Parker, J. Lee,
"Designing With Buried Capacitance," Printed Circuit Design and Fab
, vol. 26 no. 7, pp. 27-29, July 2009.
[1288] Parker, James C., Jr.,
"Via Coupling within Parallel Rectangular Planes." IEEE Transactions on
Electromagnetic Compatibility, vol. 39, no. 1, pp. 17-23, Feb 1997.
[1289] Parkerson, James Patrick, and Schaper, Leonard W.,
"A Design Methodology for the Interconnected Mesh Power System (IMPS) MCM
Technology," Proceedings of the 1995 International Electronics Packaging
Conference , San Diego, CA, Sept. 24-27, 1995, pp. 192-196.
[1290] Parkerson, James Patrick, and Schaper, Leonard W.,
"Advanced Interconnected Mesh Power System (IMPS) MCM Topologies,"
Proceedings 1996 IEEE Multi-Chip Module Conference, Santa Cruz,
CA, Feb. 6-7, 1996, pp. 123-126.
[1291] Patake, V. D., Joshi, S. S., Lokhande, C. D., and Joo, Oh-Shim,
"Electrodeposited porous and amorphous copper oxide film for application in
supercapacitor," Materials Chemistry and Physics, vol. 114 no. 1,
pp. 6-9, Mar. 15, 2009.
[1292] Patnam, Hanumantha Rao, Karunakaran, S., and Swaminathan, Madhavan,
"Compact Electromagnetic Bandgap Structure for Noise Suppression in Power
Plane," Electrical Design of Advanced Packaging and Systems Symposium
, Seoul, Korea, Dec. 10-12, 2008, pp. 13-15.
[1292d] Patsos, Alex,
"Select The Right Ultracapacitor Solution," Electronic Design
, vol. 57 no. 22, pp. 48-49, Oct. 22, 2009.
[1293] Pattavina, Jeffrey S.,
"Bypassing PC boards: Thumb your nose at rules of thumb,"
EDN, vol. 43, no. 22, pp. 149-158, Oct. 22, 1998.
[1294] Paul, Clayton R.,
"Effectiveness of Multiple Decoupling Capacitors," IEEE Transactions on
Electromagnetic Compatibility, vol. 34, no. 2, pp. 130-133, May
1992.
[1295] Paulsen, Jonathan L., and Reed, Erik K.,
"Highly Accelerated Lifetesting (HALT) of KEMET Base-Metal-Electrode (BME)
Ceramic Chip Capacitors," CARTS 2001 Proceedings, St.
Petersburg, FL, Mar. 26-30, 2001, pp. xx-xx.
[1296] Paulsen, Jonathan L.,
"Reliability Characterization of Tantalum Capacitors with MnO2
Counter-Electrode," CARTS-Europe 2006 Proceedings, Bad
Homburg, Germany, Sept. 25-28, 2006, pp. xx-xx.
[1297] Paulsen, Jonathan L., Reed, Erik K., and Kelly, Jeffrey N.,
"Reliability of Tantalum Polymer Capacitors," 24th Annual Capacitor
and Resistor Technology Symposium, San Antonio, TX, Mar. 29-Apr. 1,
2004, pp. xx-xx.
[1298] Paulsen, Jonathan L., Reed, Erik K., and Kelly, Jeffrey N.,
"Reliability of Tantalum Polymer Capacitors," CARTS-Europe 2004
, Nice, France, Oct. 18-21, 2004, pp. 33-39.
[1299] Payandehjoo, K., Kostka, D., and Abhari, R.,
"Analysis of Power Distribution Networks using Multiconductor Transmission
Line Theory," 2007 IEEE Electrical Performance of Electronic Packaging
, Atlanta, GA, Oct. 29-31, 2007, pp. 271-274.
[1300] Payne, D. A.,
"Concerning the Physics of Failure of Barium Titanate Capacitors," Sixth
Annual Reliability Physics Symposium, Los Angeles, CA, Nov. 6-8, 1967,
pp. 257-264.
[1301] Pease, Bob,
"What's All This Ground Noise Stuff, Anyhow?," Electronic Design
Analog Applications Issue, vol. 41, no. 13B, pp. 70-73, June 24, 1993.
[1302] Pease, Bob,
"What's All This Ground Noise Stuff, Anyhow?," Electronic Design
(Supplement), vol. 44, no. 17B, pp. 87-91.
[1303] Pease, Bob,
"What's All This Safety Margin Stuff, Anyhow?," Electronic Design
, vol. 55 no. 22, pp. 16, Oct. 11, 2007.
[1304] Pecharroman, Carlos, Esteban-Betegon, Fatima, Bartolome, Jose F.,
Lopez-Esteban, Sonia, and Moya, Jose S.,
"New Percolative BaTiO3-Ni Composites with a High and Frequency-Independent
Dielectric Constant (er = 80000)," Advanced Materials, vol.
13 no. 20, pp. 1541-1544, Oct. 2001.
[1305] Pederson, O., Flaten, B.-E., and Gleditsch, T.,
"Modelling of Power and Ground Planes," Circuit World, vol. 18
no. 3, pp. 30-33, 1992.
[1306] Peiffer, Joel S.,
"A Novel Embedded Cap Material," PC Fab, vol. 24, no. 2, pp.
48-52.
[1307] Peiffer, Joel, Greenlee, Bob, and Novak, Istvan,
"Electrical Performance Advantages of Ultra-Thin Dielectric Materials used for
Power-Ground Cores in High-Speed, Multilayer Printed Circuit Boards,"
IPC Expo 2003, Long Beach, CA, Mar. 25-27, 2003.
[1307d] Peiffer, Joel S.,
"Embedded Passives: Debut in Prime Time," Printed Circuit Design and Fab
, vol. 26 no. 10, pp. 24-28, Oct. 2009.
[1308] Peiffer, Joel S.,
"Embedded Passives Become Mainstream Technology, Finally!," 2009 IPC
Printed Circuits Expo, APEX & the Designers Summit Proceedings, Las
Vegas, NV, Mar. 31-Apr. 2, 2009, pp. xx-xx.
[1309] Peiffer, Joel S.,
"Ultra-Thin, Loaded Epoxy Materials for Use as Embedded Capacitor Layers,"
Proceedings 2003 International Symposium on Microelectronics
(Proceedings of SPIE - The International Society for Optical Engineering,
Volume 5288), Boston, MA, Nov. 18-20, 2003, pp. 178-182.
[1310] Pelcak, J., Vrana, B., and Zednicek, T.,
"Benchmark of Tantalum versus Ceramic Capacitors," Proceedings of
the 25th Symposium for Passive Components, Palm Springs, CA, Mar.
21-24, 2005, pp. 47-56.
[1311] Pelcak, J.,
"Equivalent Circuit Model for Tantalum and Niobium Oxide Capacitors for Use in
Simulation Software," 24th Annual Capacitor and Resistor Technology
Symposium, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. 204-209.
[1312] Pelcak, J.,
"Tantalum Capacitors Advanced to Mobile Phone Applications," CARTS
Asia 2006, Taipei, Taiwan, Oct. 9-11, 2006, pp. xx-xx.
[1312d] Peng, Bo, Lin, Fuchang, Li, Hua, Dai, Ling, Chen, Yaohong, and Han, Yongxia,
"Calculation of Electric Field in Safety Film Capacitors," IEEE
Transactions on Dielectrics and Electrical Insulation, vol. 16 no. 3,
pp. 882-886, June 2009.
[1313] Perez, Alberto, Esteban, Freddy, and Chandran, Suresh,
"High Temperature Film Capacitors for Automotive Application," 2006
CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[1314] Perez, Reinaldo,
"Proper Design of Bypass Capacitance in Wideband Operational Amplifiers,"
1998 IEEE EMC Symposium Record Volume One, Denver, CO, Aug.
24-28, 1998, pp. 608-613.
[1315] Permann, L., Latt, M., Leis, J., and Arulepp, M.,
"Electrical double layer characteristics of nanoporous carbon derived from
titanium carbide," Electrochimica Acta, vol. 51 no. 7,
pp. 1274-1281, Jan. 5, 2006.
[1316] Pesic, Miroslav, Jeremic, Zoran, Vujisic, Milos, and Osmokrovic, Predrag,
"Scaling Law Applicability to Oil-insulated Parallel-plate Capacitors,"
IEEE Transactions on Dielectrics and Electrical Insulation, vol. 14 no.
4, pp. 1002-1006, Aug. 2007.
[1317] Peterson, George W., Prince, John L., and Virga, Kathleen L.,
"Investigation of Power/Ground Plane Resonance Reduction Using Lumped RC
Elements," 2000 Proceedings 50th Electronic Components & Technology
Conference, Las Vegas, NV, May 21-24, 2000, pp. 769-774.
[1318] Pham, N., Cases, M., de Araujo, D. N., Mutnury, B., Matoglu, E., Herrman, B.,
and Patel, P.,
"Embedded Capacitor in Power Distribution Design of High-end Server Packages,"
Proceedings 56th Electronic Components & Technology Conference
, San Diego, CA, May 30-June 2, 2006, pp. 1677-1682.
[1319] Pham, Nam, and Cases, Moises,
"Decoupling Capacitors Techniques for High-Frequency Board Designs,"
DesignCon99 High-Performance System Design Conference, Santa Clara, CA,
Feb. 1-4, 1999, pp. 127-135.
[1320] Pham, Nam, Cases, Moises, de Araujo, Daniel, and Matoglu, Erdem,
"Design Methodology for Multiple Domain Power Distribution Systems,"
54th Electronic Components & Technology Conference, Volume 1, Las
Vegas, NV, June 1-4, 2004, pp. 542-539.
[1321] Pham, Nam, Cases, Moises, Hinedi, Fahd, Singh, Bhupindra, and Saunders,
Tim,
"System Board Power Distribution Guidelines for PID9q-604e(TM)," IBM
Application Note AN-022, Sept. 1997.
[1321d] Pierrat, Lambert, Montanari, G.,C., Mazzanti, G., and Cacciari, M.,
"Weibull Statistics in Short-term Dielectric Breakdown of Thin Polyethylene
Films [comments and reply]," IEEE Transactions on Dielectrics and
Electrical Insulation, vol. 2 no. 2, pp. 321-326, Apr. 1995.
[1322] Pinceloup, Pascal, Randall, Michael, and Gurav, Abhijit,
"BME-C0G MLCC with Nickel Electrodes and the Role of Mn in CaZrO3-Based
Dielectric," 2006 CARTS Conference Proceedings, Orlando, FL,
Apr. 3-6, 2006, pp. xx-xx.
[1323] Pinello, W. P., Patel, PR, and Li, Y. L.,
"System-Level I/O Power Modeling," ISMA Conference, Nov. 2000.
[1323d] Piper, J., Prymak, J. D., and Stair, Phil (F. L.),
"ESD Withstand Capability of Multilayer Ceramic Capacitors (MLCs),"
Kemet TechTopics, vol. 5 no. 3, pp. 1-4, June 1995.
[1324] Plante, Joan,
"Low Voltage Power Electronics 2001," Power 2001, pp. 32-42.
[1325] Poble, J. F., and Mayoux, C.,
"High Pressure and Thermo Depolarization Currents for the Study of Low Voltage
Capacitors," Proceedings of the Twenty-First Symposium on Electrical
Insulating Materials, Tokyo, Japan, Sept. 26-28, 1995, pp. 49-53.
[1326] Polka, Lesley, Chickamenahalli, Shamala, Chung, Chee-Yee, Figueroa,
David G., Li, Yuan-Liang, Merley, Kim, Wood, Dustin, and Zu, Larry,
"Package-Level Interconnect Design for Optimum Electrical Performance,"
Intel Technology Journal, Q3, 2000, pp. 1-17.
[1327] Pollock, Christine E., Petkova, Maria M., and Devoe, Alan D.,
"COTS Reliability - All COTS Devices Are Not Created Equal," 2006
CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[1327d] Pollock, Katherine L., and Hodgkins, Charles E.,
"Fracture Strength of Multilayer Ceramic Capacitors," Proceedings of the
1984 International Symposium on Microelectronics, Dallas, TX, Sept.
17-19, 1984, pp. 450-456.
[1327h] Polotai, A. V., Shay, D. P., Yang, G.-Y., Dickey, E. C., and Randall, C. A.,
"Stability of Ni Electrodes and Ni-BaTiO3 Interface Evolution in Ultrathin BME
MLCCs," 17th IEEE International Symposium on the Applications of
Ferroelectrics, Volume 1, Santa Fe, NM, Feb, 23-28, 2008, pp. xx-xx.
[1327l] Popall, M., Andrei, M., Kappel, J., Kron, J., Olma, K., and Olsowski, B.,
"ORMOCERs as inorganic-organic electrolytes for new solid state lithium
batteries and supercapacitors," Electrochimica Acta, vol. 43 no.
10-11, pp. 1155-1161, 1998.
[1328] Popovich, Mikhai, and Friedman, Eby G.,
"Decoupling Capacitors for Multi-Voltage Power Distribution Systems,"
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol.
14 no. 3, pp. 217-228, Mar. 2006.
[1329] Popovich, Mikhail, and Friedman, Eby G.,
"Noise Aware Decoupling Capacitors for Multi-Voltage Power Distribution
Systems," Sixth International Symposium on Quality of Electronic Design
, San Jose, CA, Mar. 21-23, pp. 334-339.
[1330] Popovich, Mikhail, and Friedman, Eby G.,
"Noise Coupling in Multi-Voltage Power Distribution Systems with Decoupling
Capacitors," IEEE International Symposium on Circuits and Systems,
Volume 1, Kobe, Japan, May 23-26, 2005, pp. 620-623.
[1331] Portet, C., Taberna, P. L., Simon, P., Flahaut, E., and Laberty-Robert, C.,
"high power density electrodes for Carbon supercapacitor applications,"
Electrochimica Acta, vol. 50 no. 20, pp. 4174-4181, July 25, 2005.
[1332] Post, H. A., Tempelman, G., van Zijtveld, M.,
"Aluminum Capacitor Anode Foils for Miniaturized Applications,"
CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007,
pp. 239-244.
[1333] Post, H. A., Tempelman, G., and van Zijtveld, M.,
"Aluminum Capacitor Anode Foils for Miniaturized Applications,"
CARTS Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[1334] Post, H. A., Lipnig, M., Stuefler, S., and Wieser, F.,
"Aluminum Capacitors for Automotive High Temperature Applications,"
24th Annual Capacitor and Resistor Technology Symposium, San Antonio,
TX, Mar. 29-Apr. 1, 2004, pp. 192-196.
[1335] Post, H. A., Meinema, W., and Rekers, D.,
"Aluminum Capacitors for Automotive High Temperature Applications,"
CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 116-120.
[1336] Post, H. A., Meinema, W., and Rekers, D.,
"Aluminum Capacitors for Automotive High Temperature Applications,"
Proceedings of the 25th Symposium for Passive Components, Palm Springs,
CA, Mar. 21-24, 2005, pp. 65-70.
[1337] Pothier, Charles,
"Tantalum capacitors for military apps," Electronic Products,
vol. 51 no. 2, pp. 75-76, July 2008.
[1337d] Potts, Henry,
"Managing Power, A Business Perspective," Printed Circuit Design and
Fab, vol. 26 no. 4, pp. xx-xx, Apr. 2009.
[1338] Prevallet, M., Bagdy, S., Prymak, J., and Randall, M.,
"High Voltage Considerations with MLCs," Proceedings of the 26th
International Power Modulator Symposium and 2004 High Voltage Workshop,
San Francisco, CA, May 23-26, 2004, pp. xx-xx.
[1339] Price, Ken,
"Probing Concerns Influence High-Speed Measurements," Microwaves &
RF, vol. 38, no. 1, pp. 69-77, Jan. 1999.
[1340] Price, Rick,
"High-speed Circuit Decoupling with Low Impedance, Polymer-based
Capacitors," ITW Paktron.
[1341] Prime, D., Paul, S., Josephs-Franks, P. W.,
"Electrical Properties of Nanometre Thin Film Polystyrene for Organic
Electronic Applications," IEEE Transactions on Dielectrics and
Electrical Insulation, vol. 15 no. 4, pp. 905-909, Aug. 2008.
[1342] Prinsloo, J. J. R., van Wyk, J. D., Swanepoel, R., Holm, M. F. K.,
and Campbell, C. K.,
"Manufacture, Behavior and Modelling of BaTiO3 Nonlinear Ceramic Disc
Capacitors for High-Voltage Applications," 1992 Proceedings 42nd
Electronic Components & Technology Conference, San Diego, CA, May
18-20, 1992, pp. 667-672.
[1343] Prophet, Graham,
"Supercaps for supercaches," EDN, vol. 48, no. 1, pp. 53-58,
Jan. 9, 2003.
[1343d] Prume, Klaus, and Waser, Rainer,
"Finite-Element Simulation of Coupled Characteristics of Ceramic Multilayer
Capacitors Under Transient Electrical Loading," Proceedings of the 2000
12th IEEE International Symposium on Applications of Ferroelectrics, Volume 2
, Honolulu, HI, July 21-Aug. 2, 2000, pp. 675-678.
[1344] Prymak, John D.,
"A Theory on Reverse Voltage Failures in SMT Tantalum/Electrolytic
Capacitors," CARTS 2002 Proceedings, New Orleans, LA, Mar.
25-29, 2002, pp. xx-xx.
[1345] Prymak, John D.,
"Advanced Decoupling Using Ceramic MLC Capacitors," 1990 Proceedings
40th Electronic Components & Technology Conference , Las Vegas, NV,
May 20-23, 1990, pp. 1014-1023.
[1346] Prymak, John,
"Ceramic Multilayer Capacitors in HF SMPS Applications."
[1347] Prymak, John, and Lai, Ken,
"Conductive Polymer Capacitors for Lead Free Processing (260°C)."
Arrow Asia Times, July 2005.
[1348] Prymak, John D.,
"Conductive Polymer Cathodes - the Latest Step in Declining ESR in Tantalum
Capacitors," Fifteenth Annual IEEE Applied Power Electronics Conference
and Exposition APEC 2000, Volume 2,New Orleans, LA, Feb. 6-10, 2000,
pp. 661-667.
[1349] Prymak, John, Reed, Erik, Randall, Michael, Blais, Peter, and Long, Bill,
"Decoupling Solutions," CARTS USA 2008 Proceedings, Newport
Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[1350] Prymak, John D.,
"Derating Differences in Tantalum-MnO2 vs. Tantalum-Polymer vs. Aluminum
Polymer," CARTS USA 2003 Proceedings, Mar. 31-Apr. 3, 2003,
pp. xx-xx.
[1351] Prymak, John D., Staubli, Paul, and Prevallet, Mike,
"Derating Review of Ta-MnO2 vs. Ta-Polymer vs. Al-Polymer vs. NbO-MnO2,"
CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. xx-xx.
[1351d] Prymak, J. D., Piper, J., and Stair, F. L.,
"ESD Susceptibility of Ceramic Multilayer Capacitors," 1996 CARTS
Conference, 1996, pp. xx-xx.
[1352] Prymak, Johnm Reed, Erik, and Mayar, Allen,
"Facedown Low Inductance Solder Pad and Via Schemes," KEMET Update
, Aug. 8, 2008.
[1353] Prymak, John, Staubli, Paul, and Prevallet, Mike,
"Facedown Termination Allows Higher C/V and Lower ESL for SMT
Conductive-Polymer Capacitors," Proceedings CARTS Asia 2005,
Taipei, Taiwan, Oct. 11-13, 2005, pp. 129-134.
[1354] Prymak, John, Staubli, Paul, and Prevallet, Mike,
"Facedown Termination Allows Higher C/V and Lower ESL for SMT
Conductive-Polymer Capacitors," Proceedings of CARTS-Europe 2005
, Prague, Czech Republic, Oct. 17-20, 2005, pp. 3-8.
[1355] Prymak, John, Blais, Peter, and Long, Bill,
"Facedown Terminations Improve Ripple Current Capability," CARTS
2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp.
89-96.
[1356] Prymak, John, Antoniades, Corey, Blais, Peter, Hill, Allen, Lai, Ken, Laps,
Mark, Lynn, Kevin, Phillips, Reggie, Riedl, Cory, Schmidt, Axel, Sloka, Bill,
and Staubli, Paul,
"Flexible Termination - Reliability in Stringent Environments,"
CARTS USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp.
xx-xx.
[1357] Prymak, John, Blais, Peter, Long, Bill, and Staubli, Paul,
"Improved Ripple Current Capacity with Facedown Terminations," CARTS
Europe 2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[1358] Prymak, John D.,
"Improvements with Polymer Cathodes in Aluminum and Tantalum Capacitors,"
Sixteenth Annual IEEE Applied Power Electronics Conference and
Exposition APEC 2001, Volume 2, Anaheim, CA, Mar. 4-8, 2001, pp.
1210-1218.
[1359] Prymak, John, and Chen, Edward,
"Lower, Thinner SMT Polymer Capacitors," Arrow Asia Times,
Apr. 2004.
[1360] Prymak, John, Prevallet, Mike, Blais, Peter, and Long, Bill,
"New Improvements in Flex Capabilities for MLC Chip Capacitors,"
2006 CARTS Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp.
xx-xx.
[1361] Prymak, John, and Lai, Ken,
"New Products Being Developed for Flex Crack Reduction and Elimination,"
Arrow Asia Times, Sept. 2005.
[1362] Prymak, John,
"New SPICE Models," Kemet TechTopics, vol. 8 no. 2, pp. 1-2,
July 1998.
[1363] Prymak, John D.,
"New Tantalum Capacitors in Power Supply Applications," Conference
Record of the 1998 IEEE Industry Applications Conference, Thirty-Third IAS
Annual Meeting, Volume 2, St. Louis, MO, Oct. 12-15, 1998, pp.
1129-1137.
[1364] Prymak, John D.,
"PE Series Capacitors Decoupling and/or Filtering."
[1365] Prymak, John,
"Piezoelectric Effects Ceramic Chip Capacitors," Arrow Asia Times
, 2006.
[1366] Prymak, John D.,
"Power-On Failures in Tantalum and Aluminum SMT Capacitors," CARTS
2002 Proceedings, New Orleans, LA, Mar. 25-29, 2002, pp. xx-xx.
[1367] Prymak, John,
"Product Update - Ceramic Fail-Open for Flex-Cracks," KEMET, July 7, 2004.
[1368] Prymak, John D., Prevallet, Mike, and Staubli, Paul,
"Proofing Tantalum Capacitors and Effects on Reliability,"
Proceedings of CARTS-Europe 2005, Prague, Czech Republic, Oct. 17-20,
2005, pp. 171-178.
[1369] Prymak, John,
"Replacing MnO2 with Conductive Polymer in Solid Tantalum Capacitors,"
19th Annual Capacitor and Resistor Technology Symposium, New
Orleans, LA, Mar. 1999, pp. xx-xx.
[1370] Prymak, John D.,
"Replacing MnO2 with Conductive Polymer in Tantalum Capacitors,"
CARTS-Europe '99, Lisbon, Portugal, Oct. 18-22, 1999, pp. xx-xx.
[1371] Prymak, John,
"Replacing MnO2 with Conductive Polymer in Tantalum Capacitors," Kemet
F2116, Dec. 2004.
[1372] Prymak, John D., and Prevallet, Mike,
"Scintillation Testing of Solid Electrolyte Capacitors," 2006 CARTS
Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[1373] Prymak, John, Staubli, Paul, Blais, Peter, and Long, Bill,
"Scintillation Testing Reveals Self-Healing in Solid Electrolytic Capacitors,"
CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept.
25-28, 2006, pp. xx-xx.
[1374] Prymak, John, Staubli, Paul, Blais, Peter, and Long, Bill,
"Self-Healing Captured as Scintillations in Solid Electrolytic Capacitors,"
CARTS Asia 2006, Taipei, Taiwan, Oct. 9-11, 2006, pp. xx-xx.
[1375] Prymak, John D.,
"Software for Calculating the Power Capability for MLC Ceramic
Capacitors."
[1376] Prymak, John D.,
"SPICE Modeling of Capacitors," Proceedings of the 15th Capacitor
and Resistor Technical Symposium, San Diego, CA, Mar. 13-16, 1995, pp.
xx-xx.
[1377] Prymak, John D.,
"Tantalum Capacitors in Power Supply Applications," 1998 PCIM
Conference, Japan, 1998, pp. xx-xx.
[1378] Prymak, John,
"Tantalum in Power Supply Applications," Kemet F2115, Dec. 2004.
[1379] Prymak, John D.,
"Technical Update - Comparison of Ceramic and Tantalum Capacitors,"
Kemet Update, Nov. 2008.
[1380] Prymak, John, Ashburn, Travis, and Lai, Ken,
"Voltage Coefficients Rob Capacitance," Arrow Asian Times,
Jan. 2006.
[1381] Prymak, John, Randall, Mike, Blais, Peter, and Long, Bill,
"Why that 47 uF capacitor drops to 37 uF, 30 uF, or lower," CARTS
USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[1382] Puczek, Dave,
"How To Control Fabrication Of Pwbs with Embedded Passive and Active Devices
Using the Flake on Film Process," 2008 IPC Midwest Show Proceedings
, Schaumburg, IL, Sept. 23-24, 2008, pp. xx-xx.
[1383] Pulliam, Wayne,
"Designing with BGAs," Printed Circuit Design, vol. 19, no. 3,
pp. 30-34, Mar. 2002.
[1384] Puppolo, Henry F., and Markarian, Mark,
"Stacked-Foil Capacitor Packaging Improvements and Technology," 25th
Electronic Components Conference, Washington, D. C., May 12-14, 1975,
pp. 110-114.
[1385] Qi, Lai, Lee, Burtrand I., Samuels, William D., Exarhos, Gregory J., and
Parler Jr., Sam G.,
"Three-Phase Percolative Silver-BaTiO3-Epoxy Nanocomposites with High
Dielectric Constants," Journal of Applied Polymer Science, vol.
102 no. 2, pp. 967-971, Oct. 15, 2006.
[1386] Qi, Xiaoguang, and Boggs, Steven,
"Analysis of the Effects of End Connection Quality on the Dielectric Loss of
Metallized Film Capacitors," IEEE Transactions on Dielectrics and
Electrical Insulation, vol. 11 no. 6, pp. 990-994, Dec. 2004.
[1387] Qi, Xiaoguang, Ronzello, JoAnne, and Boggs, Steven,
"Dielectric Properties, of Metallized Paper-film Capacitors," IEEE
Transactions on Dielectrics and Electrical Insulation, vol. 12 no. 6,
pp. 1235-1240, Dec. 2005.
[1388] Qu, Deyang,
"The study of the proton diffusion process in the porous MnO2 electrode,"
Electrochimica Acta, vol. 49 no. 4, pp. 657-665, Feb. 15, 2004.
[1389] Quinn, H.,
"Plating of multilayer ceramic capacitor termination - old technology in a new
application," Transactions of the Institute of Metal Finishing,
vol. 67 no. 1, pp. 18-20, Feb. 1989.
[1390] Quint, David, and Keen, Charles,
"Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 1,"
Printed Circuit Design and Fab, vol. 25 no. 7, pp. 28-31,
July 2008.
[1391] Quint, David, and Keen, Charles,
"Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2,"
Printed Circuit Design and Fab, vol. 25 no. 8, pp. 28-30,
Aug. 2008.
[1392] Radhakrishnan, Kaladhar, Li, Yuan-Liang, and Pinello, William P.,
"Integrated Modeling Methodology for Core and I/O Power Delivery."
[1393] Radu, S., DuBroff, R. E., Hubing, T. H., and Van Doren, T. P.,
"Designing Power Bus Decoupling for CMOS Devices," 1998 IEEE EMC
Symposium Record Volume One, Denver, CO, Aug. 24-28, 1998, pp.
375-380.
[1394] Radu, S., Zeeff, T., Nuebel, J., Drewniak, J. L., Van Doren, T. P.,
and Hubing, T. H.,
"An Impact of Layer Stack-up on EMI," 1998 IEEE EMC Symposium,
Denver, CO, Aug. 24-28, 1998, pp. 828-833.
[1395] Raghuveer, Rohit, Burkett, Susan L., Schaper, Leonard W., Ulrich, Richard K.,
Geil, Robert, and Rogers, Bridget,
"Dual Process Dielectric Formation for Decoupling Capacitors on Flexible
Substrates," 2005 Proceedings 55th Electronic Components &
Technology Conference, Volume 2, Orlando, FL, May 31-June 3, 2005, pp.
1569-1573.
[1396] Raghuveer, Rohit, Burkett, Susan L., Schaper, Leonard W., Ulrich, Richard K.,
Rogers, Bridget R., and Geil, Robert D.,
"Dual Process Dielectric Formation for Decoupling Capacitors on Flexible
Substrates," IEEE Transactions on Components and Packaging Technologies
, vol. 30 no. 4, pp. 579-584, Dec. 2007.
[1397] Rahal-Arabi, Tawfik, Taylor, Greg, Ma, Matthew, Jones, Jeff, and Webb,
Clair,
"Design and Validation of the Core and IOs decoupling of the Pentium(R) III
and Pentium(R) 4 Processors," Digest of 11th IEEE Topical Meeting on
Electrical Performance of Electronic Packaging, Monterey, CA, Oct.
21-23, 2002, pp. 249-252.
[1398] Rahal-Arabi, Tawfik, Taylor, Greg, Ma, Matthew, and Webb, Clair,
"Design and Validation of the Pentium(R) III and Pentium(R) 4 Processors Power
Delivery," 2002 Symposium on VLSI Circuits Digest of Technical
Papers, Honolulu, HA, June 13-15, 2002, pp. 220-223.
[1399] Rahal-Arabi, Tawfik, Ji, Gang, and Taylor, Greg,
"Impact of on-die Decoupling on the Core and IO Supplies of High Performance
Microprocessors," Proceedings 9th IEEE Workshop on Signal Propagation on
Interconnects, Garmisch-Partenkirchen, Germany, May 10-13, 2005, pp.
31-34.
[1400] Raj, P. Markondeya, Balaraman, Devarajan, Govind, Vinu, Wan, Lixi, Abothu,
Robin, Gerhardt, Rosario, Bhattacharya, Swapan, Swaminathan, Madhavan, and
Tummala, Rao,
"High Frequency Characteristics of Nanocomposite Thin Film "Supercapacitors"
and their Suitability for Embedded Decoupling," 2004 6th International
Conference on Electronic Packaging Technology, Singapore, Dec. 8-10,
2004, pp. 154-161.
[1401] Raj, P. Markondeya, Balaraman, Devarajan, Abothu, Isaac Robin, Yoon, Chong,
Kang, Nam-Kee, and Tummala, Rao,
"Integrating High-k Ceramic Thin Film Capacitors into Organic Substrates Via
Low-Cost Solution Processing," IEEE Transactions on Components and
Packaging Technologies, vol. 30 no. 4, pp. 585-594, Dec. 2007.
[1402] Raj, P. Markondeya, Hwang, Jin-Hyun, Jung, Hyung-Mi, Kumar, Manish, Jha,
Gopal, Coulter, Kent, Wellinghoff, Steve, Iyer, Mahadevan, and Tummala, Rao,
"Low Temperature (<100°C) Deposited Pyrochlore Films with High Capacitance
(200 nF/cm2), Low Loss (<0.003) and Low TCF (<100 ppm/C) for Integrating RF
Components," 2008 Proceedings 58th Electronic Components &,
Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp.
688-693.
[1403] Raj, P. Markondeya, Balaraman, Devarajan, Govind, Vinu, Abothu, Isaac Robin,
Wan, Lixi, Gerhardt, Rosario, Swaminathan, Madhavan, and Tummala, Rao,
"Processing and Dielectric Properties of Nanocomposite Thin Film
"Supercapacitors" for High-Frequency Embedded Decoupling," IEEE
Transactions on Components and Packaging Technologies, vol. 30 no. 4,
pp. 569-578, Dec. 2007.
[1403d] Ramajo, L., Castro, M. S., and Reboredo, M. M.,
"Dielectric response of Ag/BaTiO3/epoxy nanocomposites," Journal of
Materials Science, vol. 45 no. 1, pp. 106-111, Jan. 2010.
[1404] Randall, Michael S., Blais, Peter, Prymak, John, Prevallet, Mike, Skamser,
Dan, Gurav, Abhijit, Pinceloup, Pascal, Xu, Xilin, Tajuddin, Aziz, Lessner,
Philip, and Ashburn, Travis,
"Capacitor Considerations for Power Management," 2006 CARTS
Conference Proceedings, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[1405] Randall, Michael, Prymak, John, Laps, Mark, Renner, Garry, Blais, Peter,
Staubli, Paul, and Tajuddin, Aziz,
"D-Pack 3D Interposer Decoupling System," CARTS Asia 2007
Proceedings, Taipei, Taiwan, Oct. 9-13, 2007, pp. xx-xx.
[1406] Randall, Michael, Prymak, John, Laps, Mark, Renner, Garry, Blais, Peter,
Staubli, Paul, and Tajuddin, Aziz,
"D-Pack 3D Interposer Decoupling System," CARTS Europe 2007,
Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[1407] Randall, Michael, Sloka, Bill, Laps, Mark, Renner, Garry, Prymak, John, Blais,
Peter, and Tajuddin, Aziz,
"Decoupling Solutions," CARTS 2007 Symposium Proceedings,
Albuquerque, NM, Mar. 26-29, 2007, pp. 217-232.
[1408] Randall, Michael S., Gurav, Abhijit S., Skamser, Daniel J., and Beeson, James
J.,
"Lifetime Modeling of Sub 2 Micron Dielectric Thickness BME MLCC,"
CARTS USA 2003 Proceedings, Mar. 31-Apr. 3, 2003, pp. xx-xx.
[1409] Randall, Michael, Kinard, Tony, Qazi, Javaid, Hahn, Randy, and Lessner,
Philip,
"The Battle for Maximum Volumetric Efficiency - Part 2: Advancements in Solid
Electrolyte Capacitors," CARTS Europe 2007, Barcelona, Spain,
Oct. 29-Nov. 1, 2007, pp. xx-xx.
[1410] Randall, Michael, Skamser, Dan, Kinard, Tony, Qazi, Javaid, and Tajuddin,
Aziz,
"Thin Film MLCC," CARTS 2007 Symposium Proceedings,
Albuquerque, NM, Mar. 26-29, 2007, pp. 403-415.
[1411] Rao, Vang, Tang, Ke, and Wong, C. P.,
"A Study on Epoxy-Based High K Composite for Embedded Capacitor with Silver
Fillers Coated Self Assembly Monolayer Insulating Materials," 2003
Proceedings 53rd Electronic Components & Technology Conference, New
Orleans, LA, May 27-30, 2003, pp. 1820-1822.
[1412] Rao, Yang, and Wong, C. P.,
"Novel Ultra-high Dielectric Constant Polymer Based Composite Development for
Embedded Capacitor Application," Proceedings of 4th Electronics
Packaging Technology Conference, Singapore, Dec. 10-12, 2002, pp.
65-69.
[1413] Raper, Tim, and Knauber, Steve,
"Designing for Electromagnetic Interference (EMI) Compliance," AMD
Application Note 22507, Mar. 1999.
[1414] Rasul, Amjad, Croswell, Robert, Savic, John, and Takoudis, Christos,
"Solution Processed High Capacitance Nanocomposite Dielectric for Printed
Electronics Applications," IPC Printed Circuits Expo, APEX and the
Designer Summit, Anaheim, CA, Feb. 8-10, 2006, pp. S22-01-1-S22-01-6.
[1415] Rawal, B. S., and Chan, N. H.,
"Conduction and Failure Mechanisms in Barium Titanate Based Ceramics Under
Highly Accelerated Conditions," AVX.
[1416] Rawal, Bharat S.,
"Parameters Important for Surface Mount Applications of Multilayer Ceramic
Capacitors," AVX.
[1417] Rawlings, Gary D.,
"New Family of Conductive Polymers For Solid Electrolyte Aluminum Capacitors,"
CARTS Asia 2006, Taipei, Taiwan, Oct. 9-11, 2006, pp. xx-xx.
[1417d] Reed, C. W., and Cichanowski, S. W.,
"The Fundamentals of Aging in HV Polymer-film Capacitors," IEEE
Transactions on Dielectrics and Electrical Insulation, vol. 1 no. 5,
pp. 904-922, Oct. 1994.
[1418] Reed, Erik,
"How to Measure Low-ESL Tantalum Polymer Capacitors," CARTS USA 2009
Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[1419] Reed, Erik K., and Paulsen, Jonathan L.,
"Impact of Circuit Resistance on the Breakdown Voltage of Tantalum Chip
Capacitors," CARTS 2001 Proceedings, St. Petersburg, FL, Mar.
26-30, 2001, pp. 150-156.
[1420] Reed, Erik K., and Paulsen, Jonathan L.,
"Measuring the Power Dissipation Capacity of High-Voltage, Low-Capacitance
Ceramic Chip Capacitors," Proceedings of the 25th Symposium for
Passive Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 157-166.
[1421] Reed, Erik,
"New Ripple Current Guidelines for Very Low ESR Tantalum Capacitors,"
24th Annual Capacitor and Resistor Technology Symposium, San
Antonio, TX, Mar. 29-Apr. 1, 2004, pp. xx-xx.
[1422] Reed, Erik K., Kelly, Jeffrey N., and Paulsen, Jonathan L.,
"Reliability of Low-Voltage Tantalum Polymer Capacitors,"
Proceedings of the 25th Symposium for Passive Components, Palm Springs,
CA, Mar. 21-24, 2005, pp. 189-198.
[1423] Reed, Erik K., and Marshall, Jim C.,
"Rock Solid and Under 10 mohm New Heat and Moisture-Stable, Low-ESR Tantalum
Chip Capacitors," CARTS USA 2000 Proceedings, Huntington
Beach, CA, Mar. 6-10, 2000, pp. xx-xx.
[1424] Reed, Erik K.,
"Tantalum Chip Capacitor Reliability in High Surge and Ripple Current
Applications," 1994 Proceedings 44th Electronic Components &
Technology Conference, Washington, D. C., May 1-4, 1994, pp. 861-868.
[1425] Reed, Erik,
"The Growing Importance of Inductance in Tantalum Capacitors," CARTS
USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[1426] Remski, Richard,
"Analysis of PCB Power/Ground Plane Decoupling with new Solver Technology,"
Proceedings 2002 International Symposium on Microelectronics
(Proceedings of SPIE - The International Society for Optical Engineering,
Volume 4931), Denver, CO, Sept. 4-6, 2002, pp. 903-908.
[1427] Ren, Kening, Wu, Chang-Yu, and Zhang, Lin-Chang,
"The Restriction on Delta-I Noise along the Power/Ground Layer in the
Highspeed Digital Printed Circuit Board," 1998 IEEE EMC Symposium Record
Volume One, Denver, CO, Aug. 24-28, 1998, pp. 511-516.
[1428] Renauer, Joseph G.,
"Challenges in Powering High Performance Low Voltage Processors,"
Proceedings of the Eleventh Annual Applied Power Electronics Conference
and Exposition, San Jose, CA, Mar. 3-7, 1996, pp. 977-983.
[1429] Reynolds, Chris,
"Audio coupling with niobium oxide capacitors," Electronic Products
, vol. 51 no. 5, pp. 47-48, Oct. 2008.
[1429d] Reynolds, Chris,
"Improving Signal to Noise Ratios in Defense Electronics,"
Microwave Product Digest, May 2009, pp. 86,88,90,92.
[1430] Reynolds, Chris,
"Low ESR tantalum capacitors for radar applications," Defense
Electronics, vol. xx no. xx, pp. 10-13, Aug. 2007.
[1431] Reynolds, Chris,
"New RF Passive Discrete and Integrated Technologies Combining Ultra-Stable
Performance and Smallest Size," CARTS 2007 Symposium Proceedings
, Albuquerque, NM, Mar. 26-29, 2007, pp. 381-391.
[1431d] Reynolds, Chris C.,
"Proton Polymer: The Key To Double-Layer Supercaps For High-Voltage
Applications," Electronic Design, vol. 57 no. 10, pp.
45,47-48, May 21, 2009.
[1432] Reynolds, Chris,
"Selecting NbO capacitors," Electronic Products, vol. 50 no.
5, pp. 77-78, Oct. 2007.
[1433] Reynolds, Chris, and Brunette, Brian,
"Tantalum Chip for Mission Critical Applications - The Development of
Established Reliability Versions of Low ESR and Failsafe Technologies,"
CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29,
2007, pp. 269-276.
[1434] Rhoades, G. E., and Smith, A. W. H.,
"Expected Life of Capacitors with Non-Solid Electrolyte," 34th
Electronic Components Conference , New Orleans, LA, May 14-16, 1984,
pp. 156-161.
[1435] Ricchiuti, V., Orlandi, A., and Antonini, G.,
"Buried Capacitance Technology for Power Bus Decoupling on High Speed Digital
PCB's," Electromagnetic Compatibility 2001, Zurich, Switzerland,
Feb. 20-22, 2001, pp. 697-700.
[1436] Ricchiuti, Vittorio,
"Power Bus Signal Integrity Improvement and EMI Mitigation on Multilayer
High-Speed Digital PCBs with Embedded Capacitance," IEEE Transactions on
Mobile Computing, vol. 2, no. 4, pp. 314-321, Oct.-Dec. 2003.
[1437] Ricchiuti, Vittorio,
"Power-Supply Decoupling on Fully Populated High-Speed Digital PCBs,"
IEEE Transactions on Electromagnetic Compatibility, vol. 43, no.
4, pp. 671-676, Nov. 2001.
[1438] Ricchiuti, Vittorio,
"Simplified Evaluation of Power Bus Resonances on Fully Populated High Speed
Digital PCBs," Proceedings of 2002 IEEE International Symposium on
Industrial Electronics, L'Aquila, Italy, July 8-11, 2002, pp.
1376-1381.
[1439] Ritchey, Lee,
"Demystifying Component Selection," Printed Circuit Design, vol.
19, no. 1, pp. 10-14, Jan. 2002.
[1440] Ritchey, Lee,
"Vcc and Ground Bounce in Planes and IC Packages," Feb. 11, 2003.
[1441] Ritenour, Thurman J. (Bill), and Grasso, Charles (Chas),
"Power Distribution System Decoupling- "how 'bout them vias?"," Jan. 23,
2003.
[1442] Ritenour, Thurman J.,
"Stopping Noise Before It Starts," Medical Electronics Manufacturing, Fall
1998.
[1443] Ritenour, Thurman J. (Bill),
"Where the Noise Starts - PWB Design -," Jan. 24, 2000.
[1444] Rius, Josep, and Meijer, Maurice,
"A High-Frequency Nonquasi-Static Analytical Model Including Gate Leakage
Effects for On-Chip Decoupling Capacitors," IEEE Transactions on
Advanced Packaging, vol. 29 no. 1, pp. 88-97, Feb. 2006.
[1445] Robert, R., and Berleze, S. M.,
"Integro-Differential Equation of Absorptive Capacitors," IEEE
Transactions on Dielectrics and Electrical Insulation, vol. 8 no. 2,
pp. 244-247, Apr. 2001.
[1446] Rogers, Philip,
"Board layout boosts power-supply performance," EDN.
[1447] Rosser, Steven G., Kerr, Michael K., Chang, Chi Shih, Fang, Jiayuan,
Chen, Zhaoqing, and Chen, Yuzhe,
"Measurement and Simulation of Simultaneous Switching Noise in the
Multi-Reference Plane Package," 1996 Proceedings 46th Electronic
Components & Technology Conference, Orlando, FL, May 28-31, 1996,
pp. 660-670.
[1448] Rowe, Martin,
"Scan for ESD-induced errors," Test & Measurement World,
vol. 26 no. 7, pp. 23, Aug. 2006.
[1449] Rowe, W. M., and Eisenberg, P. H.,
"Factors Affecting the Reliability of Wet Tantalum Capacitors," Sixth
Annual Reliability Physics Symposium, Los Angeles, CA, Nov. 6-8, 1967,
pp. 243-255.
[1450] Roy, Tanmoy, Smith, Larry, and Prymak, John,
"ESR and ESL of Ceramic Capacitor Applied to Decoupling Applications,"
Proceedings of the IEEE 7th Topical Meeting on Electrical Performance of
Electronic Packaging , West Point, NY, Oct. 26-28, 1998, pp. 213-216.
[1451] Roy, Tanmoy, and Smith, Larry,
"Power Plane Decoupling Strategy for High Speed Processor Boards,"
Proceedings of the 8th IEEE Topical Meeting on Electrical Performance of
Electronic Packaging, San Diego, CA, Oct. 25-27, 1999, pp. 141-144.
[1452] Rubadue, Jason,
"Powering your core voltage," EDN, vol. 48, no. 26, pp. 69-76,
Nov. 27, 2003.
[1453] Rubin, Barry J.,
"Canonical Models for Determining the Effect of Decoupling Capacitors on
Computer Packages," 4th Topical Meeting on Electrical Performance of
Electronic Packaging Proceedings, Portland, OR, Oct. 2-4, 1995, pp.
50-51.
[1453d] Ruch, P. W., Cericola, D., Foelske, A., Kotz, R., and Wokaun, A.,
"A comparison of the aging of electrochemical double layer capacitors with
acetonitrile and propylene carbonate-based electrolytes at elevated voltages,"
Electrochimica Acta<.CITE>, vol. xx no. x, pp. xx-xx, xxxx.
[1454] Ruch, P. W., Kotz, R., and Wokaun, A.,
"Electrochemical characterization of single-walled carbon nanotubes for
electrochemical double layer capacitors using non-aqueous electrolyte,"
Electrochimica Acta, vol. 54 no. 19, pp. 4451-4458, July 30, 2009.
[1455] Ruiz, V., Blanco, C., Granda, M., and Santamaria, R.,
"Enhanced life-cycle supercapacitors by thermal treatment of mesophase-derived
activated carbons," Electrochimica Acta, vol. 54 no. 2, pp.
305-310, Dec. 30, 2008.
[1456] Ruiz, V., Santamaria, R., Granda, M., and Blanco, C.,
"Long-term cycling of carbon-based supercapacitors in aqueous media,"
Electrochimica Acta, vol. 54 no. 19, pp. 4481-4486, July 30, 2009.
[1457] Saarinen, K., Matero, E., and Perala, J.,
"SMD Plastic Film Capacitors for High Temperature Applications,"
24th Annual Capacitor and Resistor Technology Symposium, San Antonio,
TX, Mar. 29-Apr. 1, 2004, pp. 187-191.
[1458] Saarinen, K., Niskala, M., Matero, E., and Perala, J.,
"SMD Plastic Film Capacitors for High Temperature Applications,"
CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 195-201.
[1459] Saito, Akira, Wada, Nobuyuki, Tamura, Hiroshi, and Sakabe, Yukio,
"Failure Analysis of MLCC Using Focused Ion Beam," Proceedings of
CARTS-Europe 2005, Prague, Czech Republic, Oct. 17-20, 2005, pp.
189-195.
[1459d] Sakabe, Y., Wada, N., Ikeda, J., and Hamaji, Y.,
"Ceramics for Ultra-thin Dielectric Layer of Multilayer Ceramic Capacitors,"
Proceedings of the Eleventh IEEE International Symposium on Applications
of Ferroelectrics, Montreux, Switzerland, Aug. 24-27, 1998, pp.
565-569.
[1460] Sakabe, Yukio, Hayashi, Masami, Ozaki, Takefumi, and Canner, James P.,
"High Frequency Measurement of Multilayer Ceramic Capacitors," IEEE
Transactions on Components, Packaging, and Manufacturing Technology - Part
B, vol. 19, no. 1, pp. 7-14, Feb 1996.
[1461] Sakabe, Yukio, Hayashi, Masami, Ozaki, Takefumi, and Canner, James P.,
"High Frequency Performance of Multilayer Ceramic Capacitors," 1995
Proceedings 45th Electronic Components & Technology Conference, Las
Vegas, NV, May 21-24, 1995, pp. 234-240.
[1462] Sakabe, Yukio, Kohno, Yoshi, Yamada, Masayuki, and Canner, James,
"Low Harmonic Distortion, Ceramic-Multilayer Capacitor," 1989
Proceedings 39th Electronic Components Conference, Houson, TX, May
22-24, 1989, pp. 202-205.
[1463] Sakaue, Takahiko, and Yoshimaru, Katsuhiko,
"Study of Fine Copper Powder for Electrodes of Chip Device,"
Proceedings CARTS Asia 2005, Taipei, Taiwan, Oct. 11-13, 2005, pp.
3-10.
[1464] Salisbury, Ian,
"Revolutionary Approach in Tantalum Capacitor Design Which Has Made
Microminiature 0603 Case Size Possible and Improved Electrical Performance,"
1997 Proceedings 47th Electronic Components & Technology Conference
, San Jose, CA, May 18-21, 1997, pp. 1100-1104.
[1464d] Samantaray, C. B., Sim, Hyunjun, and Hwang, Hyunsang,
"The electronic structures and optical properties of BaTiO3 and SrTiO3 using
first-principles calculations," Microelectronics Journal, vol.
36 no. 8, pp. 725-728, Aug. 2005.
[1465] Sammis, John C.,
"The Digital Bypass Capacitor," TDK Tech Briefs, pp. 2, Dec.
1982.
[1465d] Sandborn, Peter A., Etienne, Bevin, Herrmann, Jeffrey W., and Chincholkar,
Mandar M.,
"Cost and production analysis for substrates with embedded passives,"
Circuit World, vol. 30 no. 1, pp. 25-30, 2004.
[1466] Sanders, D. L., Muccioli, J. P., Anthony, A. A., and Anthony, D. J.,
"X2Y Technology Used for Decoupling," X2Y Attenuators, 2004.
[1467] Sanders, Dale L., Muccioli, James P., and Anthony, Anthony A.,
"A Better Approach to DC Power Filtering,"2004 International
Symposium on Electromagnetic Compatibility, Day 2, Silicon Valley, CA,
Aug. 9-13, 2004, pp. 616-620.
[1468] Sanders, Dale L., Muccioli, James P., and Anthony, Anthony A.,
"Comparison of MLCC and X2Y Technology for Use in Decoupling Circuits,"
Capacitor and Resistor Technology Symposium 2004, San Antonio,
TX, Mar. 29-Apr. 1, 2004, pp. 78-83.
[1469] Sanders, Dale L., Muccioli, James P., and Anthony, Anthony A.,
"Comparison of MLCC and X2Y Technology for Use in Decoupling Circuits
(Presentation)," Capacitor and Resistor Technology Symposium 2004
, San Antonio, TX, Mar. 29-Apr. 1, 2004, pp. xx-xx.
[1470] Sanders, Dale L., Muccioli, James P., and Anthony, Anthony A.,
"Grounding Requirements for Optimum Performance Results with X2Y(R) Technology
on a Printed Circuit Board," 2004 International Symposium on
Electromagnetic Compatibility, Day 2, Silicon Valley, CA, Aug. 9-13,
2004, pp. 626-629.
[1471] Sanders, Dale L., Muccioni, James P., North, Terry M., and Slattery, Kevin P.,
"Reducing Switching Transients from ICs in Power Distribution Systems (PDS) on
PCBs," 10th Annual Automotive Electronics Reliability Workshop
, Novi, MI, Apr. 24, 2005, pp. xx-xx.
[1472] Sanders, Dale,
"Take steps to reduce antiresonance in decoupling," EDN, vol.
49, no. 8, pp. 70, 72, Apr. 15, 2004.
[1473] Sanders, Dale L., Muccioni, James P., North, Terry M., and Slattery, Kevin P.,
"The Quantitative Measurement of the Effectiveness of Decoupling Capacitors in
Controlling Switching Transients from Microprocessors," 25th Annual
Passive Components Conference, Palm Springs, CA, Mar. 21-24, 2005, pp.
173-188b.
[1474] Sanders, Dale L., Muccioni, James P., North, Terry M., and Slattery, Kevin P.,
"The Quantitative Measurement of the Effectiveness of Decoupling Capacitors in
Controlling Switching Transients from Microprocessors (Presentation),"
25th Annual Passive Components Conference, Palm Springs, CA, Mar.
21-24, 2005, pp. xx-xx.
[1475] Sandler, Steven M., and Hymowitz, Charles E.,
"Capacitor Values: Don't Believe the Label," Power Electronics
Technology, vol. 33 no. 5, pp. 22-25, 27, May 2007.
[1476] Sankaran, Nithya, Ramdas, Venkatesh Chelukka, Lee, Baik-Woo, Sundaram, Venky,
Engin, Ege, Iyer, Mahadevan, Swaminathan, Madhavan, and Tummala, Rao,
"Coupling Noise Analysis and High Frequency Design Optimization of
Power/Ground Plane Stack-up in Embedded Chip Substrate Cavities,"
2008 Proceedings 58th Electronic Components & Technology Conference
, Lake Buena Vista, FL, May 27-30, 2008, pp. 1874-1879.
[1477] Santarini, Michael,
"PCB East keynoter warns designers of EMC dangers," Electronic
Engineering Times, pp. 18, Sept. 18, 2000.
[1478] Sarjeant, W. J., and Staffiere, D. T.,
"A Report on Capacitors," Proceedings of 1996 IEEE Applied Power
Electronics Conference, Volume 1, San Jose, CA, Mar. 3-7, 1996, pp.
12-17.
[1479] Sarjeant, W. J., and Staffiere, D. T.,
"Capacitors as an Element in Advanced Power Sources in Power Electronics
Systems," Proceedings of 1997 IEEE Applied Power Electronics Conference,
Volume 2, Atlanta, GA, Feb. 23-27, 1997, pp. 596-601.
[1480] Sarwar, Abul,
"CMOS Power Consumption and Cpd Calculation," Texas Instruments CSAA035B,
June 1997.
[1481] Sasaki, Hideki, Harada, Takashi, and Kuriyama, Toshihide,
"A New Decoupling Circuit for Suppressing Radiated Emissions due to Power
Plane Resonance," IEICE Transactions on Communications, vol.
E85-B, no. 5, pp. 1031- 1037, May 2002.
[1482] Sasaki, Hideki, Harada, Takashi, and Kuriyama, Toshihide,
"A New Decoupling Technique for Suppressing Radiated Emissions Arising from
Power Bus Resonance of Multilayer PCBs," 1999 International Symposium on
Electromagnetic Compatibility, Tokyo, Japan, May 17-21, 1999, pp.
17-20.
[1483] Sasaki, Hideki, Harada, Takashi, and Kuriyama, Toshihide,
"A New Decoupling Circuit for Suppressing Radiated Emissions due to Power
Plane Resonance," IEICE Transactions on Communications, vol.
E85-B, no. 5, pp. 1031-1037, May 2002.
[1484] Sasaki, Hideki, Harada, Takashi, and Kuriyama, Toshihide,
"A New VLSI Decoupling Circuit for Suppressing Radiated Emissions from
Multilayer Printed Circuit Boards," IEEE International Symposium on
Electromagnetic Compatibility Symposium Record Volume One, Washington,
D.C., Aug. 21-25, 2000, pp. 157-162.
[1485] Sato, Ken, Ogata, Yoshihiro, Ohno, Katsuhiro, and Ikeo, Hirofumi,
"Mechanism of Ceramic Capacitor Leakage Failures due to Low DC Stress,"
18th Annual Reliability Physics Symposium, Las vegas, NV, Apr. 8-10,
1980, pp. 205-212.
[1486] Sato, Takaya, Masuda, Gen, and Takagi, Kentaro,
"Electrochemical properties of novel ionic liquids for electric double layer
capacitor applications," Electrochimica Acta, vol. 49 no. 21, pp.
3603-3611, Sept. 1, 2004.
[1487] Sato, Toshiro, and Adachi, Hiroyuki,
"Power Noise Analysis of Large Scale Printed Circuit Boards,"
Fujitsu Scientific and Technical Journal, vol. 44 no. 1, pp. 68-76,
Jan. 2008.
[1487d] Sauter, Wolfgang, Muncy, Jennifer, Ross, Joseph, Coffin, Jeffrey, Arvin,
Charles, Ouimet, Sylvain, and Triplett, Michael,
"Capacitors on Organic Modules: a New THB Failure Mode and Method of
Detection," 59th Electronic Components & Technology Conference
, San Diego, CA, May 26-29, 2009, pp. 1263-1270.
[1488] Sayre, Edward P., Baxter, Michael A., and Savarino, Thomas,
"Development of a New Transmission Line Skin Effect Model for SPICE
Evaluations - Simulations and Measurements," 1997 Digital
Communications Design Conference.
[1489] Sayre, Edward, Baxter, Michael, and Chen, Jinhua,
"Limits of FR-4 in High-Speed Designs."
[1490] Sayre, Edward P., Chen, Jinhua, and Baxter, Michael A.,
"OC-48/2.5Gbps Interconnect Engineering Design Rules," 1999 Digital
Communications System Design Conference.
[1491] Schaper, L. W., Ang, S., and Low, Y. L.,
"Design of the Interconnected Mesh Power System (IMPS) MCM Topology,"
Proceedings of the 1994 International Conference on Multichip
Modules, Denver, CO, Apr. 13-15, 1994, pp. 543-548.
[1492] Schaper, L. W., Ang, S., Low, Yee L., and Oldham, Danny R.,
"Electrical Characterization of the Interconnected Mesh Power System (IMPS)
MCM Topology," IEEE Transactions on Components, Hybrids, and
Manufacturing Tech - Part B, vol. 18, no. 1, pp. 99-105, Feb. 1995.
[1493] Schaper, L. W., Ang, S., Low, Y. L., and Oldham, D.,
"Electrical Characterization of the Interconnected Mesh Power System (IMPS)
MCM Topology," 1994 Proceedings 44th Electronic Components &
Technology Conference, Washington, D.C., May 1-4, 1994, pp. 791-795.
[1494] Schaper, Leonard W.,
"A New High Frequency Decoupling Capacitor," Proceedings of the 1996
International Electronics Packaging Conference , Austin, TX, Sept.
29-Oct. 1, 1996, pp. 548-557.
[1495] Schaper, Leonard W., and Glover, Michael D.,
"Comparison of the Interconnected Mesh Power System (IMPS) and Buried
Stripline Interconnect Topologies," 2001 HD International Conference on
High-Density Interconnect and Systems Packaging (Proceedings of SPIE - The
International Society for Optical Engineering, Volume 4428), Santa
Clara, CA, Apr. 17-20, 2001, pp. 58-63.
[1496] Schaper, Leonard W., and Thomason, Chris,
"High Density Tantalum Pentoxide Decoupling Capacitors," Proceedings
56th Electronic Components & Technology Conference, San Diego, CA,
May 30-June 2, 2006, pp. 510-514.
[1497] Schaper, Leonard W., and Morcan, Gabriel,
"High Frequency Characteristics of MCM Decoupling Capacitors," 1996
Proceedings 46th Electronic Components & Technology Conference,
Orlando, FL, May 28-31, 1996, pp. 358-364.
[1498] Schaper, Leonard W. and Amey, Daniel I.,
"Improved Electrical Performance Required for Future MOS Packaging,"
IEEE Transactions on Components, Packaging, and Manufacturing
Technology, vol. CHMT-6, no. 3, pp. 283-289, Sept. 1983.
[1499] Schaper, L., Ulrich, R., Nelms, D., Porter, E., Lenihan, T., and Wan,
C.,
"The "Stealth" Decoupling Capacitor," 1997 Proceedings 47th Electronic
Components & Technology Conference, San Jose, CA, May 18-21, 1997,
pp. 724-729.
[1500] Schaper, L. W., Chen, K. Y., Brown, W. D., and Naseem, H. A.,
"Thin Film Decoupling Capacitors: A High Frequency Performance Analysis,"
1999 Proceedings 49th Electronic Components & Technology
Conference, San Diego, CA, June 1-4, 1999, pp. 859-866.
[1501] Schaper, Leonard W., and Thomason, Chris,
"High Density Double and Triple Layer Tantalum Pentoxide Decoupling
Capacitors," IEEE Transactions on Components and Packaging Technologies
, vol. 30 no. 4, pp. 563-568, Dec. 2007.
[1502] Schau, Tim,
"Trends in tantalum capacitor development," Electronic Products,
vol. 45, no. 10, pp. 29-30, Mar. 2003.
[1503] Scherson, Daniel A., and Palencsar, Attila,
"Batteries and Electrochemical Capacitors," Electrochemical Society
Interface, vol. 15 no. 1, pp. 17-22, Spring 2006.
[1504] Schmidt, Kymberly,
"Choose capacitor types to optimize PC sound quality," EDN, vol.
52 no. 8, pp. 77-78, 80, 82, 84, Apr. 12, 2007.
[1505] Schmitt, Ralf, Huang, Xuejue, and Yuan, Chuck,
"Power Distribution Analysis Methodology for a Multi-Gigabit I/O Interface,"
Proceedings of the 12th Topical Meeting on Electrical Performance of
Electronic Packaging, Princeton, NJ, Oct. 27-29, 2003, pp. 141-144.
[1506] Schneider, Donald, Hopkins, Donald, Zucco, Paul, Moszczynski, Edward,
Griffin, Michael, and Takacs, Mark,
"Reliability and Characterization of MLC Decoupling Capacitors with C4
Interconnections," 1996 Proceedings 46th Electronic Components &
Technology Conference, Orlando, FL, May 28-31, 1996, pp. 365-374.
[1507] Schneuwly, A., Groning, P., Schlapbach, L., Irrgang, C., and Vogt, J.,
"Breakdown Behavior of Oil-impregnated Polypropylene as Dielectric in Film
Capacitors," IEEE Transactions on Dielectrics and Electrical Insulation
, vol. 5 no. 6, pp. 862-868, Dec. 1998. 1999.
[1508] Schott, Joachim Hossick,
"Cathode and anode potentials during charge and discharge processes in high
energy density capacitors," CARTS-Europe 2004, Nice, France,
Oct. 18-21, 2004, pp. 157-165.
[1509] Scolio, Jay,
"Basic switching-regulator-layout techniques," vol. 48, no. 36, pp. 79-84,
Nov. 27, 2003.
[1510] Sentz, Scott,
"Capacitors for high-temp, high-rel apps," Electronic Products
, vol. 51 no. 5, pp. 61-63, Oct. 2008.
[1511] Serrano-Finetti, Roberto E., and Pallas-Areny, Ramon,
"On the Use of Decoupling Capacitors in Autonomous Sensors,"
Instrumentation and Measurement Technology Conference Proceedings,
Warsaw, Poland, May 1-3, 2007, pp. xx-xx.
[1511d] Sethi, Guneet, Sahul, Raffi, Min, Cheolhong, Tewari, Pratyush, Furman, Eugene,
Horn, Mark W., and Lanagan, Michael T.,
"Dielectric Response of Tantalum Oxide Deposited on Polyethylene Terephthalate
(PET) Film by Low-Temperature Pulsed-DC Sputtering for Wound Capacitors,"
IEEE Transactions on Components and Packaging Technologies, vol.
32 no. 4, pp. 915-925, Dec. 2009.
[1512] Sevalia, Piyush,
"Straightforward techniques cut jitter in PLL-based clock drivers,"
EDN, Nov. 23, 1995.
[1513] Shah, Jitesh,
"Floorplanning A Power Delivery Network With Spice," Electronic
Design, vol. 56 no. 15, pp. 56,58-62, July 24, 2008.
[1514] Shahparnia, Shahrooz, and Ramahi, Omar M.,
"Design, Implementation, and Testing of Miniaturized Electromagnetic Bandgap
Structures for Broadband Switching Noise Mitigation in High-Speed PCBs,"
IEEE Transactions on Advanced Packaging, vol. 30 no. 2, pp.
171-179, May 2007.
[1514d] Shayan, Amirali, Bowles, Kevin, Dobre, Sorin, Popovich, Mikhail, Chen,
Xiaoming, and Pan, Christopher,
"Resonance-aware Methodology for System Level Power Distribution Network
Co-design," IEEE 18th Conference on Electrical Performance of Electronic
Packaging and Systems, Portland, OR, Oct. 19-21, 2009, pp. 29-32.
[1515] Sherman, Len,
"In Portable Designs, Powering CPUs and High-Density Logic Is An Art,"
Electronic Design Analog Applications Supplement, vol. 47, no.
24B, pp. 9-18, Nov. 22, 1999.
[1516] Sherman, Leonard,
"DC-DC Conversion Techniques For Noise-Sensitive Applications,"
Electronic Design Analog Applications Issue, vol. 45, no. 25B,
pp. 22-32, Nov. 17, 1997.
[1516d] Shi, H., Yuan, F., Sha, F., Drewniak, J. L., Hubing, T. H., and Van
Doren, T. P.,
"Simulation and Measurement for Decoupling on Multilayer PCB DC Power Buses,"
IEEE 1996 International Symposium on Electromagnetic
Compatibility, Santa Clara, CA, Aug. 19-23, 1996, pp. 430-435.
[1516h] Shi, Hang,
"Activated Carbons and Double Layer Capacitance," Electrochimica Acta
, vol. 41 no. 10, pp. 1633-1639, June 1996.
[1517] Shi, Hao, Sha, Fei, Drewniak, James L., Van Doren, Thomas P., and
Hubing, Todd H.,
"An Experimental Procedure for Characterizing Interconnects to the DC Power
Bus on a Multilayer Printed Circuit Board," IEEE Transactions on
Electromagnetic Compatibility, vol. 3, no. 4, pp. 279-285, Nov.
1997.
[1518] Shi, Hao, Fan, Jun, Drewniak, James L., Hubing, Todd H., and Van Doren,
Thomas P.,
"Modeling Multilayered PCB Power-Bus Designs Using an MPIE Based Circuit
Extraction Technique," 1998 IEEE EMC Symposium Record Volume Two,
Denver, CO, Aug. 24-28, 1998, pp. 647-651.
[1520] Shi, Weimin, and Fang, Jiayuan,
"New Efficient Method of Modeling Electronics Packages with Layered
Power/Ground Planes," IEEE Transactions on Advanced Packaging,
vol. 25, no. 3, pp. 417-423, Aug. 2002.
[1521] Shigeta, Yuji, and Ishizaki, Masato,
"Improved EMI Performance by Use of a Three-Terminal-Capacitor Applied to an
IC Power Line," 1999 IEEE International Symposium on Electromagnetic
Compatibility Symposium Record Volume One, Seattle, WA, Aug. 2-6,
1999, pp. 161-164.
[1522] Shim, Hwan W., and Hubing, Todd H.,
"20-H Rule Modeling and Measurements," 2001 IEEE EMC International
Symposium Symposium Record - Volume 2, Montreal, Canada, Aug. 13-17,
2001, pp. 939-942.
[1523] Shim, Hwan W., Zeeff, Theodore M., and Hubing, Todd H.,
"Decoupling Strategies for Printed Circuit Boards Without Power Planes,"
2002 IEEE International Symposium on Electromagnetic Compatibility
Symposium Record - Volume 1, Minneapolis, MN, Aug. 19-23, 2002, pp.
258-261.
[1524] Shim, Jongjoo, Shin, Minchul, Kim, Hyungsoo, Kim, Yongju, Park, Kunwoo, Cho,
Jeonghyeon, and Kim, Joungho,
"An Adaptive On-chip ESR Controller Scheme in Power Distribution Network for
Simultaneous Switching Noise Reduction," 17th Topical Meeting on
Electrical Performance of Electronic Packaging, San Jose, CA, Oct.
27-29, 2008, pp. 169-172.
[1525] Shin, Hyunho, Park, Jong-Sung, Kim, Sujin, Jung, Hyun Suk, and Hong, Kug Sun,
"Investigation of useful or deleterious residual thermal stress component to
the capacitance of a multilayer ceramic capacitor," Microelectronic
Engineering, vol. 77 no. 3-4, pp. 270-276, Apr. 2005.
[1526] Shinomiya, Takuya, Gupta, Vinay, and Miura, Norio,
"Effects of electrochemical-deposition method and microstructure on the
capacitive characteristics of nano-sized manganese oxide,"
Electrochimica Acta, vol. 51 no. 21, pp. 4412-4419, June 1, 2006.
[1527] Shlepnev, Yuriy,
"Transmission plane models for parallel-plane power distribution system and
signal integrity analysis," 22nd Annual Review of Progress in Applied
Computational Electromagnetics, Miami, FL, Mar. 12-16, 2006, pp.
382-389.
[1528] Sica, Manfred,
"The Optimisation of Carbon and Silver Inks for Low ESR Tantalum Capacitors,"
Proceedings of the 25th Symposium for Passive Components,
Palm Springs, CA, Mar. 21-24, 2005, pp. 11-18.
[1529] Sikula, J., Hlavka, J., Sedlakova, V., Hoeschl, P., Zednicek T., and Sita, Z.,
"Charge Carrier Transport and Storage in NbO Capacitors,"
CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004, pp. 178-181.
[1530] Sikula, J., Sedlakova, V., Hlavka, J., and Sita, Z.,
"Charge Carrier Transport in NbO and Ta Capacitors in Temperature Range 100
to 300 K," CARTS-Europe 2006 Proceedings, Bad Homburg,
Germany, Sept. 25-28, 2006, pp. xx-xx.
[1531] Sikula, J., Hlavka, J., Sedlakova, V., and Grmela, L.,
"Conductivity Mechanisms and Breakdown Characteristics of Niobium Oxide
Capacitors," AVX.
[1532] Sikula, J., Hlavka, J., Sedlakova, V., Grmela, L., Hoeschl, P., Zednicek, T.,
and Sita, Z.,
"Conductivity Mechanisms and Breakdown of NbO Capacitors," 24th
Annual Capacitor and Resistor Technology Symposium, San Antonio, TX,
Mar. 29-Apr. 1, 2004, pp. 141-146.
[1533] Sikula, J., Sedlakova, V., Navarova, H., Hlavka, J., Tacano, M., and Sita, Z.,
"Niobium Oxide and Tantalum Capacitors: Leakage Current and M-I-S Model
Parameters," CARTS 2007 Symposium Proceedings, Albuquerque,
NM, Mar. 26-29, 2007, pp. 337-345.
[1534] Sikula, J., Sedlakova, V., Navarova, H., Hlavka, J., Tacano, M., and Sita, Z.,
"Niobium Oxide and Tantalum Capacitors: Leakage Current, Restoring Voltage and
Reliability," CARTS USA 2008 Proceedings, Newport Beach, CA,
Mar. 17-20, 2008, pp. xx-xx.
[1535] Sikula, J., Hlavka, J., Sedlakova, V., Hoeschl, P., Grill, R., Sita, Z.,
Zednicek, T., and Tacano, M.,
"Niobium Oxide and Tantalum Capacitors: M-I-S Model Parameters Comparison,"
Proceedings of the 25th Symposium for Passive Components,
Palm Springs, CA, Mar. 21-24, 2005, pp. 244-248.
[1536] Sikula, J., Sedlakova, V., Hlavka, J., Sita, Z., Hoeschl, P., and Tacano, M.,
"Niobium Oxide and Tantalum Capacitors: Quantum Effects in Charge Carrier
Transport," 2006 CARTS Conference Proceedings, Orlando, FL,
Apr. 3-6, 2006, pp. xx-xx.
[1537] Sikula, J., Sedlakova, V., Navarova, H., Majzner, J., Tacano, M., and
Zednicek, T.,
"Ta and NbO High Voltage Capacitors: Leakage Current Kinetics for MnO2 and
Conducting Polymer Cathode," CARTS USA 2009 Proceedings,
Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[1538] Sikula, J., Sedlakova, V., Navarova, H., Hlavka, J., Tacano, M., and Sita, Z.,
"Tantalum and Niobium Oxide Capacitors: Leakage current, Anodic Oxidation and
Reliability," CARTS Europe 2007, Barcelona, Spain, Oct.
29-Nov. 1, 2007, pp. xx-xx.
[1539] Sikula, J., Sedlakova, V., Hlavka, J., Hoeschl, P., Sita, Z., Zednicek, T.,
Tacano, M., and Hashiguchi, S.,
"Transport and Noise Characteristics of Niobium Oxide and Tantalum
Capacitors," Proceedings of CARTS-Europe 2005, Prague, Czech
Republic, Oct. 17-20, 2005, pp. 210-216.
[1540] Simon, Patrice, and Burke, Andrew,
"Nanostructured Carbons: Double-Layer Capacitance and More,"
Electrochemical Society Interface, vol. 17 no. 1, pp. 38-43, Spring
2008.
[1540d] Simpraga, R. P., and Conway, B. E.,
"The real-area scaling factor in electrocatalysis and in charge storage by
supercapacitors," Electrochimica Acta, vol. 43 no. 19-20, pp.
3045-3058, 1998.
[1541] Since, Huang Jimmy Huat, S, Sijher Taninder, and Kai, Beh Jiun,
"The impact of capacitors selection and placement to the ESL and ESR,"
2005 International Symposium on Electronics Materials and Packaging,
Tokyo, Japan, Dec. 11-14, 2005, pp. 258-261.
[1542] Since, Huang Jimmy Huat, Jalaluddin, Bin Yusof Ahmad, and Yeong, Ong Alvin
Yih,
"Study of High Speed Current Excitation Reverse Engineering Methodology Using
Measured Voltage and PDN Impedance Profile from a Running Microprocessor,"
2007 IEEE Electrical Performance of Electronic Packaging,
Atlanta, GA, Oct. 29-31, 2007, pp. 319-322.
[1543] Sita, Z., Biler, M., Karnik, T., Sikula, J., and Sedlakova, V.,
"Dielectric Improvement in NbO Capacitors," CARTS Europe 2007
, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[1544] Sita, Z., Biler, M., Karnik, T., Sikula, J., and Sedlakova, V.,
"Dielectric Improvement in NbO Capacitors," CARTS USA 2008
Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[1545] Sita, Z., and Biler, M.,
"Ta Capacitors with Conductive Polymer Robust to Leadfree Process,"
Proceedings of the 25th Symposium for Passive Components, Palm Springs,
CA, Mar. 21-24, 2005, pp. 112-118.
[1546] Siulinski, James A.,
"Design and layout rules eliminate noise coupling in communication
systems," EDN, June 20, 1996.
[1546d] Sivaraman, P., Kushwaha, R. K., Shashidhara, K., Hande, V. R., Thakur, A. P.,
Samui, A. B., and Khandpekar, M. M.,
"All solid supercapacitor based on polyaniline and crosslinked sulfonated
poly[ether ether ketone]," Electrochimica Acta<.CITE>, vol. xx no. x,
pp. xx-xx, xxxx.
[1547] Slattery, Bill, and Wynne, John,
"Design and layout of a video graphics system for reduced EMI,"
Microprocessors and Microsystems , vol. 15, no. 2, pp. 97-112,
Mar. 1991.
[1548] Slattery, Bill, and Wynne, John,
"Design and Layout of a Video Graphics System for Reduced EMI," ITEM
1992, pp. 40-58, 102, 1992.
[1549] Sloka, Bill,
"Flex Crack Mitigation," Kemet TechTopics, Apr. 2008.
[1550] Sloka, Bill, Skamser, Dan, Phillips, Reggie, Hill, Allen, Laps, Mark, Grace,
Roy, Prymak, John, Randall, Michael, and Tajuddin, Aziz,
"Flexure Robust Capacitors," CARTS 2007 Symposium Proceedings
, Albuquerque, NM, Mar. 26-29, 2007, pp. 125-140.
[1551] Small, Charles H.,
"Distributed power takes center stage," EDN, Apr. 28, 1994.
[1552] Smith, Ben,
"Energy and Power Handling Capabilities of Thin Film and Ceramic
Capacitors."
[1553] Smith, Ben,
"Inductance Measurements for Multi-Terminal Devices."
[1554] Smith, Douglas C.,
"DC to 1GHz Probe Construction Plans."
[1555] Smith, Douglas C.,
"Improved Construction Technique for a 50 Ohm Termination."
[1556] Smith, Douglas C.,
"Measuring Capacitor Self-Inductance and ESR."
[1557] Smith, Larry D., Hockanson, David, and Kothari, Krina,
"A Transmission-Line Model for Ceramic Capacitors for CAD Tools Based on
Measured Parameters," 2002 Proceedings 52nd Electronic Components
& Technology Conference, San Diego, CA, May 28-31, 2002, pp.
331-336.
[1558] Smith, Larry D., Anderson, Raymond E., and Roy, Tammoy,
"Chip-Package Resonance in Core Power Supply Structures for a High Power
Microprocessor," IPACK'01 Pacific Rim/ASME International Electronic
Packaging Technical Conference and Exhibition, Kauai, Hawaii, July
8-13, 2001.
[1559] Smith, Larry,
"Decoupling Capacitor Calculations for CMOS Circuits," Proceedings
of IEEE 3rd Topical Meeting on Electrical Performance of Electronic Packaging
, Monterey, CA, Nov. 2-4, 1994, pp. 101-105.
[1560] Smith, Larry D., and Hockanson, David,
"Distributed SPICE Circuit Model for Ceramic Capacitors," 2001
Proceedings 51st Electronic Components & Technology Conference,
Orlando, FL, May 29-June 1, 2001, pp. 523-528.
[1561] Smith, Larry,
"ESR and bypass Caps," si-list, Feb 04, 2000.
[1562] Smith, Larry, and Shi, Hong,
"FPGA Design for Signal and Power Integrity," DesignCon 2007,
Santa Clara, CA, Jan. 29-Feb. 1, 2007, pp. xx-xx.
[1563] Smith, Larry D.,
"Packaging and Power Distribution Design Considerations for a Sun Microsystems
Desktop Workstation," Proceedings of the IEEE 6th Topical Meeting on
Electrical Performance of Electronic Packaging, San Jose, CA, Oct.
27-29, 1997, pp. 19-22.
[1564] Smith, Larry D., Anderson, Raymond E., Forehand, Douglas W., Pelc,
Thomas J., and Roy, Tammoy,
"Power Distribution System Design Methodology and Capacitor Selection for
Modern CMOS Technology," IEEE Transactions on Advanced
Packaging, vol. 22, no. 3, pp. 284-291, Aug. 1999.
[1565] Smith, Larry D., and Lee, Jeffery,
"Power distribution System for JEDEC DDR2 memory DIMM," Proceedings
of the 12th Topical Meeting on Electrical Performance of Electronic Packaging
, Princeton, NJ, Oct. 27-29, 2003, pp. 121-124.
[1566] Smith, Larry, Anderson, Raymond, and Roy, Tanmoy,
"Power Plane SPICE Models and Simulated Performance for Materials and
Geometries," IEEE Transactions on Advanced Packaging, vol.24,
no. 3, pp. 277-287, Aug. 2001.
[1567] Smith, Larry, Roy, Tanmoy, and Anderson, Raymond,
"Power Plane Spice Models for Frequency and Time Domains,"
Proceedings of the IEEE 9th Topical Meeting on Electrical Performance of
Electronic Packaging, Scottsdale, AZ, Oct. 23-25, 2000.
[1568] Smith, Larry,
"Simultaneous Switch Noise and Power Plane Bounce for CMOS Technology,"
Proceedings of the 8th IEEE Topical Meeting on Electrical Performance of
Electronic Packaging, San Diego, CA, Oct. 17-25, 1999, pp. 163-166.
[1569] Smith, Norm, Fan, Jun, Andresakis, John, Fukawa, Yoshi, Harvey, Mark,
and Knighten, Jim,
"Embedded Capacitor Technology: A Real World Example," 32nd IEEE/CPMT
International Electronic Manufacturing Technology Symposium, San Jose,
CA, Oct. 3-5, 2007, pp. 118-124.
[1570] Smith, Norm, Fan, Jun, Andresakis, John, Fukawa, Yoshi, Harvey, Mark, and
Knighten, Jim,
"Embedded Capacitor Technology: A Real World Example," 2008 Proceedings
58th Electronic Components & Technology Conference, Lake Buena
Vista, FL, May 27-30, 2008, pp. 1919-1925.
[1571] Smith, Tim S., and Paul, Clayton R.,
"Effect of Grid Spacing on the Inductance of Ground Grids," 1991
International Symposium on Electromagnetic Compatibility, Cherry Hill,
NJ, Aug. 12-16, 1991, pp. 72-77.
[1571d] Smyth, D. M.,
"Multilayer Ceramic Capacitors with Base Metal Electrodes," Proceedings
of the 2000 12th IEEE International Symposium on Applications of
Ferroelectrics, Volume 1, Honolulu, HI, July 21-Aug. 2, 2000, pp.
369-373.
[1572] Snogren, Richard,
"Embedded Passives: the Next Revolution," PC Fab, vol. 25, no.
11, pp. 26-29, Nov. 2002.
[1572d] Snogren, Richard,
"Manufacturing Considerations of Embedded Passives," Printed Circuit
Design and Manufacture, vol. 20 no. 11, pp. 22,24, Nov. 2003.
[1572h] Song, Jing-bo, Mao, Wei-min, Yang, Hong, and Feng, Hui-ping,
"Effect of trace Sn on corrosion behaviors of high voltage anode aluminum
foil," Transactions of Nonferrous Metals Society of China, vol.
18 no. 4, pp. 879-883, Aug. 2008.
[1573] Song, Ki-Jae, Kim, Jongmin, Yoo, Jongwoon, Nah, Wansoo, Lee, Jaeil, and Sim,
Hyunseop,
"Low Power Noise Multilayer PCB with Discrete Decoupling Capacitors Inside,"
2008 10th Electronics Packaging Technology Conference, Singapore,
Dec. 9-12, 2008, pp. 1241-1246.
[1573d] Song, Ki-Jae, Kim, Jongmin, Yoo, Jongwoon, Nah, Wansoo, Lee, Jaeil, and Sim,
Hyunseop,
"Low-power noise multilayer PCB with discrete decoupling capacitors inside,"
Circuit World, vol. 35 no. 2, pp. 30-36, 2009.
[1574] Spaziani, Larry,
"Fueling the Megaprocessor - A DC/DC Converter Design Review Featuring the
UC3886 and UC3910," Unitrode Application Note U-157, 1999.
[1574d] Spohr, E.,
"Molecular simulation of the electrochemical double layer,"
Electrochimica Acta, vol. 44 no. 11, pp. 1697-1705, Jan. 1999.
[1575] Spriggs, R. S., and Cronshagen, A. H.,
"Nondestructive, X-Ray Inspection of Ceramic-Chip Capacitors for
Delaminations," 14th Annual Reliability Physics Symposium, Las
Vegas, NV, Apr. 20-22, 1976, pp. 157-163.
[1576] Spyker, R. L., Nelms, R. M., and Merryman, S. L.,
"Evaluation of Double Layer Capacitors for Power Electronic Applications,"
Proceedings of 1996 IEEE Applied Power Electronics Conference, Volume 2
, San Jose, CA, Mar. 3-7, 1996, pp. 725-730.
[1577] Spyker, R. L., and Nelms, R. M.,
"High Current Performance of 470 F Double-Layer Capacitors," Proceedings
of 1997 IEEE Applied Power Electronics Conference, Volume 2, Atlanta,
GA, Feb. 23-27, 1997, pp. 590-595.
[1578] St. Cyr, Valerie, Novak, Istvan, Biunno, Nick, and Howard, Jim,
"ARIES: Using Annular-Ring Embedded Resistors to Set Capacitor ESR in Power
Distribution Networks," Proceedings 10th Topical Meeting on
Electrical Performance of Electronic Packaging, Cambridge, MA, Oct.
29-31, 2001.
[1578d] Staiti, P., Minutoli, M., and Lufrano, F.,
"All solid electric double layer capacitors based on Nafion ionomer,"
Electrochimica Acta, vol. 47 no. 17, pp. 2795-2800, July 5, 2002.
[1579] Staubli, Paul, Ashburn, Travis, Prymak, John, and Prevallet, Mike,
"Improving Flex Capabilities of Ceramic MLC Chip Capacitors,"
Proceedings of CARTS-Europe 2005, Prague, Czech Republic, Oct. 17-20,
2005, pp. 124-131.
[1580] Staubli, Paul, Prymak, John, Blais, Peter, and Long, Bill,
"Improving Flex Capabilities with Modified MLC Chip Capacitors,"
CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006,
pp. xx-xx.
[1580d] Stauf, Gregory T., Bilodeau, Steven, and Watts, Roderick K.,
"BaSrTiO3 thin films for integrated high frequency capacitors,"
Proceedings of the Tenth IEEE International Symposium on Applications of
Ferroelectrics, Volume 1, East Brunswick, NJ, Aug. 18-21, 1996, pp.
103-106.
[1581] Steffes, Michael, and Ramus, Xavier,
"Low-power, high-intercept interface to the ADS5424 14-bit, 105-MSPS converter
for undersampling applications," Analog Applications Journal,
vol. xx no. 4, pp. 10-18, Fourth Quarter 2005.
[1582] Stephenson, Donald H.,
"Tantalum Capacitor Fundamentals for Design and Reliability Engineers,"
Insulation, vol. 8, no. 8, pp. 25-30, July 1962.
[1583] Stephenson, Richard, Pogue, Ann, Creuson, Philippe, Imhof, Howard, McNeilly,
Kirk, and Meyer, Edouard Marc,
"Electrical Performance Characteristics of MLCC's With Low Laydown AgPd
Powders," CARTS-Europe 2004, Nice, France, Oct. 18-21, 2004,
pp. 25-29.
[1584] Stephenson, Richard, and Pogue, Ann,
"Electrode Powder Dispersion Evaluation," Proceedings CARTS Asia
2005, Taipei, Taiwan, Oct. 11-13, 2005, pp. 35-41.
[1585] Stevens, J. L., Geiculescu, A. C., and Strange, T. F.,
"Dielectric Aluminum Oxides: Nano-Structural Features and Composites,"
CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29,
2007, pp. 63-76.
[1586] Stevens, J. L., Marshall, T. R., Geiculescu, A. C., Feger, C. R., and Strange,
T. F.,
"The Effects of Electrolyte Composition on the Deformation Characteristics of
Wet Aluminum ICD Capacitors," 2006 CARTS Conference Proceedings
, Orlando, FL, Apr. 3-6, 2006, pp. xx-xx.
[1587] Stevenson, Bob, and Ewell, Gary,
"A Capacitor's Inductance: Critical Property for Certain Applications,"
1999 Proceedings 49th Electronic Components & Technology
Conference, San Diego, CA, June 1-4, 1999, pp. 853-858.
[1588] Stewart, Mark,
"A Soft Termination MLCC Solution Against Crack Failures,"
Proceedings CARTS Asia 2005, Taipei, Taiwan, Oct. 11-13, 2005, pp.
149-154.
[1589] Stewart, Mark,
"A Soft Termination MLCC Solution to Guard Against Capacitor Crack Failures,"
Proceedings of the 25th Symposium for Passive Components,
Palm Springs, CA, Mar. 21-24, 2005, pp. 219-224.
[1590] Stewart, Mark, and Lennox, Jonathan,
"A Soft Termination MLCC Solution to Guard against Capacitor Crack Failures,"
Proceedings of CARTS-Europe 2005, Prague, Czech Republic,
Oct. 17-20, 2005, pp. 118-123.
[1591] Stewart, Mark, and Conway, Michael,
"Advancements in Ceramic Power Capacitors Yields High Reliability and
Capacitance Stability," Proceedings CARTS Asia 2005, Taipei,
Taiwan, Oct. 11-13, 2005, pp. 183-190.
[1591d] Stimpfling, Thomas, and Leroux, Fabrice,
"Supercapacitor-Type Behavior of Carbon Composite and Replica Obtained from
Hybrid Layered Double Hydroxide Active Container," Chemistry of
Materials, vol. xx no. xx, pp. xx-xx, xxxx.
[1592] Stoddard, J., and Goodrum, A.,
"Electrical-design considerations for PCI-X and 66-MHz PCI cards,"
EDN, vol. ?, no. 19, pp. 85-92, Aug. 30, 2001.
[1593] Straus, Isidor,
"Designing For Compliance, Part 1: Design of the PC Board," Compliance
Engineering 1991 Reference Guide, vol. VIII, issue 1, pp. 107-117,
Jan. 1991.
[1594] Straus, Isidor,
"Designing For Compliance, Part 1: Design of the PC Board," Compliance
Engineering 1992 Reference Guide, pp. 101-110, 1992.
[1595] Straus, Isidor,
"Designing For Compliance, Part 1: Design of the PC Board," Compliance
Engineering 1993 Reference Guide, pp. 125-132, 1993.
[1596] Straus, Isidor,
"Designing For Compliance, Part 1: Design of the PC Board," Compliance
Engineering 1994 Reference Guide, vol. XI, no. 2, pp. 127-135, 1994.
[1597] Straus, Isidor,
"Designing PC Boards for EMC Compliance," Compliance
Engineering, vol. VII, issue 4, pp. 13-22, Summer 1990.
[1598] Straus, Isidor,
"The PC Board Design for Compliance," Compliance Engineering 1995
Reference Guide, vol. XII, no. 2, pp. A-115-A-A-123, 1995.
[1599] Straus, Isidor,
"The PC Board Design for Compliance," Compliance Engineering 1996
Reference Guide, vol. XIII, no. 2, pp. A123-A130, 1996.
[1600] Stroud, John P.,
"Equivalent Series Resistance - The Fourth Parameter for Tantalum Capacitors,"
1990 Proceedings 40th Electronic Components & Technology
Conference, Las Vegas, NV, May 20-23, 1990, pp. 1009-1012.
[1601] Stumpf, Martin, Kroning, Oliver, and Leone, Marco,
"Power-Bus Modeling Using 2D-Integral-Equation Formulation," 2009 20th
International Zurich Symposium on Electromagnetic Compatibility,
Zurich, Switzerland, Jan. 12-16, 2009, pp. 189-192.
[1602] Suchicital, Carlos A. and Payne, David A.,
"Piezoelectric Measurements on Ceramic Multilayer Capacitors," IEEE
Transactions on Components, Hybrids, and Manufacturing Technology, vol.
CHMT-8, no. 2, pp. 283-288, June 1985.
[1603] Sudo, Toshio, Ichijo, Seiju, Kushihira, Takanobu, Yamamoto, Takuya, and
Yamazaki, Kazuhiro,
"Common Mode Radiation of a Printed Circuit Board with Embedded Decoupling
Capacitor Excited by IC's Shoot-Through Current," 1st Electronics
Systemintegration Technology Conference, Volume 1, Dresden, Germany,
Sept. 5-7, 2006, pp. 67-72.
[1604] Sugimoto, Wataru, Yokoshima, Katsunori, Murakami, Yasushi, and Takasu, Yoshio,
"Charge storage mechanism of nanostructured anhydrous and hydrous
ruthenium-based oxides," Electrochimica Acta, vol. 52 no. 4, pp.
1742-1748, Dec. 1, 2006.
[1605] Sugimoto, Wataru, Kizaki, Takeo, Yokoshima, Katsunori, Murakami, Yasushi, and
Takasu, Yoshio,
"Evaluation of the pseudocapacitance in RuO2 with a RuO2/GC thin film
electrode," Electrochimica Acta, vol. 49 no. 2, pp. 313-320, Jan.
15, 2004.
[1606] Suh, Youngsuk, Sun, Pinping, Kim, Insung, Song, Jaesung, and Heo, Deukyoun,
"A Fast Computation Method in Frequency Domain for Power Ground Plane
Impedance Calculation Using the Mobius Transform," IEEE Transactions on
Advanced Packaging, vol. 31 no. 2, pp. 320-325, May 2008.
[1607] Sullivan, Tim,
"Choosing decoupling capacitors," Electronic Products, vol.
50 no. 7, pp. 45-46, Dec. 2007.
[1608] Sun, Li-Jie, Liu, Xiao-Xia, Lau, Kim King-Tong, Chen, Liang, and Gu, Wei-Min,
"Electrodeposited hybrid films of polyaniline and manganese oxide in
nanofibrous structures for electrochemical supercapacitor,"
Electrochimica Acta, vol. 53 no. 7, pp. 3036-3042, Feb. 25, 2008.
[1609] Sundaram, Venky,
"Embedded Passives: The Long Road to Becoming Mainstream,"
CircuiTree, vol. 21 no. 3, pp. xx-xx, Mar. 2008.
[1610] Sundaram, Venky, Tummala, Rao, Wiedenman, Boyd, Liu, Fuhan, Raj, P.
Markondeya, Abothu, Isaac Robin, Bhattacharya, Swapan, Varadarajan, Mahesh,
Bongio, Ed, and Sherwood, Walt,
"Recent Advances in Low CTE and High Density System-on-a-Package (SOP)
Substrate with Thin Film Component Integration," Proceedings 56th
Electronic Components & Technology Conference, San Diego, CA, May
30-June 2, 2006, pp. 1375-1380.
[1610d] Supriyanto, E., Schultz, I., Ullmann, M., and Goebel, H.,
"Ferroelectric Capacitor Compact Model Including Dynamic and Temperature
Behavior," Proceedings of the 13th IEEE International Symposium on
Applications of Ferroelectrics, Nara, Japan, May 28-June 1, 2002, pp.
61-64.
[1611] Suryakumar, Mahadevan, Cui, Wei, Parmar, Prashant, Carlson,
Christopher, Fishbein, Bruce, Sheth, Upendra, and Morgan, John,
"Power Delivery Validation Methodology and Analysis for Network Processors,"
54th Electronic Components & Technology Conference, Volume
1, Las Vegas, NV, June 1-4, 2004, pp. 589-592.
[1612] Suryakumar, Mahadevan, and He, Jiangqi,
"Power Delivery Validation of Processor Front Side Bus," 2005
Proceedings 55th Electronic Components & Technology Conference, Volume 1
, Orlando, FL, May 31-June 3, 2005, pp. 746-750.
[1613] Swager, Anne Watson,
"Applying basic grounding principles keeps demons at bay,"
EDN, Nov. 23, 1994.
[1614] Swainson, A. J. G.,
"Radiated Emission, Susceptibility and Crosstalk Control on Ground Plane
Printed Circuit Boards," Electromagnetic Compatibility, York, UK,
Aug. 28-31, 1990, pp. 37-41.
[1615] Swaminathan, Madhavan, and Engin, A. Ege,
"Modeling of Signal and Power Integrity in System on Package Applications,"
IEEE International Symposium on Electromagnetic Compatibility
, Honolulu, HI, July 8-13, 2007, pp. xx-xx.
[1616] Swaminathan, Madhavan, Kim, Joungho, Novak, Istvan, and Libous,
James P.,
"Power Distribution Networks for System-on-Package: Status and Challenges,"
IEEE Transactions on Advanced Packaging, vol. 27 no. 2, pp.
286-300, May 2004.
[1617] Swirbel, Tom, Naujoks, Adolph, and Watkins, Mike,
"Electrical Design and Simulation of High Density Printed Circuit Boards,"
IEEE Transactions on Advanced Packaging, vol. 22, no. 3, pp.
416-423, Aug. 1999.
[1618] Symes, Walt, Chu, Mike, Davis, Everette, and Capurso, Joseph,
"Development of Second Generation, Pb Free, Ultra Low Fire (< 1000C), High
Voltage, X7(8)R Dielectric Formulations," CARTS 2007 Symposium
Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 51-58.
[1619] Tabor, Donald A.,
"Solid Tantalum Capacitor Failure Modes and Analysis," 8th Annual
Reliability Physics Symposium, Las Vegas, NV, Apr. 7-10, 1970, pp.
233-237.
[1620] Taguchi, Yutaka, Itagaki, Minehiro, Inoue, Osamu, Kato, Jun-ichi, and
Eda, Kazuo,
"High Frequency Performance of Integral Capacitors in Cofired Ceramic
Substrates," 2000 Proceedings 50th Electronic Components & Technology
Conference, Las Vegas, NV, May 21-24, 2000, pp. 454-458.
[1621] Taher, Omar Al, and England, Chris,
"The Effect of Silver Polymer Termination on the Equivalent Series Resistance
of High Voltage Ceramic Capacitors," CARTS 2007 Symposium
Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 193-204.
[1622] Takada, Daisuke, Ishijima, Masaya, and Murayama, Yuji,
"Development of "NeoCapacitor," a High-Voltage Functional Polymer Tantalum
Capacitor," NEC Technical Journal, vol. 1 no. 5, pp. 63-67,
Dec. 2006.
[1623] Takahashi, Kenichi, Inoue, Takeo, Nagasawa, Toshihisa, and Sekiguchi,
Yoshinori,
"Development and Mass-Production of the New "Proadlizer" Decoupling Device,"
NEC Technical Journal, vol. 1 no. 5, pp. 57-62, Dec. 2006.
[1623d] Takahashi, Tetsuhiro, Nakano, Yuichi, Shoji, Hironari, Matsushita, Haruhiko,
Ogawa, Hiroshi, Onoe, Akira, Kanai, Hideyuki, and Yamashita, Yohachi,
"Effects of additives on the sintering behavior of the Ni internal electrode
of BaTiO3-based multilayer ceramic capacitors," Proceedings of the
Eleventh IEEE International Symposium on Applications of Ferroelectrics
, Montreux, Switzerland, Aug. 24-27, 1998, pp. 575-578.
[1624] Takken, Todd, and Tuckerman, David,
"Integral Decoupling Capacitance Reduces Multichip Module Ground Bounce,"
Proceedings 1993 IEEE Multi-Chip Module Conference, Santa Cruz,
CA, Mar. 15-18, 1993, pp. 79-84.
[1625] Tanahashi, Mike,
"Low ESR, Small Size Drive Big Demand for Ni-MLCCs," ECN, pp.
85-86, Feb. 2000.
[1626] Tanaka, Hironori, Nagata, Takashi Kariya Hiroyasu, Yoshikawa, Kazuhiro,
Shimizu, Keisuke, Noguchi, Hidetoshi, and Kato, Shinobu,
"Embedded High-k Thin Film Capacitor in Organic Package," 2008 10th
Electronics Packaging Technology Conference, Singapore, Dec. 9-12,
2008, pp. 988-993.
[1627] Tang, Bin, Zhang, Shu-Ren, Yuan, Ying, Yang, Lin-Bo, and Zhou,
Xiao-Hua,
"Influence of tetragonality and secondary phase on the Curie temperature for
barium titanate ceramics," Journal of Materials Science: Materials in
Electronics, vol. xx no. xx, pp. xx-xx, xxxx.
[1628] Tang, George,
"Surface Mount Capacitor Loop Inductance Calculation and Minimization,"
1998 IEEE EMC Symposium Record Volume One, Denver, CO, Aug.
24-28, 1998, pp. 505-510.
[1629] Tang, Jin-Long, Zhu, Jun, Qin, Wen-Feng, Xiong, Jie, and Li, Yan-Rong,
"Structure and dielectric characteristics of epitaxially strained BaTiO3 thin
films," Journal of Materials Science: Materials in Electronics,
vol. xx no. xx, pp. xx-xx, xxxx.
[1630] Tarvainen, Timo,
"Simplified Modeling of Parallel Plate Resonances on Multilayer Printed
Circuit Boards," IEEE Transactions on Electromagnetic
Compatibility, vol. 42, no. 3, pp. 284-289, Aug. 2000.
[1631] Tashima, Daisuke, Taniguchi, Mitsufumi, Fujikawa, Daisuke, Kijima, Tsuyoshi,
and Otsubo, Masahisa,
"Performance of electric double layer capacitors using nanocarbons produced
from nanoparticles of resorcinol-formaldehyde polymers," Materials
Chemistry and Physics, vol. 115 no. 1, pp. 69-73, May 15, 2009.
[1632] Taylor, Greg, Deutschle, Craig, Arabi, Tawfik, and Owens, Brian,
"An Approach to Measuring Power Supply Impedance of Microprocessors,"
Proceedings 10th Topical Meeting on Electrical Performance of Electronic
Packaging , Cambridge, MA, Oct. 29-31, 2001, pp. 211-214.
[1632d] Teowee, G., Quackenbush, E. L., Baertlein, C. D., Boulton, J. M., and
Uhlmann, D. R.,
"Fatigue and Retention Behaviors of Pt-PZT-Metal Capacitors with Various Top
Metallizations," Proceedings of the Ninth IEEE International Symposium
on Applications of Ferroelectrics, University Park, PA, Aug. 7-10,
1994, pp. 523-526.
[1633] Terzulli, Gilles, and Peace, Billy W.,
"Film Technology To Replace Electrolytic Technology," Proceedings of
the 25th Symposium for Passive Components, Palm Springs, CA, Mar.
21-24, 2005, pp. 71-77.
[1634] Teverovsky, Alexander,
"Effect of Compressive Stresses on Performance and Reliability of Chip
Tantalum Capacitors," CARTS Europe 2007, Barcelona, Spain,
Oct. 29-Nov. 1, 2007, pp. xx-xx.
[1635] Teverovsky, Alexander,
"Effect of Inductance and Requirements for Surge Current Testing of Tantalum
Capacitors," 2006 CARTS Conference Proceedings, Orlando, FL,
Apr. 3-6, 2006, pp. xx-xx.
[1636] Teverovsky, Alexander,
"Effect of Mechanical Stresses on Characteristics of Chip Tantalum
Capacitors," IEEE Transactions on Device and Materials Reliability
, vol. 7 no. 3, pp. 399-406, Sept. 2007.
[1637] Teverovsky, Alexander,
"Effect of Surge Current Testing on Reliability of Solid Tantalum Capacitors,"
CARTS USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20,
2008, pp. xx-xx.
[1638] Teverovsky, Alexander,
"Effect of Temperature Cycling and Exposure to Extreme Temperatures on
Reliability of Solid Tantalum Capacitors," CARTS 2007 Symposium
Proceedings, Albuquerque, NM, Mar. 26-29, 2007, pp. 279-306.
[1638d] Teverovsky, Alexander,
"Scintillation Breakdowns and Reliability of Solid Tantalum Capacitors,"
IEEE Transactions on Device and Materials Reliability, vol. 9
no. 2, pp. 318-324, June 2009.
[1639] Thomason, Chris, Morgan, Julie, Schaper, Leonard, Ulrich, Richard, and
Burkett, Susan,
"High Capacitance Density Multilayer Integrated Tantalum Pentoxide Decoupling
Capacitors," Proceedings of CARTS-Europe 2005, Prague, Czech
Republic, Oct. 17-20, 2005, pp. 36-42.
[1640] Thomason, Chris, Schaper, Len, Morgan, Julie, Burkett, Susan, and Ulrich,
Richard,
"High Capacitance Density Thin Film Integrated Tantalum Pentoxide Decoupling
Capacitors," 2005 Proceedings 55th Electronic Components &
Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp.
779-782.
[1641] Thompson, Joe,
"Decoupling Strategies for PCBs," Printed Circuit Design &
Manufacture, vol. 20, no. 10, pp. 26-34, Oct. 2003.
[1642] Tisani, Mohamad,
"Solutions to Current High-Speed Board Design," Pericom Application Note 22,
Feb. 9, 2000.
[1642d] Toal, F. J., Dougherty, J. P., and Randall, C. A.,
"Integrated Varistor-Capacitor Ceramics," Proceedings of the Tenth IEEE
International Symposium on Applications of Ferroelectrics, Volume 2,
East Brunswick, NJ, Aug. 18-21, 1996, pp. 593-596.
[1643] Tohya, Hirokazu, Masuda, Koichiro, Shimizu, Hideki, and Wakabayashi,
Yoshiaki,
"Low Impedance Line Structure Component (LILC) for Power Distribution Dystem
in the High-Performance Digital Circuit," Southwest Symposium on
Mixed-Signal Design, 2003, pp. 60-65.
[1643d] Topper, Michael, Fischer, Thorsten, Zang, Marcus, Teipel, Ulrich,
Fehrenbacher, Ulrich, and Reichl, Herbert,
"BCB with nano-Filled BaSrTiO3 for Thin Film Capacitors," 59th
Electronic Components & Technology Conference, San Diego, CA, May
26-29, 2009, pp. 784-792.
[1644] Tran, Thanh,
"OMAP5910 Decoupling/Filtering Techniques," Texas Instruments Application
Report SPRA906, Apr. 2003.
[1645] Travis, Bill,
"Powering the big microprocessors," EDN, Aug. 15, 1997.
[1646] Travis, Bill,
"Use local bypass capacitors to meet rigorous high-speed- system demands,"
EDN, Jan. 5. 1995.
[1647] Trinh, Hung V., Devoe, Daniel F., Devoe, Alan D., Trinh, Mary L., and
Petkova, Maria,
"MLC Discoidal Capacitors for EMI-RFI Filters Employing Non-Overlapping
Electrodes Yield Substantial Performance Improvements," Proceedings
of the 25th Symposium for Passive Components, Palm Springs, CA, Mar.
21-24, 2005, pp. 208-215.
[1648] Trinkle, Joe, and Cantoni, Antonio,
"Comparison of Methods for Calculating the Loading effect of Capacitors on
Power Ground Planes," 17th International Zurich Symposium on
Electromagnetic Compatibility, Singapore, Feb. 27-Mar. 3, 2006, pp.
97-99.
[1649] Trinkle, Joe, Tiedemann, Roland, and Cantoni, Antonio,
"Coupling between Power Supply Zones," 2002 IEEE International Symposium
on Electromagnetic Compatibility Symposium Record - Volume 2 ,
Minneapolis, MN, Aug. 19-23, 2002, pp. 615-620.
[1650] Trinkle, Joe, Cantoni, Antionio, and Fynn, Kevin,
"Efficient Impedance Calculation of Loaded Power Ground Planes,"
Electromagnetic Compatibility 2003, Zurich, Switzerland, Feb.
18-20, 2003, pp. 285-290.
[1651] Trinkle, Joe, and Cantoni, Antonio,
"Impedance Analysis of Power Ground Planes Loaded with Multiple Capacitors,"
16th International Zurich Symposium on Electromagnetic Compatibility
, Zurich, Switzerland, Feb. 13-18, 2005, pp. 257-262.
[1652] Trinkle, Joe, and Cantoni, Antonio,
"Single Summation Expression for the Rectangular Power Ground Plane Cavity,"
16th International Zurich Symposium on Electromagnetic Compatibility
, Zurich, Switzerland, Feb. 13-18, 2005, pp. 247-250.
[1653] Tripp, Scot,
"BestCap a New Dimension in "Fast" Supercapacitors," AVX.
[1654] Trobough, Doug,
"Trend in PCB Materials," Printed Circuit Design, vol. 18, no.
6, pp. 17-20, June 2001.
[1655] Tsai, Chia-Ling, and Wu, Tzong-Lin,
"An Efficient FDTD Approach of Modeling Power-Delivery-Planes with SMT
Decoupling Capacitors," 2003 IEEE Symposium on Electromagnetic
Compatibility Symposium Record, Volume 2 , Boston, MA, Aug. 18-22,
2003, pp. 581-584.
[1656] Tsai, Hsiao-Ping,
"Impact of High Impedance Mid-Frequency Noise on Power Delivery,"
Proceedings of the 12th Topical Meeting on Electrical Performance of
Electronic Packaging, Princeton, NJ, Oct. 27-29, 2003.
[1657] Tsai, Ming-Liao, and Lin, Hsiu-Yui,
"Electrolyte for Aluminum Electrolyte Capacitor - Effect of Carbohydrates,"
Journal of the Chinese Institute of Engineers, vol. 29 no. 1, pp.
153-158, Jan. 2006.
[1658] Tsai, T. L., Sawasaki, A., Tsai, M. T., and Shiao, F. T.,
"Synthesis Technique of Advanced BaTiO3 Powders for High Cap. MLCC Products,"
CARTS Asia 2007 Proceedings, Taipei, Taiwan, Oct. 9-13,
2007, pp. xx-xx.
[1659] Tsubouchi, Toshiro,
"Filtering DC power supply lines for high speed digital ICs,"
Interference Technology EMC Test & Design Guide 2003, pp.
56-60, 2003.
[1659b] Tsurumi, T., Hoshina, T., Takizawa, K., and Kakemoto, H.,
"Size Effect of Barium Titanate and MLCCs in the Next Generation," 17th
IEEE International Symposium on the Applications of Ferroelectrics, Volume 1
, Santa Fe, NM, Feb, 23-28, 2008, pp. xx-xx.
[1659d] Tummala, Rao R., and Eggerding, Carl L.,
"Ceramics Packaging with Ferroelectric Decoupling Capacitor," IEEE 7th
International Symposium on Applications of Ferroelectrics, June 6-8,
1990, pp. 28-30.
[1660] Ueno, Osamu, Iguchi, Daisuke, Arakaki, Hitoshi, Ito, Hisao, and Ozawa,
Takashi,
"Three-dimensional Noise Current Distribution on Power and Ground Planes in
Printed Circuit Boards," 1998 IEEE EMC Symposium Record Volume
Two, Denver, CO, Aug. 24-28, 1998, pp. 1136-1141.
[1661] Ulrich, Richard, Schaper, Len, Nelms, David, and Leftwich, Matt,
"Comparison of Paraelectric and Ferroelectric Materials for Applications as
Dielectrics in Thin Film Integrated Capacitors," The International
Journal of Microcircuits and Electronic Packaging, vol. 23 no. 2, pp.
172-180, Second Quarter 2000.
[1662] Ulrich, Richard, and Schaper, Leonard,
"Decoupling with Embedded Capacitors," CircuiTree, vol. 16
no. 7, pp. xx, July 2003.
[1663] Ulrich, Richard, and Schaper, Leonard,
"Decoupling with Embedded Capacitors," CircuiTree, vol. 16
no. 7, pp. xx, July 2003.
[1664] Ulrich, Richard,
"Embedded Passives Update," Circuitree, vol. 19 no. 9, pp.
xx-xx, Sept. 2006.
[1665] Ulrich, R. K., Brown, W. D., Ang, S. S., Barlow, F. D., Elshabini,
A., Lenihan, T. G., Naseem, H. A., Nelms, D. M., Parkerson, J., Schaper, L.
W., Morcan, G.,
"Getting Aggressive with Passive Devices," IEEE Circuits & Devices, vol. 16,
no. 5, pp. 16-25, Sept. 2000.
[1665d] Ulrich, Richard,
"Matching embedded capacitor dielectrics to applications," Circuit World
, vol. 30 no. 1, pp. 20-24, 2004.
[1666] Ulrich, Richard, and Schaper, Len,
"Materials Options for Dielectrics in Integrated Capacitors," 2000
International Symposium on Advanced Packaging Materials, location?, date?
2000, pp. 38-43.
[1667] Ulrich, Richard, and Schaper, Leonard,
"Putting Passives in Their Place," IEEE Spectrum, vol. 40, no.
7, pp. 26-30, July 2003.
[1668] Umeri, Andrea, Kuku, Titilayo Adelaja, Scuor, Nicola, and Sergo,
Valter,
"Raman investigation of the ageing of Ni-BaTiO3 multilayer ceramic
capacitors," Journal of Materials Science, vol. 43 no. 3, pp.
922-926, Feb. 2008.
[1669] Underwood, Stephen J.,
"DC-DC Converters Suppress EMI: Minimizing EMI at its Source."
[1670] Val, Christian M. and Martin, Jacques E.,
"A New Chip Carrier for High Performance Applications: Integrated Decoupling
Capacitor Chip Carrier (IDCCC)," IEEE Transactions on Components,
Hybrids, and Manufacturing Technology, vol. CHMT-6, no. 3, pp.
290-297, Sept. 1983.
[1670d] Vasanthi, Rajaraman, Kalpana, Dharmalingan, and Renganathan, Nedumaram
Gopalan,
"Olivine-type nanoparticle for hybrid supercapacitors," Journal of Solid
State Electrochemistry, vol. 12 no. 7-8, pp. 961-969, Aug. 2008.
[1671] Vasina, P., Zednicek, T., Sikula, J,m and Pavelka, J.,
"Failure Modes of Tantalum Capacitors Made by Different Technologies,"
AVX.
[1671d] Venigalla, S., Bendale, P., Chodelka, R. E.. Adair, J. H.. and Costantino, S.
A.,
"Preparation and Characterization of Barium Titanate Electrolytic Capacitors
by Anodic Oxidation of Porous Titanium Bodies," Proceedings of the
Eighth IEEE International Symposium on Applications of Ferroelectrics,
Greenville, SC, Aug. 30-Sept. 2, 1992, pp. 89-93.
[1672] Venkat, Narayanan, McNier, Victor K., Tsao, Bang-Hung, Dang, Thuy D., DeCerbo,
Jennifer N., and Stricker, Jeffery T.,
"High Performance Polymer Film Dielectrics for Air Force Wide-Temperature
Power Electronics Applications," CARTS USA 2009 Proceedings,
Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[1673] Vetter, Harald,
"Mission Profile Based PCC Design for Integration into HEV Converter,"
CARTS Asia 2006, Taipei, Taiwan, Oct. 9-11, 2006, pp. xx-xx.
[1674] Vetter, Harald,
"Mission Profile based PCC Design for Integration into HEV-Converter,"
CARTS-Europe 2006 Proceedings, Bad Homburg, Germany, Sept. 25-28,
2006, pp. xx-xx.
[1675] Vlemincq, Louis,
""AC Vias" Can Improve Decoupling," Electronic Design, vol.
51, no. 9, pp. 56, Apr. 28, 2003.
[1676] Vogel, Martin, and Cole, Brad,
"Power-integrity and ground-bounce simulation of high-speed pc boards,"
EDN, vol. 48, no. 20, pp. 83-88, Sept. 18, 2003.
[1677] Vogel, Martin, and Cole, Brad,
"Power Integrity and Ground Bounce Simulation of High Speed PCBs."
[1678] Voss, Bernard,
"BGA Power Delivery Routing," Printed Circuit Design, vol. 19,
no. 9, pp. 32, 39, Sept. 2002.
[1679] Voss, Bernard, and Goedecke, Stephanie,
"The Layout of Mixed-Signal PCBs for PCB Design."
[1679d] Vu-Quoc, Loc, and Srinivas, Vinay,
"A New Methodology to obtain Accurate Models for Ferroelectrics with
Application to BaTiO3," IEEE Transactions on Dielectrics and Electrical
Insulation, vol. 1 no. 2, pp. 196-212, Apr. 1994.
[1680] Wada, Hajime, Nohara, Shinji, Furukawa, Naoji, Inoue, Hiroshi, Sugoh, Nozomu,
Iwasaki, Hideharu, Morita, Masayuki, and Iwakura, Chiaki,
"Electrochemical characteristics of electric double layer capacitor using
sulfonated polypropylene separator impregnated with polymer hydrogel
electrolyte," Electrochimica Acta, vol. 49 no. 27, pp. 4871-4875,
Oct. 2004.
[1681] Waizman, Alex, Vikinski, Omer, and Sizikov, Gregory.
"CPU Power Delivery Impedance Profile Resonances Impact on Core FMAX,"
15th Topical Meeting on Electrical Performance of Electronic Packaging,
Scottsdale, CA, Oct. 23-25, 2006, pp. 119-122.
[1682] Waizman, Alex,
"CPU Power Supply Impedance Profile Measurement Using FFT and Clock Gating, "
Proceedings of the 12th Topical Meeting on Electrical Performance of
Electronic Packaging, Princeton, NJ, Oct. 27-29, 2003, pp. 29-32.
[1683] Waizman, Alex, and Chung, Chee-Yee,
"Extended Adaptive Voltage Positioning (EAVP)," Proceedings of the IEEE
9th Topical Meeting on Electrical Performance of Electronic Packaging,
Scottsdale, AZ, Oct. 23-25, 2000, pp. 65-68.
[1684] Waizman, Alex, and Chung, Chee-Yee,
"Package Capacitors Impact on Microprocessor Maximum Operating Frequency,"
2001 Proceedings 51st Electronic Components & Technology
Conference, Orlando, FL, May 29-June 1, 2001, pp. 118-122.
[1685] Waizman, Alex, and Chung, Chee-Yee,
"Resonant Free Power Network Design Using Extended Adaptive Voltage
Positioning (EAVP) Methodology," IEEE Transactions on Advanced
Packaging, vol. 24, no. 3, pp. 236-244, Aug. 2001.
[1686] Walker, G. A.,
"Failure Analysis of Multilayer Ceramic Substrates," 18th Annual
Reliability Physics Symposium, Las vegas, NV, Apr. 8-10, 1980, pp.
227-231.
[1687] Wan, Chuanyun, Azumi, Kazuhisa, and Konno, Hidetaka,
"Hydrated Mn(IV) oxide-exfoliated graphite composites for electrochemical
capacitor," Electrochimica Acta, vol. 52 no. 9, pp. 3061-3066,
Feb. 15, 2007.
[1688] Wan, Lixi, Raj, P. Markondeya, Swaminathan, M., and Tummala, R.,
"Design, Simulation and Measurement Techniques for Embedded Decoupling
Capacitors in Multi-GHz Packages/PCBs," 2005 6th International
Conference on Electronic Packaging Technology, Dameisha, Shenzhen,
China, Aug. 30-Sept. 2, 2005, pp. 108-112.
[1689] Wan, Lixi. Raj, P. Markondeya, Balaraman, Devarajan, Muthana, Pratap,
Bhattacharya, Swapan K., Varadarajan, Mahesh, Abothu, Isaac Robin,
Swaminathan, Madhavan, and Tummala, Rao,
"Embedded Decoupling Capacitor Performance in High Speed Circuits," 2005
Proceedings 55th Electronic Components & Technology Conference, Volume 2
, Orlando, FL, May 31-June 3, 2005, pp. 1617-1622.
[1690] Wang, Chen, Mao, Jingkun, Selli, Giuseppe, Luan, Shaofeng, Zhang, Lin, Fan,
Jun, Pommerenke, David J., DuBroff, Richard E., and Drewniak, James L.,
"An Efficient Approach for Power Delivery Network Design With Closed-Form
Expressions for Parasitic Interconnect Inductances," IEEE Transactions
on Advanced Packaging, vol. 29 no. 2, pp. 320-334, May 2006.
[1690d] Wang, Chen-Chao, Kuo, Chih-Wen, Wu, Sung-Mao, Cheng, Hung-Hsiang, Chiu,
Chi-Tsung, and Hung, Chih-Pin,
"A Novel Time-Domain Approach for Extracting Broadband Models of Power
Delivery Networks With Resonance Effect," IEEE Transactions on Advanced
Packaging, vol. 32 no. 3, pp. 636-643, Aug. 2009.
[1691] Wang, Chen-Chao, Kuo, Chih-Wen, Cheng, Hung-Hsiang, Chiu, C. T., and Hung, C.
P.,
"Synthesizing SPICE-Compatible Models of Power Delivery Networks with
Resonance Effect by Time-Domain Waveforms," 2008 Proceedings 58th
Electronic Components &, Technology Conference, Lake Buena Vista,
FL, May 27-30, 2008, pp. 1799-1803.
[1692] Wang, Chen-Ching, and Hu, Chi-Chang,
"Electrochemical and textural characterization of binary Ru-Sn oxides
synthesized under mild hydrothermal conditions for supercapacitors,"
Electrochimica Acta, vol. 50 no. 13, pp. 2573-2581, Apr. 30, 2005.
[1692d] Wang, Jinzhao, Zhang, Tianjin, Zhang, Baishun, Jiang, Juan, Pan, Ruikun, and
Ma, Zhijun,
"Interfacial characteristic of (Ba,Sr)TiO3 thin films deposited on different
bottom electrodes," Journal of Materials Science: Materials in
Electronics, vol. xx no. x, pp. xx-xx, xxxx.
[1693] Wang, Lihong, Morishita, Takahiro, Toyoda, Masahiro, and Inagaki, Michio,
"Asymmetric electric double layer capacitors using carbon electrodes with
different pore size distributions," Electrochimica Acta, vol. 53
no. 2, pp. 882-886, Dec. 1, 2007.
[1694] Wang, Pei, Raghuveer, M. R., McDermid, W., and Bromley, J. C.,
"A Digital Technique for the On-line Measurement of Dissipation Factor and
Capacitance," IEEE Transactions on Dielectrics and Electrical Insulation
, vol. 8 no. 2, pp. 228-232, Apr. 2001.
[1694d] Wang, Shuang, Su, Hao, Chen, Liying, and Yuan, Haiyi,
"Effect of Pb(Ti, Sn)O3 on the dielectric properties of high dielectric
constant X8R BaTiO3-based ceramics," Journal of Materials Science:
Materials in Electronics, vol. xx no. x, pp. xx-xx, xxxx.
[1695] Wang, Ting-Yuan, Tsai, Jeng-Liang, and Chen, Charlie Chung-Ping,
"Thermal and Power Integrity based Power/Ground Networks Optimization,"
Proceedings of the Design, Automation and Test in Europe Conference and
Exhibition, Volume 2, Paris, France, February, 16-20, 2004, pp.
20830-20835.
[1696] Wang, X. X., Chen, W. P., Chan, H. L. W., and Choy, C. L.,
"H2O-induced degradation in TiO2-based ceramic capacitors," Materials
Letters, vol. 57 no. 28, pp. 4351-4355, Oct. 2003.
[1696d] Wang, Xiao-feng, Ruan, Dian-bo, and You, Zheng,
"Application of spherical Ni(OH)2/CNTs composite electrode in asymmetric
supercapacitor," Transactions of Nonferrous Metals Society of China
, vol. 16 no. 5, pp. 1129-1134, Oct. 2006.
[1697] Wang, Xiaopeng, Yao, Ruoping, and Rao, Fangquan,
"Subsystem-Interaction Restraint in the Two-Stage DC Distributed Power Systems
with Decoupling-Controlled-Integration Structure," IEEE Transactions on
Industrial Electronics, vol. 52 no. 6, pp. 1555-1563, Dec. 2005.
[1698] Wang, Yong-Gang, Wang, Zi-Dong, and Xia, Yong-Yao,
"An asymmetric supercapacitor using RuO2/TiO2 nanotube composite and activated
carbon electrodes," Electrochimica Acta, vol. 50 no. 28, pp.
5641-5646, Sept. 20, 2005.
[1699] Wang, Zhi Liang, Wada, Osami, Toyota, Yoshitaka, and Koga, Ryuji,
"Application of Segmentation Method to Analysis of Power/Ground Plane
Resonance in Multilayer PCBs," reference?, location?, date?, pp. 775-778.
[1700] Wang, Zhi Liang, Wada, Osama, and Koga, Ryuji,
"Modeling of Gapped Power Bus Structures for Isolation Using Cavity Modes,"
2003 IEEE Symposium on Electromagnetic Compatibility Symposium Record,
Volume 1, Boston, MA, Aug. 18-22, 2003, pp. 10-15.
[1701] Wang, Z. L., Wada, O., Toyota, Y., and Koga, R.,
"Power Bus Resonance Characteristics in Multilayer Printed Circuit Boards with
Slits," Electromagnetic Compatibility 2003, Zurich, Switzerland,
Feb. 18-20, 2003, pp. 23-28.
[1702] Watanabe, Takayuki, Srinivasan, Krishna, Asai, Hideki, and Swaminathan,
Madhavan,
"Modeling of Power Distribution Networks with Retardation Using the
Transmission Matrix Method," IEEE 13th Topical Meeting on Electrical
Performance of Electronic Packaging, Portland, OR, Oct. 25-27, 2004,
pp. 233-236
[1703] Watanabe, Takayuki, Tanji, Yuichi, Kubota, Hidemasa, and Asai, Hideki,
"Parallel-Distributed Time-Domain Circuit Simulation of Power Distribution
Networks with Frequency-Dependent Parameters," Asia and South Pacific
Conference on Design Automation, Yokohama, Japan, Jan. 24-27, 2006,
pp. 832-837.
[1704] Watson, J. K., and Tantri, H.,
"Characterization of Capacitor Parasitics," IEEE Southeastcon
'83, Orlando, FL, Apr. 11-14, 1983, pp. 27-30.
[1705] Wei, Chen, Xiaogang, Wang, Bin, Liu, Wenyu, Shang, Qingfeng, Liu, and
Shoutian, Chen,
"Dielectric Loss of BaTiO3-based High Voltage Ceramic Capacitor under High
Field Strength," Proceedings of 1998 International Symposium on
Electrical Insulating Materials, Toyohashi, Japan, Sept. 27-30, 1998,
pp. 121-122.
[1705b] Wei, Te-Yu, Chen, Chun-Hung, Chien, Hsing-Chi, Lu, Shih-Yuan, and Hu,
Chi-Chang,
"A Cost-Effective Supercapacitor Material of Ultrahigh Specific Capacitances:
Spinel Nickel Cobaltite Aerogels from an Epoxide-Driven Sol-Gel Process,"
Advanced Materials, vol. xx no. xx, pp. xx-xx, xxxx.
[1705d] Wei, Te-Yu, Chen, Chun-Hung, Chang, Kuo-Hsin, Lu, Shih-Yuan, and Hu,
Chi-Chang,
"Cobalt Oxide Aerogels of Ideal Supercapacitive Properties Prepared with an
Epoxide Synthetic Route," Chemistry of Materials, vol. 21 no. 14,
pp. 3228-3233, July 28, 2009.
[1706] Wei, Xing Chang, Li, Er Ping, Liu, En Xiao, and Vahldieck, R.,
"Efficient Simulation of Power Distribution Network by Using Integral-Equation
and Modal-Decoupling Technology," IEEE Transactions on Microwave Theory
and Techniques, vol. 56 no. 10, pp. 2277-2285, Oct. 2008.
[1707] Weir, Ralph, and Frantz, Gene,
"Guidelines for Using Decoupling Capacitors on DSP Designs," Texas
Instruments Application Brief SPRA230, June 1993.
[1708] Weir, Steve,
"Accurate Capacitor Inductance Extraction from S21 Measurements," X2Y
Application Note 1014, v. 1, 10/27/04.
[1709] Weir, Steve,
"Application of X2Y Capacitors in Power Delivery Networks," IEEE RTP
Chapter, Apr. 1, 2008.
[1710] Weir, Steve,
"Bypass Capacitor Inductance, Data Sheet Simplicity to Practical Reality,"
Teraspeed Consulting Group.
[1711] Weir, Steve,
"Bypass Filter Design Considerations for Modern Digital Systems, A Comparative
Evaluation of the Big "V", Multi-pole, and Many Pole Bypass Strategies,"
DesignCon East 2005, Worchester, MA, Sept. 19-21, 2005, pp.
xx-xx.
[1712] Weir, Steve,
"Considerations for Capacitor Selection in FPGA Designs,"
Proceedings of the 25th Symposium for Passive Components, Palm Springs,
CA, Mar. 21-24, 2005, pp. 57-64.
[1713] Weir, Steve,
"Considerations for Capacitor Selection in FPGA Designs (Presentation),"
Proceedings of the 25th Symposium for Passive Components, Palm
Springs, CA, Mar. 21-24, 2005, pp. xx-xx.
[1714] Weir, Steve,
"Does Position Matter? Locating Bypass Capacitors for Effective Power
Distribution," Teraspeed Consulting Group, 2005.
[1715] Weir, Steve, and McMorrow, Scott,
"High Performance FPGA Bypass Networks," DesignCon 2005,
Santa Clara, CA, Jan. 31-Feb. 3, 2005, pp. xx-xx.
[1716] Weir, Steve, and McMorrow, Scott,
"High Performance FPGA Bypass Networks (Presentation)," DesignCon
2005, Santa Clara, CA, Jan. 31-Feb. 3, 2005, pp. xx-xx.
[1717] Weir, Steve,
"Impact of PCB Stack-up and Capacitor Via Design In Power Distribution
Design," IEEE EMC Society SCV Meeting, Feb. 14, 2006.
[1718] Weir, Steve,
"Measurement and comparative S21 performance of raw and mounted decoupling
capacitors," Interference Technology, pp. 72, 74-77, EMC
Design & Test Guide 2004.
[1719] Weir, Steve, and Dagostino, Tom,
"PCB Power Delivery Optimizations for the Cost Driven Era,"
DesignCon 2009, Santa Clara, CA, Feb. 2-5, 2009, pp. xx-xx.
[1720] Weir, Steve, and Dagostino, Tom,
"PCB Power Delivery Optimizations for the Cost Driven Era (Presentation),"
DesignCon 2009, Santa Clara, CA, Feb. 2-5, 2009, pp. xx-xx.
[1721] Weir, Steve,
"X2Y Capacitors for Instrumentation Amplifier RFI Suppression," X2Y
Application Note 2008, v. 3.0, 4/28/05.
[1722] Weir, Steve,
"X2L FPGA SerDes Bypass," X2Y Attenuators, Dec. 11, 2008.
[1722d] Westerlund, Svante, and Ekstam, Lars,
"Capacitor Theory," IEEE Transactions on Dielectrics and Electrical
Insulation, vol. 1 no. 5, pp. 826-839, Oct. 1994.
[1723] Whittle, Ben, Greenhill, Dave, Adams, Kerry, and Cocker, John,
"A New Polymeric Carbon Undercoat for Improved Leakage Current Performance of
Tantalum Capacitors," CARTS-Europe 2004, Nice, France, Oct.
18-21, 2004, pp. 9-14.
[1724] Williams, Jim, and Owen, Todd,
"LDO noise testing depends on filters," Electronic Engineering
Times, pp. 118,136, Sept. 11, 2000.
[1725] Williams, Jim,
"Switching-regulator design lowers noise to 100 æV," EDN,
Dec. 4, 1997.
[1726] Williamson, Tom,
"Designing Microprocessor Systems for Electrically Noisy Environments," Intel
Application Note AP-125, Dec. 1993.
[1726d] Windlass, Hitesh, Raj, P. Markondeya, Balaraman, Devarajan,
Bhattacharya, Swapan K., and Tummala, Rao R.,
"Colloidal Processing of Polymer Ceramic Nanocomposite Integral
Capacitors," IEEE Transactions on Electronics Packaging
Manufacturing, vol. 26 no. 2, pp. 100-105, Apr. 2003.
[1726h] Windlass, Hitesh, Raj, P. Markondeya, Balaraman, Devarajan, Bhattacharya,
Swapan K., and Tummala, Rao R.,
"Polymer-Ceramic Nanocomposite Capacitors for System-On-Package (SOP)
Applications," IEEE Transactions on Advanced Packaging, vol. 26
no. 1, pp. 10-16, Feb. 2003.
[1726l] Windlass, Hitesh, Raj, P. Markondeya, Balaraman, Devarajan, Bhattacharya,
Swapan K., and Tummala, Rao R.,
"Processing of Polymer-Ceramic Nanocomposites for System-On-Package
Applications," 2001 Proceedings 51st Electronic Components &
Technology Conference, Orlando, FL, May 29-June 1, 2001, pp. 1201-1206.
[1727] Winsor IV, Paul, Lobo, Edward, Zafar, M., Munshi, A., and Ibrahim, Ayad,
"New Polymer Dielectric For High Energy Density Film Capacitors,"
CARTS USA 2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp.
xx-xx.
[1728] Wojewoda, Leigh E., Hill, Michael J., Radhakrishnan, Kaladhar, and Goyal,
Nitin,
"Use Condition Characterization of MLCCs," IEEE Transactions on Advanced
Packaging, vol. 32 no. 1, pp. 109-115, Feb. 2009.
[1729] Won, H. I., Nersisyan, H. H., and Won, C. W.,
"Combustion synthesis-derived tantalum powder for solid-electrolyte
capacitors," Journal of Alloys and Compounds, vol. 478 no. 1-2,
pp. 716-720, June 10, 2009.
[1730] Wondrak, W., Roser, R., and Bartel, W.,
"Bending Strength of Ceramic Capacitors," CARTS-Europe 2006
Proceedings, Bad Homburg, Germany, Sept. 25-28, 2006, pp. xx-xx.
[1731] Wong, Oi Ying, Tam, Wing Shan, Shea, Oi Kan, Cheung, Shiu Hung, Liu, Jun,
Kok, C. W., and Wong, H.,
"Effects of periphery encapsulation material on the characteristics of micro
vacuum dielectric capacitor," Microelectronics Reliability, vol.
49 no. 5, pp. 506-509, May 2009.
[1732] Wong, Tony,
"Choosing capacitors," Electronics World, vol. 100 no. xxxx, pp.
327-329, Apr. 1994.
[1733] Wood, Matt,
"Embedded Intelligence," PCB007, June 24, 2008.
[1734] Wu, Henry HungJen, and Meyer, Jeffrey W.,
"Accurate Power Supply and Ground Plane Pair Models," DesignCon99
High-Performance System Design Conference, Santa Clara, CA, Feb. 1-4,
1999, pp. 19-29.
[1735] Wu, Henry Hungjen, Meyer, Jeffrey W., Lee, Keunmyung, and Barber, Alan,
"Accurate Power Supply and Ground Plane Pair Models," IEEE Transactions
on Advanced Packaging, vol. 22, no. 3, pp. 259-266, Aug. 1999.
[1735d] Wu, Hsien-Chang, Lin, Yen-Po, Lee, Eric, Lin, Wen-Ting, Hu, Jui-Kai, Chen,
Hung-Chang, and Wu, Nae-Lih,
"High-performance carbon-based supercapacitors using Al current-collector with
conformal carbon coating," Materials Chemistry and Physics, vol.
117 no. 1, pp. 294-300, Sept. 15, 2009.
[1735h] Wu, Huiming, Rao, Ch. Venkateswara, and Rambabu, B.,
"Electrochemical performance of LiNi0.5Mn1.5O4 prepared by improved solid
state method as cathode in hybrid supercapacitor," Materials Chemistry
and Physics, vol. 116 no. 2-3, pp. 532-535, Aug. 15, 2009.
[1736] Wu, Kai-Bin, Shiue, Guang-Hwa, Guo, Wei-Da, Lin, Chien-Min, and Wu, Ruey-Beei,
"An Efficient and Flexible Modeling for Power/Ground Planes," 15th
Topical Meeting on Electrical Performance of Electronic Packaging,
Scottsdale, CA, Oct. 23-25, 2006, pp. 83-86.
[1737] Wu, Kai-Bin, Shiue, Guang-Hwa, Guo, Wei-Da, Lin, Chien-Min, and Wu, Ruey-Beei,
"Delaunay-Voronoi Modeling of Power-Ground Planes With Source Port
Correction," IEEE Transactions on Advanced Packaging, vol. 31 no.
2, pp. 303-310, May 2008.
[1738] Wu, Richard L. C, Kosai, H., Carter, M., Rumler, M., Fries-Carr, S., Weimer,
J., Furmaniak, T., Barshaw, E., Scozzie, S., Jow, R., Garrison, R, and
Warnock, F.,
"Diamond-Like Carbon Capacitors For High Voltage High Energy Density
Operations," Proceedings of the 25th Symposium for Passive
Components, Palm Springs, CA, Mar. 21-24, 2005, pp. 89-93.
[1739] Wu, Richard L. C., Finke, Steve, Veshinfsky, Joseph, Carter, Mark, Smith,
Eric, Lukich, S., Fries-Carr, Sandra, Weimer, Joseph, and Freeman, Marilyn,
"Diamond-Like Carbon Capacitors for High Energy Density and High Temperature
Operations," CARTS USA 2008 Proceedings, Newport Beach, CA,
Mar. 17-20, 2008, pp. xx-xx.
[1740] Wu, Ruey-Beei,
"Resistance Computations for Multilayer Packaging Structures by Applying the
Boundary Element Method," IEEE Transactions on Components, Hybrids, and
Manufacturing Technology, vol. 15, no. 1, pp. 87-96, Jan. 1992.
[1741] Wu, S. P., Gao, R. Y., and Xu, L. H.,
"Preparation of micron-sized flake copper powder for base-metal-electrode
multi-layer ceramic capacitor," Journal of Materials Processing
Technology, vol. 209 no. 3, pp. 1129-1133, Feb. 1, 2009.
[1742] Wu, Shunhua, Wang, Shuang, Chen, Liying, and Wang, Xiaoyong,
"Effect of Mn substitutions on dielectric properties of high dielectric
constant BaTiO3-based ceramic," Journal of Materials Science: Materials
in Electronics, vol. 19 no. 6, pp. 505-508, June 2008.
[1743] Wu, Sung-Mao, Jahja, Endruw, Yen, Wen-Kuan, and Wang, Jui-Wen,
"Study of Discrete Capacitor Embedded Process and Characterization Analysis in
Organic-Base Substrate," 9th Electronics Packaging Technology Conference
, Singapore, Dec. 10-12, 2007, pp. 125-129.
[1744] Wu, Tian, Jin, Xianbo, Xiao, Wei, Hu, Xiaohong, Wang, Dihua, and Chen, George
Z.,
"Thin Pellets: Fast Electrochemical Preparation of Capacitor Tantalum
Powders," Chemistry of Materials, vol. 19 no. 2, pp. 153-160,
Jan. 23, 2007.
[1744d] Wu, Z. Leo, and Raju, G. R. Govinda,
"Electrical Conduction in Fluoropolymer Films" IEEE Transactions on
Dielectrics and Electrical Insulation, vol. 2 no. 3, pp. 475-482, June
1995.
[1745] Wu, Zhonghua, Chen, Yuzhe, and Fang, Jiayuan,
"Modeling and Simulation of Integral Decoupling Capacitors in Single and
Multichip Module Electronics Packaging," 1994 Proceedings 44th
Electronic Components & Technology Conference, Washington, D. C.,
May 1-4, 1994, pp. 945-948.
[1746] Xiao, Peiyi, Tan, Zhigang, and Deng, Yongwei,
"Analysis on Discoloration of MLCC Dielectric in DPA," CARTS USA
2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp. xx-xx.
[1747] Xiao, Qiangfeng, and Zhou, Xiao,
"The study of multiwalled carbon nanotube deposited with conducting polymer
for supercapacitor," Electrochimica Acta, vol. 48 no. 5, pp.
575-580, Jan. 15, 2003.
[1748] Xie, Xuebing and Prince, John L.,
"Frequency Response Characteristics of Reference Plane Effective Inductance
and Resistance," IEEE Transactions on Advanced Packaging, vol.
22, no. 2, pp. 221-229, May 1999.
[1749] Xinyou, Huang, Chen, Zhao, Zhigang, Chen, and Chunhua, Gao,
"Influence of Composition on Properties of Medium Temperature Sintering
(Ba, Sr)TiO3 Series Capacitor Ceramics," Journal of Rare Earths,
vol. 24 no. 6, pp. 777-781, Dec. 2006.
[1750] Xu, Bin, Wu, Feng, Chen, Shi, Zhang, Cunzhong, Cao, Gaoping, and Yang,
Yusheng,
"Activated carbon fiber cloths as electrodes for high performance electric
double layer capacitors," Electrochimica Acta, vol. 52 no. 13,
pp. 4595-4598, Mar. 20, 2007.
[1751] Xu, Jianwen, Moon, Kyoung-Sik, Tison, Christopher, and Wong, C. P.,
"A Novel Aluminum-Filled Composite Dielectric for Embedded Passive
Applications," IEEE Transactions on Advanced Packaging, vol. 29
no. 2, pp. 295-306, May 2006.
[1751d] Xu, Jianwen, and Wong, C. P.,
"Dielectric Behavior of Ultrahigh-k Carbon Black Composites for Embedded
Capacitor Applications," 2005 Proceedings 55th Electronic Components
& Technology Conference, Volume 2, Orlando, FL, May 31-June 3,
2005, pp. 1864-1869.
[1752] Xu, Jianwen, and Wong, C. P.,
"Effect of the Polymer Matrices on the Dielectric Behavior of a Percolative
High-k Polymer Composite for Embedded Capacitor Applications," Journal
of Electronic Materials, vol. 35 no. 5, pp. 1087-1094, May 2006.
[1753] Xu, Jianwen, Bhattacharya, Swapan, Pramanik, Pranabes, and Wong, C. P.,
"High Dielectric Constant Polymer-Ceramic (Epoxy Varnish-Barium Titanate)
Nanocomposites at Moderate Filler Loadings for Embedded Capacitors,"
Journal of Electronic Materials, vol. 35 no. 11, pp. 2009-2015, Nov.
2006.
[1754] Xu, Jianwen, and Wong, C. P.,
"High Dielectric Constant SU8 Composite Photoresist for Embedded Capacitors,"
Journal of Applied Polymer Science, vol. 103 no. 3, pp.
1523-1528, Feb. 5, 2007.
[1755] Xu, Jianwen, and Wong, C. P.,
"High-K Nanocomposites with Core-Shell Structured Nanoparticles for Decoupling
Applications," 2005 Proceedings 55th Electronic Components &
Technology Conference, Volume 1, Orlando, FL, May 31-June 3, 2005, pp.
1234-1240.
[1755d] Xu, Jianwen, and Wong, C. P.,
"High Performance Low Cost Metal-Filled Composites for Embedded Passive
Applications," 2003 Electronics Packaging Technology Conference,
Dec 10-12, 2003, pp. 544-550.
[1756] Xu, Jianwen, Bhattacharya, Swapan, Moon, Kyoung-sik, Lu, Jiongxin, Englert,
Brian, Wong, C. P., and Pramanik, Pranabes,
"Large-Area Processable High k Nanocomposite-Based Embedded Capacitors,"
Proceedings 56th Electronic Components & Technology Conference
, San Diego, CA, May 30-June 2, 2006, pp. 1520-1532.
[1757] Xu, Jianwen, Moon, Kyoung-Sik, Pramanik, Pranabes, Bhattacharya, Swapan, and
Wong, C. P.,
"Optimization of Epoxy-Barium Titanate Nanocomposites for High Performance
Embedded Capacitor Components," IEEE Transactions on Components and
Packaging Technologies, vol. 30 no. 2, pp. 248-253, June 2007.
[1758] Xu, Jianwen, and Wong, C. P.,
"Photodefinable High-k SU8 Nanocomposite for Embedded Capacitors," 2006
11th International Symposium on Advanced Packaging Materials: Processes,
Properties and Interface, Atlanta, GA, Mar. 15-17, 2006, pp. 133-138.
[1758d] Xu, Jianwen, Wong, Michelle, and Wong, C. P.,
"Super High Dielectric Constant Carbon Black-Filled Polymer Composites as
Integral Capacitor Dielectrics," 54th Electronic Components &
Technology Conference, Volume 1, Las Vegas, NV, June 1-4, 2004, pp.
536-541.
[1758h] Xu, Kang, Ding, Michael S., and Jow, T. Richard,
"A better quantification of electrochemical stability limits for electrolytes
in double layer capacitors," Electrochimica Acta, vol. 46 no. 12,
pp. 1823-1827, Mar. 30, 2001.
[1758j] Xu, M., Chen, J., and Hubing, T.,
"TV1 Power Bus Noise Measurements," NCMS Embedded Capacitance
Conference, Feb. 28-29, 2000.
[1758l] Xu, Mao-Wen, Bao, Shu-Juan, and Li, Hu-Lin,
"Synthesis and characterization of mesoporous nickel oxide for electrochemical
capacitor," Journal of Solid State Electrochemistry, vol. 11 no.
3, pp. 372-377, Mar. 2007.
[1759] Xu, Minjia, Wang, Hao, and Hubing, Todd H.,
"Application of the Cavity Model to Lossy Power-Return Plane Structures in
Printed Circuit Boards," IEEE transactions on Advanced Packaging,
vol. 26, no. 1, pp. 73-80, Feb. 2003.
[1760] Xu, Minjia, Ji, Yun, Hubing, Todd H., Van Doren, Thomas .P., and
Drewniak, James L.,
"Development of a Closed-Form Expression for the Input Impedance of
Power-Ground Plane Structures," IEEE International Symposium on
Electromagnetic Compatibility Symposium Record Volume One, Washington,
D.C., Aug. 21-25, 2000, pp. 77-82.
[1761] Xu, Minjia, and Hubing, Todd H.,
"Estimating the Power Bus Impedance of Printed Circuit Boards With Embedded
Capacitance," IEEE Transactions on Advanced Packaging, vol. 25 ,
no. 3, pp. 424-432, Aug. 2002.
[1762] Xu, Minjia, Hubing, Todd H., Chen, Juan, Drewniak, James L., Van Doren,
Thomas P., and Dubroff, Richard E.,
"Mitigating Power Bus Noise with Embedded Capacitance in PCB Designs,"
2001 IEEE EMC International Symposium Symposium Record - Volume
1, Montreal, Canada, Aug. 13-17, 2001, pp. 496-500.
[1763] Xu, Minjia, Hubing, T., Drewniak, J., Van Doren, T., and DuBroff, R.,
"Modeling Printed Circuit Boards with Embedded Decoupling Capacitance,"
Electromagnetic Compatibility 2001, Zurich, Switzerland, Feb.
20-22, 2001, pp. 515-520.
[1764] Xu, Minjia, Hubing, Todd H., Chen, Juan, Van Doren, Thomas P.,
Drewniak, James L., and DuBroff, Richard E.,
"Power-Bus Decoupling With Embedded Capacitance in Printed Circuit Board
Design," IEEE Transactions on Electromagnetic Compatibility, vol.
45, no. 1, pp. 22-30, Feb. 2003.
[1765] Xu, Minjia, and Hubing, Todd H.,
"The Development of a Closed-Form Expression for the Input Impedance of
Power-Return Plane Structures,"
[1767] Xu, Rong, Berduque, Alfonso, and Dou, Zongli,
"Further Electrolyte Development for High Temperature Aluminium Electrolytic
Capacitors," CARTS USA 2009 Proceedings, Jacksonville, FL,
Mar. 30-Apr. 2, 2009, pp. xx-xx.
[1768] Xu, Tao, and Brim, Brad,
"A Resonance-Free Power Delivery System Design Methodology Applying 3D
Optimized Extended Adaptive Voltage Positioning," 17th Topical Meeting
on Electrical Performance of Electronic Packaging, San Jose, CA, Oct.
27-29, 2008, pp. 107-110.
[1769] Xu, Xilin, Niskala, Matti, Gurav, Abhijit, Laps, Mark, Saarinen, Kimmo,
Tajuddin, Aziz, Montanari, Davide, Bergamaschi, Francesco, and Boni,
Evangelista,
"Advances in Class-I C0G MLCC and SMD Film Capacitors," CARTS USA
2008 Proceedings, Newport Beach, CA, Mar. 17-20, 2008, pp. xx-xx.
[1770] Xu, Xilin, Gurav, Abhijit, Randall, Michael, Magee, Jim, Laps, Mark, and
Tajuddin, Aziz,
"BME C0G MLCCs: The High Capacitance Class-I Solution," CARTS Europe
2007, Barcelona, Spain, Oct. 29-Nov. 1, 2007, pp. xx-xx.
[1771] Xu, Xilin, Pinceloup, Pascal, Gurav, Abhijit, Randall, Michael, and Tajuddin,
Aziz,
"High CV BME C0G," CARTS 2007 Symposium Proceedings,
Albuquerque, NM, Mar. 26-29, 2007, pp. 179-188.
[1772] Xu, Xilin, Pinceloup, Pascal, Gurav, Abhijit, Skamser, Daniel, Tajuddin, Aziz,
and Yang, Gai-Ying,
"High Reliability Thin Layer BME X7R Dielectric with Few Core-Shell Structured
Grains," 2006 CARTS Conference Proceedings, Orlando, FL, Apr.
3-6, 2006, pp. xx-xx.
[1773] Xu, Xilin, Magee, Jim, Hoskins, Adriana, Laps, Mark, and Gurav, Abhijit,
"Robust Class-I Dielectric for High Temperature Applications," CARTS
USA 2009 Proceedings, Jacksonville, FL, Mar. 30-Apr. 2, 2009, pp.
xx-xx.
[1774] Xue, Rong, Qian, Yuan-Yuan, Liu, Ke-Ke, Jiang, Xiao-Xing, Zhu, Jun-Jie, and
Zhang, Jian-Rong,
"Nano-pit corrosion of the tabs in aluminum electrolytic capacitor:
Polarization characteristics of the tabs in ethyleneglycol-borate solution
with chloride ions," Corrosion Science, vol. 50 no. 10, pp.
2779-2784, Oct. 2008.
[1775] Yamagata, Takehiko, and Yamane, Hiroshi,
"Evaluation of Improved CVD Nickel Powders for Thin Electrode MLCC,"
CARTS 2007 Symposium Proceedings, Albuquerque, NM, Mar. 26-29,
2007, pp. 43-49.
[1776] Yamamoto, Hidetoshi,
"Chip EMI Filters Handle Large Currents for DC Power Supply Lines,"
JEE, vol. 31, no. 329, pp. 50-54, May 1994.
[1777] Yamamoto, Takuya, Yamazaki, K., Kuwako, F., and Andresakis, John,
"Nonreinforced Substrates for Use as Embedded Capacitors," Printed
Circuit Design & Manufacture, vol. 20, no. 4, pp. 36-40, Apr.
2003.
[1778] Yamanaga, Koh, Sato, Takashi, and Masu, Kazuya,
"Accurate parasitic inductance determination of a ceramic capacitor through
2-port measurements," 17th Topical Meeting on Electrical Performance of
Electronic Packaging, San Jose, CA, Oct. 27-29, 2008, pp. 119-122.
[1779] Yamanaga, Koh, Sato, Takashi, and Masu, Kazuya,
"Substrate-geometry aware 2-port modeling for surface-mount passive
components," Asia-Pacific Symposium on Electromagnetic Compatibility and
19th International Zurich Symposium on Electromagnetic Compatibility,
Singapore, May 19-23, 2008, pp. 498-501.
[1779d] Yamano, Y., and Endoh, H.,
"Increase in Breakdown Strength of PE Film by Additives Of azocompounds,"
IEEE Transactions on Dielectrics and Electrical Insulation, vol.
5 no. 2, pp. 270-275, Apr. 1998.
[1779h] Yamano, Y., and Endoh, H.,
"Increase in breakdown strength of PE film by additives of azocompounds
{erratum]," IEEE Transactions on Dielectrics and Electrical Insulation
, vol. 5 no. 3, pp. 466, June 1998.
[1780] Yang, Chun-Mo, Ju, Jeh Beck, Lee, Joong Kee, Cho, Won Il, and Cho, Byung Won,
"Electrochemical performances of electric double layer capacitor with
UV-cured gel polymer electrolyte based on
poly[(ethylene glycol)diacrylate]-poly(vinylidene fluoride) blend,"
Electrochimica Acta, vol. 50 no. 9, pp. 1813-1819, Mar. 1, 2005.
[1781] Ye, Xiaoning, Koledintseva, Marina Y., Li, Min, and Drewniak, James L.,
"DC Power-Bus Design Using FDTF Modeling With Dispersive Media and Surface
Mount Technology Components," IEEE Transactions on Electromagnetic
Compatibility, vol. 43, no. 4, pp. 579-587, Nov. 2001.
[1782] Ye, Xiaoning, Fan, Jun, Koledintseva, Marina, and Drewniak, James L.,
"DC Power Bus Design with FDTD Modeling Including a Dispersive Media,"
Proceedings of the IEEE 9th Topical Meeting on Electrical Performance of
Electronic Packaging, Scottsdale, AZ, Oct. 23-25, 2000, pp. 55-58.
[1783] Ye, Xiaoning, Hockanson, David M., Li, Min, Ren, Yong, Cui, Wei,
Drewniak, James L, and Dubroff, Richard E.,
"EMI Mitigation With Mul